G5U2596M GTM
Document overview
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Technical content
Features
&3.3V, 5.0V, 12V and adjustable output versions &Guaranteed 3A output current &Operating voltage can be up to 22V &150kHz fixed frequency internal oscillator &Built-in TTL On/Off control &TTL Shutdown Capability &Uses readily available standard inductors &Thermal shutdown and current limit protection
Applications
&High-efficiency step-down regulator &One-ch switching regulators simple &Positive to negative converter Package Dimensions A 4.40 4.80 c2 1.25 1.45 b 0.66 0.91 L2 1.27 REF. L4 0.00 0.30 B D 8.6 9.0 c 0.36 0.5 e 1.70 REF. L1 2.29 2.79 L 14.6 15.8 E 9.80 10.4 0˚ 8˚ Block Diagram
G5U2596M Page: 2/6 ISSUED DATE :2005/12/26 REVISED DATE :2006/05/17C Pin Function Pin Name Pin# Function VIN 1 This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be present at this pin to minimize voltage transients and to supply the switching current needed by regulator. Output 2 Internal switch. The voltage at this pin switches between (+VIN - VSAT) and approximately -0.5V, with a duty cycle of approximately VOUT/VIN. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin should be keep to a minimum. Ground 3 Circuit ground Feedback(FB) 4 Senses the regulated output voltage to complete the feedback loop. ON/OFF(SD) Allows the switching regulator circuit to be shutdown using logic level signals. Thus drop the total input supply current to approximately 150A. Pulling this pin below a threshold voltage of approximately 1.3V turns the regulator on, and pulling this pin above 1.3V (up to a maximum of 18V) shuts the regulator down. If this shutdown feature is not needed, ON/OFF pin can be wired to the ground pin. Absolute Maximum Ratings Parameter Symbol Ratings Unit Supply Voltage VCC 24 V ON/OFF Pin Input Voltage VSD -0.3 ~ +18 V Feedback Pin Voltage VFB -0.3 ~ +18 V Output Voltage to ground VOUT -1 V Power Dissipation PD Internally Limited W Storage Temperature TST -65 ~ +150 : Operating temperature TOP -40 ~ +125 : Operating Voltage VOP +4.5 ~ +22 V Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 :. Parameter Symbol Conditions Min Typ Max Unit Output Feedback VFB 5 VIN 22V, 0.2A ILOAD 3A Efficiency VIN=12V, ILOAD=3A, VOUT=3V 74 % Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 :. Parameter Symbol Conditions Min Typ Max Unit Output Feedback VFB 5.5V VIN 22V Efficiency VIN=12V, ILOAD=3A 75 % Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 :. Parameter Symbol Conditions Min Typ Max Unit Output Feedback VFB 8V VIN 22V Efficiency VIN=12V, ILOAD=3A 80 % Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 :. Parameter Symbol Conditions Min Typ Max Unit Output Feedback VFB 15V VIN 22V Efficiency VIN=16V, ILOAD=3A 89 %
G5U2596M Page: 3/6 ISSUED DATE :2005/12/26 REVISED DATE :2006/05/17C All Output Voltage Version Electrical Characteristics Specifications in boldface type are for full operating temperature range. The other type are for TJ=25 :. Parameter Symbol Conditions Min Typ Max Unit Feedback bias current IFB VFB=1.3V (adjustable version only) - -10 -50/-100 nA Oscillator frequency FOSC 127/110 150 173/173 kHz Oscillator frequency of short circuit protect FSCP When current limit occurred and VFB<0.5V, TA=25 :. 5 15 25 kHz Saturation voltage VSAT ILOAD=3A No outside circuit VFB=0V force drive on - 1.4 1.6/1.7 V Max. duty cycle (ON) VFB=0V force drive on - 100 - Max. duty cycle (OFF) DC VFB=12V force drive off - 0 - % Current limit ICL Peak current No outside circuit VFB=0V force drive on 3.6 4.5 5.5/6.5 A Output=0V, No outside circuit VFB=12V force drive off - - -200 uA Output leakage current IL Output=-1V, VIN=22V - -5 - mA Quiescent current IQ VFB=12V force drive off - 5 10 mA VIL Low (Regulator ON) - -
0.6 ON/OFF pin logic input
Threshold Voltage VIH High (Regulator OFF) 2.0 - - V ON/OFF pin Logic input current IH V LOGIC=2.5V ( Regulator OFF) - - -0.01 ON/OFF pin input current IL V LOGIC=0.5V ( Regulator ON) - -0.1 -1 uA Standby quiescent current ISTBY ON/OFF pin=5V, V IN=12V - 150 200 uA JC Junction to Case - 3.5 - Thermal Resistance JA Junction to Ambient with copper area of approximately 3 in2 - 23 - :/W Unless otherwise specified, VIN=12V for 3.3V, 5V, adjustable version and VIN=18V for the 12V version. ILOAD=0.5A Function Description The TO-263 surface mount package tab was designed to be soldering to the copper on printed circuit board. The copper and the board are the heat sink for this package and the other heat producing components, such as the catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.8in , and ideally should have 2 or more square inches of 2 oz. Additional copper area improves the thermal characteristics, but with copper area greater than approximately 6in , only small improvements in heat dissipation are realized. If further thermal improvements are needed, double sided, multi-layer PC board with large copper areas and/or airflow will be recommended. The G5U2596M junction temperature rises above ambient temperature with a 2A load for various input and output voltages. This data was taken with the circuit operating as a buck-switching regulator with all components mounted on a PC board to simulate the junction temperature under actual operating conditions. This curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature. When load current higher than 3A are used, double sided or multi-layer PC boards with lager copper areas and/or airflow might be needed, especially for high ambient temperatures and high output voltages. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further. Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors will affect these numbers. Some of these factors include board size, shape, thickness, position, location and even board temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer board and the amount of solder on the board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board, as well as the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board.
G5U2596M Page: 4/6 ISSUED DATE :2005/12/26 REVISED DATE :2006/05/17C Typical Application Circuit (1)Fixed Type Circuit (2)Adjustable Type Circuit (3)Delay Start Circuit
G5U2596M Page: 5/6 ISSUED DATE :2005/12/26 REVISED DATE :2006/05/17C Typical Performance Characteristics
G5U2596M Page: 6/6 ISSUED DATE :2005/12/26 REVISED DATE :2006/05/17C Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165