F2933

F2933 RENESAS

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Technical content

High Reliability SP2T RF Switch 50 MHz to 8000 MHz F2933, Rev O 05/04/2016 1 GENERAL DESCRIPTION The F2933 is a high reliability, low insertion loss, 50 Ω SP2T absorptive RF switch designed for a multitude of wireless and other RF applications. This device covers a broad frequency range from 50 MHz to 8000 MHz. In addition to providing low insertion loss, the F2933 also delivers high linearity and high isolation performance while providing a 50 Ω termination to the unused RF input port. The F2933 uses a single positive supply voltage of 2.7 V to 5.5 V supporting three states using either 3.3 V or 1.8 V control logic. COMPETITIVE ADVANTAGE The F2933 provides the following advantages Insertion Loss = 0.79 dB* RFX to RFC Isolation = 67 dB* IIP3 = +64 dBm* Active Port Operating Power Handling = 34 dBm Term Port Operating Power Handling = 27 dBm Extended Temperature Range = -40°C to 105°C * 2 GHZ

APPLICATIONS

• Base Station 2G, 3G, 4G
• Portable Wireless
• Repeaters and E911 systems
• Digital Pre-Distortion
• Point to Point Infrastructure
• Public Safety Infrastructure
• WIMAX Receivers and Transmitters
• Military Systems, JTRS radios
• RFID handheld and portable readers
• Test / ATE Equipment

FEATURES

• High Isolation: o 70 dB @ 1 GHz o 67 dB @ 2 GHz o 65 dB @ 3 GHz o 66 dB @ 4 GHz
• High Linearity: o IIP2 of 111 dBm o IIP3 of 64 dBm @ 2 GHz
• Wide Single Positive Supply Voltage Range
• 3.3 V and 1.8 V compatible control logic
• Operating temperature -40 °C to +105 °C
• 4 mm x 4 mm 16 pin QFN package FUNCTIONAL BLOCK DIAGRAM Control Circuit VDD VCTL RFC RF1 RF2 50Ω 50Ω

ORDERING INFORMATION

Tape & Reel

High Reliability SP2T RF Switch 2 F2933, Rev O 05/04/2016 ABSOLUTE MAXIMUM RATINGS Parameter / Condition Symbol Min Max Unit VDD to GND VDD -0.3 +6.0 V VCTL to GND Vlogic -0.3 Lower of 3.6, VDD+0.3 V RF1, RF2, RFC to GND VRF -0.3 +0.3 V RF Input Power 1 RF1 or RF2 as an input (Connected to RFC) PRF12 36 dBm RFC as an input (Connected to RF1 or RF2) PRFC 36 RF1 or RF2 as input (Terminated states) PRF12_TERM 30 Maximum Junction Temperature TJmax +140 °C Storage Temperature Range TST -65 +150 °C Lead Temperature (soldering, 10s) TLEAD +260 °C ESD Voltage– HBM (Per JESD22-A114) VESDHBM Class 2 (2000V) ESD Voltage – CDM (Per JESD22-C101) VESDCDM Class C3 (1000V) N ote 1: VDD = 2.7 V to 5.5 V, 50 MHz ≤ FRF ≤ 8000 MHz, Tc= 105 ºC, ZS = ZL = 50 ohms. Note 2: Each port. Stresses above those listed above may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL AND MOISTURE CHARACTERISTICS θJA (Junction – Ambient) 60 °C/W θJC (Junction – Case) The Case is defined as the exposed paddle 3.9 °C/W Moisture Sensitivity Rating (Per J-STD-020) MSL1

F2933, Rev O 05/04/2016 3 High Reliability SP2T RF Switch F2933 RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min Typ Max Units Supply Voltage VDD 2.7 5.5 V Operating Temp Range T CASE Exposed Paddle Temperature -40 +105 OC RF Frequency Range F RF 50 8000 MHz RF Continuous Input CW Power (Non-Switched) 1 PRF RFC connected to RF1 or RF22 TC = 85 ºC 34 dBm TC = 105 ºC 34 RF1/ RF2 Input Terminated State3,4 TC = 85 ºC 27 TC = 105 ºC 27 RF Continuous Input Power (RF Hot Switching CW) PRFSW RFC Input, switching between RF1 and RF2 T C = 85 ºC 30 dBm TC = 105 ºC 30 RF1 or RF2 as input, switched between RFC and Term. T C = 85 ºC 27 TC = 105 ºC 27 RF1/2 Port Impedance Z RFx 50 Ω RFC Port Impedance Z RFC 50 Note 1: Levels based on: VDD = 3.1 V to 5.5 V, 50 MHz ≤ FRF ≤ 8000 MHz, ZS = ZL = 50 ohms. See Figure 1 for power handling derating vs. RF frequency. Note 2: Input could be: RFC, RF1, or RF2 (applied to only one input). Note 3: Any RF1 / RF2 termination state. Power level specified is for each port. Note 4: Power level specified is for each port. Figure 1: Maximum RF Input Operating Power vs. RF Frequency

