DS90C031B

DS90C031B LVDS Quad CMOS Differential Line Driver datasheet (Rev. B)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNLS051,B]
• PDF pages: 19

Technical content

www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013 DS90C031BLVDSQuadCMOS DifferentialLineDriver Check forSamples: DS90C031B 1FEATURES DESCRIPTION The DS90C031B is a quad CMOS differentialline 2• >155.5Mbps (77.7MHz) switchingrates driverdesigned forapplicationsrequiringultralow• High impedance LVDS outputswithpower-off power dissipationand high data rates.The device

• ±350 mV differentialsignaling supportsdata ratesin excess of 155.5 Mbps (77.7 MHz) and uses Low VoltageDifferentialSignaling• Ultralow power dissipation (LVDS) technology.• 400 ps maximum differentialskew (5V,25°C) The DS90C031B acceptsTTL/CMOS inputlevelsand• 3.5ns maximum propagationdelay translatesthem to low voltage(350 mV) differential• Industrialoperatingtemperaturerange outputsignals.Inadditionthedriversupportsa TRI-
• Pin compatiblewithDS26C31, MB571 (PECL) STATE functionthatmay be used to disablethe and 41LG (PECL) outputstage,disablingthe load current,and thus droppingthedevicetoan ultralow idlepower stateof• Conforms toANSI/TIA/EIA-644LVDS standard 11 mW typical.• Offeredinnarrow body SOIC package In addition,the DS90C031B providespower-offhigh• Fail-safelogicforfloatinginputs impedance LVDS outputs.This featureassures minimalloadingeffecton the LVDS bus lineswhen VCC isnotpresent. The DS90C031B and companion line receiver (DS90C032B) provide a new alternativeto high power pseudo-ECL devicesforhigh speed point-to- pointinterfaceapplications. Connection Diagram FunctionalDiagram Figure1. Dual-In-Line See Package Number D (R-PDSO-G16) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS051B –MARCH 1999–REVISED MARCH 2013 www.ti.com DriverTruthTable Enables Input Outputs EN EN* D IN D OUT+ D OUT − L H X Z Z L L HAllothercombinationsofENABLE inputs H H L These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) SupplyVoltage(VCC ) −0.3Vto+6V InputVoltage(DIN) −0.3Vto(VCC + 0.3V) EnableInputVoltage(EN,EN*) −0.3Vto(VCC + 0.3V) OutputVoltage(DOUT+ ,D OUT −) −0.3Vto+5.8V ShortCircuitDuration (DOUT+ ,D OUT −) Continuous Maximum Package Power Dissipationat+25°C 1068 mW DeratePower Dissipation 8.5mW/ °C above +25°C StorageTemperatureRange −65°C to+150°C Lead TemperatureRange, Soldering(4seconds) +260°C Maximum JunctionTemperature +150°C ESD Rating HBM, 1.5kΩ,100 pF ≥ 2kV EIAJ,0 Ω,200 pF ≥ 250V (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe guaranteed.They arenotmeant to implythatthedevicesshouldbe operatedattheselimits.The tableof“ElectricalCharacteristics”specifiesconditionsofdevice operation. Recommended OperatingConditions Min Typ Max Units SupplyVoltage(VCC ) +4.5 +5.0 +5.5 V OperatingFreeAirTemperature(TA) −40 +25 +85 °C

