HL75-250F LEIDITECH
Document overview
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Technical content
Features
Radial leaded devices, higher rated voltage of 75V Cured, flame retardant epoxy polymer insulating material meets UL94 V-0 requirements Lead-free and compliant with the European Union RoHS Directive 2011/65/EU Product Dimensions (mm) A B C D E F Lead
Electrical Characteristics
IH IT Max. Time-to-trip Vmax Imax Pd typ Rmin Rmax R1max Part number (A) (A) Current(A) Time(s) (V) (A) (W) (Ω) (Ω) (Ω) IH=Hold current: maximum current at which the device will not trip at 25℃ still air. IT=Trip current: minimum current at which the device will always trip at 25℃ still air. Vmax=Maximum voltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Max. Time-to-trip =Maximum time to trip(s) at assigned current. Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment. Rmin=Minimum device resistance at 25℃ prior to tripping. Rmax=Maximum device resistance at 25℃ prior to tripping. R1max= Maximum resistance of device when measured one hour post trip at 25℃. Thermal Derating Chart-IH(A) Maximum ambient operating temperatures(℃) Part number -40 -20 0 25 40 50 60 70 85
Package Information
Bulk: 500pcs per bag. HL75-250F Rev : www.leiditech.com 01.06.2017 1/2
Soldering temperature：350℃±5℃. Soldering time：no more than 5s. Soldering position：at least 4 mm away from PTC chip. HL75-250F Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2017 2/2