DAC0808

DAC0808 8-Bit D/A Converter datasheet (Rev. A)

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SNAS539,A]
• PDF pages: 19

Technical content

DAC0808 8-Bit D/A Converter Literature Number: SNAS539A

The DAC0808 is an 8-bit monolithic digital-to-analog con- verter (DAC) featuring a full scale output current settling time of 150 ns while dissipating only 33 mW with ±5V supplies. No reference current (IREF ) trimming is required for most applications since the full scale output current is typically±1 LSB of 255 IREF /256. Relative accuracies of better than ±0.19% assure 8-bit monotonicity and linearity while zero level output current of less than 4 µA provides 8-bit zero accuracy for I REF ≥2 mA. The power supply currents of the DAC0808 is independent of bit codes, and exhibits essen- tially constant device characteristics over the entire supply voltage range. The DAC0808 will interface directly with popular TTL, DTL or CMOS logic levels, and is a direct replacement for the MC1508/MC1408. For higher speed applications, see DAC0800 data sheet.

Features

n Relative accuracy:±0.19% error maximum n Full scale current match:±1 LSB typ n Fast settling time: 150 ns typ n Noninverting digital inputs are TTL and CMOS compatible n High speed multiplying input slew rate: 8 mA/µs n Power supply voltage range:±4.5V to±18V n Low power consumption: 33 mW@ ±5V Block and Connection Diagrams DS005687-1 Dual-In-Line Package DS005687-2 Top View Order Number DAC0808 See NS Package M16A or N16A May 1999 DAC0808 8-Bit D/A Converter © 2001 National Semiconductor Corporation DS005687 www.national.com

Block and Connection Diagrams(Continued)

Ordering Information

TEMPERATURE RANGE N PACKAGE (N16A) (Note 1) SO PACKAGE (M16A) 8-bit 0˚C ≤TA≤+75˚C DAC0808LCN MC1408P8 DAC0808LCM Note 1:Devices may be ordered by using either order number. Small-Outline Package DS005687-13 DAC0808 www.national.com 2

Absolute Maximum Ratings(Note 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Power Supply Voltage V CC +18 VDC VEE −18 VDC Digital Input Voltage, V5–V12 −10 V DC to +18 VDC Applied Output Voltage, VO −11 VDC to +18 VDC Reference Current, I14 5m A Reference Amplifier Inputs, V14, V15 V CC ,V EE Power Dissipation (Note 4) 1000 mW ESD Susceptibility (Note 5) TBD Storage Temperature Range −65˚C to +150˚C Lead Temp. (Soldering, 10 seconds) Dual-In-Line Package (Plastic) 260˚C Dual-In-Line Package (Ceramic) 300˚C Surface Mount Package Vapor Phase (60 seconds) 215˚C Infrared (15 seconds) 220˚C Operating Ratings Temperature Range T MIN ≤ TA ≤ TMAX DAC0808 0 ≤TA ≤ +75˚C

Electrical Characteristics

(VCC = 5V, VEE = −15 VDC ,V REF /R14 = 2 mA, and all digital inputs at high logic level unless otherwise noted.) Symbol Parameter Conditions Min Typ Max Units Er Relative Accuracy (Error Relative (Figure 4)% to Full Scale IO ) DAC0808LC (LM1408-8) ±0.19 % Settling Time to Within1⁄2 LSB T A =25˚C (Note 7), 150 ns (Includes tPLH )( Figure 5) tPLH ,tPHL Propagation Delay Time T A = 25˚C, (Figure 5) 30 100 ns TCIO Output Full Scale Current Drift ±20 ppm/˚C MSB Digital Input Logic Levels ( Figure 3) VIH High Level, Logic “1” 2 V DC VIL Low Level, Logic “0” 0.8 V DC MSB Digital Input Current ( Figure 3) High Level V IH = 5V 0 0.040 mA Low Level V IL = 0.8V −0.003 −0.8 mA I15 Reference Input Bias Current ( Figure 3)− 1 − 3 µ A Output Current Range ( Figure 3) VEE = −5V 0 2.0 2.1 mA VEE = −15V, TA = 25˚C 0 2.0 4.2 mA IO Output Current V REF = 2.000V, R14 = 1000Ω , (Figure 3) 1.9 1.99 2.1 mA Output Current, All Bits Low ( Figure 3)0 4 µ A Output Voltage Compliance (Note 3) Er ≤ 0.19%, TA = 25˚C VEE =−5V, IREF =1 mA −0.55, +0.4 V DC VEE Below −10V −5.0, +0.4 V DC SRIREF Reference Current Slew Rate ( Figure 6) 4 8 mA/µs Output Current Power Supply −5V ≤ VEE ≤ −16.5V 0.05 2.7 µA/V Sensitivity Power Supply Current (All Bits ( Figure 3) Low) ICC 2.3 22 mA IEE −4.3 −13 mA Power Supply Voltage Range T A = 25˚C, (Figure 3) VCC 4.5 5.0 5.5 V DC VEE −4.5 −15 −16.5 V DC Power Dissipation DAC0808 www.national.com3

