HVU145 HITACHI

Document overview

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Technical content

Features

  • Low capacitance.(C = 0.45 pF max)
  • Low forward resistance. (rf = 1.8 Ω max)
  • Ultra small Resin Package (URP) is suitable for surface mount design.

Ordering Information

Type No. Laser Mark Package Code HVU145 T5 URP Pin Arrangement Cathode mark Mark 12 T5 1. Cathode 2. Anode

Rev.1, Jun. 2002, page 2 of 6 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Value Unit Reverse voltage V R 60 V Forward current I F 50 mA Power dissipation Pd 150 mW Junction temperature Tj 125 °C Storage temperature Tstg –55 to +125 °C

Electrical Characteristics

(Ta = 25°C) Item Symbol Min Typ Max Unit Test Condition Reverse current I R — — 100 nA V R = 60 V Forward voltage V F ——0 . 9 V I F = 2 mA Capacitance C — — 0.45 pF V R = 1 V, f = 1 MHz Forward resistance rf ——1 . 8 Ω IF = 10 mA, f = 100 MHz ESD-Capability * — 100 — — V C = 200 pF, R = 0 Ω, Both forward and reverse direction 1 pulse. Note : 1. Failure criterion ; IR ≥ 100 nA at VR = 60 V

Rev.1, Jun. 2002, page 3 of 6 Main Characteristic 100 101 10-1 101.00.1 f = 1MHz 10-2 10-4 10-6 10-8 10-10 10-12 08 0 20 60 40 100 10-9 10-7 10-8 10-10 10-11 10-12 10-13 0.1 1.0 Ta = 75/KB0 C Ta = 25°C Ta = –25°C Ta = 75/KB0 C Ta = 50/KB0 C Ta = 25/KB0 C Forward current IF (A) Fig.1 Forward current vs. Forward voltage Forward voltage VF (V) Capacitance C (pF) Fig.3 Capacitance vs. Reverse voltage Reverse voltage VR (V) Forward resistance rf (Ω ) Fig.4 Forward resistance vs. Forward current Forward current IF (A) Fig.2 Reverse current vs. Reverse voltage Reverse voltage VR (V) Reverse current IR (A) 10-4 10-3 10-2 10-1 103 102 f = 100MHz

Rev.1, Jun. 2002, page 4 of 6 104 102 107 106 103 101 0.2 0.4 0.6 0.8 100 105 f=100MHz Fig.5 Forward resistance (parallel) vs. Forward voltage Forward voltage VF (V) Forward resistance (parallel) rP (Ω )

Rev.1, Jun. 2002, page 5 of 6 Package Dimensions Hitachi Code JEDEC JEITA Mass (reference value) URP Conforms 0.004 g 1.7 ± 0.15 2.5 ± 0.15 0.3 ± 0.15 1.25 ± 0.15 0 – 0.10 0.9 ± 0.15 As of January, 2002 Unit: mm

Rev.1, Jun. 2002, page 6 of 6 Disclaimer 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan. Hitachi Asia Ltd. Hitachi Tower

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Tel : <65>-6538-6533/6538-8577 Fax : <65>-6538-6933/6538-3877 URL : http://semiconductor.hitachi.com.sg URL http://www.hitachisemiconductor.com/ Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-2735-9218 Fax : <852>-2730-0281 URL : http://semiconductor.hitachi.com.hk Hitachi Europe GmbH Electronic Components Group Dornacher Straße 3 D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Semiconductor (America) Inc.

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