DS34LV87T Enhanced CMOS Quad Differential Line Driver datasheet (Rev. D)

Document overview

  • Manufacturer or author: Texas Instruments, Incorporated [SNLS116,D]
  • PDF pages: 15

Technical content

www.ti.com SNLS116D –JULY 2006–REVISED APRIL 2013 DS34LV87TEnhancedCMOS QuadDifferentialLineDriver Check forSamples: DS34LV87T 1FEATURES DESCRIPTION The DS34LV87T is a high speed quad differential• Meets TIA/EIA-422-B(RS-422)and ITU-TV.11 CMOS driverthatmeets the requirementsof bothRecommendation TIA/EIA-422-B and ITU-T V.11. The CMOS• InteroperableWith Existing5V RS-422 DS34LV87T featureslow staticICC of 100 μA max Networks which makes itidealforbatterypowered and power consciousapplications.The TRI-STATE enable,EN,• Ensured VOD of2V Min Over Operating allowsthe deviceto be disabledwhen the deviceisConditions not in use to minimize power. The dual enable• Balanced Output Crossover forLow EMI scheme allowsforflexibilityinturningdeviceson or(TypicalWithin40 mV of50% VoltageLevel) off.

  • Low Power Design (330μW @ 3.3VStatic) Protectiondiodesprotectallthedriverinputsagainst• ESD ≥ 7 kV on Cable I/OPins (HBM) electrostaticdischarge.The driverand enableinputs
  • IndustrialTemperature Range (DI and EN) are compatible with LVTTL and LVCMOS devices.Differentialoutputshave thesame• Ensured AC Parameter: VOD (≥2V) ensure as the 5V version.The outputs– Maximum DriverSkew: 2 ns have enhanced ESD Protectionprovidinggreater – Maximum TransitionTime: 10 ns than7 kV tolerance.
  • Pin Compatible With DS26C31
  • AvailableinSOIC Packaging TRUTH TABLE (1) Connection Diagram Enables Input Outputs EN DI DO+ DO − L X Z Z H H H L H L L H (1) L = Low logicstate X = Irrelevant Figure1. Dual-In-LinePackage (Top View) H = Highlogicstate See Package Number D0016A Z = TRI-STATE Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2006–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS116D –JULY 2006–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. ABSOLUTE MAXIMUM RATINGS (1)(2) SupplyVoltage(VCC ) −0.5Vto+7V EnableInputVoltage(EN) −0.5VtoVCC + 0.5V DriverInputVoltage(DI) −0.5VtoVCC + 0.5V Clamp DiodeCurrent ±20 mA DC OutputCurrent,perpin ±150 mA DriverOutputVoltage (PowerOff:DO+, DO −) −0.5Vto+7V Maximum Package Power Dissipation D Package @+25 °C 1226 mW DerateD Package 9.8mW/ °C above +25°C StorageTemperatureRange −65°C to+150°C Lead TemperatureRange (Soldering,4 sec.) +260°C ESD Ratings(HBM, 1.5k,100 pF) DriverOutputs ≥ 7 kV OtherPins ≥ 2.5kV (1) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexas InstrumentsSalesOffice/Distributorsforavailabilityand specifications. (2) AbsoluteMaximum Ratingsarethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimplythat thedeviceshouldbe operatedattheselimits.The tableofElectricalCharacteristicsspecifiesconditionsofdeviceoperation. RECOMMENDED OPERATING CONDITIONS Min Typ Max Units SupplyVoltage(VCC ) 3.0 3.3 3.6 V OperatingFreeAir TemperatureRange (TA) −40 25 +85 °C DS34LV87T InputRiseand FallTime 500 ns

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www.ti.com SNLS116D –JULY 2006–REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS (1)(2) Over SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified Symbol Parameter Conditions Pin Min Typ Max Units VOD1 OutputDifferentialVoltage R L= ∞,(No Load) DO+, 3.3 4.0 V DO −VOD2 OutputDifferentialVoltage R L = 100Ω See Figure2 2 2.6 V ΔVOD2 Change inMagnitudeof −400 7 400 mV OutputDifferentialVoltage VOD3 OutputDifferentialVoltage R L = 3900Ω (V.11),See 3.2 3.5 V Figure2(3) VOC Common Mode Voltage R L = 100Ω See Figure2 1.5 2 V ΔVOC Change inMagnitudeof −400 6 400 mV Common Mode Voltage IOZ TRI-STATE Leakage Current VOUT = VCC orGND ±0.5 ±20 μA DriversDisabled ISC OutputShortCircuitCurrent VOUT = 0V −40 −70 −150 mA VIN = VCC orGND (4) IOFF OutputLeakage Current VCC = 0V,VOUT = 3V 0.03 100 μA VCC = 0V,VOUT = −0.25V −0.08 −100 μA VIH HighLevelInputVoltage DI, 2.0 VCC V ENVIL Low LevelInputVoltage GND 0.8 V IIH HighLevelInputCurrent VIN= VCC 10 μA IIL Low LevelInputCurrent VIN = GND −10 μA VCL InputClamp Voltage IIN = −18 mA −1.5 V ICC Power SupplyCurrent No Load,VIN (all)= VCC orGND VCC 100 μA (1) Currentintodevicepinsisdefinedas positive.Currentoutofdevicepinsisdefinedas negative.Allvoltagesarereferencedtoground exceptdifferentialvoltagesVOD1 ,VOD2 ,VOD3 . (2) AlltypicalvaluesaregivenforVCC = 3.3Vand TA = +25°C. (3) ThisspecificationlimitisforcompliancewithTIA/EIA-422-Band ITU-TV.11. (4) Onlyone outputshortedata time.The output(trueorcomplement)isconfiguredHigh. Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS34LV87T