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www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013 ElectricalCharacteristics Over supplyvoltageand operatingtemperatureranges,unlessotherwisespecified.(1)(2) Symbol Parameter TestConditions Pin Min Typ Max Units VOD1 DifferentialOutputVoltage R L = 100Ω (Figure2) D OUT −, 250 345 450 mV D OUT+ΔVOD1 Change inMagnitudeofVOD1 for 4 35 |mV| ComplementaryOutputStates VOS OffsetVoltage 1.10 1.25 1.35 V ΔVOS Change inMagnitudeofVOS for 5 25 |mV| ComplementaryOutputStates VOH OutputVoltageHigh R L = 100Ω 1.41 1.60 V VOL OutputVoltageLow 0.90 1.07 V VIH InputVoltageHigh D IN, 2.0 VCC V EN,VIL InputVoltageLow GND 0.8 VEN* II InputCurrent VIN = VCC ,GND, 2.5Vor0.4V −10 ±1 +10 μA VCL InputClamp Voltage ICL = −18 mA −1.5 −0.8 V IOS OutputShortCircuitCurrent VOUT = 0V (3) D OUT −, −3.5 −5.0 mA D OUT+IOZ OutputTRI-STATE Current EN = 0.8Vand EN* = 2.0V, −10 ±1 +10 μA VOUT = 0V orVCC IOFF Power -OffLeakage VO = 0V or2.4V,VCC = 0V orOpen −10 ±1 +10 μA ICC No Load SupplyCurrentDrivers D IN = VCC orGND VCC 1.7 3.0 mA Enabled D IN = 2.5Vor0.4V 4.0 6.5 mA ICCL Loaded SupplyCurrentDrivers R L = 100Ω (allchannels), 15.4 21.0 mA Enabled VIN = VCC orGND (allinputs) ICCZ No Load SupplyCurrentDrivers D IN = VCC orGND, 2.2 4.0 mA Disabled EN = GND, EN* = VCC (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground except:VOD1 and ΔVOD1 . (2) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (3) Outputshortcircuitcurrent(IOS )isspecifiedas magnitudeonly,minus signindicatesdirectiononly. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS90C031B

SNLS051B –MARCH 1999–REVISED MARCH 2013 www.ti.com SwitchingCharacteristics Symbol Parameter Conditions Min Typ Max Units tPHLD DifferentialPropagationDelayHightoLow R L = 100Ω,C L = 5 pF 1.0 2.0 3.0 ns (Figure3 and Figure4)tPLHD DifferentialPropagationDelayLow toHigh 1.0 2.1 3.0 ns tSKD DifferentialSkew |tPHLD – tPLHD | 0 80 400 ps tSK1 Channel-to-ChannelSkew (4) 0 300 600 ps tTLH RiseTime 0.35 1.5 ns tTHL FallTime 0.35 1.5 ns tPHZ DisableTime HightoZ R L = 100Ω,C L = 5 pF 2.5 10 ns (Figure5 and Figure6)tPLZ DisableTime Low toZ 2.5 10 ns tPZH EnableTime Z toHigh 2.5 10 ns tPZL EnableTime Z toLow 2.5 10 ns (1) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (2) Generatorwaveform foralltestsunlessotherwisespecified:f= 1 MHz, ZO = 50Ω,tr ≤ 6 ns,and tf≤ 6 ns. (3) C L includesprobeand jigcapacitance. (4) Channel-to-ChannelSkew isdefinedas thedifferencebetween thepropagationdelayofthechanneland theotherchannelsinthe same chipwithan eventon theinputs. SwitchingCharacteristics Symbol Parameter Conditions Min Typ Max Units tPHLD DifferentialPropagationDelayHightoLow R L = 100Ω,C L = 5 pF 0.5 2.0 3.5 ns (Figure3 and Figure4)tPLHD DifferentialPropagationDelayLow toHigh 0.5 2.1 3.5 ns tSKD DifferentialSkew |tPHLD – tPLHD | 0 80 900 ps tSK1 Channel-to-ChannelSkew (4) 0 0.3 1.0 ns tSK2 ChiptoChipSkew (5) 3.0 ns tTLH RiseTime 0.35 2.0 ns tTHL FallTime 0.35 2.0 ns tPHZ DisableTime HightoZ R L = 100Ω,C L = 5 pF 2.5 15 ns (Figure5 and Figure6)tPLZ DisableTime Low toZ 2.5 15 ns tPZH EnableTime Z toHigh 2.5 15 ns tPZL EnableTime Z toLow 2.5 15 ns (1) Alltypicalsaregivenfor:VCC = +5.0V,TA = +25°C. (2) Generatorwaveform foralltestsunlessotherwisespecified:f= 1 MHz, ZO = 50Ω,tr ≤ 6 ns,and tf≤ 6 ns. (3) C L includesprobeand jigcapacitance. (4) Channel-to-ChannelSkew isdefinedas thedifferencebetween thepropagationdelayofthechanneland theotherchannelsinthe same chipwithan eventon theinputs. (5) ChiptoChipSkew isdefinedas thedifferencebetween theminimum and maximum specifieddifferentialpropagationdelays.