the device beyond its specified operating conditions. Note 3:Range control is not required. package, this number increases to 175˚C/W and for the small outline M package this number is 100˚C/W. Note 5:Human body model, 100 pF discharged through a 1.5 kΩ resistor. Note 6:All current switches are tested to guarantee at least 50% of rated current. Note 8:Pin-out numbers for the DAL080X represent the dual-in-line package. The small outline package pinout differs from the dual-in-line package. FIGURE 1. +10V Output Digital to Analog Converter(Note 8)

Typical Performance CharacteristicsVCC = 5V, VEE = −15V, TA = 25˚C, unless otherwise noted (Continued) Unless otherwise specified: R14 = R15 = 1 kΩ , C = 15 pF, pin 16 to VEE ;R L =5 0Ω , pin 4 to ground. Curve A:Large Signal Bandwidth Method ofFigure 7,V REF = 2 Vp-p offset 1V above ground. Curve B:Small Signal Bandwidth Method ofFigure 7,R L = 250Ω ,V REF = 50 mVp-p offset 200 mV above ground. Curve C:Large and Small Signal Bandwidth Method ofFigure 9(no op amp, RL =5 0Ω ), RS =5 0Ω ,VREF =2 V ,VS = 100 mVp-p centered at 0V. Output Current vs Output Voltage (Output Voltage Compliance) DS005687-17 Output Voltage Compliance vs Temperature DS005687-18 Typical Power Supply Current vs Temperature DS005687-19 Typical Power Supply Current vs V EE DS005687-20 Typical Power Supply Current vs V CC DS005687-21 Reference Input Frequency Response DS005687-22 DAC0808 www.national.com5

FIGURE 2. Equivalent Circuit of the DAC0808 Series(Note 8)

equal to the peak positive input level at pin 15. diode is recommended between pin 14 and ground. creasing the overall bandwidth. yield a voltage output of 256 levels between 0 and −4.980V. mines the switching time due to increased voltage swing. reference current amplifier. ing a change in the absolute accuracy of output current. Figure 4. The 12-bit con- tors, or stored in a peak detector. accuracy when referred to full-scale. DC reference current is 0.5 to 4 mA.

Physical Dimensionsinches (millimeters) unless otherwise noted Small Outline Package Order Number DAC0808LCM Dual-In-Line Package Order Number DAC0808 DAC0808 www.national.com11

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Corporation Americas Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com DAC0808 8-Bit D/A Converter National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

www.ti.com 11-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DAC0808LCM/NOPB Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 DAC0808LCM DAC0808LCM/NOPB.B Active Production SOIC (D) | 16 48 | TUBE Yes SN Level-1-260C-UNLIM 0 to 70 DAC0808LCM DAC0808LCMX/NOPB Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 DAC0808LCM DAC0808LCMX/NOPB.B Active Production SOIC (D) | 16 2500 | LARGE T&R Yes SN Level-1-260C-UNLIM 0 to 70 DAC0808LCM DAC0808LCN/NOPB Active Production PDIP (NFG) | 16 25 | TUBE Yes SN Level-1-NA-UNLIM 0 to 70 DAC0808LCN MC1408P8 DAC0808LCN/NOPB.B Active Production PDIP (NFG) | 16 25 | TUBE Yes SN Level-1-NA-UNLIM 0 to 70 DAC0808LCN MC1408P8 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 11-Nov-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC0808LCMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) DAC0808LCM/NOPB D SOIC 16 48 495 8 4064 3.05 DAC0808LCM/NOPB.B D SOIC 16 48 495 8 4064 3.05 DAC0808LCN/NOPB NFG PDIP 16 25 502 14 11938 4.32 DAC0808LCN/NOPB.B NFG PDIP 16 25 502 14 11938 4.32 Pack Materials-Page 3

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