DS36277 Dominant Mode Multipoint Transceiver datasheet (Rev. E)
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- Manufacturer or author: Texas Instruments, Incorporated [SNLS086,E]
- PDF pages: 20
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013 DominantModeMultipointTransceiver Check forSamples: DS36277 1FEATURES DESCRIPTION The DS36277 Dominant Mode MultipointTransceiver 2• FAILSAFE Receiver,RO = HIGH for: is designed for use on bi-directionaldifferential– OPEN Inputs busses.Itisoptimalforuse on Interfacesthatutilize – TerminatedInputs Society of Automotive Engineers (SAE) J1708 ElectricalStandard.– SHORTED Inputs
- OptimalforUse inSAE J1708 Interfaces The device is similarto standard TIA/EIA-485 transceivers,but differsin enablingscheme. The• Compatible withPopularInterfaceStandards: Driver'sInputisnormallyexternallytiedLOW, thus– TIA/EIA-485and TIA/EIA-422-A providingonlytwo states:Active(LOW), or Disabled – CCITT Recommendation V.11 (OFF).When thedriverisactive,thedominantmode isLOW, conversely,when thedriverisdisabled,the• Bi-DirectionalTransceiver bus ispulledHIGH by externalbiasresistors.– Designed forMultipointTransmission The receiverprovides a FAILSAFE featurethat• Wide Bus Common Mode Range ensuresa known outputstatewhen theInterfaceisin– (−7V to+12V) the followingconditions:FloatingLine,IdleLine(no
- AvailableinPDIP and SOIC Packages activedrivers),and Line FaultConditions(open or short).The receiveroutputisHIGH forthe following conditions:Open Inputs,TerminatedInputs(50Ω),or Shorted Inputs.FAILSAFE is a highlydesirable feature when the transceiversare used with AsynchronousControllerssuch as UARTs. Connection and Logic Diagram See Package Number D (R-PDSO-G8) or P (R-PDIP-T8) Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SNLS086E –JULY 1998–REVISED APRIL 2013 www.ti.com TruthTable Driver Inputs Outputs DE DI DO/RI DO /RI L L L H L H H L H X Z Z Receiver Inputs Output RE DO/RI–DO /RI RO L ≥ 0 mV H L ≤ −500 mV L L SHORTED H L OPEN H H X Z These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) Value Unit SupplyVoltage(VCC ) 7 V InputVoltage(DE ,RE ,and DI) 5.5 V DriverOutputVoltage/ReceiverInputVoltage −10V to+15 V ReceiverOutputVoltage(RO) 5.5 V Maximum Package Power Dissipation@ +25°C P Package (derate9.3mW/ °C above +25°C) 1168 mW D Package (derate5.8mW/ °C above +25°C) 726 mW StorageTemperatureRange −65°C to+150 °C Lead Temperature(Soldering4 sec.) 260 °C ESD Rating(HBM, 1.5kΩ,100 pF) 7.0 kV (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe specified.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tablesof“ElectricalCharacteristics”specifyconditionsfordeviceoperation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. Recommended OperatingConditions Min Max Units SupplyVoltage,VCC 4.75 5.25 V Bus Voltage −7 +12 V OperatingTemperature(TA)DS36277T −40 +85 °C
