Power Management

DA9210-XXFN2-A

Dialog Semiconductor

Multi-Phase 12 A DC-DC Buck Converter

Manufacturer variants: 1

Selected specification: Dialog Semiconductor

Documents: 2

Request Quote Download Datasheet Read online HTML view

Compare manufacturer specifications More from Dialog Semiconductor Browse D parts

Manufacturer Specifications

Compare DA9210-XXFN2-A variants.

Select a manufacturer to view its specifications, local PDF, and searchable HTML text.

1 manufacturers / 2 documents

Manufacturer	Series	Package	Documents	Available	Select specification
Dialog Semiconductor	-	-	2	PDF HTML	Viewing

Online Datasheet

Read the Dialog Semiconductor document online.

DA9210 DIALOG

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 90

Technical content

Datasheet sections

1 Block Diagram
2 Pinout
2.1 Pin Configuration (48 WLCSP)
2.2 Pin Configuration (42 VFBGA)
3 Absolute Maximum Ratings
4 Recommended Operating Conditions
5 Typical Current Consumptions
6 Electrical Characteristics
6.1 DC/DC Buck Converter
6.4 DVC Interface
6.5 Power Good and Temperature Supervision
7 Typical Characteristics
8 Functional Description
8.1 DC/DC Buck Converter
8.1.1 Switching Frequency
8.1.2 Operation Modes and Phase Selection
8.1.3 Output Voltage Selection
8.1.4 Soft Start-up
8.2 Ports Description
8.2.1 VDD_IO Rail
8.2.2 EN_CHIP
8.2.3 GPIO0
8.2.4 VERROR / GPIO1
8.2.5 IPHASE / GPIO2
8.2.6 BUCK_CLK / GPIO3
8.2.7 Digital External Clock Input / GPIO4
8.2.8 OC_PG / nIRQ
8.3 DA9210 Operating Modes
8.3.1 ON Mode
8.3.2 OFF Mode
8.3.3 Dual Parallel Mode
8.4 GPIO Extender

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 1 of 90 © 2016 Dialog Semiconductor General Description DA9210 is a multi-phase synchronous step-down converter suitable for supplying the CPU power in smartphones, tablets, UltrabooksTM, and other handheld applications, which require high currents to run the processor core. DA9210 is designed to operate with four phases, each phase using a small external 0.47 µH inductor. The buck is capable of delivering up to 12 A continuous output current with an output of low voltage systems, including all Li-Ion battery supplied applications. Two DA9210s can be used in parallel to deliver an output current of up to 24 A. The DA9210 point-of-load remote-sensing feature guarantees the highest accuracy while supporting multiple PCB routing scenarios without loss of performance. The highly-integrated design removes the need for external switching FETs or Schottky diodes. A programmable soft start-up can be enabled, which limits the inrush current from the input node and ensures a slope controlled activation of the rail. The Dynamic Voltage Control (DVC) supports adaptive adjustment of the supply voltage dependent on the processor load. This is done via direct register write through the communication interface (I2C or SPI compatible), via the dedicated DVC control interface, or via a programmable input pin. DA9210 integrates over-temperature and over-current protection for increased system reliability, without the need for external sensing components. A Power Good and Over-Current Alarm output informs the CPU of an out range voltage output and if the current exceeds a programmable limit, thereby enabling the processor to reduce its consumption before the supply rail collapses. Key Features ■ 2.8 V to 5.5 V input voltage ■ 0.3 V to 1.57 V output voltage ■ 12 A output current ■ 24 A output current in parallel configuration ■ 3 MHz nominal switching frequency □ Enables use of low-profile inductors ■ Output voltage accuracy ±2.5 % ■ Dynamic Voltage Control (DVC) ■ Automatic phase shedding ■ Integrated power switches ■ Remote sensing at point-of-load ■ Power Good and Over-Current Alarm signal ■ Interfaces: □ I2C and SPI □ Dedicated DVC □ GPIO ■ Adjustable soft-start ■ -40 ºC to +125 ºC junction temperature operation ■ Regulator supervision with automatic under- voltage and over-voltage protection ■ AEC Q100 grade 3 automotive option ■ Package 48 WLCSP (Route EasyTM, equivalent to 0.8 mm pitch) ■ Package 42 VFBGA 0.8 mm pitch (automotive)