High Reliability SP2T RF Switch 4 F2933, Rev O 05/04/2016 F2933 SPECIFICATION Typical Application Circuit, VDD = 5.0 V, TC = +25 °C, FRF = 2000 MHz, Driven Port = RF1 or RF2, input power = 10 dBm, ZS = ZL = 50 ohms, PCB board trace and connector losses are de-embedded unless otherwise noted. Parameter Symbol Condition Min Typ Max Units Logic Input High Threshold V IH 1.1 Lower of (3.6, VDD) V Logic Input Low Threshold V IL -0.3 0.6 V Logic Current IIH, IIL For each control pin -1 +1 µA DC Current IDD VDD =3.3 V 200 260 1 µA VDD =5.0 V 260 325 Insertion Loss RFC to RF1 / RF2 IL 50 MHz 0.68 dB 1 GHz 0.73 2 GHz 0.79 1.1 3 GHz 0.82 4 GHz 0.93 6 GHz 1.06 8 GHz 1.6 Isolation RFC to RF1 / RF2 ISOC

50 MHz 77

d B

1 GHz 68 70

2 GHz 63 67

3 GHz 62 65

4 GHz 60 66

6 GHz 53 63

8 GHz 45

50 MHz 86

1 GHz 64

2 GHz 58

3 GHz 54

4 GHz 51

6 GHz 45

8 GHz 37

RFC, RF1, RF2 RF RL

50 MHz 25

1 GHz 25

2 GHz 23

3 GHz 24

4 GHz 20

6 GHz 18

8 GHz 14

RF1, RF2 Terminated RFRLTERM

50 MHz 40

1 GHz 31

2 GHz 35

3 GHz 23

4 GHz 17

6 GHz 19

8 GHz 22

N ote 1: Items in min/max columns in bold italics are Guaranteed by Test. Note 2: Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization.

F2933, Rev O 05/04/2016 5 High Reliability SP2T RF Switch F2933 SPECIFICATION (CONT.) Typical Application Circuit, VDD = 5.0 V, TC = +25 °C, FRF = 2000 MHz, Driven Port = RF1 or RF2, input power = 10 dBm, ZS = ZL = 50 ohms, PCB board trace and connector losses are de-embedded unless otherwise noted. Parameter Symbol Condition Min Typ Max Units Input 1dB Compression3 ICP 1dB 50 MHz 33.2 dBm 1 GHz 35.5 2 GHz 36.5 3 GHz 36.1 4 GHz 35.3 Input 0.1dB Compression3 ICP0.1dB VDD = 5.0 V 50 MHz 30.4 dBm 2 GHz 32.3 3 GHz 32.6 4 GHz 32.2 VDD = 3.1 V 50 MHz 30.1 2 GHz 32.1 3 GHz 32.6 4 GHz 32.1 Input IP2 IIP2 FRF1 = 2000 MHz, FRF2 = 1990 MHz RFIN = RF1 or RF2 PIN = +20 dBm / tone FIP2 =FRF1 + FRF2 111 dBm Input IP3 IIP3 RF Input = RF1 or RF2 PIN = +15 dBm/tone ∆ F = 1 MHz

50 MHz 58

2 GHz 64

2.5 GHz 63.4 4 GHz 63.6 Non-RF Driven Spurious4 At any RF port when externally terminated into 50 Ω -114 dBm Switching Time5 TSW 50% control to 90% RF 210 ns 50% control to 10% RF 115 50% control to RF settled to within +/- 0.1 dB of I.L. value 225 Maximum Switching Rate6 SW RATE 25 kHz Maximum Video Feed- through on RF Ports VIDFT

5 MHz to 1000 MHz

Measured with 20 ns risetime, 0 to 3.3 V control pulse 12 mVpp N ote 1: Items in min/max columns in bold italics are Guaranteed by Test. Note 2: Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization. Note 3: The input 1 dB compression point is a linearity figure of merit. Refer to the Recommended Operating Conditions section for the specified maximum operating power levels. Note 4: Spurious due to on-chip negative voltage generator. Typical generator fundamental frequency is 5.2 MHz. Note 5: F RF = 1 GHz. Note 6: Minimum time required between switching of states = 1/ (Maximum Switching Rate).

High Reliability SP2T RF Switch 6 F2933, Rev O 05/04/2016 Control Mode Table 1 - Switch Control Truth Table V CTL RFC to RF1 RFC to RF2

0 ON OFF

1 OFF ON

TYPICAL OPERATING CONDITIONS (TOC) U nless otherwise noted for the TOC graphs on the following pages, the following conditions apply.