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(2) Over recommended SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Min Typ Max Units DRIVER CHARACTERISTICS VOD DifferentialOutputVoltage IO = 0 mA (No Load) 1.5 3.6 6 V VoDO OutputVoltage IO = 0 mA (OutputtoGND) 0 6 V VoDO OutputVoltage 0 6 V VT1 DifferentialOutputVoltage R L = 54Ω (485) (Figure1) 1.3 2.2 5.0 V (TerminationLoad) R L = 100Ω (422) 1.7 2.6 5.0 V ΔVT1 BalanceofVT1 R L = 54Ω See (3) −0.2 0.2 V |VT1 − VT1 | R L = 100Ω −0.2 0.2 V VOS DriverCommon Mode R L = 54Ω (Figure1) 0 2.5 3.0 V OutputVoltage R L = 100Ω 0 2.5 3.0 V ΔVOS BalanceofVOS R L = 54Ω See (3) −0.2 0.2 V |VOS − VOS | R L = 100Ω −0.2 0.2 V VOH OutputVoltageHigh IOH = −22 mA (Figure2) 2.7 3.7 V VOL OutputVoltageLow IOL = +22 mA 1.3 2 V IOSD DriverShort-Circuit VO = +12V (Figure3) 92 290 mA OutputCurrent VO = −7V −187 −290 mA RECEIVER CHARACTERISTICS VTH DifferentialInputHigh VO = VOH ,IO = −0.4mA −0.150 0 V ThresholdVoltage(4) −7V ≤ VCM ≤ +12V VTL DifferentialInputLow VO = VOL ,IO = 8.0mA −0.5 −0.230 V ThresholdVoltage(4) −7V ≤ VCM ≤ +12V VHST Hysteresis(5) VCM = 0V 80 mV IIN LineInputCurrent OtherInput= 0V VI= +12V 0.5 1.5 mA (VCC = 4.75V,5.25V,0V) DE = VIH (6) VI= −7V −0.5 −1.5 mA IOSR ShortCircuitCurrent VO = 0V RO −15 −32 −85 mA IOZ TRI-STATE Leakage Current VO = 0.4to2.4V −20 1.4 +20 μA VOH OutputHighVoltage VID = 0V,IOH = −0.4mA 2.3 3.7 V (Figure12) VID = OPEN, IOH = −0.4mA 2.3 3.7 V VOL OutputLow Voltage VID = −0.5V,IOL = +8 mA 0.3 0.7 V (Figure12) VID = −0.5V,IOL = +16 mA 0.3 0.8 V R IN InputResistance 10 20 kΩ DEVICE CHARACTERISTICS VIH HighLevelInputVoltage DE , 2.0 VCC V RE ,VIL Low LevelInputVoltage GND 0.8 Vor IIH HighLevelInputCurrent VIH = 2.4V 20 μADI IIL Low LevelInputCurrent VIL= 0.4V −100 μA VCL InputClamp Voltage ICL = −18 mA −0.7 −1.5 V ICC OutputLow Voltage DE = 0V,RE = 0V,DI = 0V 39 60 mA SupplyCurrentICCR DE = 3V,RE = 0V,DI = 0V 24 50 mA(No Load) ICCD DE = 0V,RE = 3V,DI = 0V 40 75 mA ICCX DE = 3V,RE = 3V,DI = 0V 27 45 mA (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground unlessotherwisespecified. (2) AlltypicalsaregivenforVCC = 5.0Vand TA = +25°C. (3) Δ |VT1|and Δ |VOS |arechanges inmagnitudeofVT1 and VOS ,respectively,thatoccurwhen theinputchanges state. (4) Thresholdparameterlimitsspecifiedas an algebraicvalueratherthanby magnitude. (5) Hysteresisdefinedas VHST = VTH − VTL. (6) IIN includesthereceiverinputcurrentand driverTRI-STATE leakagecurrent. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS36277
SNLS086E –JULY 1998–REVISED APRIL 2013 www.ti.com SwitchingCharacteristics(1) Over recommended SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified. Symbol Parameter Conditions Min Typ Max Units DRIVER CHARACTERISTICS tPLHD Diff.Prop.DelayLow toHigh R L = 54Ω 8 17 60 ns tPHLD Diff.Prop.DelayHightoLow C L = 50 pF 8 19 60 ns tSKD Diff.Skew (|tPLHD –tPHLD |) C D = 50 pF 2 10 ns tr Diff.RiseTime (Figure4 and Figure5) 11 60 ns tf Diff.FallTime 11 60 ns tPLH Prop.DelayLow toHigh R L = 27Ω,C L = 15 pF 22 85 ns (Figure6 and Figure7)tPHL Prop.DelayHightoLow 25 85 ns tPZH EnableTime Z toHigh R L = 110Ω 25 60 ns C L = 50 pFtPZL EnableTime Z toLow 30 60 ns(Figure8 – Figure11 ) tPHZ DisableTime HightoZ 16 60 ns tPLZ DisableTime Low toZ 11 60 ns RECEIVER CHARACTERISTICS tPLH Prop.DelayLow toHigh VID = −1.5Vto+1.5V 15 37 90 ns C L = 15 pFtPHL Prop.DelayHightoLow 15 43 90 ns(Figure13 and Figure14) tSK Skew (|tPLH –tPHL |) 6 15 ns tPZH EnableTime Z toHigh C L = 15 pF 12 60 ns (Figure15 and Figure16)tPZL EnableTime Z toLow 28 60 ns tPHZ DisableTime HightoZ 20 60 ns tPLZ DisableTime Low toZ 10 60 ns (1) AlltypicalsaregivenforVCC = 5.0Vand TA = +25°C.
