High Power Differential Driver Amplifier datasheet
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SBWS004,*]
- PDF pages: 12
Technical content
In– Out+ +5V G = 3V/V DRV1100 Patent Pending GND Out– 4Ω Protection 1:4 Transformer 135Ω HIGH POWER DIFFERENTIAL DRIVER AMPLIFIER OPA658 DRV1100 DRV1100 International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
DESCRIPTION
The DRV1100 is fixed gain differential line driver designed for very low harmonic distortion at the high powers required of xDSL line interface standards. Operating on a single +5V supply, it can deliver 230mA peak output current and 9.5Vp-p differential output voltage swing. This high output power on a single +5V supply makes the DRV1100 an excellent choice for the xDSL applications that require up to 17dBm power onto the line with high crest factors. The DRV1100 is available in both 8-pin plastic DIP and SO-8 packages.
FEATURES
l HIGH OUTPUT CURRENT: 230mA l SINGLE SUPPLY OPERATION: 5V l 5MHz BANDWIDTH: 6Vp-p into 15Ω l VERY LOW THD AT HIGH POWER: –72dBc at 6Vp-p, 100kHz, 100Ω l LOW QUIESCENT CURRENT: 11mA l FIXED DIFFERENTIAL GAIN: 3V/V
APPLICATIONS
l xDSL TWISTED PAIR LINE DRIVER l COMMUNICATIONS LINE DRIVER l TRANSFORMER DRIVER l SOLENOID DRIVER l HIGH POWER AUDIO DRIVER l CRT YOKE DRIVER © 1996 Burr-Brown Corporation PDS-1354 Printed in U.S.A. December, 1996 SBWS004
DRV1100P, U PARAMETER CONDITIONS MIN TYP MAX UNITS AC PERFORMANCE –3dB Bandwidth R L = 15Ω , VO = 1Vp-p 8 MHz R L ≥ 100Ω , VO = 1Vp-p 11 MHz R L = 15Ω , VO = 6Vp-p 5 MHz R L ≥ 100Ω , VO = 6Vp-p 6 MHz Differential Slew Rate R L = 100Ω , VO = 6Vp-p 80 V/ µs Step Response Delay(1) VO = 1Vp-p 25 ns Settling Time to 1%, Step Input V O = 1Vp-p, RL = 100Ω 0.25 µs Settling Time to 1%, Step Input V O = 6Vp-p, RL = 100Ω 0.3 µs Settling Time to 0.1%, Step Input V O = 1Vp-p, RL = 100Ω 0.8 µs Settling Time to 0.1%, Step Input V O = 6Vp-p, RL = 100Ω 1.1 µs THD, Total Harmonic Distortion(2) f = 10kHz R L = 100Ω , VO = 6Vp-p –85 dBc f = 10kHz R L = 15Ω , VO = 6Vp-p –66 –76 dBc f = 100kHz R L = 100Ω , VO = 6Vp-p –72 dBc f = 100kHz R L = 15Ω , VO = 6Vp-p –65 dBc Input Voltage Noise f = 100kHz 30 nV/ √Hz Input Current Noise f = 100kHz 0.5 fA/ √Hz INPUT CHARACTERISTICS Differential Input Resistance 1011 Ω Differential Input Capacitance 1p F Common-Mode Input Resistance 1011 Ω Common-Mode Input Capacitance 6p F Input Offset Voltage 5m V Input Bias Current 1p A Common-Mode Rejection Ratio Input Referred 62 dB Power Supply Rejection Ratio Input Referred 60 76 dB Input Common-Mode Voltage Range OUTPUT CHARACTERISTICS Differential Output Offset, RTO 10 25 mV Differential Output Offset Drift, RTO –40 °C to +85°C3 0 µV/°C Differential Output Resistance 0.16 Ω Peak Current (Continuous) R L = 15Ω 200 230 mA Differential Output Voltage Swing R L = 1kΩ 9.6 Vp-p R L = 100Ω 8.5 9.5 Vp-p R L = 15Ω 6.0 6.6 Vp-p Output Voltage Swing, Each Side R L = 1kΩ 0.125 4.875 V Gain Fixed Gain, Differential 3 V/V Gain Error ±0.25 dB POWER SUPPLY Operating Voltage Range +4.5 +5.0 +5.5 V Quiescent Current V DD = 5.0V +11 +16 mA TEMPERATURE RANGE –40 +85 °C Thermal Resistance, θJA DRV1100P 8-Pin DIP 100 °C/W DRV1100U 8-Pin SO-8 125 °C/W NOTES: (1) Time from 50% point of input step to 50% point of output step. (2) Measurement Bandwidth = 500kHz. (3) Output common-mode voltage follows input common-mode voltage; therefore, if input VCM = VDD /2, then output VCM = VDD /2. SPECIFICATIONS At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