Applications

■ High performance multi-core system-on-chip (SoC) applications ■ Smartphones ■ Mobile phones ■ UltrabooksTM ■ Tablet PCs ■ In-car infotainment/dashboard ■ Portable navigation devices ■ TV and media players ■ Embedded industrial systems

1 Block Diagram

Figure 1: Block Diagram VSYS VOUT_SENSE DVS DAC VSS_QUIET REGISTER SPACE VDDCORE OTP MEMORY DIGITAL CORE 2/4-WIRE / DVC CTRL INTERFACE EN_CHIP VDD_IO CTRL DRIVE BIAS SUPERV OSC VSS_NOISY Verror/ GPIO1 OUTOC_PG/ nIRQ 220nF 4x 0.47µH 4x 47µF 4x 10µF AC_OK/ GPIO4 nCS/SYNC GPIO5 SI/DATA SK/CLK SO/INPUT GPIO6 IN IN GPIO GPIO GPIO GPIO VSS_SENSE L/C/R PCB-CPU BUCK_CLK/ GPIO3 GPIO GPIO0 GPIO Iphase/ GPIO2 GPIO TP 1µF VDD1 VDD2 VDD3 VDD4

2 Pinout

2.1 Pin Configuration (48 WLCSP)

Figure 2: Connection Diagram (48 WLCSP) Table 1 Pin Description (48 WLCSP) Pin No. Pin Name Alter nate Function Type Description A1, B2, B4 LX1 AO Sw itching node for phase 1 J1, H2, H4 LX2 AO Sw itching node for phase 2 A13, B10, B12 LX3 AO Sw itching node for phase 3 J13, H10, H12 LX4 AO Sw itching node for phase 4 A3, A5 VDD1 PS Supply voltage for phase 1 To be connected to VSYS J3, J5 VDD2 PS Supply voltage for phase 2 To be connected to VSYS A9, A11 VDD3 PS Supply voltage for phase 3 To be connected to VSYS J9, J11 VDD4 PS Supply voltage for phase 4 To be connected to VSYS C13 EN_CHIP DI IC Enable Signal C1 OC_PG nIRQ DO Output for Over Current Alarm and Pow er Good signal, IRQ line tow ards the host G13 VDD_IO PS I/O voltage r ail E1 VOUT_SENSE AI Output and s ense node for the buck

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 8 of 90 © 2016 Dialog Semiconductor Pin No. Pin Name Alter nate Function Type Description D2 VSS_SENSE AI Ground s ense node for the buck F2 VDDCORE AO Regulated supply for internal circuitry 2.5 V (decouple w ith 220 nF) F12 GPIO0 AI/DIO General purpose I/O D12 VERROR GPIO1 AIO/DIO Error amplifier v oltage signal for dual parallel mode, general purpose I/O E13 IPHASE GPIO2 AIO/DIO Current distribution s ignal for dual parallel mode, general purpose I/O G1 BUCK_CLK GPIO3 DIO Buck clock input/output (depending on slave/master function in dual parallel mode), general purpose I/O B8 AC_OK GPIO4 DIO Input from safe charger out to OC_PG signalling, general purpose I/O, input of external 6 MHz clock H8 nCS/SYNC GPIO5 DIO 4-WIRE chip select, DVC Interface input clock, general purpose I/O J7 SO/INPUT GPIO6 DIO 4-WIRE data output, DVC interface input data, general purpose I/O B6 SI DATA DIO 4-WIRE data input, 2-WIRE data A7 SK CLK DI 4-WIRE/2-WIRE Clock C7 TP DIO Test pin connect to VSS E3, E11 NC VSS Electrically not connected Connect to VSS H6 VSYS PS Supply for IC and input for voltage supervision G7 VSS_QUIET VSS C3, C5, G3, G5, C9, C11, G9, G11 VSS_NOISY VSS Table 2: Pin Type Definition Pin type Description Pin type Description DI Digital Input AI Analog Input DO Digital Output AO Analog Output DIO Digital Input/Output AIO Analog Input/Output DIOD Digital Input/Output Open Drain BP Backdrive Protection PU Fixed Pull-Up resistor SPU Sw itchable Pull-Up resistor PD Fixed Pull-Dow n resistor SPD Sw itchable Pull-dow n resistor

