EC1019C

EC1019C ETC1

Document overview

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Technical content

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 5 January 2006 EC1019C InGaP HBT Gain Block Product Information The Communications Edge TM Product Features x DC – 6 GHz x +19 dBm P1dB at 2 GHz x +31 dBm OIP3 at 2 GHz x 17 dB Gain at 2 GHz x 3 dB Noise Figure at 2 GHz x Lead-free / green SOT-86 pkg x Internally matched to 50 :

Applications

x Defense / Homeland Security x Fixed Wireless Product Description The EC1019C is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 2000 MHz, the EC1019C typically provides 17 dB of gain, +31 dBm Output IP3, and +19 dBm P1dB. The EC1019C consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in low-cost, surface-mountable plastic lead-free/green/RoHS-compliant SOT-86 packages. A SOT-89 version is also available as the EC1019B. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1019Cwill work for other various applications within the DC to 6 GHz frequency range such as CATV and fixed wireless. Functional Diagram RF Out RF In GND GND EC1019C RF Out RF In GND GND EC1019C-G Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz DC 6000 Test Frequency MHz 2000 Gain dB Input Return Loss dB Output Return Loss dB Output P1dB dBm 14.5 +19 Output IP3 (2) dBm +31 Noise Figure dB 3.0 Device Voltage V 4.2 4.7 5.2 Device Current mA 1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +6V, Rbias = 16.5 , 50 system. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 qC Storage Temperature -55 to +150 qC Device Current 130 mA RF Input Power (continuous) +12 dBm Junction Temperature +250 qC Operation of this device above any of these parameters may cause permanent damage. Typical Performance (3) Parameter Units Typical Frequency MHz 500 900 1900 2140 S21 dB 20.5 19.7 17.2 16.7 S11 dB -26.9 -25.5 -19.9 -15.4 S22 dB -24.4 -17.2 -11.3 -12.2 Output P1dB dBm +19 +19 +19.5 +19 Output IP3 (2) dBm +34 +34 +31 +31 Noise Figure dB 2.9 2.9 3.0 3.0 3. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = +4.7V, Rbias = 16.5 , 50 System.

Ordering Information

Part No.

Description

EC1019C* InGaP HBT Gain Block (lead-tin SOT-86 Pkg) EC1019C-G InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-86 Pkg) EC1019C-PCB 700 – 2400 MHz Fully Assembled Eval. Board * This package is being phased out in favor of the green package type which is backward compatible for existing designs.

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 5 January 2006 EC1019C InGaP HBT Gain Block Product Information The Communications Edge TM Typical Device RF Performance Supply Bias = +6 V, Rbias = 15 :, Icc = 70 mA Frequency MHz 100 500 900 1900 2140 2400 3500 5800 S21 dB 21.0 20.5 19.7 17.2 16.7 16.2 13.8 10.7 S11 dB -32.0 -26.9 -25.5 -19.9 -15.4 -12.7 -12.0 -9.9 S22 dB -23 -24.4 -17.2 -11.3 -12.2 -13.8 -12.2 -11.3 Output P1dB dBm +19.4 +19.4 +19.4 +19.5 +19.0 +18.8 +16.2 Output IP3 dBm +33 +33.2 +33.6 +31 +31 +30.7 Noise Figure dB 3.3 2.9 2.9 3.0 3.0 3.1 1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.7 V, Rbias = 16.5 , Icc = 70 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. S21 vs. Frequency Frequency (GHz) S21 (dB) +25 °C S11, S22 vs. Frequency -30 -25 -20 -15 -10 Frequency (GHz) S11,S22 (dB) S22 S11 Icc vs. Vde 120 160 Vde (V) Icc (mA) 25°C OIP3 vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) OIP3 (dBm) 25°C 85°C -40°C Noise Figure vs. Frequency 500 1000 1500 2000 2500 Frequency (MHz) NF (dB) NF P1dB vs. Frequency 500 1000 1500 2000 2500 3000 Frequency (MHz) P1dB (dBm) 25°C 85°C -40°C

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 5 January 2006 EC1019C InGaP HBT Gain Block Product Information The Communications Edge TM Recommended Application Circuit Recommended Component Values Reference Frequency (MHz) Designator 500 900 1900 2200 2500 3500 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH C1, C2, C4 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. Value / Type Size 39 nH wirewound inductor 0603 C1, C2 56 pF chip capacitor 0603

0.018 PF chip capacitor

15 : 1% tolerance 0805 Recommended Bias Resistor Values Supply Voltage R1 value Size 6 V 16.4 ohms 0805 7 V 30.7 ohms 1210 8 V 45 ohms 1210 9 V 59 ohms 2010 10 V 74 ohms 2010 12 V 102 ohms 2512 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended. Typical Device S-Parameters S-Parameters (Vdevice = +4.7, ICC = 70 mA, T = 25 C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -24.85 -7.98 20.43 176.75 -22.76 0.42 -19.95 -3.26 500 -27.17 -60.24 20.09 153.21 -22.63 1.05 -24.50 -34.64 1000 -23.41 -46.18 19.25 129.05 -22.38 1.04 -18.46 -90.44 1500 -19.49 -28.53 18.19 107.82 -22.09 0.58 -12.87 -100.14 2000 -16.60 -74.75 17.15 89.07 -21.57 0.00 -12.94 -95.63 2500 -11.88 -105.49 16.21 71.51 -20.87 -2.16 -15.63 -78.47 3000 -12.89 -134.51 15.41 55.02 -20.02 -6.13 -21.87 -147.92 3500 -11.92 -151.23 14.26 39.14 -19.68 -10.34 -13.98 -165.49 4000 -8.69 -134.38 13.03 27.44 -19.34 -12.21 -10.61 -125.29 4500 -8.09 -135.74 12.56 15.99 -18.43 -14.58 -11.00 -108.79 5000 -10.55 -168.37 12.38 -0.44 -17.23 -23.37 -18.32 -156.08 5500 -11.17 156.03 11.61 -16.12 -16.81 -32.14 -13.00 142.07 6000 -9.71 159.92 10.74 -27.95 -16.53 -37.03 -9.89 159.16 Device S-parameters are available for download off of the website at: http://www.wj.com Blocking Capacitor RF OUT RF Choke 0.018 µF Bias Resistor RF IN Bypass Capacitor Blocking Capacitor Vcc Icc = 70 mA EC1019C

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 5 January 2006 EC1019C InGaP HBT Gain Block Product Information The Communications Edge TM EC1019C (SOT-86 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Land Pattern Product Marking The component will be marked with a two- digit numeric lot code (shown as “xx”) followed by an “A” designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 1 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.

Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 5 January 2006 EC1019C InGaP HBT Gain Block Product Information The Communications Edge TM EC1019C-G (Green / Lead-free Sot-86 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Outline Drawing Land Pattern Product Marking The component will be marked with a two- digit numeric lot code (shown as “XX”) followed by a “B” designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Class 1A Value: Passes between 250 and 500V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.