HL60-005 LEIDITECH

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features：  RoHS Compliant ＆ Halogen Free  Radial-leaded Devices  Cured，flame retardant epoxy polymer insulating material meets UL94V-0 requirements  Operation Current: 0.05A~5A ，Maximum V oltage: 60Vdc，Operating Temperature：-40℃ TO 85℃  Agency recognition:UL、TUV Product Dimensions Pig.1 Pig.2 Unit ：mm HL60 Series Model Dimensions mm Lead material Shape A(max) B(max) C(max) D(typ) Tinned metal (mm) Fig HL 005 5.0 8.5 3.0 5.1 24AWG/Φ0.5 HL 010 5.5 9.5 3.0 5.1 24AWG/Φ0.5 HL 017 7.4 12.7 3.0 5.1 24AWG/Φ0.5 HL 020 7.4 12.7 3.0 5.1 24AWG/Φ0.5 HL 025 7.4 12.7 3.0 5.1 24AWG/Φ0.5 HL 030 7.4 13.0 3.0 5.1 24AWG/Φ0.5 HL 040 7.8 16.2 3.0 5.1 24AWG/Φ0.5 HL 050 7.8 16.2 3.0 5.1 24AWG/Φ0.5 HL 065 9.7 17.8 3.0 5.1 22AWG/Φ0.6 HL 075 10.4 18.4 3.0 5.1 22AWG/Φ0.6 HL 090 11.7 18.4 3.0 5.1 22AWG/Φ0.6 HL 110 13.0 18.0 3.0 5.1 20 AWG/Φ0.8 HL 135 14.5 19.6 3.0 5.1 20 AWG/Φ0.8 Positive Thermal Coefficent Diodes HL60-005~500 Series Rev : www.leiditech.com 01.06.2018 1/4

HL60-160 16.3 21.3 3.0 5.1 20 AWG/Φ0.8 HL 185 17.8 22.9 3.0 5.1 20 AWG/Φ0.8 HL 200 17.8 22.9 3.0 5.1 20 AWG/Φ0.8 HL 250 21.3 26.4 3.0 10.2 20 AWG/Φ0.8 HL 300 21.3 26.4 3.0 10.2 20 AWG/Φ0.8 HL 375 28.5 33.5 3.0 10.2 20 AWG/Φ0.8 HL 500 28.5 33.5 3.0 10.2 20 AWG/Φ0.8 Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm. Thermal Derating Chart-IH（A）

Electrical Characteristics

H (A) I T (A) Vmax Imax P d Maximum Time to Trip R esistance Ω V（DC） A（DC） W Current A Time S R min R max HL60-005 0.05 0.15 60 40 0.26 0.25 8.0 7.3 HL60-010 0.10 0.3 60 40 0.38 0.5 5.0 2.5 7.5 HL60-017 0.17 0.34 60 40 0.48 0.85 5.0 5.21 HL60-020 0.2 0.4 60 40 0.41 1.0 5.0 1.5 2.84 HL60-025 0.25 0.5 60 40 0.45 1.25 5.0 1.0 1.95 HL60-030 0.30 0.6 60 40 0.49 1.5 5.0 0.76 1.38 HL60-040 0.40 0.8 60 40 0.56 2.0 5.0 0.45 0.88 HL60-050 0.50 1.0 60 40 0.77 2.5 5.0 0.40 0.79 HL 065 0.65 1.3 0.88 3.25 5.0 0.31 0.50 HL 075 0.75 1.5 0.92 3.75 5.0 0.25 0.42 HL 090 0.90 1.8 0.99 4.5 5.0 0.20 0.33 HL 110 1.10 2.2 1.5 5.5 8.0 0.15 0.27 HL 135 1.35 2.7 1.7 6.75 8.0 0.12 0.21 HL 160 1.60 3.2 1.9 8.0 8.0 0.09 0.16 HL 185 1.85 3.7 2.1 9.25 8.0 0.08 0.14 HL 200 2.00 4.0 2.3 10.0 8.0 0.07 0.14 HL 250 2.50 5.0 2.5 12.5 8.0 0.05 0.10 HL 300 3.00 6.0 2.8 15.0 8.0 0.04 0.08 HL 375 3.75 7.5 3.2 18.75 24.0 0.03 0.06 HL 500 5.00 3.5 25.0 24.0 0.02 0.06 IH=Hold current:Maximum current at which the device will not interruptin 25℃ still air. IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air. Model Maximum ambient operating temperature 40℃ 20℃ 25℃ 30℃ 40℃ 50℃ 60℃ 70℃ HL series 147% 100% 90% HL60-005~500 Series Vmax=Maximum continuousvoltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Maximum Time-to-trip:Maximum time to trip at assigned current. Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment. Rmin=Minimum resistance of device at 25℃ prior to tripping. Rmax=Maximum resistance of device at 25℃ prior to tripping. Rev : www.leiditech.com 01.06.2018 2/4

Environmental Specifications Test Conditions Resistance change Passive Aging +85℃，1000hours ± 8% typical Humidity Aging +85℃，85%R.H.1000hours ± 8% typical Thermal Shock +125℃ to -55℃，10 Times ± 12% typical SolventResistance MIL-STD-202，Method 215F No change Vibration MIL-STD-202，Method 201 No change Solderingmethod Wave Soldering Soldering Temperature:245℃~260℃ Soldering Time:≤5sec Soldering Position: Resettable fuse lead and the distance from the bottom ≥ 6mm Manual soldering Soldering Temperature:250℃~280℃ Soldering Time: ≤3sec Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm Marking System HL Leiditech series productLeiditech series productLeiditech series product HL60-005~500 Series Rev : www.leiditech.com 01.06.2018 3/4

The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful substancesare present. Warning:

  • Please read this specification before using the product.
  • Use PPTC beyond the maximum ratings or improper use may result in device damage , electrical arcing and flame.
  • PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
  • Device performance can be impacted negatively if devices are handled in a mann er inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
  • Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
  • Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC can be cleaned by standard methods. HL60-005~500 Series Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 4/4