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GENERALPLUS TECHNOLOGY INC. reserves the right to change this documentation without prior notice. Information provided by GENERALPLUS TECHNOLOGY INC. is believed to be accurate and reliable. However, GENERALPLUS TECHNOLOGY INC. makes no warranty for any errors which may appear in this document. Contact GENERALPLUS TECHNOLOGY INC. to obtain the latest version of devi ce specifications before plac ing your order. No responsibility is assumed by GENERALPLUS TECHNOLOGY INC. for any infringement of patent or other rights of third parties which may result from its use. GG L JAN. 19, 2010 Version 1.4 PPYY00002299BB Liinneeaarr RReegguullaattoorr In addition, GENERALPLUS products are not authorized for use as critical components in life s upport devices/systems or aviation devices/systems, where a malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the express written approval of Generalplus.
© Generalplus Technology Inc. Proprietary & Confidential 2 JAN. 19, 2010 Version: 1.4 Table of Contents PAGE
© Generalplus Technology Inc. Proprietary & Confidential 3 JAN. 19, 2010 Version: 1.4 LINEAR REGULATOR 1. GENERAL DESCRIPTION The GPY0029B is a voltage regulator IC with ultra-low quiescent current and low voltage detection by CMOS process. It operates to +7.0V input range and delivers up to 150mA. 2. APPLICATION Battery-powered equipment Hand-held communication equipment Audio/Video system Toys 3. FEATURES Low Quiescent Current (Typ. 3μA @ VOUT = 3.0V/3.3V, VIN = 5.0V) High Current Driving Capability (Typ. 150mA @ VOUT = 3.0V/3.3V, VIN = 5.0V) Over Current Limitation (Typ. 300mA @ VOUT = 3.0V/3.3V, VIN = 5.0V ) Small Dropout Voltage (Typ. 40mV @ VOUT = 3.0V/3.3V, IOUT = 1.0mA) Low Temperature-Drift Coefficient of Output Voltage (Typ. ±50ppm/ Excellent Line Regulation (Typ. 0.15%/V) High Accuracy Output Voltage (±3%) RESET output pin for low VIN and low VOUT detection Only One 10μF Capacitor Required (ESR Range : 0.5 ~ 5 Ω) Three pin Types of Package or Dice Form 4. BLOCK DIAGRAM Voltage reference VIN GND Vref1 Vref 90%Vref OP1 OP2 COMP1 COMP2 PMOS NMOS LVDB VOUT FB 85%Vref RESET
© Generalplus Technology Inc. Proprietary & Confidential 4 JAN. 19, 2010 Version: 1.4 5. SIGNAL DESCRIPTIONS 5.1. 4 PIN Only For Chip On Board (COB) Mnemonic PIN No. PAD No. Type Description RESET 1 5 O Open Drain Reset Output, Low Reset GND 2 4 G Chip Ground VOUT 3 2 O Output Regulated Voltage VIN 4 1 I Input Voltage FB 3 3 I Regulator Feedback Input. FB pad must be bonded to VOUT pin 5.2. 3 PIN (SOT-89) Mnemonic PIN No. Type Description GND 1 G Chip Ground VIN 2 I Input Voltage VOUT 3 O Output Regulated Voltage 5.3. PIN Configuration Customize COB-4pin SOT-89 GPY0029B / 29B-30 COB GPY0029B / 29B-30 123 Customize COB-4pin / 29B-30
© Generalplus Technology Inc. Proprietary & Confidential 5 JAN. 19, 2010 Version: 1.4 5.4. PAD Assignment and Locations VOUT ( 0 , 0 ) GNDRESET VIN FB This IC substrate should be connected to VSS Note1: To ensure IC functions properly, please bond all of VDD and VSS pins. Note2: FB pad must be bonded to VOUT pin in COB or SOT89 package.
