HL16-010 LEIDITECH

Document overview

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Technical content

Features：  RoHS Compliant ＆ Halogen Free  Radial-leaded Devices  Cured，flame retardant epoxy polymer insulating material meets UL94V -0 requirements  Operation Current: 0.1A~14A ，Maximum Voltage: 16Vdc， Operating Temperature：-40℃ TO 85℃  Agency recognition：TUV Product Dimensions Pig.1 Pig.2 Unit ：mm HL16 Series Model Dimensions mm Lead material Shape A(max) B(max) C(max) D(typ) Tinned metal (mm) Fig HL16 010 5.5 12.0 3.0 5.1 24 AWG/Φ0.5 1 HL16 025 5.5 12.0 3.0 5.1 24 AWG/Φ0.5 1 HL16 030 5.5 12.0 3.0 5.1 24 AWG/Φ0.5 1 HL16 050 5.5 12.0 3.0 5.1 24 AWG/Φ0.5 1 HL16 075 7.4 13.5 3.0 5.1 24 AWG/Φ0.5 HL16 090 7.4 13.5 3.0 5.1 24 AWG/Φ0.5 HL16 110 7.4 13.5 3.0 5.1 24 AWG/Φ0.5 HL16 135 7.4 13.5 3.0 5.1 24 AWG/Φ0.5 1 HL16 160 7.4 14.0 3.0 5.1 24 AWG/Φ0.5 1 HL16 200 9.0 12.0 3.0 5.1 24 AWG/Φ0.5 2 HL16 300 9.0 12.0 3.0 5.1 AWG/Φ0.8 HL16 400 10.0 13.0 3.0 5.1 20 AWG/Φ0.8 HL16 500 1.8 17.5 3.0 5.1 20 AWG/Φ0.8 Positive Thermal Coefficent Diodes HL16-010~1400 Series Rev : www.leiditech.com 01.06.2018 1/4

13.5 17.5 3.0 5.1 20 AWG/Φ0.8 HL16 700 13.5 23.0 3.0 5.1 20 AWG/Φ0.8 2 HL16 800 13.5 23.0 3.0 5.1 20 AWG/Φ0.8 2 HL16 900 15.0 24.0 3.0 5.1 20 AWG/Φ0.8 2 HL16 1000 18.0 6.0 3.0 5.1 20 AWG/Φ0.8 HL16 1100 18.0 6.0 3.0 5.1 20 AWG/Φ0.8 HL16 1200 22.5 26.0 3.0 10.2 20 AWG/Φ0.8 HL16 1300 24.0 30.0 3.0 10.2 20 AWG/Φ0.8 2 HL16 1400 24.0 30.0 3.0 10.2 20 AWG/Φ0.8 2 Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is at the tolerance of ± 0.75mm. Thermal Derating Chart-IH（A）

Electrical Characteristics

(A) I T (A) Vmax Imax P d Maximum Time to Trip R esistance mΩ V DC A W Current A Time S R min R max HL16 010 0.1 0.3 100 0.38 0.5 1500 7500 HL16 025 0.25 0.5 100 0.45 1.25 500 1950 HL16 030 0.3 0.6 100 0.49 1.5 5 300 700 HL16 050 0.5 1.0 100 0.56 2.5 5 200 500 HL16 075 0.75 1.5 100 0.72 3.75 5 100 32 HL16 090 0.9 1.8 100 0.83 4.5 180 HL16 110 1.1 2.2 100 0.94 5.5 150 HL16 135 1.35 2.7 100 1.2 6.75 130 HL16 160 1.6 3.2 100 1.4 5 40 110 HL16 200 2 4 100 2.2 15 35 75 HL16 300 3 6 100 2.3 15 20 60 HL16 400 100 2.4 HL16 500 100 2.6 HL16 600 100 2.8 HL16 700 100 3.0 HL16 800 8 16 100 3.0 15 6 13 HL16 900 9 18 100 3.3 25 4 12 HL16 1000 10 20 100 3.7 30 4 11 HL16 1100 100 3.7 HL16 1200 100 4.2 Model Maximum ambient operating temperature 40℃ 20℃ 25℃ 30℃ 40℃ 50℃ 60℃ 70℃ HL16 series 147% 132% 120% 100% 90% 8 47% HL16-010~1400 Series Rev : www.leiditech.com 01.06.2018 2/4

4.2 HL16 1400 14 28 100 4.2 50 3 7 IH=Hold current:Maximum current at which the device will not interruptin 25℃ still air. IT=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air. Vmax=Maximum continuousvoltage device can withstand without damage at rated current. Imax=Maximum fault current device can withstand without damage at rated voltage. Maximum Time-to-trip:Maximum time to trip at assigned current. Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment. Rmin=Minimum resistance of device at 25℃ prior to tripping. Rmax=Maximum resistance of device at 25℃ prior to tripping. Environmental Specifications Test Conditions Resistance change Passive A ging +85 1000h ou rs ± 8% typical Humidity A ging +85 85%R.H.1000h ou rs ± 8% typical Thermal S hock +125 to T imes ± 12% typical SolventResistance MIL STD 202 Method 215 F No change Vibration MIL STD 202 Method 201 No change Solderingmethod Wave Soldering Soldering Temperature:245℃~260℃ Soldering Time:≤5sec Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm Manual soldering Soldering Temperature:250℃~280℃ Soldering Time: ≤3sec Soldering Position: Resettable fuse lead and the distance fromthe bottom ≥ 6mm HL16-010~1400 Series Rev : www.leiditech.com 01.06.2018 3/4 Marking System HL Leiditech series productLeiditech series productLeiditech series product

The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 70%.High humidity with high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful substancesare present. Warning:

  • Please read this specification before using the product.
  • Use PPTC beyond the maximum ratings or improper use may result in device damage, electrical arcing and flame.
  • PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
  • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
  • Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
  • Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC can be cleaned by standard methods. HL16-010~1400 Series Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 4/4