Thunderbolt & DisplayPort Differential Switch datasheet
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SLAS827,*]
- PDF pages: 15
Technical content
2:1 pair MUX RPD LSRX LSTX ML1(n)_IN ML1(p)_IN RPU VDD ML1(n)_OUT ML1(p)_OUT CAD_OUT CAD_IN HPD_OUT HPD_IN 3:1 pair MUX 10G(p) 10G(n) 10G_RX1(p) 10G_RX1(n) AUX(p) AUX(n) DDC_SCL DDC_SDA VDD TRI# DP_EN# 10G_EN HD3SS0001 www.ti.com SLAS827 –SEPTEMBER 2013 10.3GbpsThunderbolt™ PortandDisplayPort™ Switch Check for Samples: HD3SS0001 The MUXs are controlled by 4 input pins: TRI#,1FEATURES DP_EN#, 10G_EN, and CAD_IN (cable detect from 23• Compatible with Thunderbolt™ Technology the connector). The HD3SS0001 is packaged in aElectrical Standards and DisplayPort ™ 1.2a small 3x3mm 24-pin QFN, operates from a single
- Wide –3dB Differential Bandwidth of Over 3.3V supply, and supports an ambient temperature range of –40°C to 85°C.10GHz on 10G Path
- Supports DP and DP++ Configurations sp
- Handles HPD (5V tolerant) and Cable Detect FUNCTIONAL DIAGRAM• Supports AUX and DDC MUX
- Excellent Dynamic Characteristics (on 10G path, typical values at 5GHz): – Crosstalk = –35dB – Off-Isolation = –24dB – Insertion Loss = –1.5dB – Return Loss = –20dB – Intra-pair Skew Added < 4ps
- Single 3.3V Power Supply
- Small 3x3mm 24-Pin QFN Package
- Low Power Consumption – 3.3mW Typical Active Power – 80 µW Typical Detect Mode
DESCRIPTION
The HD3SS0001 is a high-speed passive-switch device with integrated buffers and resistors, designed to support Thunderbolt™ technology, DisplayPort, and Dual Mode DisplayPort. The 10G path supports a high 10GHz bandwidth and excellent loss characteristics, while the DisplayPort path supports 5.4Gbps. The integrated 3-pairs to 1-pair multiplexer (3:1 MUX) switches between DDC, AUX, and 10.3Gbps signals. The integrated 2-pairs to 1-pair multiplexer (2:1 MUX) switches between the Thunderbolt™ technology Low Speed UART transmit/receive pair and DisplayPort Main Link 1. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2Thunderbolt is a trademark of Intel Corp. 3DisplayPort is a trademark of VESA Standards Association. PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
10 G _RX1
Thunderbolt™ Controller Pin 2 LSTX LSRX AUX(n) AUX(p) CAD_OUT HPD_OUT
10 G(p)
10 G(n)
10G_RX 1(n) 10G_ RX1(p) DDC_SDA DDC _SCL ML 1(p)_OUT ML 1(n)_OUTML1(n)_IN ML1(p)_IN CAD_IN HPD_IN TRI# DP_EN # 10G _ EN Pin 9 Pin 1 1 Pin 16 Pin 18 mDP / Thunderbolt™ Connector HD3SS0001 Thunderbolt™ Port and DisplayPort™ Switch HD3SS0001 SLAS827 –SEPTEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TYPICAL APPLICATION TRUTH TABLE LOGICAL INPUT TO SET(1) EFFECT MODE 2:1 MUX 3:1 MUX PULL-UP RESISTORTRI# DP_EN# 10G_EN CAD_IN SELECTION(2) SELECTION(2) on 10G(n) 1 1 1 X LS 10G DisconnectedThunderbolt™ Protocol 0 1 1 X LS Tri-stated Disconnected 1 0 0 0 ML AUX Connected DisplayPort 0 0 0 0 Tri-Stated Tri-stated Connected 1 0 0 1 ML DDC Connected TMDS 0 0 0 1 Tri-Stated Tri-stated Connected Detect Mode X 1 0 X LS Tri-Stated Connected [Invalid] X 0 1 X Tri-Stated Tri-Stated Disconnected (1) “X”= Don’t Care. (2) MUX Selection names are abbreviated.
