DS90C031 LVDS Quad CMOS Differential Line Driver datasheet (Rev. A)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNLS095,A]
- PDF pages: 19
Technical content
DS90C031 LVDS Quad CMOS Differential Line Driver Literature Number: SNLS095A
LVDS Quad CMOS Differential Line Driver General Description The DS90C031 is a quad CMOS differential line driver de- signed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 155.5 Mbps (77.7 MHz) utilizing Low Volt- age Differential Signaling (LVDS) technology. The DS90C031 accepts TTL/CMOS input levels and trans- lates them to low voltage (350 mV) differential output sig- nals. In addition the driver supports a TRI-STATE ® function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state of 11 mW typical. The DS90C031 and companion line receiver (DS90C032) provide a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications.
Features
n >155.5 Mbps (77.7 MHz) switching rates n ±350 mV differential signaling n Ultra low power dissipation n 400 ps maximum differential skew (5V, 25˚C) n 3.5 ns maximum propagation delay n Industrial operating temperature range n Military operating temperature range option n Available in surface mount packaging (SOIC) and (LCC) n Pin compatible with DS26C31, MB571 (PECL) and 41LG (PECL) n Compatible with IEEE 1596.3 SCI LVDS standard n Conforms to ANSI/TIA/EIA-644 LVDS standard n Available to Standard Microcircuit Drawing (SMD) 5962-95833 Connection Diagrams TRI-STATE® is a registered trademark of National Semiconductor Corporation. Dual-In-Line DS011946-1 Order Number DS90C031TM See NS Package Number M16A DS011946-33 Order Number DS90C031E-QML See NS Package Number E20A For Complete Military Specifications, refer to appropriate SMD or MDS. June 1998 DS90C031 LVDS Quad CMOS Differential Line Driver © 2000 National Semiconductor Corporation DS011946 www.national.com
EN EN* D IN D OUT+ D OUT− LH X Z Z All other combinations L L H of ENABLE inputs H H L DS011946-2 DS90C031 www.national.com 2
Absolute Maximum Ratings(Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (V CC ) −0.3V to +6V Input Voltage (DIN) −0.3V to (V CC + 0.3V) Enable Input Voltage (EN, EN*) −0.3V to (VCC + 0.3V) Output Voltage (DOUT+ ,D OUT− ) −0.3V to (V CC + 0.3V) Short Circuit Duration (DOUT+ ,D OUT− ) Continuous Maximum Package Power Dissipation@ +25˚C M Package 1068 mW E Package 1900 mW Derate M Package 8.5 mW/˚C above +25˚C Derate E Package 12.8 mW/˚C above +25˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature Range Soldering (4 sec.) +260˚C Maximum Junction Temperature (DS90C031T) +150˚C Maximum Junction Temperature (DS90C031E) +175˚C ESD Rating (Note 7) (HBM, 1.5 kΩ , 100 pF) ≥ 3,500V (EIAJ, 0Ω , 200 pF) ≥ 250V Recommended Operating Conditions Min Typ Max Units Supply Voltage (VCC ) +4.5 +5.0 +5.5 V Operating Free Air Temperature (TA) DS90C031T −40 +25 +85 ˚C DS90C031E −55 +25 +125 ˚C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3) Symbol Parameter Conditions Pin Min Typ Max Units VOD1 Differential Output Voltage R L = 100Ω (Figure 1)D OUT− , D OUT+ 250 345 450 mV ΔVOD1 Change in Magnitude of VOD1 for Complementary Output States 4 35 |mV| VOS Offset Voltage 1.125 1.25 1.375 V ΔVOS Change in Magnitude of VOS for Complementary Output States 5 25 |mV| VOH Output Voltage High R L = 100Ω 1.41 1.60 V VOL Output Voltage Low 0.90 1.07 V VIH Input Voltage High D IN, EN, EN*
2.0 V CC V
VIL Input Voltage Low GND 0.8 V II Input Current V IN =V CC , GND, 2.5V or 0.4V −10 ±1 +10 µA VCL Input Clamp Voltage I CL = −18 mA −1.5 −0.8 V IOS Output Short Circuit Current VOUT = 0V (Note 8) D OUT− , D OUT+ −3.5 −5.0 mA IOZ Output TRI-STATE Current EN = 0.8V and EN* = 2.0V, VOUT =0 Vo rVCC −10 ±1 +10 µA ICC No Load Supply Current Drivers Enabled D IN =V CC or GND DS90C031T V CC 1.7 3.0 mA D IN = 2.5V or 0.4V 4.0 6.5 mA ICCL Loaded Supply Current Drivers Enabled R L = 100Ω All Channels VIN =V CC or GND (all inputs) DS90C031T 15.4 21.0 mA DS90C031E 15.4 25.0 mA ICCZ No Load Supply Current Drivers Disabled D IN =V CC or GND EN = GND, EN* = VCC DS90C031T 2.2 4.0 mA DS90C031E 2.2 10.0 mA Switching Characteristics VCC = +5.0V, TA = +25˚C DS90C031T. (Notes 3, 4, 6, 9) Symbol Parameter Conditions Min Typ Max Units tPHLD Differential Propagation Delay High to Low RL = 100Ω ,C L =5p F (Figure 2and Figure 3) 1.0 2.0 3.0 ns tPLHD Differential Propagation Delay Low to High 1.0 2.1 3.0 ns tSKD Differential Skew |tPHLD –tPLHD | 0 80 400 ps tSK1 Channel-to-Channel Skew (Note 4) 0 300 600 ps DS90C031 www.national.com3
