HDC1050 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor datasheet (Rev. C)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNAS658,C]
- PDF pages: 28
Technical content
3.3V ADC TEMPERATURE RH I2C Registers Logic HDC1050 SDA SCL OTP Calibration Coefficients VDD GND 3.3V VDD 3.3V Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design HDC1050 SNAS658C –MAY 2015–REVISED DECEMBER 2015 HDC1050LowPower,HighAccuracyDigitalHumiditySensorwithTemperatureSensor
1 Features 3 Description
The HDC1050 is a digital humidity sensor with 1• Relative Humidity Accuracy ±3% (typical) integrated temperature sensor that provides excellent• Temperature Accuracy ±0.2°C (typical) measurement accuracy at very low power. The
- 14 Bit Measurement Resolution HDC1050 operates over a wide supply range, and is a low cost, low power alternative to competitive• 100 nA Sleep Mode Current solutions in a wide range of common applications.• Average Supply Current: The humidity and temperature sensors are factory – 710 nA @ 1sps, 11 bit RH Measurement calibrated. – 1.3 µA @ 1sps, 11 bit RH and Temperature Device Information (1) Measurement PART• Supply Voltage 2.7 V to 5.5 V PACKAGE BODY SIZE (NOM)NUMBER
- Small 3 mm x 3 mm Device Footprint HDC1050 PWSON (6-pin) DMB 3.00 mm x 3.00 mm
- I2C Interface (1) For all available packages, see the orderable addendum at the end of the datasheet.
2 Applications
- HVAC
- Smart Thermostats and Room Monitors
- White Goods
- Printers
- Handheld Meters
- Medical Devices
- Wireless Sensor (TIDA-00374)
4 Typical Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
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5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (July 2015) to Revision C Page Changes from Revision A (July 2015) to Revision B Page Changes from Original (July 2015) to Revision A Page
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6 Pin Configuration and Functions
6 Pin PWSON
I/O TYPE(1) DESCRIPTION NAME NO. SDA 1 I/O Serial data line for I2C, open-drain; requires a pull-up resistor to VDD GND 2 G Ground NC 3,4 - These pins may be left floating, or connected to GND VDD 5 P Supply Voltage SCL 6 I Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD DAP DAP G Die Attach Pad. Should be left floating. (On bottom of the device, not shown in the figure) (1) P=Power, G=Ground, I=Input, O=Output Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: HDC1050
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7 Specifications
7.1 Absolute Maximum Ratings(1)
VDD -0.3 6 Input Voltage SCL -0.3 6 V SDA -0.3 6 Storage Temperature TSTG -65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge VCharged-device model (CDM), per JEDEC specification JESD22- ±500C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply Voltage 2.7 3 5.5 V TA, Temperature sensor Ambient Operating Temperature -40 125 °C TA, Humidity sensor Ambient Operating Temperature -20 60 °C
7.4 Thermal Information
THERMAL METRIC(1) PWSON UNIT DMB 6 PINS RθJA Junction-to-Ambient Thermal Resistance 49.4 °C/W (1) For more information about traditional and new thermal metrics, see the: IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics(1)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C, RH = 40%, and VDD = 3V. PARAMETER TEST CONDITION(2) MIN(3) TYP(4) MAX(3) UNIT POWER CONSUMPTION IDD Supply Current RH measurement, bit 12 of 0x02 register = 190 220 µA 0(5) Temperature measurement, bit 12 of 0x02 160 185 µA register = 0(5) Sleep Mode 100 200 nA Average @ 1 measurement/second, RH (11 710 nA bit), bit 12 of 0x02 register = 0(5)(6) Average @ 1 measurement/second, Temp 590 nA (11 bit), bit 12 of 0x02 register = 0(5)(6) Average @ 1 measurement/second, RH 1.3 µA (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1(5)(6) Startup (average on Start-up time) 300 µA IHEAT Heater Current(7) Peak current 7.2 mA Average @ 1 measurement/second, RH 50 µA (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1(5)(6) RELATIVE HUMIDITY SENSOR RHACC Accuracy Refer to Figure 2 in Typical Characteristics ±3 %RH section. RHREP Repeatability(7) 14 bit resolution ±0.1 %RH RHHYS Hysteresis (8) 20% ≤ RH ≤ 60% ±1 %RH RHRT Response Time(9) t 63% (10) 30 s RHCT Conversion Time(7) 8 bit resolution 2.50 ms 11 bit resolution 3.85 ms 14 bit resolution 6.50 ms RHOR Operating Range(11) Non-condensing 0 100 %RH RHLTD Long Term Drift ±0.5 %RH/yr TEMPERATURE SENSOR TEMPACC Accuracy(7) 5°C < TA< 60°C ±0.2 ±0.4 °C TEMPREP Repeatability(7) 14 bit resolution ±0.1 °C TEMPCT Conversion Time(7) 11 bit accuracy 3.65 ms 14 bit accuracy 6.35 ms (1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. (2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal values have no prefix. (3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method. (4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material. (5) I2C read/write communication and pull-up resistors current through SCL and SDA not included. (6) Average current consumption while conversion is in progress. (7) This parameter is specified by design and/or characterization and it is not tested in production. (8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point. (9) Actual response times will vary dependent on system thermal mass and air-flow. (10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity. (11) Recommended humidity operating range is 20% to 60% RH. Prolonged operation outside this range may result in a measurement offset. The measurement offset will decrease after operating the sensor in this recommended operating range. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: HDC1050
7.6 I2C Interface Electrical Characteristics
(1) This parameter is specified by design and/or characterization and it is not tested in production.