SNLS116D –JULY 2006–REVISED APRIL 2013 www.ti.com SWITCHING CHARACTERISTICS (1)(2) Over SupplyVoltageand OperatingTemperatureranges,unlessotherwisespecified Symbol Parameter Conditions Min Typ Max Units tPHLD DifferentialPropagationDelay R L = 100Ω,C L = 50 pF 6 10.5 16 nsHightoLow See Figure3 and Figure4 tPLHD DifferentialPropagationDelay 6 11 16 nsLow toHigh tSKD DifferentialSkew 0.5 2.0 ns|tPHLD –tPLHD | tSK1 Skew, PintoPin(same device) 1.0 2.0 ns tSK2 Skew, ParttoPart(3) 3.0 5.0 ns tTLH DifferentialTransitionTime 4.2 10 nsLow toHigh(20% to80%) tTHL DifferentialTransitionTime 4.7 10 nsHightoLow (80% to20%) tPHZ DisableTime HightoZ See Figure5 and Figure6 12 20 ns tPLZ DisableTime Low toZ 9 20 ns tPZH EnableTime Z toHigh 22 32 ns tPZL EnableTime Z toLow 22 32 ns fMAX Maximum OperatingFrequency(4) 32 MHz (1) f= 1 MHz, tr and tf≤ 6 ns (10% to90%). (2) See TIA/EIA-422-Bspecificationsforexacttestconditions. (3) Devicesareatthesame VCC and within5°C withintheoperatingtemperaturerange. (4) Allchannelsswitching,outputdutycyclecriteriais40%/60% measured at50%. Thisparameterisensuredby designand characterization.

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www.ti.com SNLS116D –JULY 2006–REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure2. DifferentialDriverDC TestCircuit Figure3. DifferentialDriverPropagationDelay and TransitionTime TestCircuit Generatorwaveform foralltestsunlessotherwisespecified:f= 1 MHz, DutyCycle= 50%, Zo = 50Ω,tr ≤ 10 ns,tf≤ 10 ns. C L includesprobeand fixturecapacitance. Figure4. DifferentialDriverPropagationDelay and TransitionTime Waveforms Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS34LV87T

SNLS116D –JULY 2006–REVISED APRIL 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure5. DriverSingle-EndedTri-stateTestCircuit Figure6. DriverSingle-EndedTri-stateWaveforms

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www.ti.com SNLS116D –JULY 2006–REVISED APRIL 2013 TYPICAL APPLICATION INFORMATION General applicationguidelinesand hintsfordifferentialdriversand receiversmay be found in the following applicationnotes:

  • TransmissionLineDriversand ReceiversforTIA/EIAStandardsRS-422 and RS-423(SNLA137 )
  • A ComparisonofDifferentialTerminationTechniques(SNLA304 ) Power DecouplingRecommendations: Bypass caps must be used on power pins.High frequencyceramic(surfacemount isrecommended) 0.1μF in parallelwith0.01μF atthepower supplypin.A 10 μF orgreatertantalumorelectrolyticshouldbe connectedat thepower entrypointon theprintedcircuitboard. R T isoptionalalthoughhighlyrecommended toreduce reflection Figure7. TypicalDriverConnection Figure8. TypicalDriverOutput Waveforms Copyright© 2006–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:DS34LV87T

SNLS116D –JULY 2006–REVISED APRIL 2013 www.ti.com

REVISION HISTORY

Changes from RevisionC (April2013)toRevisionD Page

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www.ti.com 31-Oct-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS34LV87TM/NOPB Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS34LV87 TM DS34LV87TM/NOPB.A Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM -40 to 85 DS34LV87 TM DS34LV87TMX/NOPB Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS34LV87 TM DS34LV87TMX/NOPB.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 85 DS34LV87 TM (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

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PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS34LV87TMX/NOPB SOIC D 16 2500 356.0 356.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DS34LV87TM/NOPB D SOIC 16 48 495 8 4064 3.05 DS34LV87TM/NOPB.A D SOIC 16 48 495 8 4064 3.05 Pack Materials-Page 3

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