FIGURE 1. Driver VOD and VOS Test Circuit
Applications Information(Continued) The footprint of the DS90C031 is the same as the industry standard 26LS31 Quad Differential (RS-422) Driver. Pin Descriptions Pin No. Name Description (SOIC) 1, 7, 9, 15 D IN Driver input pin, TTL/CMOS compatible 2, 6, 10, 14 D OUT+ Non-inverting driver output pin, LVDS levels 3, 5, 11, 13 D OUT− Inverting driver output pin, LVDS levels
4 EN Active high enable pin, OR-ed
with EN*
12 EN* Active low enable pin, OR-ed
Pin No. Name Description (SOIC)
16 V CC Power supply pin, +5V± 10%
8 GND Ground pin
Ordering Information
Operating Package Type/ Order Number Temperature Number −40˚C to +85˚C SOP/M16A DS90C031TM −55˚C to +125˚C LCC/E20A DS90C031E-QML DS90C031E-QML (NSID) 5962-95833 (SMD) Note 1:“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. Note 2:Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except: VOD1 and ΔVOD1 . Note 3:All typicals are given for: VCC = +5.0V, TA = +25˚C. Note 4:Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs. Note 5:Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays. Note 6:Generator waveform for all tests unless otherwise specified:f=1 MHz, ZO =5 0Ω ,tr ≤ 6 ns, and tf≤ 6 ns. Note 7:ESD Ratings: HBM (1.5 kΩ , 100 pF)≥ 3,500V EIAJ (0Ω , 200 pF)≥ 250V Note 8:Output short circuit current (IOS ) is specified as magnitude only, minus sign indicates direction only. Note 9:C L includes probe and jig capacitance. Note 10:Guaranteed by characterization data (DS90C031E). DS011946-9 FIGURE 7. Driver Output Levels
Typical Performance Characteristics Power Supply Current vs Power Supply Voltage DS011946-10 Power Supply Current vs Temperature DS011946-11 Power Supply Current vs Power Supply Voltage DS011946-12 Power Supply Current vs Temperature DS011946-13 Output TRI-STATE Current vs Power Supply Voltage DS011946-14 Output Short Circuit Current vs Power Supply Voltage DS011946-15 DS90C031 www.national.com 8
Typical Performance Characteristics(Continued) Differential Output Voltage vs Power Supply Voltage DS011946-16 Differential Output Voltage vs Ambient Temperature DS011946-17 Output Voltage High vs Power Supply Voltage DS011946-18 Output Voltage High vs Ambient Temperature DS011946-19 Output Voltage Low vs Power Supply Voltage DS011946-20 Output Voltage Low vs Ambient Temperature DS011946-21 DS90C031 www.national.com9
Typical Performance Characteristics(Continued) Offset Voltage vs Power Supply Voltage DS011946-22 Offset Voltage vs Ambient Temperature DS011946-23 Power Supply Current vs Frequency DS011946-24 Power Supply Current vs Frequency DS011946-25 Differential Output Voltage vs Load Resistor DS011946-26 Differential Propagation Delay vs Power Supply Voltage DS011946-27 DS90C031 www.national.com 10
Typical Performance Characteristics(Continued) Differential Propagation Delay vs Ambient Temperature DS011946-28 Differential Skew vs Power Supply Voltage DS011946-29 Differential Skew vs Ambient Temperature DS011946-30 Differential Transition Time vs Power Supply Voltage DS011946-31 Differential Transition Time vs Ambient Temperature DS011946-32 DS90C031 www.national.com11
Physical Dimensionsinches (millimeters) unless otherwise noted 20-Lead Ceramic Leadless Chip Carrier, Type C Order Number DS90C031E-QML 16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC Order Number DS90C031TM DS90C031 www.national.com 12
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com DS90C031 LVDS Quad CMOS Differential Line Driver National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
www.ti.com 31-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS90C031TM/NOPB Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS90C031TM DS90C031TM/NOPB.A Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS90C031TM DS90C031TMX/NOPB Active Production SOIC (D) | 16 2500 | LARGE T&R Yes Call TI | Sn Level-1-260C-UNLIM -40 to 85 DS90C031TM DS90C031TMX/NOPB.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS90C031TM (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90C031TMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DS90C031TM/NOPB D SOIC 16 48 495 8 4064 3.05 DS90C031TM/NOPB.A D SOIC 16 48 495 8 4064 3.05 Pack Materials-Page 3
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