HCPL-520X HP

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 12

Technical content

Features

  • Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing
  • Manufactured and Tested on a MIL-PRF-38534 Certified Line
  • QML-38534, Class H and K
  • Four Hermetically Sealed Package Configurations
  • Performance Guaranteed over -55 °C to +125°C
  • Wide VCC Range (4.5 to 20 V)
  • 350 ns Maximum Propaga- tion Delay
  • CMR: > 10,000 V/µs Typical
  • 1500 Vdc Withstand Test Voltage
  • Three State Output Available
  • High Radiation Immunity
  • HCPL-2200/31 Function Compatibility
  • Reliability Data Available
  • Compatible with LSTTL, TTL, and CMOS Logic

Applications

  • Military and Space
  • High Reliability Systems
  • Transportation and Life Critical Systems
  • High Speed Line Receiver CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
  • Isolated Bus Driver (Single Channel)
  • Pulse Transformer Replacement
  • Ground Loop Elimination
  • Harsh Industrial Environments
  • Computer-Peripheral Interfaces

Description

These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DSCC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Qualified Manufac- turers List QML-38534 for Hybrid Microcircuits. Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. The detector has a threshold with hysteresis which provides differ- ential mode noise immunity and eliminates the potential for output signal chatter. The detector in the single channel units has a tri-state output stage Truth Tables (Positive Logic) Multichannel Devices Input Output On (H) H Off (L) L HCPL-520x* 5962-88768 HCPL-523x HCPL-623x HCPL-625x 5962-88769 *See matrix for available extensions. Functional Diagram Multiple Channel Devices Available VCC VO VE GND Single Channel DIP Input Enable Output On (H) H Z Off (L) H Z On (H) L H Off (L) L L A 0.1 µF bypass capacitor must be connected between V CC and GND pins.

Selection Guide–Package Styles and Lead Configuration Options Package 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC Lead Style Through Hole Through Hole Unformed Leads Surface Mount Channels 1 2 4 2 Common Channel None V CC, GND V CC, GND None Wiring Agilent Part # & Options Commercial HCPL-5200 HCPL-5230 HCPL-6250 HCPL-6230 MIL-PRF-38534, Class H HCPL-5201 HCPL-5231 HCPL-6251 HCPL-6231 MIL-PRF-38534, Class K HCPL-520K HCPL-523K HCPL-625K HCPL-623K Standard Lead Finish Gold Plate Gold Plate Gold Plate Soldered Pads Solder Dipped Option #200 Option #200 Butt Cut/Gold Plate Option #100 Option #100 Gull Wing/Soldered Option #300 Option #300 Class H SMD Part # Prescript for all below 5962- 5962- 5962- 5962- Either Gold or Solder 8876801PX 8876901PX 8876903FX 88769022X Gold Plate 8876801PC 8876901PC 8876903FC Solder Dipped 8876801PA 8876901PA 88769022A Butt Cut/Gold Plate 8876801YC 8876901YC Butt Cut/Soldered 8876801YA 8876901YA Gull Wing/Soldered 8876801XA 8876901XA Class K SMD Part # Prescript for all below 5962- 5962- 5962- 5962- Either Gold or Solder 8876802KPX 8876904KPX 8876906KFX 8876905K2X Gold Plate 8876802KPC 8876904KPC 8876906KFC Solder Dipped 8876802KPA 8876904KPA 8876905K2A Butt Cut/Gold Plate 8876802KYC 8876904KYC Butt Cut/Soldered 8876802KYA 8876904KYA Gull Wing/Soldered 8876802KXA 8876904KXA which allows for direct connection to data buses. The output is non- inverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity of up to 10,000 V/µs. Improved power supply rejection eliminates the need for special power supply bypass precautions. Package styles for these parts are 8 pin DIP through hole (case outline P), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limita- tions and are as noted. Addition- ally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s per- formance for die related reliability and certain limited radiation test results.

