F2970

F2970 RENESAS

Document overview

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Technical content

Features

Low Insertion Loss: 0.32 dB @ 1200 MHz High Isolation: 70 dB @ 1200 MHz (RF1/RF2 to RFC) Excellent Linearity: IIP3 of 63 dBm Selectable Logic Control Operating Temperature: -40 °C to +105 °C 4 mm x 4 mm 20-pin LQFN package Block Diagram Figure 1. Block Diagram

Table 1. Pin Descriptions GND Ground these pins as close to the device as possible. 16 C2 Control pin to set switch state. See Table 8. 17 C1 Control pin to set switch state. See Table 8. vias are also required to achieve the specified RF performance.

conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings

Table 3. Recommended Operating Conditions Figure 3. Maximum RF Input Operating Power vs. RF Frequency

© 2016 Integrated Device Technology, Inc. 5 November 11, 2016

Electrical Characteristics

Table 4. Electrical Characteristics Typical Application Circuit: VDD = 3.0 V, TC = +25 °C, F RF = 1200 MHz, Driven Port = RF1 or RF2, Input Power = 0 dBm, Z S = ZL = 75 ohms. PCB board trace and connector losses are de-embedded unless otherwise noted. a. Items in min/max columns in bold italics are Guaranteed by Test. b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization. esult if logic high level is below VDD and down to VIH min.

© 2016 Integrated Device Technology, Inc. 6 November 11, 2016 Table 5. Electrical Characteristics Typical Application Circuit: VDD = 3.0 V, TC = +25 °C, F RF = 1200 MHz, Driven Port = RF1 or RF2, Input Power = 0 dBm, Z S = ZL = 75 ohms. PCB board trace and connector losses are de-embedded unless otherwise noted. a. Items in min/max columns in bold italics are Guaranteed by Test. b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization. section and Figure 3 for the maximum operating power levels. f. Minimum time required between switching of states = 1/ (Maximum Switching Rate).

Table 6. Package Thermal Characteristics Junction to Case Thermal Resistance. All temperatures are referenced to the exposed paddle. Evaluation Kit traces and connector losses are de-embedded.

Figure 28. Electrical Schematic

Table 7. Bill of Material (BOM)

1 Printed Circuit Board F2970 EVKIT REV 01 IDT

Control pins do not include internal pull-down resistors to logic LOW or pull-up resistors to logic HIGH. minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail. 0.3V) while the supply voltage ramps or while it returns to zero. at the input of each control pin is recommended. This applies to control pins 16 & 17 as shown below. Figure 29. Control Pin Interface Schematic

© 2016 Integrated Device Technology, Inc. 16 November 11, 2016 External Supply Setup Set up a VCC power supply in the voltage range of 2.7 V to 3.6 V with the power supply output disabled. Logic Control Setup External logic control is applied to J8 CTL1 (pins 5 and 7) and CTL2 (pins 9 and 11). See Table 8 for the logic truth table. Turn On Procedure Setup the supplies and EVKIT as noted in the External Supply Setup and Logic Control Setup sections above. Enable the VCC supply. Set the desired logic setting to achieve the desired configuration (see Table 8). Note that external control logic should not be applied without VCC being present. Turn Off Procedure Set the logic control to a logic low. Disable the VCC supply.

Figure 30. Package Outline Drawing

Figure 31. Recommended Land Pattern

© 2016 Integrated Device Technology, Inc. 19 November 11, 2016

Ordering Information

Orderable Part Number Package MSL Rating Shipping Packaging Temperature F2970NCGK 4.00 x 4.00 x 0.75 mm LQFN MSL1 Bulk -40° to +105°C F2970NCGK8 4.00 x 4.00 x 0.75 mm LQFN MSL1 Tape and Reel -40° to +105°C F2970EVBI Evaluation Board Marking Diagram 1. Line 1 and 2 are the part number. 2. Line 3 - “ZE” are for die version. 3. Line 3 - “YWW” is last digit of the year plus work week. 4. Line 3 - “PBG” denotes the production process.

6024 Silver Creek Valley Road

San Jose, CA 95138 www.IDT.com Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales Tech Support www.IDT.com/go/support D ISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary . All contents of this document are copyright of Int egrated Device Technology, Inc. All rights reserved F2970 Datasheet © 2016 Integrated Device Technology, Inc. 20 November 11, 2016

Revision History

Revision Revision Date Description of Change O 2016-November-10 Initial Release

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