DGD05463

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 14

Technical content

Features

  • 50V Floating High-Side Driver
  • Drives Two N-Channel MOSFETs in a Half-Bridge Configuration
  • 1.5A Source / 2.5A Sink Output Current Capability
  • Internal Bootstrap Diode Included
  • Undervoltage Lockout for High-Side and Low-Side Drivers
  • Programmable Deadtime to Protect MOSFETs
  • Logic Input (IN and EN) 3.3V Capability
  • Ultra-Low Standby Currents (< 1µA)
  • Extended Temperature Range: -40°C to +125°C
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data
  • Package: W-DFN3030-10, MSOP-10
  • Package Material: Molded Plastic. “Green” Molding Compound. UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 3 per J-STD-020
  • Terminals: Finish – Matte Tin Finish. Solderable per MIL-STD-202, Method 208
  • Weight: ▪ W-DFN3030-10 (Type TH): 0.017 grams (Approximate) ▪ MSOP-10: 0.0286 grams (Approximate) Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. W-DFN3030-10 (Type TH) Top View Typical Configuration Bottom View Top View MSOP-10 THE DGD05463 IS OBSOLETE. PLEASE CONTACT US.

Document number: DS40512 Rev. 9 - 4 2 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Ordering Information (Note 4) Orderable Part Number Package Marking Reel Size (inches) Tape Width (mm) Packing Qty. Carrier DGD05463FN-7 W-DFN3030-10 (Type TH) DGD05463 7 8 3000 Reel DGD05463M10-13 MSOP-10 DGD05463 13 12 2500 Reel Note: 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information Pin Diagrams Pin Descriptions Pin Number Pin Name Function

1 VCC Low-Side and Logic Supply

2 VB High-Side Floating Supply

3 HO High-Side Gate Drive Output

4 VS High-Side Floating Supply Return

5 NC No Connection (No Internal Connection)

6 DT Deadtime Control

7 EN Logic Input Enable, a Logic Low Turns Off Gate Driver

8 IN Logic Input for High-Side and Low-Side Gate Driver Outputs (HO and LO), in Phase with HO

9 COM Low-Side and Logic Return

10 LO Low-Side Gate Drive Output

PAD Substrate Connect to COM on PCB (For W-DFN3030-10 (Type TH) Only) YYWW DGD05463 Top View: W-DFN3030-10 (Type TH) DGD05463 = Product Type Marking Code YY = Year (ex: 26 = 2026) WW = Week (01 to 53) = Manufacturer’s Code Marking DGD05463 = Product Type Marking Code Y = Year: 0 to 9 (ex: 6 = 2026) W = Week: A to Z : week 1 to 26 a to z : week 27 to 52 Top View: MSOP-10 DGD05463

Document number: DS40512 Rev. 9 - 4 3 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Functional Block Diagram

Document number: DS40512 Rev. 9 - 4 4 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit High-Side Floating Positive Supply Voltage VB -0.3 to +60 V High-Side Floating Negative Supply Voltage VS VB-14 to VB+0.3 V High-Side Floating Output Voltage VHO VS-0.3 to VB+0.3 V Offset Supply Voltage Transient dVS / dt 50 V/ns Logic and Low-Side Fixed Supply Voltage VCC -0.3 to +14 V Low-Side Output Voltage VLO -0.3 to VCC+0.3 V Logic Input Voltage (IN and EN) VIN -0.3 to VCC+0.3 V Thermal Characteristics – W-DFN3030-10 (Type TH) (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 5) PD 0.4 W Thermal Resistance, Junction to Ambient (Note 5) RθJA 64 °C/W Thermal Resistance, Junction to Case (Note 5) RθJC 42 °C/W Operating Temperature TJ 150 °C Lead Temperature (Soldering, 10s) TL 300 Storage Temperature Range TSTG -55 to 150 Note: 5. When mounted on a standard JEDEC 2-layer FR-4 board. Thermal Characteristics – MSOP-10 (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation Linear Derating Factor (Note 6) PD 0.75 W Thermal Resistance, Junction to Ambient (Note 6) RθJA 166 °C/W Thermal Resistance, Junction to Case (Note 6) RθJC 32 °C/W Operating Temperature TJ 150 °C Lead Temperature (Soldering, 10s) TL 300 Storage Temperature Range TSTG -55 to 150 Note: 6. When mounted on a standard JEDEC 2-layer FR-4 board with minimum recommended pad layout. Recommended Operating Conditions Parameter Symbol Min Max Unit High-Side Floating Supply VB VS + 4.2 VS + 14 V High-Side Floating Supply Offset Voltage VS (Note 7) 50 (Note 8) V High-Side Floating Output Voltage VHO VS VB V Logic and Low-Side Fixed Supply Voltage VCC 4.5 (Note 9) 14 V Low-Side Output Voltage VLO 0 VCC V Logic Input Voltage (IN and EN) VIN 0 5 V Ambient Temperature TA -40 125 °C Notes: 7. Logic operation for VS of -5V to +50V. 8. Provided VB does not exceed absolute maximum rating of 60V. the external Schottky diode is not required.