8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC

Through Hole Through Hole Unformed Leads Surface Mount

1 Channel 2 Channels 4 Channels 2 Channels

Note: Multichannel DIP and flat pack devices have common V CC and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip carrier) package has isolated channels with separate V CC and ground connections. VCC VO VE GND Outline Drawings

16 Pin Flat Pack, 4 Channels

8 Pin DIP Through Hole, 1 and 2 Channel20 Terminal LCCC Surface Mount, 2 Channels

8.13 (0.320) MAX. 5.23 (0.206) MAX. /n00/n00 /n00/n00/n00 /n00/n00/n00 /n00/n00/n00 2.29 (0.090) MAX. 7.24 (0.285) REF. 0.46 (0.018) 0.36 (0.014) 11.13 (0.438) 10.72 (0.422) 2.85 (0.112) MAX. 0.89 (0.035) 0.69 (0.027) 0.31 (0.012) 0.23 (0.009) 0.88 (0.0345) MIN. 9.02 (0.355) 8.76 (0.345) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) 4.95 (0.195) 5.21 (0.205) 8.70 (0.342) 9.10 (0.358) 1.78 (0.070) 2.03 (0.080) 0.51 (0.020) 0.64 (0.025) (20 PLCS) 1.52 (0.060) 2.03 (0.080) METALIZED CASTILLATIONS (20 PLCS) 2.16 (0.085) TERMINAL 1 IDENTIFIER NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX. 1.14 (0.045) 1.40 (0.055) /n00/n00 /n00/n00/n00/n00 /n00/n00 3.81 (0.150) MIN. 4.32 (0.170) MAX. 9.40 (0.370) 9.91 (0.390) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 0.76 (0.030) 1.27 (0.050) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 7.16 (0.282) 7.57 (0.298) NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

Hermetic Optocoupler Options Option Description 100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). 200 Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. 300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads. Leadless Device MarkingLeaded Device Marking *QUALIFIED PARTS ONLY *QUALIFIED PARTS ONLY /n00/n00/n00/n00 /n00/n00/n00 1.14 (0.045) 1.40 (0.055) 4.32 (0.170) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 0.20 (0.008) 0.33 (0.013) /n00/n00/n00 /n00/n00/n00 0.51 (0.020) MIN. 4.57 (0.180) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 9.65 (0.380) 9.91 (0.390) 5° MAX. 4.57 (0.180) MAX. NOTE: DIMENSIONS IN MILLIMETERS (INCHES). COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) A QYYWWZ XXXXXX XXXXXXX XXX XXX 50434 COUNTRY OF MFR. Agilent FSCN* Agilent LOGO DSCC SMD* PIN ONE/ ESD IDENT Agilent P/N DSCC SMD* COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) A QYYWWZ XXXXXX XXXX XXXXXX XXX 50434 DSCC SMD* Agilent FSCN* Agilent LOGO COUNTRY OF MFR. Agilent P/N PIN ONE/ ESD IDENT DSCC SMD*

Single Channel Product Only

8 Pin Ceramic DIP Single Channel Schematic

Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage V CC 4.5 20 V Input Current, High Level, I FH 28 m A Each Channel Input Voltage, Low Level, V FL 0 0.8 V Each Channel Fan Out (TTL Load) N 4 Each Channel Single Channel Product Only High Level Enable Voltage V EH 2.0 20 V Low Level Enable Voltage V EL 0 0.8 V Note enable pin 6. An external 0.01 µF to 0.1 µF bypass capacitor is recommended between VCC and ground for each package type. ESD Classification (MIL-STD-883, Method 3015) ANODE CATHODE

