ECG015

ECG015 ETC

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 5

Technical content

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com September 2004 ECG015 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM Product Features

• 1800 – 2500 MHz
• +24 dBm P1dB
• +41 dBm OIP3
• 15 dB Gain
• 5 dB Noise Figure
• Single Positive Supply (+8V)
• Available in a lead-free / green

Applications

• Mobile Infrastructure
• W-LAN / ISM
• RFID
• Defense / Homeland Security
• Fixed Wireless Product Description The ECG015 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve performance over a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power and is housed in a lead-free/green/RoHS-compliant SOT-89 SMT package. All devices are 100% RF and DC tested. The product is targeted for use as a gain block/driver amplifier for various current an d next generati on wireless technologies such as GPRS, UMTS and WCDMA, where high linearity and medium power is required. In addition, the ECG015 will work for numerous other applications within the 1800 to 2500 MHz frequency range. Functional Diagram RF IN GND RF OUT GND 1 23 ECG015B / ECG015B-G Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz 1800 2500 Test Frequency MHz 2140 Gain dB 13.5 15 Input Return Loss dB 17 Output Return Loss dB 10 Output P1dB dBm +22 +24 Output IP3 (2) dBm +37.5 +41 Noise Figure dB 5 Device Voltage V 5 Device Current mA 85 100 135 1. Test conditions unless otherwise noted: 25 °C, Vsupply = +8V, in tuned application circuit with Rbias = 30 Ω. 2. 3OIP measured with two tones at an output power of +9Bm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 °C Storage Temperature -55 to +125 °C Device Current 180 mA RF Input Power (continuous) +15 dBm Junction Temperature +250 °C Operation of this device above any of these parameters may cause permanent damage. Typical Performance (3) Parameter Units Typical Frequency MHz 1900 2140 2450 S21 dB 21 15 14 S11 dB -15 -17 -19 S22 dB -10 -10 -10 Output P1dB dBm +24 +24 +23 Output IP3 (2) dBm +41 +41 +42 Noise Figure dB 5 5 5 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc = 100 mA, +25° C, Rbias = 30 Ω.

Ordering Information

Part No. Description ECG015B 0.2 Watt, High Linearity InGaP HBT Amplifier (leaded SOT-89 Pkg) ECG015B-G 0.2 Watt, High Linearity InGaP HBT Amplifier (lead-free/green/RoHS-compliant SOT-89 Pkg) ECG015B-PCB1900 1900 MHz Fully Assembled Eval. Board ECG015B-PCB2140 2140 MHz Fully Assembled Eval. Board

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com September 2004 ECG015 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM Typical Device Data S-parameters (Vdevice = +5V, Icc = 100 mA, 25° C, unmatched 50 ohm system) Frequency (GHz) Gain / Maximum Stable Gain Gain (dB) DB(|S[2,1]|) DB(GMax) 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S11 Swp Max 2.50123GHz Swp Min 1.79083GHz 1.0 1.0-1.0 10.0 10.0 -10.0 5.0 5.0 -5.0 2.0 2.0 -2.0 3.0 3.0 -3.0 4.0 4.0 -4.0 0.2 0.2 -0.2 0.4 0.4 -0.4 0.6 0.6 -0.6 0.8 0.8 -0.8 S22 Swp Max 2.50123GHz Swp Min 1.79083GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 1800 – 2500 MHz, with markers placed at 1.8 – 2.5 GHz in 0.1 GHz increments. S-Parameters (Vdevice = +5 V, Icc = 100 mA, T = 25° C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning sh unt capacitors. The markers and vias are spaced in .050” increments.

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com September 2004 ECG015 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM Typical Device RF Performance Supply Bias = +8 V, Rbias = 30 Ω, Icc = 100 mA 1. Test conditions: T = 25º C, Supply Voltage = +8 V, Device Voltage = 5.0 V, Rbias = 30 Ω, Icc = 100 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Ssg & P1dB vs. Temperature @ 1.96GHz -40°C 25°C 85°C Ssg OIP3 P1dB ACPR1 vs. Pout at 1.9GHz (IS95 9 Ch. Fwd) 11 13 15 17 Average power out(dBm) dBc 85°C -40°C 25°C P1dB vs. Frequency 22.5 23.5 24.5 1.96GHz 2.14GHz 2.45GHz dBm ACPR1vs. Pout at 2.14GHz (IS95 9 Ch Fwd) 11 13 15 17 Average power out(dBm) dBc 25°C -40°C 85°C Icc vs. Vde 100 120 140 Vde Icc (mA) 25°C Ssg, OIP3 and P1dB vs. Temperature at 2.45GHz -40°C 25°C 85°C OIP3 Ssg P1dB

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com September 2004 ECG015 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM ECG015B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 128 ° C / W Junction Temperature, Tjc (2) 149 ° C Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. Product Marking The component will be marked with an “E015” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +240 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias ar e critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as poss ible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 100000 60 70 80 90 100 110 120 Tab Temperature (°C)

Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com September 2004 ECG015 ¼ Watt, High Linearity InGaP HBT Amplifier Product Information The Communications Edge TM ECG015B (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 ° C Thermal Resistance, Rth (1) 128 ° C / W Junction Temperature, Tjc (2) 149 ° C Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85 ° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. Product Marking The component will be marked with an “E015G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias ar e critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as poss ible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 100000 60 70 80 90 100 110 120 Tab Temperature (°C)