±10mA, Continuous ABSOLUTE MAXIMUM RATINGS In+ 2 8In– Out+ +5V GND Out– PACKAGE/ORDERING INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER (1) DRV1100P 8-Pin PDIP 006 DRV1100U 8-Lead SO-8 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. GND In+ In– GND Out– VDD (+5V) VDD (+5V) Out+
TYPICAL PERFORMANCE CURVES At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. –40 –45 –50 –55 –60 –65 –70 –75 –80 100K SMALL SIGNAL 2ND HARMONIC DISTORTION 2nd Harmonic (dB) Frequency (Hz) 1M 10M R L = 15Ω VO = 1Vp-p R L = 100Ω –40 –45 –50 –55 –60 –65 –70 –75 –80 100K SMALL SIGNAL 3RD HARMONIC DISTORTION 3rd Harmonic (dB) Frequency (Hz) 1M 10M VO = 1Vp-p R L = 100Ω R L = 15Ω –40 –45 –50 –55 –60 –65 –70 –75 –80 100K LARGE SIGNAL 2ND HARMONIC DISTORTION 2nd Harmonic (dB) Frequency (Hz) 1M 10M R L = 15Ω VO = 6Vp-p R L = 100Ω –40 –45 –50 –55 –60 –65 –70 –75 –80 100K LARGE SIGNAL 3RD HARMONIC DISTORTION 3rd Harmonic (dB) Frequency (Hz) 1M 10M VO = 6Vp-p R L = 100Ω R L = 15Ω 9.5 8.5 7.5 6.5 5.5 4.5 3.5 2.5 1.5 10K 100K SMALL SIGNAL FREQUENCY RESPONSE Differential Gain (dB) Frequency (Hz) 1M 10M R L = 1kΩ R L = 100Ω R L = 15Ω VO = 1Vp-p 9.5 8.5 7.5 6.5 5.5 4.5 3.5 2.5 1.5 10K 100K LARGE SIGNAL FREQUENCY RESPONSE Differential Gain (dB) Frequency (Hz) 1M 10M R L = 1kΩ R L = 100Ω R L = 15Ω VO = 6Vp-p
TYPICAL PERFORMANCE CURVES (CONT) At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. –40 –50 –60 –70 –80 –90 12 3 4 10kHz THD THD (dBc) Differential Output Voltage (Vp-p) 56 7 8 9 1 0 R L = 15Ω R L = 100Ω R L = 1kΩ –40 –50 –60 –70 –80 –90 12 3 4 100kHz THD THD (dBc) Differential Output Voltage (Vp-p) 56 7 8 9 1 0 R L = 15Ω R L = 100Ω R L = 1kΩ +0.5V –0.5V SMALL SIGNAL STEP RESPONSE Differential Voltage (125mV/div) Time (50ns/div) Output Input R L = 100Ω +3V –3V LARGE SIGNAL STEP RESPONSE Differential Voltage (750mV/div) Time (50ns/div) Output Input R L = 100Ω MAXIMUM V O vs SUPPLY VOLTAGE Differential Output Voltage (Vp-p) Supply Voltage (VDD ) 4.5 4.75 5 5.25 5.5 R L = 100Ω R L = 1kΩ R L = 15Ω 10K1K 100K LARGE SIGNAL OPERATING RANGE Differential Output Swing (Vp-p) Frequency (Hz) 1M 10M R L = 15Ω R L = 1kΩ R L = 100Ω1% THD
TYPICAL PERFORMANCE CURVES (CONT) At VDD = +5.0V, VCM = VDD /2, TA = 25°C, unless otherwise specified. 1000 100 DIFFERENTIAL INPUT VOLTAGE NOISE Voltage Noise (nV/√Hz) Frequency (Hz) 100 1K 10K 100K 1M 0.1 DIFFERENTIAL OUTPUT IMPEDANCE Impedance (Ω ) Frequency 1k 10K 100K 1M 10M –40 –20 0 20 40 60 80 100 QUIESCENT CURRENT vs TEMPERATURE Quiescent Current (mA) Temperature (°C) VDD = +5V 10K1K 100K POWER SUPPLY REJECTION vs FREQUENCY PSRR (dB) Frequency (Hz) 1M 10M
www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DRV1100U NRND Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-2-260C-1 YEAR - DRV 1100U DRV1100U.B NRND Production SOIC (D) | 8 75 | TUBE Yes NIPDAU Level-2-260C-1 YEAR See DRV1100U DRV 1100U (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DRV1100U D SOIC 8 75 506.6 8 3940 4.32 DRV1100U.B D SOIC 8 75 506.6 8 3940 4.32 Pack Materials-Page 1
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