2.2 Pin Configuration (42 VFBGA)

Figure 3: Connection Diagram (42 VFBGA) Table 3: Pin List (42 VFBGA) Pin No. Pin name Alternate function Type Description B1, B2 LX1 AO Sw itching node for phase 1 E1, E2 LX2 AO Sw itching node for phase 2 B6, B7 LX3 AO Sw itching node for phase 3 E6, E7 LX4 AO Sw itching node for phase 4 A1, A2 VDD1 PS Supply voltage for phase 1 To be connected to VSYS F1, F2 VDD2 PS Supply voltage for phase 2 To be connected to VSYS A6, A7 VDD3 PS Supply voltage for phase 3 To be connected to VSYS

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 10 of 90 © 2016 Dialog Semiconductor Pin No. Pin name Alternate function Type Description F6, F7 VDD4 PS Supply voltage for phase 4 To be connected to VSYS A5 EN_CHIP DI IC Enable Signal C5 OC_PG nIRQ DO Output for Over Current Alarm and Pow er Good signal, IRQ line tow ards the host A4 VDD_IO PS I/O voltage r ail D4 VOUT_SENSE AI Output and Sense node for the buck C4 VSS_SENSE AI Ground Sense node for the buck F5 VDDCORE AO Regulated supply for internal circuitry (decouple w ith 220 nF) B5 GPIO0 AI/DIO General purpose I/O B4 VERROR GPIO1 AIO/DIO Error amplifier voltage signal for dual parallel mode, general purpose I/O E4 IPHASE GPIO2 AIO/DIO Current distribution signal for dual parallel mode, general purpose I/O E5 BUCK_CLK GPIO3 DIO Buck clock input/output (depending on slave/master function in dual parallel mode), general purpose I/O C3 AC_OK GPIO4 DIO Input from safe charger out to OC_PG signalling, general purpose I/O, input of external 6 MHz clock D3 nCS/SYNC GPIO5 DIO 4-WIRE chip select, DVC Interface input clock , general purpose I/O E3 SO/INPUT GPIO6 DIO 4-WIRE data output, DVC Interface input data, general purpose I/O B3 SI DATA DIO 4-WIRE data input, 2-WIRE data

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 11 of 90 © 2016 Dialog Semiconductor Pin No. Pin name Alternate function Type Description A3 SK CLK DI 4-WIRE/2-WIRE clock D5 TP DIO Test pin, connect to VSS F3 VSYS PS Supply for IC and input for voltage supervision F4 VSS_QUIET VSS C1, C2, D1, D2, C6, C7, D6, D7 VSS_NOISY VSS Table 4: Pin Type Definition Pin type Description Pin type Description DI Digital Input AI Analog Input DO Digital Output AO Analog Output DIO Digital Input/Output AIO Analog Input/Output DIOD Digital Input/Output Open Drain BP Backdrive Protection PU Fixed Pull-Up resistor SPU Sw itchable Pull-Up resistor PD Fixed Pull-Dow n resistor SPD Sw itchable Pull-Dow n resistor

3 Absolute Maximum Ratings

Table 5: Absolute Maximum Ratings Parameter Description Conditions ( Note 1) Min Max Unit TSTG Storage temperature -65 +150 °C TJ Operating junction temperature -40 +150 Note 2 VSYS Supply v oltage -0.3 5.5 V All pins except above -0.3 VSYS + 0.3 V ESD protection HBM 2000 V Note 1 Stresses beyond those listed under ‘A bsolute maximum ratings’ may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 2 See Sections 11.1 and 8.6 for more detail

4 Recommended Operating Conditions

Table 6: Recommended Operating Conditions Parameter Description Conditions Min Typ Max Unit VSYS Supply v oltage 2.8 5.5 V VDD_IO Supply v oltage IO 1.2 3.6 Note V Maximum pow er Dissipation Note 2 Derating factor above TA = 70 °C: 33 mW/°C

48 WL-CSP

TA = 70°C: 28 mW/°C

42 VF-BGA

Note 1 VDD_IO must not exceed VSYS Note 2 Obtain from simulation on a 2S2P 4L JEDEC Board. Influenced by PCB technology and layout. All voltages are referenced to VSS unless otherwise stated. Currents flowing into DA9210 are deemed positive, currents flowing out are deemed negative. All parameters are valid over the recommended temperature range and power supply range unless otherwise noted. Please note that power dissipation must be limited to avoid overheating of DA9210. Maximum power dissipation should not be reached with maximum ambient temperature.