Electrical Characteristics

TA = -55°C to +125°C, 4.5 V ≤ VCC ≤ 20 V, 2 mA ≤ IF(ON) ≤ 8 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. Group A[11] Limit Logic Low Output Voltage V OL IOL = 6.4 mA (4 TTL Loads) 1, 2, 3 0.5 V 1, 3 2 Logic High Output Voltage V OH (**VOH = VCC - 2.1 V) 2, 3 2 IOH = -0.32 mA NA 3.1 Output Leakage Current I OHH VO = 5.5 V I F = 8 mA 1, 2, 3 100 µA2 (VOUT > VCC)V O = 20 V V CC = 4.5 V 500 Single V CC = 5.5 V V F = 0 V 4.5 6 Channel V E = Don't CareLogic Low V CC = 20 V 1, 2, 3 5.3 7.5 Supply I CCL Current Dual V CC = 5.5 V 9.0 12 mA Channel V F1 = VF2 = 0 V VCC = 20 V 10.6 15 Quad V CC = 5.5 V V F1 = VF2 =1 4 2 4 Channel V F3 = VF4 = 0 V VCC = 20 V 17 30 Single V CC = 5.5 V I F = 8 mA 2.9 4.5 Channel V E = Don't Care 1, 2, 3 Logic High V CC = 20 V 3.3 6 Supply I CCH Current Dual V CC = 5.5 V 5.8 9 mA Channel I F1 = VCC = 20 V I F2 = 8 mA 6.6 12 Quad V CC = 5.5 V I F1 = IF2 =9 1 8 Channel V F3 = VF4 = 8 mAVCC = 20 V V F3 =1 1 2 4 IF4 = 8 mA Logic Low Short Circuit V O = VCC = 5.5 V 20 mA Output Current I OSL VF = 0 V 1, 2, 3 2, 3 VO = VCC = 20 V 35 Logic High Short Circuit V CC = 5.5 V I F = 8 mA -10 mA Output Current I OSH VO = GND 1, 2, 3 2, 3VCC = 20 V -25 Input Forward Voltage V F IF = 8 mA 1, 2, 3 1.0 1.3 1.8 V 4 2 Input Reverse BV R IR = 10 µA 1, 2, 3 3 V 2 Breakdown Voltage Input-Output Insulation I I-O VI-O = 1500 Vdc, t = 5s 1 1.0 µA 4, 5 Leakage Current RH = 45%, T A = 25°C Logic High Common Mode |CMH|I F = 2 mA, VCM = 50 VP-P 9, 10, 11 1000 10,000 V/ µs 9 2, 6, Transient Immunity 12 Logic Low Common Mode |CML|I F = 0 mA, VCM = 50 VP-P 9, 10, 11 1000 10,000 V/ µs 9 2, 6, Transient Immunity 12 Propagation Delay Time t PHL 9, 10, 11 173 350 ns 5, 2, 7 to Logic Low 6 Propagation Delay Time t PLH 9, 10, 11 118 350 ns 5, 2, 7 to Logic High 6 IF3 =

Electrical Characteristics Single Channel Product Only TA = -55°C to +125°C, 4.5 V ≤ VCC ≤ 20 V, 2 mA ≤ IF (ON) ≤ 8 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, 2.0 V ≤ VEH ≤ 20 V, 0 V ≤ VEL ≤ 0.8 V, unless otherwise specified. Group A[11] Limits High Impedance State I OZL VO = 0.4 V V EN = 2 V, 1, 2, 3 -20 µA Output Current V F = 0 V VO = 2.4 V 20 µA IOZH VO = 5.5 V 1, 2, 3 100 VO = 20 V 500 Logic High Enable V EH 1, 2, 3 2.0 V Voltage Logic Low Enable V EL 1, 2, 3 0.8 V Voltage Logic High Enable V EN = 2.7 V 20 µA IEH VEN = 5.5 V 1, 2, 3 100 VEN = 20 V 0.004 250 Logic Low Enable I EL VEN = 0.4 V 1, 2, 3 -0.32 mA Current VEN = 2 V, IF = 8 mA *All typical values are at VCC = 5 V, TA = 25°C, IF(ON) = 5 mA unless otherwise specified. Typical Characteristics All typical values are at TA = 25°C, VCC = 5 V, IF(ON) = 5 mA unless otherwise specified. Parameter Symbol Typ. Units Test Conditions Fig. Notes Input Current Hysteresis I HYS 0.07 mA V CC = 5 V 3 2 Δ VFInput Diode Temperature Coefficient –––– -1.25 mV/ °CI F = 8 mA 2Δ TA Resistance (Input-Output) R I-O 1013 Ω VI-O = 500 Vdc 2, 8 Capacitance (Input-Output) C I-O 2.0 pF f = 1 MHz 2, 8 Input Capacitance C IN 20 pF V F = 0 V, f = 1 MHz 2, 10 Output Rise Time (10-90%) t r 45 ns 5, 7 2 Output Fall Time (90-10%) t f 10 ns 5, 7 2 Current

MIL-PRF-38534 Class H, Class K, and DSCC SMD Test Program Agilent’s Hi-Rel Optocouplers are in compliance with MIL-PRF- 38534 Classes H and K. Class H and Class K devices are also in compliance with DSCC drawings 5962-88768 and 5962-88769. Testing consists of 100% screen- ing and quality conformance inspection to MIL-PRF-38534. www.semiconductor.agilent.com Data subject to change. Copyright © 1999 Agilent Technologies, Inc. Obsoletes 5967-6330E 5980-0280E (10/00)