FP1007R6 ETC2

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • Halogen free, lead free, RoHS compliant
  • 125°C Maximum total temperature operation
  • 10.5 x 8.0 x 7.0mm Maximum surface mount package
  • Ferrite core material
  • Controlled DCR tolerance for sensing circuits
  • Inductance Range from 150nH to 470nH
  • Current range from 23.5 to 75 Amps
  • Frequency range up to 2MHz High Current, High Frequency, Pow er Inductors Flat-Pac™ FP1007R6 Series

0912 BU-SB12795 Page 1 of 4 Data Sheet: 10007

Applications

  • Multi-phase regulators
  • Voltage Regulator Modules (VRMs)
  • Desktop and server VRMs and EVRDs
  • Notebook regulators
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules
  • DCR Sensing Environm ental D ata
  • Storage temperature range: -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Packaging
  • Supplied in tape-and-reel packaging, 700 parts per 13 inch diameter reel Product Specifications Part OCL 1 ±10% FLL 2 Min. Irms 3 Isat 14 @25°C Isat 25 @100°C DCR @20°C Number 7 (nH) (nH) (Amps) (Amps) (Amps) (m Ω) K-Factor 6 FP1007R6-R15-R 150 108 75.0 60.0 FP1007R6-R18-R 180 129 60.0 50.0 FP1007R6-R22-R 220 158 50.0 40.0 FP1007R6-R27-R 270 194 61 41.0 33.0 0.29 ± 5% 348.8 FP1007R6-R33-R 330 237 33.0 26.5 FP1007R6-R39-R 390 280 28.0 22.5 FP1007R6-R47-R 470 338 23.5 19.0 1. Open Circuit Inductance (OCL) T est Parameters: 100kHz, 0.10V rms , 0.0Adc 2. Full Load Inductance (FLL) T est Parameters: 100kHz, 0.1V rms , I sat 1 3. Irms : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat 1: Peak current for approximately 20% rolloff at +25°C. 5. Isat 2: Peak current for approximately 20% rolloff at +100°C. 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10 -3 . B p-p :(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007R6-Rxx-R FP1007R6 = Product code and size Rxx= Inductance value in uH, R = decimal point -R suffix = RoHS compliant

0912 BU-SB12795 Page 2 of 4 Data Sheet: 10007

24.0 ±0.30 1.75 11.5 1.5 dia 1.5 dia 4.0 2.0 8.1 12.0 7.1 10.60 A A SECTION A-A Supplied in T ape-and-Reel packaging, 700 parts per 13 inch diameter reel. The nominal DCR is measured from point "A" to point "B" Part Marking: Coiltronics Logo, 1007R6, Rxx = Inductance value in µH. (R = Decimal point) wwllyy = Date code R = Revision level T olerance are ±0.15mm unless otherwise specified. Soldering surfaces to be coplanar within 0.1016mm. PCB tolerance ±0.1mm unless otherwise specified. Packaging Inform ation - m m Temperature Rise (°C) Total Loss (W) Tem perature R ise vs. Total Loss D im ensions - m m

0912 BU-SB12795 Page 3 of 4 Data Sheet: 10007

20% 40% 60% 80% 100% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of OCL % of Isat1 % of OCL vs. Isat1 -40°C +100°C +25°C 0.00001 0.0001 0.001 0.01 0.1 100 1000 10000 Core Loss (W) Bp-p (Gauss) Core Loss vs. Bp-p 100kHz 200kHz 500kHz1MHz 300kHz Inductance C haracteristics

© 2012 C ooper B ussm ann w w w .cooperbussm ann.com

0912 BU-SB12795 Page 4 of 4 Data Sheet: 10007

t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) Volume Vo lume Package mm 3 mm3 Thickness <3 50 > _350 <2.5mm 2 35°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Vo lume Vo lume Package mm 3 mm3 mm3 Thickness <3 50 3 50 - 2000> 2 000 <1.6mm 2 60°C 2 60°C 2 60°C 1.6 – 2 .5mm 2 60°C 2 50°C 2 45°C >2.5mm 2 50°C 2 45°C 2 45°C Reference JDEC J-STD-020D Profile Feature S tandard SnPb Solder Le ad (Pb) Free Solder Preheat and Soak • Tem perature min. (Tsmin)1 0 0 ° C 1 5 0 ° C

  • Temperature max. (Tsmax)1 5 0 ° C 2 0 0 ° C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Se conds Average ramp up rate Tsmax to Tp 3°C/ Se cond Max. 3°C/ Se cond Max. Liquidous temperature (TL)1 8 3 ° C 2 1 7 ° C Time at liquidous (tL) 60-150 Seconds 60-150 Se conds Peak package body temperature (TP)* Tab le 1 T able 2 Time (tp) within 5 ° C of the specified classification temperature (Tc) 20 Second s 30 Se conds** Average ramp-down rate (Tp to Tsmax)6 ° C/ Second Max. 6°C/ Se cond Max. Time 25° C to Peak Temperature 6 M inutes Max. 8 M inutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. N orth Am erica Cooper Electronic T echnologies

1225 Broken Sound Parkway NW

Boca Raton, FL 33487-3533 T el: 1-561-998-4100 Fax: 1-561-241-6640 T oll Free: 1-888-414-2645 Cooper Bussmann P .O. Box 14460 St. Louis, MO 63178-4460 T el: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic T echnologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK T el: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic T echnologies Avda. Santa Eulalia, 290 08223 T errassa, (Barcelona), Spain T el: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic T echnologies

1 Jalan Kilang Timor

#06-01 Pacific T ech Centre Singapore 159303 T el: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.