• VDD= 3.3 V
• TC = +25 °C (TC = Temperature of Exposed Paddle)
• FRF = 2000 MHz
• ZS = ZL = 50 Ω
• PIN = +10 dBm for all small signal tests.
• PIN = +15 dBm/tone applied to RF1 or RF2 port for two tone linearity tests.
• Two tone frequency spacing = 1 MHz.
• RF1 or RF2 is the driven RF port and RFC is the output port.
• All unused RF ports terminated into 50 ohms.
• For Insertion Loss and Isolation plots, RF trace and connector losses are de-embedded (see EVKIT Board and Connector loss plot).
• Plots for Isolation and Insertion Loss over temperature and voltage are for a typical path. For performance of a specific path, refer to the online S-Parameter file.

F2933, Rev O 05/04/2016 7 High Reliability SP2T RF Switch TYPICAL OPERATING CONDITIONS (- 1 -) R F1 to RFC Insertion Loss RF1 Port Match [On State] RF1 Port Match [Terminated State] RF2 to RFC Insertion Loss RF2 Port Match [On State] RF2 Port Match [Terminated State] -1.5 -0.5 0 1 2 3 4 5 6 7 8 Insertion Loss (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 Match (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 Match (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -1.5 -0.5 0 1 2 3 4 5 6 7 8 Insertion Loss (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 Match (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 Match (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C

High Reliability SP2T RF Switch 8 F2933, Rev O 05/04/2016 TYPICAL OPERATING CONDITIONS (- 2 -) R FC Port Match [RF1 On State] RF1 to RFC Isolation [RF2 On State] RF1 to RF2 Isolation [RF1 On State] RFC Port Match [RF2 On State] RF2 to RFC Isolation [RF1 On State] RF2 to RF1 Isolation [RF2 On State] -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 Match (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 5 6 7 8 Isolation (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 5 6 7 8 Isolation (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 Match (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 5 6 7 8 Isolation (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 5 6 7 8 Isolation (dB) Frequency (GHz) 2.7V, 25C 3.3V, 25C 5.0V, 25C 5.5V, 25C 2.7V, 105C 3.3V, 105C 5.0V, 105C 5.5V, 105C

F2933, Rev O 05/04/2016 9 High Reliability SP2T RF Switch TYPICAL OPERATING CONDITIONS (- 3 -) E VKIT PCB and Connector Thru Loss Input IP3 RF1 Port [TC operating = -40C to 105C] Input P1dB [1GHz] [TC operating = -40C to 105C] Input IP3 RF2 Port [TC operating = -40C to 105C] -0.8 -0.6 -0.4 -0.2 0 1 2 3 4 5 6 7 8 Loss (dB) Frequency (GHz) -40C 25C 105C Input IP3 (dBm) Frequency (GHz) RF2, -55C, 2.5V RF2, -55C, 3.3V RF2, -55C, 5.5V RF2, 25C, 2.5V RF2, 25C, 3.3V RF2, 25C, 5.5V RF2, 120C, 2.5V RF2, 120C, 3.3V RF2, 120C, 5.5V -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Compression (dB) Input Power (dBm) -55C 25C 125C Input IP3 (dBm) Frequency (GHz) RF1, -55C, 2.5V RF1, -55C, 3.3V RF1, -55C, 5.5V RF1, 25C, 2.5V RF1, 25C, 3.3V RF1, 25C, 5.5V RF1, 120C, 2.5V RF1, 120C, 3.3V RF1, 120C, 5.5V

High Reliability SP2T RF Switch 10 F2933, Rev O 05/04/2016 PACKAGE DRAWING (4 mm x 4 mm 16-pin QFN), NBG16 Note: The F2933 uses EPAD Option P2 and Lead Option Z2

F2933, Rev O 05/04/2016 11 High Reliability SP2T RF Switch LAND PATTERN DIMENSION

High Reliability SP2T RF Switch 12 F2933, Rev O 05/04/2016 PIN DIAGRAM VDD 1 RFC GND GND GND GND VCTL E.P. GND RF1 GND RF2 GND N/C GND GND 50Ω 50Ω GND PIN DESCRIPTION PIN NAME FUNCTION 1 VDD Power Supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as possible to pin. 2 VCTL Logic control pin. See Table 1.

3 RFC

RF Common Port. Matched to 50 Ω when one of the 2 RF ports is selected. If this pin is not 0 V DC, then an external coupling capacitor must be used. 4, 5, 6, 7, 8, 10, 11, 13, 14, 15, 16 GND Ground. Also, internally connected to the ground paddle. Ground this pin as close to the device as possible. 9 RF2 RF2 Port. Matched to 50 Ω . If this pin is not 0 V DC, then an external coupling capacitor must be used. 12 RF1 RF1 Port. Matched to 50 Ω . If this pin is not 0 V DC, then an external coupling capacitor must be used. 17 — EP Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device and into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance.