© Generalplus Technology Inc. Proprietary & Confidential 6 JAN. 19, 2010 Version: 1.4 6. ELECTRICAL SPECIFICATIONS 6.1. Absolute Maximum Ratings Characteristic Symbol Rating Unit Input Voltage VIN +7.0V V Output Voltage VOUT -0.3 ~ (VIN + 0.3) V Operating Temperature TOPT 0 - 70 ℃ Storage Temperature TSTG -40 - 125 ℃ Power Consumption (#) PWATT 500 mW Note1: Stresses beyond those given in the “Absolute Maximum Ratings” table may cause operational errors or damage to the device. For normal operational conditions, see Electrical Characteristic. Note2: (#) applied to SOT-89 package. Note3: For bonding-wire current density & package power dissipation issues, we highly recommend that the power consumption should not exceed “Absolute Maximum Ratings”; it may cause device damage or affect device reliability. 6.2. DC Characteristic (VIN = 5.0V, VOUT (target) = 3.0V / 3.3V, CIN = COUT = 10μF, Typical values are at TOPT = 25ºC) Item Test Conditions Symbol Min. Typ. Max. Unit GPY0029B 3.0 - 7.0 V Input Voltage GPY0029B-30 VIN 2.7 - 7.0 V GPY0029B 3.2 3.3 3.4 V Output Voltage GPY0029B-30 10μA≦ IOUT ≦150mA VOUT 2.91 3.0 3.09 V Output Current VIN = 3.6V IOUT 150 - - mA Current Limit ILIM 200 300 - mA Load Regulation VIN = 5.0V, 1mA ≦ IOUT ≦ 150mA △VOUT - 40 60 mV Line Regulation IOUT = 1mA, VOUT + 0.5V ≦ V IN ≦ 7.0V VoutΔVin ΔVout - 0.15 - %/V Dropout Voltage IOUT = 1mA, Vin = VOUT (normal), VDIF = VIN - VOUT , VOUT = 3.3V VDIF - 40 60 mV Quiescent Current IOUT = 0 ISS - 3.0 6.0 μA Temperature Coefficient IOUT = 10mA, O C ≦ T OPT ≦ 70 O C , VOUT = 3.3V ΔT ΔVout - ±50 - ppm/℃ Reset Function RESET Output Low Voltage RESET Output Sinking 2mA VOL - 50 100 mV Output High Leakage Current VRESET = 5V IRESET - - 100 nA GPY0029B - 2.87 - V Threshold to Output Voltage GPY0029B-30 Rising edge, referred to VOUT VTHVOUT - 2.65 - V GPY0029B - 2.90 - V Threshold to Input Voltage GPY0029B-30 Falling edge of VIN VTHVIN - 2.65 - V Power-ON Reset Delay Time See Timing Diagram TDPOR - 22 - mS VIN Reset Delay Time See Timing Diagram TDLVIN - - 100 mS VOUT Reset Delay Time See Timing Diagram TDLVOUT 1 - 8 mS Note1: VOUT (normal) @ VIN = 5.0V, IOUT = 1mA, Vout = 3.0V / 3.3V, TOPT = 25 OC Note2: Pwatt = (VIN - VOUT)* IOUT; SOT-89 package maximum power dissipation is 500mW for GPY0029B.
© Generalplus Technology Inc. Proprietary & Confidential 7 JAN. 19, 2010 Version: 1.4 6.3. Typical Operating Characteristics 3.308 3.310 3.312 3.314 3.316 3.318 3.320 3.322 3.324 0 2 04 06 08 0 1 0 0 1 2 0 1 4 0 1 6 0 Output Current (mA) Output Voltage (V) VIN=3.6V VIN=5.0V VIN=6.0V 2.950 3.000 3.050 3.100 3.150 3.200 3.250 3.300 3.350 Intput Voltage (V) Output Voltage (V) Iout=1mA Iout=50mA Iout=150mA 6.3.3. Load transient response; IOUT = 10mA to 150mA 6.3.4. Load transient response; IOUT = 1mA to 50mA (ΔVOUT = 30mV) 6.3.5. Line transient response; IOUT=150mA(VIN=4 to 5V) 6.3.6. Line transient response; IOUT=10mA (VIN=4 to 5V) CH1: IOUT CH2: VOUT CH1: VIN CH2: VOUT CH1: VIN CH2: VOUT CH1: IOUT CH2: VOUT (ΔVOUT = 45mV) CH1: 500mV CH2: 50.0mV M 100μs CH1: 500mV CH2: 20.0mV M 100μs CH1: 500mV CH2: 20.0mV M 100μs CH1: 200mV CH2: 50.0mV M 100μs VIN =4.0V to 5.0V & tr=tf=10μs; IOUT =150mA; COUT=10μF VIN = 5.0V; IOUT =1mA to 50mA & tr=tf=10μs; COUT=10μF (ΔVOUT = 46mV) (ΔVOUT = 32mV) VIN = 5.0V; IOUT =10mA to 150mA & tr=tf=10μs; COUT=10μF VIN =4.0V to 5.0V & tr=tf=10μs; IOUT =10mA; COUT=10μF (ΔVOUT = 5mV) (ΔVOUT = 3mV) (ΔVOUT = 8mV) (ΔVOUT = 8mV)
© Generalplus Technology Inc. Proprietary & Confidential 8 JAN. 19, 2010 Version: 1.4 6.4. Application Circuit 6.4.1. PIN (with Reset Function) Note: FB pad must be bonded to VOUT pin in COB. VOUT VIN / FB RESETGND 6.4.2. PIN (no Reset Function) GPY0029B / 29B-30 VIN VOUT GND 10μF 10μF VIN GND VOUT Note: FB pad must be bonded to VOUT pin in COB or SOT89 package. VOUT VIN / FB GND
© Generalplus Technology Inc. Proprietary & Confidential 9 JAN. 19, 2010 Version: 1.4 6.5. Reset Timing Diagram VIN t VOUT RESET t t TDPOR 3.3V VTHVIN VTHVIN+0.15V VTHVOUT+0.05V VTHVOUT TDLVOUT TDLVINTDLVIN Note: When power on, Low VIN threshold voltage is VTHVIN.