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Product Folder Links :HD3SS0001
(n) 10G (p) G ND M L1(n)_OUT M L1(p)_OUT 10G _RX 1(n) 10G_ RX 1(p) GND ML 1(n)_IN ML 1(p)_IN 24 18 126 TRI# CAD_IN DP_EN# HPD_OUT HPD_IN CAD_OUT 10G_EN LSTX LSRX AUX(n) AUX(p) VDD DDC_SDA DDC_SCL 3:1 2:11 7 8 1 110 20 1923 22 HD3SS0001 www.ti.com SLAS827 –SEPTEMBER 2013 PACKAGE PINOUT (TOP VIEW) MUX PIN MAPPING(1) CONTROLLER-SIDE PIN Connector-Side Pin AUX(n) DDC_SDA 10G(n) 10G_RX1(n) AUX(p) DDC_SCL 10G(p) 10G_RX1(p) ML1(p)_IN ML1(p)_OUT LSTX ML1(n)_IN ML1(n)_OUT LSRX (1) NOTE: The HD3SS0001 can tolerate polarity inversions for the differential signals denoted by the (p) and (n) terminology, to ease potential board routing issues. LSTX/LSRX cannot be swapped, since LSRX is buffered and therefore unidirectional. Also, note that the integrated pullup on 10G(n) and the integrated pulldown on 10G(p) cannot be swapped. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links :HD3SS0001
SLAS827 –SEPTEMBER 2013 www.ti.com PIN FUNCTIONS PIN SYSTEMI/O DESCRIPTIONSIDENO. NAME
11 ML1(p)_IN DisplayPort MainLink1(p) input
10 ML1(n)_IN DisplayPort MainLink1(n) input
24 TRI# Controller Tri-State control (see TRUTH TABLE)
6 DP_EN# I DisplayPort Enable, active-low (see TRUTH TABLE)
15 10G_EN 10.3Gbps Mode Enable (see TRUTH TABLE)
18 CAD_IN Cable Detect
17 HPD_IN Hot Plug Detect
2 AUX(p) AUX Positive Signal
1 AUX(n) AUX Negative Signal
5 DDC_SCL DDC Clock
4 DDC_SDA DDC Data
14 LSTX UART TX Signal
13 LSRX UART RX Signal
22 10G(p) 10G_RX1(p) or AUX(p) or DDC_SCL, with pull-down 23 10G(n) 10G_RX1(n) or AUX(n) or DDC_SDA, with pull-up Connector
19 ML1(p)_OUT DisplayPort MainLink1(p) output or LSTX
20 ML1(n)_OUT DisplayPort MainLink1(n) output or LSRX
8 10G_RX1(p) 10.3Gbps Positive Signal 7 10G_RX1(n) 10.3Gbps Negative Signal O
16 CAD_OUT Cable Detect
Controller12 HPD_OUT Hot Plug Detect
3 VDD Power supply
Power9, 21, SupplyGND Reference groundCenter Pad ABSOLUTE MAXIMUM RATINGS(1) Over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX Supply voltage range(2) VDD –0.5 4 V Differential I/O –0.5 4 Voltage range V Control pin/buffers –0.5 VDD+0.5 Human body model(3) ±1,500 Electrostatic discharge V Charged-device model(4) ±500 Continuous power dissipation See Power Characteristics (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC/ESDA JS-001-2011 (4) Tested in accordance with JEDEC JESD22 C101-E
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www.ti.com SLAS827 –SEPTEMBER 2013 THERMAL INFORMATION over operating free-air temperature range (unless otherwise noted) HD3SS0001 THERMAL METRIC(1) UNITS 24-PIN VQFN (RLL) θJA Junction-to-ambient thermal resistance 41.5 θJCtop Junction-to-case (top) thermal resistance 43.1 θJCbot Junction-to-case (bottom) thermal resistance 6.3 °C/W θJB Junction-to-board thermal resistance 11.2 ψJT Junction-to-top characterization parameter 1.2 ψJB Junction-to-board characterization parameter 11.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. POWER CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX(1) UNIT IDD Supply Current in Active Mode Outputs Floating 1.0 1.3 mA IDETECT Supply Current in Detect Mode DP_EN# = 1, 10G_EN = 0 26 50 µA PD Power Dissipation in Active Mode 3.3 4.7 mW PDetect Power Dissipation in Detect Mode 80 150 µW (1) The maximum ratings are simulated for VDD = 3.6V. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links :HD3SS0001
