DS3486

DS3486 Quad RS-422, RS-423 Line Receiver datasheet (Rev. D)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNLS354,D]
• PDF pages: 12

Technical content

www.ti.com SNLS354D –MAY 1998–REVISED APRIL 2013 DS3486QuadRS-422,RS-423LineReceiver Check forSamples: DS3486 1FEATURES DESCRIPTION Texas Instruments'quad RS-422, RS-423 receiver 2• Four IndependentReceivers featuresfour independentreceiverswhich comply• TRI-STATE Outputs withEIA Standardsfortheelectricalcharacteristicsof

• InternalHysteresis−140 mV (typ) balanced/unbalancedvoltagedigitalinterfacecircuits. Receiveroutputsare 74LS compatible,TRI-STATE• FastPropagationTimes −19 ns (typ) structureswhichareforcedtoa highimpedance state• TTL Compatible Outputs when the appropriateoutputcontrolpin reaches a
• 5V Supply logiczero condition.A PNP device bufferseach outputcontrolpin to assure minimum loadingfor• Pin Compatible and Interchangeablewith eitherlogicone orlogiczeroinputs.Inaddition,eachMC3486 receiverhas internalhysteresiscircuitryto improve noise margin and discourageoutputinstabilityfor slowlychanginginputwaveforms. Block and Connection Diagrams Figure1. Dual-In-LinePackage Top View D-16 (SOIC)Package or NFG0016E (PDIP) Package Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1998–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SNLS354D –MAY 1998–REVISED APRIL 2013 www.ti.com These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings(1)(2) Power SupplyVoltage,VCC 8V InputCommon-Mode Voltage,VICM ±25V InputDifferentialVoltage,VID ±25V TRI-STATE ControlInputVoltage,VI 8V OutputSinkCurrent,IO 50 mA StorageTemperature,TSTG −65°C to+150°C Maximum Power Dissipation(3)at25°C Molded PDIP Package 1362 mW θJA +124.5°C/W θJC +41.2°C/W (1) “AbsoluteMaximum Ratings”arethosevaluesbeyond whichthesafetyofthedevicecannotbe ensured.They arenotmeant toimply thatthedevicesshouldbe operatedattheselimits.The tableof“ElectricalCharacteristics”providesconditionsforactualdevice operation. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityand specifications. (3) DeratePDIP molded package 10.2mW/ °C above 25°C. DerateSOIC package 8.01mW/ °C above 25°C. OperatingConditions Max Min Units Power SupplyVoltage,VCC 4.75 5.25 V OperatingTemperature,TA 0 70 °C InputCommon-Mode Voltage −7.0 7.0 V Range, VICR ElectricalCharacteristics(1) (Unlessotherwisenoted,minimum and maximum limitsapplyoverrecommended temperatureand power supplyvoltage ranges.TypicalvaluesareforTA = 25°C, VCC = 5V and VIC = 0V.) Symbol Parameter Conditions Min Typ Max Units VIH InputVoltage— HighLogicState 2.0 V(TRI-STATE Control) VIL InputVoltage— Low LogicState 0.8 V(TRI-STATE Control) VTH(D) DifferentialInputThresholdVoltage −7V ≤ VIC ≤ 7V,VIH TRI-STATE = 2V 0.070 0.2 VIO = −0.4mA, VOH ≥ 2.7V IO = 8 mA, VOL ≥ 0.5V 0.070 −0.2 V IIB (D) InputBiasCurrent VCC = 0V or5.25V,OtherInputsat0V VI= −10V −3.25 mA VI= −3V −1.50 mA VI= 3V 1.50 mA VI= 10V 3.25 mA InputBalance −7V ≤ VIC ≤ 7V,VIH(3C)= 2V, (2) VOH IO = −0.4mA, VID = 0.4V 2.7 V VOL IO = 8 mA, VID = −0.4V 0.5 V (1) Allcurrentsintodevicepinsareshown as positive,outofdevicepinsarenegative.Allvoltagesreferencedtogroundunlessotherwise noted. (2) RefertoEIA RS-422/3forexactconditions.

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www.ti.com SNLS354D –MAY 1998–REVISED APRIL 2013 ElectricalCharacteristics(1)(continued) (Unlessotherwisenoted,minimum and maximum limitsapplyoverrecommended temperatureand power supplyvoltage ranges.TypicalvaluesareforTA = 25°C, VCC = 5V and VIC = 0V.) Symbol Parameter Conditions Min Typ Max Units IOZ OutputTRI-STATE Leakage Current VI(D)= 3V,VIL= 0.8V,VOL = 0.5V −40 μA VI(D)= −3V,VIL= 0.8V,VOH = 2.7V 40 μA IOS OutputShort-CircuitCurrent VI(D)= 3V,VIHTRI-STATE = 2V, −15 −100 mA VO = 0V, (3) IIL InputCurrent— Low LogicState VIL= 0.5V −100 μA(TRI-STATE Control) IIH InputCurrent— HighLogicState VIH = 2.7V 20 μA (TRI-STATE Control) VIH = 5.25V 100 μA VIC InputClamp DiodeVoltage IIN = −10 mA −1.5 V(TRI-STATE Control) ICC Power SupplyCurrent AllInputsVIL= 0V 85 mA (3) Onlyone outputata timeshouldbe shorted. SwitchingCharacteristics (Unlessotherwisenoted,VCC = 5V and TA = 25°C.) Symbol Parameter Min Typ Max Units tPHL(D) PropagationDelayTime— DifferentialInputstoOutput 19 35 ns OutputHightoLow tPLH(D) OutputLow toHigh 19 30 ns tPLZ TRI-STATE ControltoOutput 23 35 ns OutputLow toTRI-STATE tPHZ OutputHightoTRI-STATE 25 35 ns tPZH OutputTRI-STATE toHigh 18 30 ns tPZL OutputTRI-STATE toLow 20 30 ns AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:DS3486

SNLS354D –MAY 1998–REVISED APRIL 2013 www.ti.com Inputpulsecharacteristics: tTLH = tTHL = 6 ns (10% to90%) PRR = 1 MHz, 50% dutycycle Figure2. PropagationDelay DifferentialInputtoOutput 1.5VfortPHZ and tPLZ 1.5VfortPLZ and tPZL Inputpulsecharacteristics: tTLH = tTHL = 6 ns (10% to90%) PRR = 1 MHz, 50% dutycycle tPLZ

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www.ti.com SNLS354D –MAY 1998–REVISED APRIL 2013 tPHZ tPZH tPZL Figure3. PropagationDelay TRI-STATE ControlInputtoOutput Copyright© 1998–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:DS3486

SNLS354D –MAY 1998–REVISED APRIL 2013 www.ti.com

REVISION HISTORY

Changes from RevisionC (April2013)toRevisionD Page

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www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DS3486M/NOPB Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 DS3486M DS3486M/NOPB.B Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 DS3486M DS3486MX/NOPB Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 DS3486M DS3486MX/NOPB.B Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 DS3486M (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS3486MX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DS3486M/NOPB D SOIC 16 48 495 8 4064 3.05 DS3486M/NOPB.B D SOIC 16 48 495 8 4064 3.05 Pack Materials-Page 3

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