Document number: DS40512 Rev. 9 - 4 5 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Parameter Symbol Min Typ Max Unit Condition Logic “1” Input Voltage VIH 2.4 — — V — Logic “0” Input Voltage VIL — — 0.8 V — Enable Logic “1” Input Voltage VENIH 1.5 — — V — Enable Logic “0” Input Voltage VENIL — — 0.7 V — Input Voltage Hysteresis VINHYS — 0.6 — V — High-Level Output Voltage, VBIAS - VO VOH — 0.45 0.6 V IO+ = 100mA Low-Level Output Voltage, VO VOL — 0.15 0.22 V IO- = 100mA Offset Supply Leakage Current ILK — 10 50 µA VB = VS = 60V VCC Shutdown Supply Current ICCSD — 0 1 µA VIN = 0V or 5V, VEN = 0V VCC Quiescent Supply Current ICCQ — 0.28 0.5 mA VIN = 0V or 5V RDT = 100kΩ VCC Operating Supply Current ICCOP — 7.6 — mA fs = 500kHz, CL = 1000pF VBS Quiescent Supply Current IBSQ — 32 100 µA VIN = 0V or 5V VBS Operating Supply Current IBSOP — 7.6 — mA fs = 500kHz, CL = 1000pF Logic “1” Input Bias Current IIN+ — 25 60 µA VIN = 5V Logic “0” Input Bias Current IIN- — 0 1 µA VIN = 0V VBS Supply Undervoltage Positive Going Threshold VBSUV+ 3.3 3.8 4.4 V — VBS Supply Undervoltage Negative Going Threshold VBSUV- 2.9 3.3 3.9 V — VCC Supply Undervoltage Positive Going Threshold VCCUV+ 3.3 3.8 4.4 V — VCC Supply Undervoltage Negative Going Threshold VCCUV- 2.9 3.3 3.9 V — Output High Short-Circuit Pulsed Current IO+ 1.0 1.5 — A VO = 0V, PW ≤ 10µs Output Low Short-Circuit Pulsed Current IO- 1.9 2.5 — A VO = 15V, PW ≤ 10µs Forward Voltage of Bootstrap Diode VF1 — 0.67 — V IF = 100µA Forward Voltage of Bootstrap Diode VF2 — 1.7 — V IF = 100mA Note: 10. The VIN and IIN parameters are applicable to the two logic pins: IN and EN. The V O and IO parameters are applicable to the respective output pins: HO and LO. Parameter Symbol Min Typ Max Unit Condition Turn-on Propagation Delay, HO & LO ton 65 96 125 ns RDT = 10kΩ 350 463 580 ns RDT = 100kΩ Turn-off Propagation Delay, HO & LO toff — 22 56 ns — Turn-on Rise Time tr — 17 35 ns — Turn-off Fall Time tf — 12 25 ns — Delay Matching tDM — — 50 ns — Deadtime: tDT LO-HO & tDT HO-LO tDT 40 70 100 ns RDT = 10kΩ 300 430 560 ns RDT = 100kΩ Deadtime Matching tMDT — — 50 ns RDT = 100kΩ

Document number: DS40512 Rev. 9 - 4 6 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Timing Waveforms tf tf tr tr

Document number: DS40512 Rev. 9 - 4 7 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Typical Performance Characteristics (VCC = 12V, @ TA = +25°C, unless otherwise specified.)

Document number: DS40512 Rev. 9 - 4 8 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Typical Performance Characteristics (VCC = 12V, @ TA = +25°C, unless otherwise specified.) (continued)

Document number: DS40512 Rev. 9 - 4 9 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Typical Performance Characteristics (VCC = 12V, @ TA = +25°C, unless otherwise specified.) (continued)

© 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 26. EN to Output ton vs. Supply Voltage Figure 27. EN to Output ton vs. Temperature

© 2026 Copyright Diodes Incorporated. All Rights Reserved. Figure 28. EN to Output toff vs. Supply Voltage Figure 29. EN to Output toff vs. Temperature

Document number: DS40512 Rev. 9 - 4 12 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. W-DFN3030-10 (Type TH) MSOP-10 MSOP-10 Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.17 0.27 0.20 c 0.08 0.23 0.15 D 2.95 3.05 3.00 e - - 0.50 E 4.80 5.00 4.90 E1 2.95 3.05 3.00 E3 2.85 3.05 2.95 L 0.40 0.80 0.60 X -- -- 0.750 Y -- -- 0.750 a 0 8° 4° All Dimensions in mm A A1 A3 Seating Plane D E e b L h h DA E e Y X D b Seating Plane Gauge Plane 0.25 L4x10° 4X10° c a W-DFN3030-10 (Type TH) Dim Min Max Typ A 0.70 0.80 0.75 A1 -- 0.05 0.02 A3 0.18 0.25 0.20 b 0.18 0.30 0.25 D 2.90 3.10 3.00 D2 2.40 2.60 2.50 e 0.50BSC e1 2.00BSC E 2.90 3.10 3.00 E2 1.45 1.65 1.55 h 0.20 0.30 0.25 L 0.30 0.50 0.40 All Dimensions in mm

Document number: DS40512 Rev. 9 - 4 13 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. W-DFN3030-10 (Type TH) MSOP-10 Dimensions Value (in mm) C 0.500 X 0.300 X1 2.300 X2 2.600 Y 0.600 Y1 3.300 Y2 1.650 Dimensions Value (in mm) C 0.50 X 0.30 Y 1.35 Y1 5.30 X Y C X Y C

Document number: DS40512 Rev. 9 - 4 14 of 14 www.diodes.com August 2026 © 2026 Copyright Diodes Incorporated. All Rights Reserved. DGD05463 OBSOLETE – PART DISCONTINUED IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICU LAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes ’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring their applications, which incor porate Diodes’ products, comply the applicable legal and regulatory requirements as well as safety and functional - safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality co ntrol techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications. 3. 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