F2933, Rev O 05/04/2016 13 High Reliability SP2T RF Switch EVKIT PICTURE (TOP) EVKIT PICTURE (BOTTOM)

High Reliability SP2T RF Switch 14 F2933, Rev O 05/04/2016 EVKIT / APPLICATIONS CIRCUIT

F2933, Rev O 05/04/2016 15 High Reliability SP2T RF Switch EVKIT BOM Part Reference QTY DESCRIPTION Mfr. Part # Mfr. C1 0 Not Installed (0402) C2 1 0.1 µF ±10%, 16V, X7R, Ceramic Capacitor (0402) GRM155R71C104K Murata C4, C6 0 Not Installed (0402) R1 1 100 Ω ±1%, 1/10W, Resistor (0402) ERJ-2RKF1000X Panasonic R4 1 100k Ω ±1%, 1/10W, Resistor (0402) ERJ-2RKF1003X Panasonic R5 1 15k Ω ±1%, 1/10W, Resistor (0402) ERJ-2RKF1502X Panasonic R6 1 18k Ω ±1%, 1/10W, Resistor (0402) ERJ-2RKF1802X Panasonic J1 – J5 5 SMA Edge Launch (0.375 inch pitch ground tabs) 142-0701-851 Emerson Johnson J6 1 CONN HEADER VERT 4x2 POS GOLD 67997-108HLF FCI U1 1 SP2T Switch 4 mm x 4 mm QFN16-EP F2933NBGP IDT VCC 1 Test Point Loop (Red) 5000 Keystone Electronics GND1, GND2 2 Test Point Loop (Black) 5001 Keystone Electronics

1 Printed Circuit Board F2933 EVKIT REV 1 IDT

Date Code [YWW] (Week 50 of 2015) ASM Test Step Assembler Code

High Reliability SP2T RF Switch 16 F2933, Rev O 05/04/2016 APPLICATIONS INFORMATION Default Start-up There is no internal pull-up or pull-down resistor o n the VCTL pin. Logic Control The VCTL pin is used to set the state of the SP 2T switch (see Table 1). Power Supplies A common VCC power supply should be used for all pin s requiring DC power. All supply pins should be bypassed with external capacitors to minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail. Supply voltage change or transients should have a slew rate smaller than 1 V / 20 µs. In addition, all control pins should remain at 0 V (+/-0.3 V) while the supply voltage ramps or while it returns to zero. Control Pin Interface If control signal integrity is a concern and clean s ignals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit is recommended at the input of control pin 2 (VCTL). See figure below. 50Ω 50Ω VCTL 5k ohm 2pF

F2933, Rev O 05/04/2016 17 High Reliability SP2T RF Switch EVKIT OPERATION E xternal Supply Setup Set up a VCC power supply in the voltage range of 2.7 V to 5.5 V and disable the power supply output. Logic Control Setup Using the EVKIT to manually set the control logic: On connector J6 connect a 2-pin shunt from pin 3 (VCC) to pin 4 (VLOGIC). This connection provides the VCC voltage supply to the Eval Board logic control pull up network. Resistors R5 and R6 form a voltage divider to set the Vhigh level over the 2.7 V to 5.5 V VCC range for manual logic control. Connector J6 has one logic input pin: VCTL (pin 7). See Table 1 for Logic Truth Table. With the pullup network enabled (as noted above) this pin can be left open to provide a logic high through pull up resistor R4. To set a logic low for VCTL connect a 2-pin shunt on J6 from pin 7 (VCTL) to pin 8 (GND). Note that when using the on board R5 / R6 voltage divider the current draw from the VCC supply will be higher by approximately VCC / 33k Ω. Using external control logic: Pins 3, 4, 5, 6, and 8 of J6 should have no external connection. External logic control is applied to J6 pin 7 (VCTL). See Table 1 for Logic Truth Table. Turn on Procedure S etup the supplies and Eval Board as noted in the External Supply Setup and Logic Control Setup sections above. Connect the preset disabled VCC power supply to the red VCC loop and ground to GND1 or GND2. Enable the VCC supply. Set the desired logic setting using J6 pin 7 (VCTL) to achieve the desired Table 1 setting. Note that external control logic should not be applied without VCC being present. Turn off Procedure If using external control logic for VCTL then set it to a logic low. Disable the VCC supply.

High Reliability SP2T RF Switch 18 F2933, Rev O 05/04/2016 Revision History Sheet Rev Date Page Description of Change O 2016-May-04 Initial Release

F2933, Rev O 05/04/2016 19 High Reliability SP2T RF Switch Corporate Headquarters

6024 Silver Creek Valley Road

San Jose, CA 95138 USA Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.idt.com Tech Support http://www.idt.com/support/technical-support DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. Copyright ©2015. Integrated Device Technology, Inc. All rights reserved.

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