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www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013 PARAMETER MEASUREMENT INFORMATION Figure2. DriverVOD and VOS TestCircuit Figure3. DriverPropagationDelay and TransitionTime TestCircuit Figure4. DriverPropagationDelay and TransitionTime Waveforms Figure5. DriverTRI-STATE Delay TestCircuit Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS90C031B

SNLS051B –MARCH 1999–REVISED MARCH 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure6. DriverTRI-STATE Delay Waveform TypicalApplication Figure7. Point-to-PointApplication

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www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013 APPLICATIONS INFORMATION LVDS driversand receiversareintendedtobe primarilyused inan uncomplicatedpoint-to-pointconfigurationas isshown inFigure7.Thisconfigurationprovidesa cleansignalingenvironmentforthequickedge ratesofthe drivers.The receiverisconnectedtothedriverthrougha balancedmedia whichmay be a standardtwistedpair cable,a parallelpaircable,or simplyPCB traces.Typically,thecharacteristicimpedance ofthemedia isinthe rangeof100Ω.A terminationresistorof100Ω shouldbe selectedtomatch themedia,and islocatedas closeto the receiverinputpinsas possible.The terminationresistorconvertsthe currentsourcedby the driverintoa voltagethatisdetectedby thereceiver.Otherconfigurationsarepossiblesuch as a multi-receiverconfiguration, but the effectsof a mid-streamconnector(s),cablestub(s),and otherimpedance discontinuitiesas wellas groundshifting,noisemarginlimits,and totalterminationloadingmust be takenintoaccount. The DS90C031B differentiallinedriverisa balancedcurrentsourcedesign.A currentmode driver,generally speakinghas a highoutputimpedance and suppliesa constantcurrentfora range of loads(a voltagemode driveron theotherhand suppliesa constantvoltagefora rangeofloads).Currentisswitchedthroughtheloadin one directionto produce a logicstateand inthe otherdirectionto produce the otherlogicstate.The typical outputcurrentisa mere 3.4 mA witha minimum of 2.5 mA, and a maximum of 4.5 mA. The currentmode requires(asdiscussedabove)thata resistiveterminationbe employed toterminatethesignaland tocomplete theloopas shown inFigure7.AC orunterminatedconfigurationsarenotallowed.The 3.4mA loopcurrentwill developa differentialvoltageof340 mV acrossthe100Ω terminationresistorwhich thereceiverdetectswitha 240 mV minimum differentialnoisemarginneglectingresistivelinelosses(drivensignalminus receiverthreshold (340mV – 100 mV = 240 mV). The signaliscenteredaround+1.2V (DriverOffset,VOS )withrespecttoground as shown inFigure8.Note thatthesteady-statevoltage(VSS )peak-to-peakswingistwicethedifferentialvoltage (VOD )and istypically680 mV. The currentmode driverprovidessubstantialbenefitsovervoltagemode drivers,such as an RS-422 driver.Its quiescentcurrentremainsrelativelyflatversusswitchingfrequency.Whereas theRS-422 voltagemode driver increasesexponentiallyinmost case between 20 MHz –50 MHz. Thisisdue to the overlapcurrentthatflows between therailsofthedevicewhen theinternalgatesswitch.Whereas thecurrentmode driverswitchesa fixed currentbetween itsoutputwithoutany substantialoverlapcurrent.This is similarto some ECL and PECL devices,but withoutthe heavy staticICC requirementsof the ECL/PECL designs.LVDS requires> 80% less currentthansimilarPECL devices.AC specificationsforthedriverarea tenfoldimprovementoverotherexisting RS-422 drivers. The fail-safecircuitryguaranteesthattheoutputsare enabledand ata logic"0"(thetrueoutputislow and the complement outputishigh)when theinputsarefloating. The TRI-STATE functionallowsthedriveroutputstobe disabled,thusobtainingan even lowerpower statewhen thetransmissionofdataisnotrequired. The footprintoftheDS90C031B isthesame as theindustrystandard26LS31 Quad Differential(RS-422)Driver. The DS90C031B iselectricallysimilartotheDS90C031, butdiffersby supportinghighimpedance LVDS outputs under power-offcondition.Thisallowsformultipleor redundantdriverstobe used incertainapplications.The DS90C031B isofferedina space savingnarrowSOIC (150mil.)package. For additionalLVDS applicationinformation,see TI'sLVDS Owner's Manual availablethroughTI'swebsite http://www.ti.com/lsds/ti/analog/interface.page. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS90C031B