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure1. DriverVT1 and VOS TestCircuit Figure2. DriverVOH and VOL TestCircuit Figure3. DriverShortCircuitTestCircuit C L includesprobeand straycapacitance The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f=1.0MHz, 50% dutycycle,Tr and tf<6.0ns,Zo=50Ω Figure4. DriverDifferentialPropagationDelay and TransitionTime TestCircuit Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS36277
SNLS086E –JULY 1998–REVISED APRIL 2013 www.ti.com Figure5. DriverDifferentialPropagationDelays and TransitionTimes C L includesprobeand straycapacitance The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f=1.0MHz, 50% dutycycle,Tr and tf<6.0ns,Zo=50Ω Figure6. DriverPropagationDelay TestCircuit Figure7. DriverPropagationDelays
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013 S1 toDO forDI = 3V S1 toDO forDI = 0V C L includesprobeand straycapacitance The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f=1.0MHz, 50% dutycycle,Tr and tf<6.0ns,Zo=50Ω Figure8. DriverTRl-STATE TestCircuit(tPZH ,tPHZ ) Figure9. DriverTRI-STATE Delays (tPZH ,tPHZ ) S1 toDO forDI = 0V S1 toDO forDI = 3V C L includesprobeand straycapacitance The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f=1.0MHz, 50% dutycycle,Tr and tf<6.0ns,Zo=50Ω Figure10. DriverTRI-STATE TestCircuit(tPZL ,tPLZ ) Figure11. DriverTRl-STATE Delays (tPZL ,tPLZ ) Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS36277
SNLS086E –JULY 1998–REVISED APRIL 2013 www.ti.com Figure12. ReceiverVOH and VOL CL includesprobeand straycapacitance The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f=1.0MHz, 50% dutycycle,Tr and tf<6.0ns,Zo=50Ω Figure13. ReceiverPropagationDelay TestCircuit Figure14. ReceiverPropagationDelays C L includesprobeand straycapacitance The inputpulseissuppliedby a generatorhavingthefollowingcharacteristics:f=1.0MHz, 50% dutycycle,Tr and tf<6.0ns,Zo=50Ω Diodesare1N916 orequivalent. Figure15. ReceiverTRI-STATE Delay TestCircuit
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013 S1 1.5V S2 OPEN S3 CLOSED S1 1.5V S2 CLOSED S3 CLOSED S1 −1.5V S2 CLOSED S3 OPEN S1 −1.5V S2 CLOSED S3 CLOSED Figure16. ReceiverEnable and DisableTiming Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:DS36277
SNLS086E –JULY 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics DifferentialOutput Voltage DifferentialOutput Voltage vs Output Current vs Output Current Figure17. Figure18. DriverVOH DriverVOH vs vs IOH IOH vs vs VCC Temperature Figure19. Figure20. DriverVOL DriverVOL vs vs IOL IOL vs vs VCC Temperature Figure21. Figure22.
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013 TypicalPerformance Characteristics(continued) ReceiverVOH ReceiverVOH vs vs IOH IOH vs vs VCC Temperature Figure23. Figure24. ReceiverVOL ReceiverVOL vs vs IOL IOL vs vs VCC Temperature Figure25. Figure26. Supply Current Supply Current vs vs Supply Voltage Temperature Figure27. Figure28. Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:DS36277
SNLS086E –JULY 1998–REVISED APRIL 2013 www.ti.com TypicalPerformance Characteristics(continued) VoltageOutput vs VoltageInput(Hysteresis) Figure29. TYPICAL APPLICATIONS INFORMATION Figure30. SAE J1708 Node withExternalBias Resistorsand Filters
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www.ti.com SNLS086E –JULY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from RevisionD (April2013)toRevisionE Page Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:DS36277
www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS36277TMX/NOPB Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS362 77TM DS36277TMX/NOPB.B Active Production SOIC (D) | 8 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS362 77TM (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 9-Aug-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36277TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C .228-.244 TYP [5.80-6.19] .069 MAX [1.75] 6X .050 [1.27] 8X .012-.020 [0.31-0.51] .150 [3.81] .005-.010 TYP [0.13-0.25] 0 - 8 .004-.010 [0.11-0.25] .010 [0.25].016-.050 [0.41-1.27] 4X (0 -15 ) A .189-.197 [4.81-5.00] NOTE 3 B .150-.157 [3.81-3.98] NOTE 4 4X (0 -15 ) (.041) [1.04] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. 1 8 .010 [0.25] C A B PIN 1 ID AREA SEATING PLANE .004 [0.1] C SEE DETAIL A DETAIL A TYPICAL SCALE 2.800
www.ti.com EXAMPLE BOARD LAYOUT .0028 MAX [0.07] ALL AROUND .0028 MIN [0.07] ALL AROUND (.213) [5.4] 6X (.050 ) [1.27] 8X (.061 ) [1.55] 8X (.024) [0.6] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL UNDER SOLDER MASK SOLDER MASK DEFINED EXPOSED METAL LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SYMM 4 5 SEE DETAILS SYMM
www.ti.com EXAMPLE STENCIL DESIGN 8X (.061 ) [1.55] 8X (.024) [0.6] 6X (.050 ) [1.27] (.213) [5.4] (R.002 ) TYP [0.05] SOIC - 1.75 mm max heightD0008A SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X SYMM SYMM 4 5
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