DS89C21 Differential CMOS Line Driver and Receiver Pair datasheet (Rev. C)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNLS091,C]
- PDF pages: 16
Technical content
www.ti.com SNLS091C –JUNE 1998–REVISED APRIL 2013 DS89C21DifferentialCMOS LineDriverandReceiverPair Check forSamples: DS89C21 1FEATURES DESCRIPTION The DS89C21 isa differentialCMOS linedriverand 2• Meets TIA/EIA-422-A(RS-422)and CCITT V.11 receiverpair,designedto meet the requirementsofRecommendation TIA/EIA-422-A (RS-422) electricalcharacteristics• LOW POWER Design— 15 mW Typical interfacestandard.The DS89C21 providesone driver
- Guaranteed AC Parameters: and one receiverina minimum footprint.The device isofferedinan 8-pinSOIC package.– Maximum DriverSkew 2.0ns The CMOS designminimizesthesupplycurrentto6– Maximum ReceiverSkew 4.0ns mA, making the device idealfor use in battery• Extended Temperature Range: −40°C to powered orpower consciousapplications.+85°C The driverfeaturesa fasttransitiontimespecifiedat• AvailableinSOIC Packaging 2.2 ns, and a maximum differentialskew of 2 ns• Operates over 20 Mbps making the driverideal for use in high speed
- ReceiverOPEN InputFailsafeFeature applicationsoperatingabove 10 MHz. The receivercan detectsignalsas low as 200 mV, and alsoincorporateshysteresisfornoiserejection. Skew isspecifiedat4 ns maximum. The DS89C21 is compatiblewith TTL and CMOS levels(DIand RO). Connection Diagram See Package Number D (R-PDSO-G8) TruthTableDriver Input Outputs DI DO DO* H H L L L H TruthTableReceiver Inputs Output RI–RI* RO VDIFF ≥ +200 mV H VDIFF ≤ −200 mV L OPEN (1) H (1) Non-terminated Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS091C –JUNE 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1)(2)(3) SupplyVoltage(VCC ) 7V DriverInputVoltage(DI) −1.5VtoVCC + 1.5V DriverOutputVoltage(DO, DO *) −0.5Vto+7V ReceiverInputVoltage— V CM (RI,RI*) ±14V DifferentialReceiverInput ±14V Voltage— VDIFF (RI,RI*) ReceiverOutputVoltage(RO) −0.5VtoVCC +0.5V ReceiverOutputCurrent(RO) ±25 mA StorageTemperatureRange (TSTG ) −65°C to+150°C Lead Temperature(TL) +260°C (Soldering4 sec.) Maximum JunctionTemperature 150°C Maximum Package Power Dissipation@+25 °C D Package 714 mW DerateD Package 5.7mW/ °C above +25°C (1) AbsoluteMaximum Ratingsarethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimplythat thedevicesshouldbe operatedattheselimits.The tablesofElectricalCharacteristicsspecifyconditionsfordeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) ESD Rating:HBM (1.5kΩ,100 pF)allpins≥ 2000V.EIAJ(0Ω,200 pF)≥ 250V Recommended OperatingConditions Min Max Units SupplyVoltage(VCC ) 4.50 5.50 V OperatingTemperature(TA) −40 +85 °C InputRiseorFallTime (DI) 500 ns
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www.ti.com SNLS091C –JUNE 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2) Over recommended supplyvoltageand operatingtemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Pin Min Typ Max Units DRIVER CHARACTERISTICS VIH InputVoltageHIGH 2.0 VCC V VIL InputVoltageLOW DI GND 0.8 V IIH,IIL InputCurrent V IN = VCC ,GND, 2.0V,0.8V 0.05 ±10 μA VCL InputClamp Voltage IIN = −18 mA −1.5 V VOD1 UnloadedOutputVoltage No Load DO, 4.2 6.0 V DO*VOD2 DifferentialOutputVoltage R L = 100Ω 2.0 3.0 V ΔVOD2 Change inMagnitudeofV OD2 5.0 400 mV forComplementaryOutputStates VOD3 DifferentialOutputVoltage R L = 150Ω 2.1 3.1 V VOD4 DifferentialOutputVoltage R L = 3.9kΩ 4.0 6.0 V VOC Common Mode Voltage R L = 100Ω 2.0 3.0 V ΔVOC Change inMagnitudeofV