7.7 I2C Interface Timing Requirements
(1) This parameter is specified by design and/or characterization and it is not tested in production. (2) Within this interval it is not possible to communicate to the device. Figure 1. I2C Timing
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7.8 Typical Characteristics
Unless otherwise noted. TA = 30°C, VDD = 3V. Figure 2. RH Accuracy vs. RH Figure 3. Temperature Accuracy vs. Temperature Figure 4. Supply Current vs. Supply Voltage, RH Figure 5. Supply Current vs. Temperature, RH Measurement Figure 6. Supply Current vs. Supply Voltage, Temp Figure 7. Supply Current vs. Temperature, Temp
Unless otherwise noted. TA = 30°C, VDD = 3V. Figure 8. Supply Current vs. Supply Voltage, Sleep Mode Figure 9. Supply Current vs. Temperature, Sleep Mode
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8 Detailed Description
8.1 Overview
The HDC1050 is a digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The sensing element of the HDC1050 is placed on the top part of the device. Measurement results can be read out through the I2C compatible interface. Resolution is based on the measurement time and can be 8, 11, or 14 bits for humidity; 11 or 14 bits for temperature.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Power Consumption
One of the key features of the HDC1050 is its low power consumption, which makes the device suitable in battery or power harvesting applications. In these applications the HDC1050 spends most of the time in sleep mode: with a typical 100nA of current consumption in sleep mode, the averaged current consumption is minimal. Its low consumption in measurement mode minimizes any self-heating.
8.3.2 Voltage Supply Monitoring
The HDC1050 monitors the supply voltage level and indicates when the voltage supply of the HDC1050 is less than 2.8V. This information is useful in battery-powered systems in order to inform the user to replace the battery. This is reported in the BTST field (register address 0x02:bit[11]) which is updated after POR and after each measurement request.
8.3.3 Heater
The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off the sensor. The heater can be activated using HEAT, bit 13 in the Configuration Register. The heater helps in reducing the accumulated offset after long exposure at high humidity conditions. Once enabled the heater is turned on only in the measurement mode. To accelerate the temperature increase it is suggested to increase the measurement data rate.
8.4 Device Functional Modes
The HDC1050 has two modes of operation: sleep mode and measurement mode. After power up, the HDC1050 is in sleep mode. In this mode, the HDC1050 waits for I2C input including commands to configure the conversion times, read the status of the battery, trigger a measurement, and read measurements. Once it receives a command to trigger a measurement, the HDC1050 moves from sleep mode to measurement mode. After completing the measurement the HDC1050 returns to sleep mode. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: HDC1050
8.5 Programming
8.5.1 I2C Interface
communication or measurement is performed. All data bytes are transmitted MSB first.
8.5.1.1 Serial Bus Address
or write operation. The I2C address of the HDC1050 is 1000000 (7-bit address).
8.5.1.2 Read and Write Operations
To access a particular register on the HDC1050, write the desired register address value to the Pointer Register. operation to the HDC1050 requires a value for the pointer register (refer to Figure 10). the R/W bit low, followed by the pointer byte. No additional data is required (refer to Figure 11). incorrect I2C address returns a NACK after the I2C address. Figure 10. Writing Frame (Configuration Register)
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Figure 11. Reading Frame (Configuration Register)
8.5.1.3 Device Measurement Configuration
- Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to measure both temperature and humidity by setting Bit[12] to 1. – Set Bit[10] to 0 for 14 bit resolution. – Set Bit[10] to 1 for 11 bit resolution. – Set Bit[9:8] to 00 for 14 bit resolution. – Set Bit[9:8] to 01 for 11 bit resolution. – Set Bit[9:8] to 10 for 8 bit resolution.
- Trigger the measurements by executing a pointer write transaction with the address pointer set to 0x00.
- Wait for the measurements to complete, based on the conversion time (refer to Electrical Characteristics(1)
registers have not been updated as shown in Figure 13. To perform another acquisition with the same measurement configuration simply repeat steps 2 through 4.
- Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to independently measure temperature or humidity by setting Bit[12] to 0. – Set Bit[10] to 0 for 14 bit resolution. which the device may be permanently degraded, either mechanically or electrically.
– Set Bit[10] to 1 for 11 bit resolution. – Set Bit[9:8] to 00 for 14 bit resolution. – Set Bit[9:8] to 01 for 11 bit resolution. – Set Bit[9:8] to 10 for 8 bit resolution.
- Trigger the measurement by executing a pointer write transaction. Refer to Figure 12
– Set the address pointer to 0x00 for a temperature measurement. – Set the address pointer to 0x01 for a humidity measurement.