SLAS827 –SEPTEMBER 2013 www.ti.com RECOMMENDED OPERATING CONDITIONS Typical values for all parameters are at VDD = 3.3V and TA = 25°C. (Temperature limits are specified by design) PARAMETER NOTES/CONDITIONS MIN TYP MAX UNIT VDD Supply voltage 3.0 3.3 3.6(1) V Operating free-airTA –40 85 °Ctemperature CAD_IN, HPD_IN(2), TRI#, DP_EN#, and 10G_EN 2.0 VDD VIH Input high voltage V ML1(n)_OUT (when 2:1 MUX selects LS) 2.0 VDD CAD_IN, HPD_IN(2), TRI#, DP_EN#, and 10G_EN –0.1 0.8 VIL Input low voltage V ML1(n)_OUT (when 2:1 MUX selects LS) –0.1 0.8 CAD_OUT, HPD_OUT 2.7 VDD VOH Output high voltage V LSRX (when 2:1 MUX selects LS) 2.7 VDD(1) CAD_OUT, HPD_OUT 0.0 0.1 VOL Output low voltage V LSRX (when 2:1 MUX selects LS) 0.0 0.1 TRI#, DP_EN#, 10G_EN, CAD_IN, and HPD_IN; 5VDD = 3.6V, VIN = VDDIIH High-level input current µA ML1(n)_OUT; VDD = 3.6V; VIN = VDD (when 2:1 MUX 3.75selects LS) TRI#, DP_EN#, 10G_EN, CAD_IN, and HPD_IN; 100VDD = 3.6V, VIN = GNDIIL Low-level input current nA ML1(n)_OUT; VDD = 3.6V, VIN = GND (when 2:1 MUX 100selects LS) AUX(p)/AUX(n), 10G_RX1(p)/ 10G_RX1(n), ML1(p)_IN/ML1(n)_IN, 10G(p)/10G(n), andVI/O_Diff Differential I/O voltage 0 1.8 VppML1(p)_OUT/ML1(n)_OUT when MUX’s are connected to Differential Signals. AUX(p)/AUX(n), 10G_RX1(p)/10G_RX1(n), Common mode I/O ML1(p)_IN/ML1(n)_IN, 10G(p)/ 10G(n), andVI/O_CM 0 2.0 Vvoltage ML1(p)_OUT/ML1(n)_OUT when MUX’s are connected to Differential Signals. (1) VDD range supports 3.0V to 3.6V, but for Thunderbolt products it is anticipated that the VDD must be maintained at less than or equal to 3.4V to ensure that the VOH on the LSRx do not exceed 3.4V. (2) HPD_IN is 5V tolerant.
ELECTRICAL CHARACTERISTICS
(under recommended operation conditions) PARAMETER CONDITIONS MIN TYP MAX UNIT Thunderbolt™ Technology 10.3Gbps Link: 10G_RX1(p), 10G_RX1(n) (1) RL Differential Return Loss f = 5.0 GHz –20 dB IL Differential Insertion Loss f = 5.0 GHz –1.5 dB OIRR Differential Off Isolation f = 5.0GHz (see Figure 3) –24 dB XTALK Differential Crosstalk f = 5.0 GHz –35 dB BW Bandwidth –3 dB 10 GHz Propagation Delay(from input totPD Rsc and RL = 50 Ω (see Figure 2) 200 psoutput) TSKEW Intra-Pair Skew Added Rsc and RL = 50 Ω (see Figure 2) 4 ps CON Outputs ON Capacitance VI = 0 V, Outputs Open, Switch ON 1.5 pF COFF Outputs OFF Capacitance VI = 0 V, Outputs Open Switch OFF 1 pF RON Output ON resistance VDD = 3.3 V, IO = –15 µA 7.5 Ω On resistance match between pairs ofΔRON VDD = 3.3V; IO = –15 µA 1 Ωthe same channel TON 400Control Line Change to MUX Output See Figure 1 µsSwitchedTOFF 10 (1) These values apply for CAD_IN tri-stated, unless otherwise noted.