OC 2.0 400 mV forComplementaryOutputStates IOSD OutputShortCircuitCurrent V OUT = 0V −30 −115 −150 mA IOFF OutputLeakage Current VCC = 0V VOUT = +6V 0.03 +100 μA VOUT = −0.25V −0.08 −100 μA RECEIVER CHARACTERISTICS VTL,VTH DifferentialThresholds V IN = +7V, 0V,−7V RI, −200 ±25 +200 mV RI*VHYS Hysteresis V CM = 0V 20 50 mV R IN InputImpedance V IN = −7V,+7V, Other= 0V 5.0 9.5 kΩ IIN InputCurrent OtherInput= 0V, VIN = +10V +1.0 +1.5 mA VCC = 5.5Vand VIN = +3.0V 0 +0.22 mA VCC = 0V VIN = +0.5V −0.04 mA VIN = −3V 0 −0.41 mA VIN = −10V −1.25 −2.5 mA VOH OutputHIGH Voltage IOH = −6 mA VDIFF = +1V RO 3.8 4.9 V VDIFF = OPEN 3.8 4.9 V VOL OutputLOW Voltage IOL = +6 mA, VDIFF = −1V 0.08 0.3 V IOSR OutputShortCircuitCurrent V OUT = 0V −25 −85 −150 mA DRIVER AND RECEIVER CHARACTERISTICS ICC SupplyCurrent No Load DI = VCC orGND VCC 3.0 6 mA DI = 2.4Vor0.5V 3.8 12 mA (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified. (2) AlltypicalsaregivenforVCC = 5.0Vand T A = 25°C. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS89C21
SNLS091C –JUNE 1998–REVISED APRIL 2013 www.ti.com SwitchingCharacteristics(1)(2) Over recommended supplyvoltageand operatingtemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Min Typ Max Units DIFFERENTIAL DRIVER CHARACTERISTICS tPLHD PropagationDelayLOW toHIGH R L = 100Ω (Figure2 Figure3) 2 4.9 10 ns tPHLD PropagationDelayHIGH toLOW C L = 50 pF 2 4.5 10 ns tSKD Skew, |tPLHD –tPHLD | 0.4 2.0 ns tTLH TransitionTime LOW toHIGH (Figure2 Figure4) 2.2 9 ns tTHL TransitionTime HIGH toLOW 2.1 9 ns RECEIVER CHARACTERISTICS tPLH PropagationDelayLOW toHIGH C L = 50 pF (Figure5 Figure6) 6 18 30 ns tPHL PropagationDelayHIGH toLOW VDIFF = 2.5V 6 17.5 30 ns tSK Skew, |tPLH –tPHL | VCM = 0V 0.5 4.0 ns tr RiseTime (Figure7) 2.5 9 ns tf FallTime 2.1 9 ns (1) AlltypicalsaregivenforVCC = 5.0Vand T A = 25°C. (2) f= 1 MHz, tr and tf≤ 6 ns. Parameter Measurement Information Figure1. VOD and VOC TestCircuit f= 1 MHz, trand tf≤ 6 ns. Figure2. DriverPropagationDelay TestCircuit
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www.ti.com SNLS091C –JUNE 1998–REVISED APRIL 2013 Figure3. DriverDifferentialPropagationDelay Timing Figure4. DriverDifferentialTransitionTiming f= 1 MHz, trand tf≤ 6 ns. Figure5. ReceiverPropagationDelay TestCircuit Figure6. ReceiverPropagationDelay Timing Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS89C21
SNLS091C –JUNE 1998–REVISED APRIL 2013 www.ti.com Figure7. ReceiverRise and FallTimes
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REVISION HISTORY
Changes from RevisionB (April2013)toRevisionC Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS89C21
www.ti.com 31-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS89C21TM/NOPB Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS89C 21TM DS89C21TM/NOPB.A Active Production SOIC (D) | 8 95 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS89C 21TM DS89C21TMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS89C 21TM DS89C21TMX/NOPB.A Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS89C 21TM (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
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PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS89C21TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DS89C21TM/NOPB D SOIC 8 95 495 8 4064 3.05 DS89C21TM/NOPB.A D SOIC 8 95 495 8 4064 3.05 Pack Materials-Page 3
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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