5 Typical Current Consumptions

Table 7: Typical Current Consumption Operating Mode Conditions Battery (typ) Unit OFF mode EN_CHIP Low <1 µA ON mode EN_CHIP High, BUCK_EN = 0 (excluding the current consumption of the buck) 45 µA

6 Electrical Characteristics

Table 8: DC Characteristics Parameter Description Conditions Min Typ Max Unit EN_ON EN_CHIP Level on 1.1 V EN_OFF EN_CHIP Level off 0.35 V EN_HYST EN_CHIP Hysteresis 100 mV IEN_CHIP EN_CHIP Input current VEN_CHIP  1.1 V 100 nA tEN IC control start- up time 750 µs VDDCORE VDDCORE voltage 2.5 V VIH GPI0-6, SYNC, INPUT, CLK, DATA, (2-WIRE mode) Input High Voltage VDDCORE mode VDD_IO mode 0.7*VDDCORE 0.7*VDD_IO V VIL GPI0-6, SYNC, INPUT, CLK, DATA, (2-WIRE mode) Input Low Voltage VDDCORE mode VDD_IO mode 0.3*VDDCORE 0.3*VDD_IO V VIH SK, nCS, SI (4 - WIRE mode) Input High Voltage 0.7*VDD_IO V VIL SK, nCS, SI (4 - WIRE mode) Input Low Voltage 0.3*VDD_IO V

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 14 of 90 © 2016 Dialog Semiconductor Parameter Description Conditions Min Typ Max Unit VOH GPO0-6, OC_PG, SO (4 - WIRE ode) Output High Voltage Push-pull mode @1 mA VDD_IO ≥1.5 V 0.8*VDD_IO V VOL@1 mA GPO0-6, OC_PG, DATA (2-WIRE mode) SO (4-WIRE mode) Output Low Voltage 0.3 V VOL @3 mA DATA (2-WIRE mode) Output 0.24 V VOL @20 mA DATA (2-WIRE mode) Output Low Voltage 0.4 V CIN CLK, DATA (2- WIRE mode) Input Capacitance 2.5 10 pF tSP CLK, DATA (2- WIRE mode) Spike Suppression Fast/Fast+ mode High Speed mode ns tfDA DATA (2-WIRE mode) Fast @ Cb<550 pF HS @ 10<Cb<100 HS @ Cb<400 pF 20 + 0.1 Cb 120 ns tOC_DEL OC_PG Delay From over-current detection to OC_PG port asserted 10 ns tOC_ASSERT OC_PG Assert From end of over - current to OC_PG port released 100 ns tOC_PD OC_PG Pow er Dow n After disabling the buck until OC_PG released 250 µs fGPI4 Digital clock input frequency At GPIO4 -7 % 6.0 +7 % MHz DGPI4 Digital clock input duty cycle At GPIO4 50 10 %

6.1 DC/DC Buck Converter

Unless otherwise noted, the following is valid for VDD = 2.8 V to 5.5 V, COUT = 4x 47 µF, local sensing, f = 3 MHz. Table 9: DC/DC Buck Converter Characteristics Parameter Description Conditions Min Typ Max Unit VDD Input voltage VDD = VSYS 2.8 5.5 V COUT Output capacitor Including voltage and temperature coefficient 100 200 (4x47) (8x22) 400 µF LBUCK Inductor value (per phase) Including current and temperature dependence -50 % 0.47 +30 % µH VOUT Output voltage Note 1 IOUT = 0 mA to IMAX 0.3 1.57 V Output voltage accuracy VDD = 3.8 V VOUT = 0.9 V TA = 25 °C no load -0.5 +0.5 % VDD = 3.8 V VOUT = 0.9 V TA = -25 °C to +85 °C no load -1.0 +1.0 % Including static line/load regulation and voltage ripple VOUT ≥ 1 V -2.5 +2.5 % Including static line/load regulation and voltage ripple VOUT < 1 V 25 mV VTRLOAD Load regulation transient Note 2 IOUT = 0 / 5 A dI/dt = 10 A/µs 4-phase operation VOUT = 1 V VTRLINE Line regulation transient VDD = 3.0 to 3.6 V IOUT = IMAX tr = tf = 10 µs 10 mV Max resistance PCB for remote sensing Note 3 From output capacitor to sense connection at point of load 10 mΩ Max inductance PCB for remote sensing Note 4 From output capacitor to sense connection at point of load 10 nH RFB Feedback comparator input impedance 500 kΩ IMAX Output current 4-phase operation 12000 mA