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Product Folder Links :HD3SS0001
www.ti.com SLAS827 –SEPTEMBER 2013 ELECTRICAL CHARACTERISTICS (continued) (under recommended operation conditions) PARAMETER CONDITIONS MIN TYP MAX UNIT DisplayPort Link: ML1(p)_IN, ML1(n)_IN RL Differential Return Loss f = 2.7 GHz –16 dB IL Differential Insertion Loss f = 2.7 GHz; VCM = 0 V –0.8 dB OIRR Differential Off-Isolation f = 2.7 GHz (see Figure 3) –20 dB XTALK Differential Crosstalk f = 2.7 GHz –35 dB BW Differential Bandwidth –3 dB 7 GHz Propagation Delay(from input totPD RSC and RL = 50 Ω (see Figure 2) 200 psoutput) TSKEW Intra-pair Skew Added RSC and RL = 50 Ω (see Figure 2) 4 ps CON Outputs ON Capacitance VI = 0 V; Outputs Open; Switch ON 1.5 pF COFF Outputs OFF Capacitance VI = 0 V; Outputs Open; Switch OFF 1 pF VDD = 3.3 V; IO = –15 mA; VCM = 0.5 V to 1.5 V;RON Output ON resistance 6 8 ΩCAD_IN = 0 V On resistance match between pairs ofΔRON VDD = 3.3 V; IO = -15 mA; VCM = 0.5 V to 1.5 V 1 Ωthe same channel TON 400Control Line Change to MUX Output See Figure 1 µsSwitchedTOFF 10 Thunderbolt™ Technology Low Speed UART : LSTX CON Outputs ON capacitance VI = 0 V , Outputs Open, Switch ON 8 pF COFF Outputs OFF capacitance VI = 0 V, Outputs Open, Switch OFF 3 pF VDD = 3 V, VCM = 0 V to 3 V, IO = –1 mARON Output ON resistance 12 19 ΩCAD_IN = 0 V tPD Propagation Delay LSTX to ML1(p)_OUT 200 ps DisplayPort: AUX(p), AUX(n) CON Outputs ON Capacitance VI = 0 V; Outputs Open; Switch ON 6 pF COFF Outputs OFF Capacitance VI = 0 V; Outputs Open; Switch OFF 3 pF VDD = 3.3V; IO = –10 mA; AUX(p) = 0.3 V;RON Output ON resistance 12 ΩAUX(n) = 3.0 V; CAD_IN = 0 V VDD = 3.3 V; IO = –10 mA;On resistance match between pairs ofΔRON 1 Ωthe same channel VCM = 0.5 V to 1.5 V TON 40 msControl line change to Mux output See Figure 2switchedTOFF 10 µs Thunderbolt Technology Low Speed UART : LSRX CON Outputs capacitance 3 pF ZO Output impedance VDD = 3.3 V 60 Ω tPD Propagation delay ML1(n)_OUT to LSRX 3.2 ns tr Rise Time VDD = 3 V 3 ns tf Fall Time VDD = 3 V 3 ns TON 400 µsControl line change to MUX Output See Figure 1SwitchedTOFF 10 µs Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links :HD3SS0001
Figure 1. Control Line Change to Switched Signals
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Figure 2. Propagation Delay and Skew
10 G_EN
Figure 3. Off-Isolation Measurement Setup
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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) HD3SS0001RLLR Active Production VQFN (RLL) | 24 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 3SS001 HD3SS0001RLLR.B Active Production VQFN (RLL) | 24 3000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 3SS001 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2023 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 20-Apr-2023 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) HD3SS0001RLLR VQFN RLL 24 3000 346.0 346.0 33.0 Pack Materials-Page 2
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