HS-139RH RENESAS

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • QML qualified per MIL-PRF-38535 requirements
  • R a d i a t i o n e n v i r o n m e n t - Latch-up free under any conditions - Low dose rate effects immunity
  • 100V output voltage withstand capability
  • ESD protection to >3000V
  • Differential input voltage range equal to the supply voltage
  • Pb-Free (RoHS Compliant)

Applications

  • P u l s e g e n e r a t o r s
  • Timing circuitry
  • L e v e l s h i f t i n g
  • Analog-to-digital conversion Pin Configurations HS-139RH, HS-139EH (SBDIP CDIP2-T14) TOP VIEW HS-139RH, HS-139EH (FLATPACK CDFP3-F14) TOP VIEW OUT 2 OUT 1 - IN 1 + IN 1 - IN 2 + IN 2 OUT 3 OUT 4 GND + IN 4 - IN 4 + IN 3 - IN 3 1OUT 2 OUT 1 - IN 1 + IN 1 - IN 2 +IN 2 OUT 3 OUT 4 GND + IN 4 - IN 4 + IN 3 - IN 3

HS-139RH, HS-139EH FN3573 Rev 6.00 Page 2 of 6 August 8, 2013

Ordering Information

(Note 1) PART NUMBER (Note 2) PART MARKING TEMP. RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # 5962F9861303VCC HS1-139EH-Q Q 5962F98 61303VCC -55 to +125 14 Ld SBDIP D14.3 5962F9861301VCC HS1-139RH-Q Q 5962F98 61301VCC -55 to +125 14 Ld SBDIP D14.3 5962F9861301QCC HS1-139RH-8 Q 5962F98 61301QCC -55 to +125 14 Ld SBDIP D14.3 HS1-139RH/PROTO HS1-139RH/PROTO HS1-139RH/PROTO -55 to +125 14 Ld SBDIP D14.3 5962F9861301VXC HS9-139RH-Q Q 5962F98 61301VXC -55 to +125 14 Ld FLATPACK K14.A 5962F9861301QXC HS9-139RH-8 Q 5962F98 61301QXC -55 to +125 14 Ld FLATPACK K14.A 5962F9861303VXC HS9-139EH-Q Q 5962F98 61303VXC -55 to +125 14 Ld FLATPACK K14.A HS9-139RH/PROTO HS9-139RH/PROTO HS9-139RH /PROTO -55 to +125 14 Ld FLATPACK K14.A 5962F9861303V9A HS0-139EH-Q -55 to +125 Die 5962F9861301V9A HS0-139RH-Q -55 to +125 Die HS0-139RH/SAMPLE HS0-139RH/SAMPLE -55 to +125 Die NOTES: 1. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table on page 2 must be used when ordering. 2. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

HS-139RH, HS-139EH FN3573 Rev 6.00 Page 3 of 6 August 8, 2013 Die Characteristics DIE DIMENSIONS: 3750µm x 2820µm (148 mils x 111 mils) 483µm ±25.4µm (19 mils ±1 mil) INTERFACE MATERIALS: Glassivation: Type: Silox (SiO2) Thickness: 8.0kÅ ±1.0kÅ Top Metallization: Type: AlSiCu Thickness: 16.0kÅ ±2kÅ Substrate: Radiation Hardened Silicon Gate, Dielectric Isolation Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential: Unbiased (DI) ADDITIONAL INFORMATION: Worst Case Current Density: <2.0 x 105 A/cm2 Transistor Count: Metallization Mask Layout HS-139RH, HS-139EH GND +IN4 -IN4 V+ -IN1 +IN1 +IN3 -IN3 +IN2 -IN2 OUT4 OUT3 OUT2 OUT1 (9) (8) (7) (6) (5)(4)(3) (2) (1) (14) (13) (12) (11) (10)

otherwise under any patent or patent rights of Intersil or its subsidiaries. © Copyright Intersil Americas LLC 1999-2013. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. TABLE 1. HS-139RH, HS-139EH PAD COORDINATES

1 OUT 2 0 0

2 OUT 1 0 -535

3 V+ 1323 -688

12 GND 1550 1503

13 OUT 4 0 1331

14 OUT 3 0 796

HS-139RH, HS-139EH FN3573 Rev 6.00 Page 5 of 6 August 8, 2013 Ceramic Dual-In-Line Metal Seal Packages (SBDIP) NOTES: 3. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 4. The maximum limits of lead dimensions b and c or M shall be mea- sured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 6. Corner leads (1, N, N/2, and N/2+1) may be configured with a par- tial lead paddle. For this configur ation dimension b3 replaces di - mension b2. 7. Dimension Q shall be measured from the seating plane to the base plane. 8. Measure dimension S1 at all four corners. 9. Measure dimension S2 from the top of the ceramic body to the near- est metallization or lead. 10. N is the maximum number of terminal positions. 11. Braze fillets shall be concave. 12. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 13. Controlling dimension: INCH. bbb C A - BS c Q L A SEATING BASE D PLANE PLANE S S -D--A- -C- eA -B- aaa C A - BM DS Sccc C A - BM DS S D E b A e M (c) (b) SECTION A-A BASE LEAD FINISH METAL eA/2 M A D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C)

14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 E 0.220 0.310 5.59 7.87 - e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7  90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N 14 14 8 Rev. 0 4/94

HS-139RH, HS-139EH FN3573 Rev 6.00 Page 6 of 6 August 8, 2013 Ceramic Metal Seal Flatpack Packages (Flatpack) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass over- run. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materi- als shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the me- niscus) of the lead from the bo dy. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. -D- -C-

0.004 H A - BM DS S

-A- -B-

0.036 H A - BM DS S

e E A Q L D A SEATING AND LE2 E3 E3 BASE PLANE -H- b C M (c) (b) SECTION A-A BASE LEAD FINISH METAL PIN NO. 1 ID AREA A M K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B)

14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019 0.38 0.48 - c 0.004 0.009 0.10 0.23 - c1 0.004 0.006 0.10 0.15 - D - 0.390 - 9.91 3 E 0.235 0.260 5.97 6.60 - E1 - 0.290 - 7.11 3 E3 0.030 - 0.76 - 7 e 0.050 BSC 1.27 BSC - k 0.008 0.015 0.20 0.38 2 L 0.270 0.370 6.86 9.40 - Q 0.026 0.045 0.66 1.14 8 S1 0.005 - 0.13 - 6 N 14 14 - Rev. 0 5/18/94