© Generalplus Technology Inc. Proprietary & Confidential 10 JAN. 19, 2010 Version: 1.4 7. PACKAGE/PAD LOCATIONS 7.1. Ordering Information Product Number Output Voltage (V) Package Type Package Marking GPY0029B - C 3.3 Chip form (VOUT = 3.3V ±3%) N/A GPY0029B - 30 - C 3.0 Chip form (VOUT = 3.0V ±3%) N/A GPY0029B - HE011 3.3 Package form - SOT89 (VOUT = 3.3V ±3%) Y0029B GPY0029B - 30 - HE011 3.0 Package form - SOT89 (VOUT = 3.0V ±3%) Y29B30 GPY0029B - EE011 3.3 Package form (Tape & reel) - SOT89 (VOUT = 3.3V ±3%) Y0029B GPY0029B - 30 - EE011 3.0 Package form (Tape & reel) - SOT89 (VOUT = 3.0V ±3%) Y29B30
© Generalplus Technology Inc. Proprietary & Confidential 11 JAN. 19, 2010 Version: 1.4 7.2. Package Information 7.2.1. 3 PIN SOT89 package size D H EL C POLISHED(2X) e A 100(2X) B Symbol Min. Max. Unit A 1.40 1.60 Millimeter B 0.44 0.56 Millimeter B1 0.36 0.48 Millimeter C 0.35 0.44 Millimeter D 4.40 4.60 Millimeter D1 1.35 1.83 Millimeter E 2.29 2.60 Millimeter H 3.94 4.25 Millimeter e 1.50 BSC Millimeter e1 3.00 BSC Millimeter L 0.89 1.2 Millimeter
© Generalplus Technology Inc. Proprietary & Confidential 12 JAN. 19, 2010 Version: 1.4 7.2.2. 4-PIN Chip On Board (COB) bonding diagram GPY0029B / 29B-30 Pin: 4 (VIN) Pin: 3 (VOUT) Pin: 2 (GND) Pin: 1 (RESET) 7.3. Storage Condition and Period for Package Package Moisture sensitivity level Max. Reflow temperature Floor life storage condition Dry pack SOT LEVEL 3 220 +5/-0℃ N/A No Note1: Please refer to IPC/JEDEC standard J-STD-020A and EIA JEDEC stand JFSD22-A112. Note2: or refer to the “CAUTION Note” on dry pack bag. 7.4. Recommended SMT Temperature Profile This “Recommended” temperature profile is a rough guideline for SMT process reference. Most of GENERALPLUS lead-frame base products choose Matte Tin and Sn/Bi for plating recipe. For PPF (Pre-Plated Frame) product with 63/37 solder paste, we recommend 240 ~245℃℃ for peak temperature.
© Generalplus Technology Inc. Proprietary & Confidential 13 JAN. 19, 2010 Version: 1.4 8. HTOL TEST RESULT Check Point ( 168hrs; 500hrs; 1000hrs ) Package Type 168hrs 500hrs 1000hrs COB4 77pcs sample are all passed 77pcs sample are all passed 77pcs sample are all passed SOT89 77pcs sample are all passed 77pcs sample are all passed 77pcs sample are all passed Note1: Testing Conditions: VIN=5.0V, VOUT=3.3V, IOUT=150mA, Temp=125℃. Note2: Testing Method: Reference to MIL-STD-883E method 1005.8. Note3: COB Material: Hysol EO1016.
© Generalplus Technology Inc. Proprietary & Confidential 14 JAN. 19, 2010 Version: 1.4 9. DISCLAIMER The information appearing in this publication is believed to be accurate. Integrated circuits sold by Generalplus Technology are covered by the warranty and patent indem nification provisions stipulated in the terms of sale only. GENERALPLUS makes no warranty, express, statutory implied or by description regarding the information in t his publication or regarding the freedom of the described chip(s) from patent infringem ent. FURTHERMORE, GENERALPLUS MAKES NO WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. GENERALPLUS reserves the right to halt production or alter the specifications and prices at any time without notice. Acco rdingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. Products described herein are intended for use in normal co mmercial applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical lif e support equipment, are specifically not recommended without additional proc essing by GENERALPLUS for such applications. Please note th at application circuits illustrated in this document are for reference purposes only.
© Generalplus Technology Inc. Proprietary & Confidential 15 JAN. 19, 2010 Version: 1.4 10. REVISION HISTORY Date Revision # Description Page JAN. 19, 2010 1.4 1. Modify Block Diagram in section 4. 3. Modify Application Circuit in section 6.4. JUN. 20, 2007 1.2 1. Modify the diagram in section 5.3. 2. Add VOUT = 3.0V specification in section 6.2. 4. Modify Order Information in section 7.2. 5. Modify HTOL TEST RESULT in section 8. DEC. 26, 2006 1.1 1. Modify the figure in section 6.3.2. 2. Add “4 PIN Chip On Board (COB) Bonding Diagram” in section 7.3.2. NOV. 15, 2006 1.0 Original 14