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 16 of 90 © 2016 Dialog Semiconductor Parameter Description Conditions Min Typ Max Unit ILIM Current limit per phase (programmable) Note 5 BUCK_ILIM = 0010 -20 % 2000 Note 6 % mA BUCK_ILIM = 1111 -20 % 4600 20 % mA IALARM Current alarm threshold (programmable) BUCK_IALARM = 0 and BUCK_ILIM ≥ 1010 ILIM - 600 ILIM – 300 ILIM 100 mA BUCK_IALARM = 1 and BUCK_ILIM ≥ 1010 ILIM - 1000 ILIM – 600 ILIM 300 mA IQON Quiescent current in synchronous rectification mode 4-phase operation No load VDD = 3.7 V 60 mA IMIN_PFM Minimum output current in PFM mode Static output voltage, No DVC Note 7 2 mA f Sw itching frequency 2.79 3 3.21 MHz Minimum on time 20 ns tON Turn-on time STARTUP_CTRL = 011 µs Output pull-dow n resistor Can be sw itched off via BUCK_PD_DIS 150 200 Ω Note 1 Programmable in 10 mV increments Note 2 Additional to the DC accuracy. The value is intended measured directly at C OUT. In case of remote sensing, parasitics of PCB and external components may affect this value. Note 3 10 mΩ equivalent to a 5 inch (ca 13 cm) copper trace ( = 1.7x10-8 Ω/m), w idth 6 mm, thickness 35 µm Note 4 10 nH equivalent to a 5 inch (ca 13 cm) trace routed over a ground plane (approx. 1.2 nH/cm) Note 5 Peak current on the inductor Note 6 Minimum value of the a ccuracy is ±400 mA under all conditions Note 7 For DVC, see Application Note AN -PM-052 6.2 2-WIRE Control Bus Figure 4: 2-WIRE Interface Timing STOP SDA SCL tF tR tF START tH_STA tH_D 1/fSCL VIH VIL VIH VIL tSU_D tLOW tHIGH tVD_D ACK tVD_ACK tSU_STO

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 17 of 90 © 2016 Dialog Semiconductor Table 10: 2-WIRE Interface Electrical Characteristics Parameter Description Test conditions Min Typ Max Unit tBUF Bus free time STOP to START 0.5 µs CB Bus line capacitive load 150 pF Standard/Fast/Fast mode fSCL SCL clock frequency Note 1 0 1000 kHz tSU_STA Start condition set -up time 0.26 µs tH_STA Start condition hold time 0.26 µs tW_CL SCL low time 0.5 µs tW_CH SCL high time 0.26 µs tR 2-WIRE SCL and SDA rise time (input requirement) 1000 ns tF 2-WIRE SCL and SDA fall time (input requirement) 300 ns tSU_D Data set-up time 50 ns tH_D Data hold time 0 ns tVD_D Data valid time 0.45 µs tVD_ACK Data valid time acknow ledge 0.45 µs tSU_STO Stop condition set -up time 0.26 µs High Speed mode fSCL SCL clock frequency Requires V DDIO ≥ 1.8 V Note 1 0 3400 kHz tSU_STA Start condition set -up time 160 ns tH_STA Start condition hold time 160 ns tW_CL SCL low time 160 ns tW_CH SCL high time 60 ns tR 2-w ire SCL and SDA rise time (input requirement) 160 ns tF 2-w ire SCL and SDA fall time (input requirement) 160 ns tSU_D Data set-up time 10 ns tH_D Data hold-time 0 ns tSU_STO Start condition hold time 160 ns Note 1 Minimum clock frequency is 10 kHz if 2WIRE_TO is enabled

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 18 of 90 © 2016 Dialog Semiconductor 6.3 4-WIRE Control Bus Figure 4: 4-WIRE Bus Timing NOTE The above timing is valid for active low and high CS. Table 11: 4-WIRE Interface Electrical Characteristics Parameter Description Label in Plot Min Typ Max Unit CLD Bus line capacitive load 100 pF tC Cycle time 1 70 ns tCSS Enable lead time 2, from CS active to first SK edge 20 ns tSCS Enable lag time 3, from last SK edge to CS idle 20 ns tCL Clock low time 4 0.4 x tC ns tCH Clock high time 5 0.4 x tC ns tSIS Data in setup time 6 5 ns tSIH Data in hold time 7 5 ns tSOV Data out valid time 8 22 ns tSOH Data out hold time 9 6 ns tWCS CS inactive time 11 20 ns

