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HZ0603B112R-10 “sui DOCUMENT PHYSICAL DIMENSIONS: A 1.60 [.063] +015 [.006] ELECTRICAL CHARACTERISTICS: B 0.80 [.031] +015 [.006] SS Z @ 100MHz c [Minimum [25 | 1375 200 mA Z vs FREQUENCY IMPEDANCE UNDER DC BIAS sco NOTES: UNLESS OTHERWISE SPECIFIED ~ wo) 1. TAPED AND REELED per CURRENT EIA Siw) D SPECIFICATIONS 7” REELS, 4000 PCS/REEL. go) jo k or 2. TERMINATION FINISH IS 100% TIN. 6” 3. COMPONENTS SHOULD BE ADEQUATELY g° PREHEATED BEFORE SOLDERING. 2 \\ —_—_—_—Z ~ 100 1000 10000 LAND PATTERNS FOR REFLOW SOLDERING RECOMMENDED SOLDERING CONDITIONS REFLOW SOLDERING 250 PRE-HEATING. ‘SOLDERING NATURAL FREQUENCY (MHz) 0.60 _, 48> COOLING [—T[.023] ba Il oS | IZ, R, AND X vs. FREQUENCY O80 & | . w vs (ost) § aap I | Zw T FE: 1 | ae) 2.60 a Go scomos! | | w [.102] a 1 Zee @ z [Ba SONS ARE ra [NGHEST Toots rans 0 [TTT oes 'n conigence . 1 10 100 2000 20000 in ert itr, Laird FREQUENCY (MHz) Of! [qi it i ec ah | TecHINOLOIES: > 4 oT reeved a