- Wait for the measurement to complete, based on the conversion time (refer to Electrical Characteristics(1) for
Figure 11. A read operation will return a NACK if the measurement result is not yet available, as shown in To perform another acquisition with the same measurement configuration repeat steps 2 through 4. measurement is ongoing will abort the ongoing measurement. Figure 12. Trigger Humidity/Temperature Measurement Figure 13. Read Humidity/Temperature Measurement (Data Not Ready)
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Figure 14. Read Humidity and Temperature Measurement (Data Ready)
8.6 Register Map
measurement results, and status information. Table 1. Register Map Registers addresses 0x03 to 0xFA are reserved and should not be written. command. The power-on reset (POR) value of the pointer is 0x00, which selects a temperature measurement.
8.6.1 Temperature Register
Table 2. Temperature Register Description (0x00) which the device may be permanently degraded, either mechanically or electrically.
8.6.2 Humidity Register
Table 3. Humidity Register Description (0x01) which the device may be permanently degraded, either mechanically or electrically.
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8.6.3 Configuration Register
This register configures device functionality and returns status. Table 4. Configuration Register Description (0x02)
1 Heater Enabled
MODE [12] Mode of 0 Temperature or Humidity is acquired. acquisition 1 Temperature and Humidity are acquired in sequence, Temperature first.
8.6.4 Serial Number Registers
These registers contain a 40bit unique serial number for each individual HDC1050. Table 5. Serial Number Register Description (0xFB) Table 6. Serial Number Register Description (0xFC) Table 7. Serial Number Register Description (0xFD)
8.6.5 Manufacturer ID Register
same I2C bus. The manufacturer ID reads 0x5449. Table 8. Manufacturer ID Register Description (0xFE)
8.6.6 Device Register ID
Table 9. Device ID Register Description (0xFF)
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9 Application and Implementation
validate and test their design implementation to confirm system functionality.
9.1 Application Information
system. The collected data are then shown on a display that can be easily controlled by the micro controller. environment at customer-defined preferred conditions.
9.2 Typical Application
Figure 15. Typical Application Schematic HVAC
9.2.1 Design Requirements
9.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in Figure 15 a small circuit board is possible. HDC1050, which can improve measurement response time and accuracy.
9.2.3 Application Curve
Figure 16. RH vs. Time
9.3 Do's and Don'ts
9.3.1 Soldering
soldering profile according to IPC/JEDEC J-STD-020 with peak temperatures at 260 °C. When soldering the HDC1050 it is mandatory to use no-clean solder paste and no board wash shall be applied. The HDC1050 should be limited to a single IR reflow and no rework is recommended.
9.3.2 Hydration Procedure
- Store the PCB containing the HDC1050 at 85% RH and 85 °C for 12 hours.
9.3.3 Chemical Exposure and Sensor Protection
circuit board, the sensor must be protected during the coating process.
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10 Power Supply Recommendations
0.1µF between the VDD and GND pins is recommended.
11 Layout
11.1 Layout Guidelines
The Relative Humidity sensor element is located on the top side of the package. (GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.
11.2 Layout Example
board pad should NOT be connected to GND. Figure 17. Layout
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
Texas Instruments Humidity Sensors, SNAA216, provides a general description of humidity sensing and important design guidelines.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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www.ti.com 10-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) HDC1050DMBR NRND Production WSON (DMB) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 FE HDC1050DMBR.A NRND Production WSON (DMB) | 6 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 125 FE (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Feb-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) HDC1050DMBR WSON DMB 6 3000 335.0 335.0 32.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 6X 0.45 0.35 2.4 0.1 6X 0.5 0.3 1.5 0.1 4X 1
0.8 MAX
0.05 0.00 (1.2) (1.3) B 3.1 2.9 A 3.1 2.9 (0.2) TYP (0.45) (0.22) (0.9) WSON - 0.8 mm max heightDMB0006A PLASTIC SMALL OUTLINE - NO LEAD 4221225/C 12/2018 PIN 1 INDEX AREA PICK AREA NOTE 4 SEATING PLANE0.08 C 3 4 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4. Pick and place nozzle 0.9 mm or smaller recommended. SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MIN
0.07 MAX
(1.5) 4X (1) (2.8) 6X (0.4) 6X (0.6) (2.4) (R0.05) TYP ( 0.2) TYP (0.95) TYP (1) TYP WSON - 0.8 mm max heightDMB0006A PLASTIC SMALL OUTLINE - NO LEAD 4221225/C 12/2018 SYMM SYMM LAND PATTERN EXAMPLE SCALE:20X NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED)
www.ti.com EXAMPLE STENCIL DESIGN 6X (0.4) 6X (0.6) 4X (1) 2X (1.06) 2X (1.38) (0.63) (2.8) (R0.05) TYP WSON - 0.8 mm max heightDMB0006A PLASTIC SMALL OUTLINE - NO LEAD 4221225/C 12/2018 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 7: 81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X SYMM SYMM METAL TYP
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