DS3668 Quad Fault Protected Peripheral Driver datasheet (Rev. A)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SNLS351,A]
- PDF pages: 9
Technical content
DS3668 Quad Fault Protected Peripheral Driver Literature Number: SNLS351A
Quad Fault Protected Peripheral Driver General Description The DS3668 quad peripheral driver is designed for those applications where low operating power, high breakdown voltage, high output current and low output ON voltage are required. Unlike most peripheral drivers available, a unique fault protected circuit is incorporated on each output. When the load current exceeds 1.0A (approximately) on any output for more than a built-in delay time, nominally 12 µs, that output will be shut off by its protection circuitry with no effect on other outputs. This condition will prevail until that protec- tion circuitry is reset by toggling the corresponding input or the enable pin low for at least 1.0 µs. This built-in delay is provided to ensure that the protection circuitry is not trig- gered by turn-on surge currents associated with certain kinds of loads. The DS3668’s inputs combine TTL compatibility with high input impedance. In fact, its extreme low input current allows it to be driven directly by a MOS device. The outputs are capable of sinking 600 mA each and offer a 70V breakdown. However, for inductive loads the output should be clamped to 35V or less to avoid latch up during turn off (inductive fly-back protection — refer AN-213). An on-chip clamp diode capable of handling 800 mA is provided at each output for this purpose. In addition, the DS3668 incorporates circuitry that guarantees glitch-free power up or down operation and a fail-safe feature which puts the output in a high impedance state when the input is open. The molded package is specifically constructed to allow increased power dissipation over conventional packages. The four ground pins are directly connected to the device chip with a special copper lead frame. When the quad driver is soldered into a PC board, the power rating of the device improves significantly.
Applications
n High current, high voltage drivers n Level translators n Fiber optic LED drivers
Features
n High impedance TTL compatible inputs n High output current — 600 mA per output n No output latch-up at 35V n Low output ON voltage (550 mV typ@ 600 mA) n High breakdown voltage (70V) n Open collector outputs n Output clamp diodes for inductive fly-back protection n NPN inputs for minimal input currents (1 µA typical) n Low operating power n Standard 5V power supply n Power up/down protection n Fail-safe operation n 2W power package n Pin-for-pin compatible with SN75437 Connection Diagram Dual-In-Line Package DS005225-1 Top View Order Number DS3668N See NS Package Number N16E January 2001 DS3668 Quad Fault Protected Peripheral Driver © 2001 National Semiconductor Corporation DS005225 www.national.com
H = High state L = Low state Z = High impedance state DS3668 www.national.com 2
Absolute Maximum Ratings(Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage 7.0V Input Voltage 15V Output Voltage 70V Continuous Power Dissipation @ 25˚C Free-Air (Note 5) 2075 mW Storage Temperature Range −65˚C to +150˚C Lead Temperature (Soldering, 4 seconds) 260 Operating Conditions Min Max Units Supply Voltage 3.00 5.25 V Ambient Temperature −40 125 ˚C Electrical Characteristics(Notes 2, 3, 6) Symbol Parameter Conditions Min Typ Max Units VIH Input High Voltage 2.0 V VIL Input Low Voltage 0.8 V IIH Input High Current V IN = 5.25V, VCC = 5.25V 1.0 20 µA IIL Input Low Current V IN = 0.4V ±10 µA VIK Input Clamp Voltage I I = −12 mA −0.8 −1.5 V VOL Output Low Voltage I L = 300 mA 0.2 0.7 V IL = 600 mA (Note 4) 0.55 1.5 V ICEX Output Leakage Current V CE = 70V, VIN = 0.8V 100 µA VF Diode Forward Voltage I F = 800 mA 1.2 1.6 V IR Diode Leakage Current V R = 70V 100 µA ICC Supply Current All Inputs High 62 80 mA All Inputs Low 20 mA ITH Protection Circuit Threshold Current 1 1.4 A Switching Characteristics(Notes 2, 6) Symbol Parameter Conditions Min Typ Max Units tPHL Turn On Delay R L =6 0Ω ,V L = 30V 0.3 1.0 µs tPLH Turn Off Delay R L =6 0Ω ,V L = 30V 2 10.0 µs tFZ Protection Enable Delay (after Detection of Fault) 61 2 µ s tRL Input Low Time for Protection Circuit Reset 1.0 µs Note 1:“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of actual device operation. Note 2:Unless otherwise specified, min/max limits apply across the 0˚C to +70˚C temperature range and the 4.75V to 5.25V power supply range. All typical values are for TA = 25˚C and VCC = 5.0V. Note 3:All currents into device pins are shown as positive; all currents out of device pins are shown as negative; all voltages are referenced to ground, unless otherwise specified. All values shown as max or min are so classified on absolute value basis. Note 4:All sectors of this quad circuit may conduct rated current simultaneously, however, power dissipation averaged over a short interval of time must fall within specified continuous dissipation ratings. Note 5:For operation over 25˚C free-air temperature, derate linearly to 1328 mW@ 70˚C @ the rate of 16.6 mW/˚C. Note 6:Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. DS3668 www.national.com3
AC Test Circuit Switching Waveforms Typical Application Protection Circuit Block Diagram DS005225-2 DS005225-3 DS005225-4 DS005225-5 DS3668 www.national.com 4
Physical Dimensionsinches (millimeters) unless otherwise noted LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com Molded Dual-In-Line Package (N) Order Number DS3668N DS3668 Quad Fault Protected Peripheral Driver National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS3668N/NOPB Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 DS3668N DS3668N/NOPB.B Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 DS3668N DS3668N/NOPBG4 Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 DS3668N DS3668N/NOPBG4.B Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU Level-1-NA-UNLIM -40 to 125 DS3668N (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DS3668N/NOPB N PDIP 16 25 502 14 11938 4.32 DS3668N/NOPB.B N PDIP 16 25 502 14 11938 4.32 DS3668N/NOPBG4 N PDIP 16 25 502 14 11938 4.32 DS3668N/NOPBG4.B N PDIP 16 25 502 14 11938 4.32 Pack Materials-Page 1
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