SNLS051B –MARCH 1999–REVISED MARCH 2013 www.ti.com Figure8. DriverOutput Levels Pin Descriptions Pin No. Name Description 1,7,9,15 D IN Driverinputpin,TTL/CMOS compatible 2,6,10,14 D OUT+ Non-invertingdriveroutputpin,LVDS levels 3,5,11,13 D OUT − Invertingdriveroutputpin,LVDS levels

4 EN Activehighenablepin,OR-ed withEN*

12 EN* Activelowenablepin,OR-ed withEN

16 VCC Power supplypin,+5V ± 10%

8 GND Ground pin

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±3.4 ±3.2 ±3.6 5 5.25 5.54.5 ±3.8 4.75 TA = 25 ° C VIN = 0V or 5V VOUT = 0V VCC ± Power Supply Voltage (V) IOS ± Output Short Circuit Current (mA) DS90C031B www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Power Supply Current Power Supply Current vs Power Supply Voltage vs Temperature Figure9. Figure10. Power Supply Current Power Supply Current vs Power Supply Voltage vs Temperature Figure11. Figure12. Output TRI-STATE Current Output ShortCircuitCurrent vs Power Supply Voltage vs Power Supply Voltage Figure13. Figure14. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS90C031B

SNLS051B –MARCH 1999–REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) DifferentialOutput Voltage DifferentialOutput Voltage vs Power Supply Voltage vs Ambient Temperature Figure15. Figure16. Output VoltageHigh vs Output VoltageHigh vs Power Supply Voltage Ambient Temperature Figure17. Figure18. Output VoltageLow vs Output VoltageLow vs Power Supply Voltage Ambient Temperature Figure19. Figure20.

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www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) OffsetVoltagevs OffsetVoltagevs Power Supply Voltage Ambient Temperature Figure21. Figure22. Power Supply Current Power Supply Current vs Frequency vs Frequency Figure23. Figure24. DifferentialOutput Voltage DifferentialPropagationDelay vs Load Resistor vs Power Supply Voltage Figure25. Figure26. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:DS90C031B

SNLS051B –MARCH 1999–REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) DifferentialPropagationDelay DifferentialSkew vs vs Ambient Temperature Power Supply Voltage Figure27. Figure28. DifferentialSkew vs DifferentialTransitionTime Ambient Temperature vs Power Supply Voltage Figure29. Figure30. DifferentialTransitionTime vs Ambient Temperature Figure31.

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www.ti.com SNLS051B –MARCH 1999–REVISED MARCH 2013

REVISION HISTORY

Changes from RevisionA (March 2013)toRevisionB Page Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:DS90C031B

www.ti.com 1-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS90C031BTM/NOPB Active Production SOIC (D) | 16 48 | TUBE Yes Call TI | Sn Level-1-260C-UNLIM -40 to 85 DS90C031BTM DS90C031BTM/NOPB.A Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS90C031BTM DS90C031BTMX/NOPB Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS90C031BTM DS90C031BTMX/NOPB.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS90C031BTM DS90C031BTMX/NOPB.B Active Production SOIC (D) | 16 2500 | LARGE T&R - Call TI Call TI -40 to 85 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90C031BTMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DS90C031BTM/NOPB D SOIC 16 48 495 8 4064 3.05 DS90C031BTM/NOPB.A D SOIC 16 48 495 8 4064 3.05 Pack Materials-Page 3

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