6.4 DVC Interface

Table 12: DVC Interface Parameter Description Conditions Min Typ Max Unit TSYNC Clock period at SYNC port 40 300 ns tPWH High pulse w idth at SYNC port 12 180 ns tPWL Low pulse w idth at SYNC port 12 180 ns DSYNC Duty cycle at SYNC port 40 60 % tSETUP Set-up time INPUT to rising edge of SYNC 10 ns tHOLD Hold time INPUT from rising edge of SYNC 2 ns tRISE Rise time INPUT and SYNC ports 1 ns tFALL Fall time INPUT and SYNC ports 1 ns

6.5 Power Good and Temperature Supervision

Table 13: Power Good and Temperature Supervision Parameter Description Conditions Min Typ Max Unit VGOOD Pow er good low threshold VOUT (Typ) - 0.05 V VGOOD _HYST Pow er good low threshold hyst 50 mV TEMP_WA RN Note 2 Thermal w arning 110 125 140 °C TEMP_CRIT Thermal shutdow n threshold 125 140 155 °C TEMP_POR Thermal POR threshold 135 150 165 °C Note 2 Thermal thresholds are non -overlapping

7 Typical Characteristics

Figure 5: Efficiency vs Output Current VOUT = 1.0 V Figure 6: Efficiency vs Output Current VOUT = 1.2 V

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 32 of 90 © 2016 Dialog Semiconductor Figure 29: Transient Load, Auto, 4-phases, 10 mA to 5 A in 10 A/µs, VDD = 3.7 V, V OUT = 1.0 V

8 Functional Description

The DA9210 quad-phase buck converter has been designed to operate either as a high-performance stand-alone regulator or as a sub-PMIC that extends the functionality of an integrated system PMIC such as the Dialog DA9063. In stand-alone operation, the DA9210 provides:  high performance, 12 A output current capability  high efficiency, quad-phase operation with phase-shedding  a small footprint  an Over-Current Alarm/ Power Good signal to provide real-time status information to the host processor. In the case of an over-current event or loss of power, the host processor is able to react to maximise system integrity When operated with a Dialog system PMIC such as the DA9063, the system also benefits from the following:  The DA9210 can be enabled as part of the system start-up sequence by utilizing one of the DA9063 sequenced GPIO signals.  The DA9210 has been designed to operate seamlessly with the DA9063 by sharing the same control interface (same SPI chip select or I2C address).  The DA9210 register map has been designed to interleave with the DA9063 register map. When operated in this way, the two devices appear as a single power management solution to the host processor, thereby simplifying system power control. By using the general 2-WIRE interface, the DA9210 can easily be integrated into power management systems using system PMICs other than DA9063. Section 8.1 provides details of the individual blocks of the DA9210 and the configurability available to optimize its performance in any application.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 34 of 90 © 2016 Dialog Semiconductor Figure 30: Control ports and interface As shown in Figure 30, a typical application case includes a host processor, a main PMIC (for example DA9063) and the DA9210 used as companion IC for the high power core supply. The easiest way of controlling the DA9210 is through the control interface. The host processor is the master that initiates communication and reads and writes to and from the main PMIC’s and DA9210’s registers. To poll the status of DA9210, the host processor must access the dedicated registers area through the control interface. Additionally, DA9210 can be controlled by means of hardware inputs. A dedicated hardware signal from the DA9210 to the external host processor is implemented through the OC/PG line.

8.1 DC/DC Buck Converter

The buck converter is a four-phase, high efficiency, synchronous step down DVC regulator, typically operating at 3 MHz. The buck converter supports the sensing of the configured voltage directly at the point of load (see VOUT_SENSE and VSS_SENSE pins, not supported in tracking mode). The default output voltage is loaded from OTP. DVC operates in PWM mode (synchronous rectification). The completion of a DVC transition is signalled by GPIO3, assuming the port is configured as GPO and the control bit READY_EN is asserted. The buck converter has two voltage registers for output voltage A and B. The appropriate values are stored in the registers VBUCK_A and VBUCK_B. The specific output voltage is selected with the bit BUCK_SEL in register BUCK_CONF. This can be operated either via GPI or via the control interface, according to the configuration of VBUCK_GPI. A DVC transition occurs:

when the selected voltage VBUCK_A/VBUCK_B is updated to a new target value
when the voltage selection is changed via BUCK_SEL from VBUCK_A to VBUCK_B or vice versa The slew rate of the DVC transition is programmed at 10 mV per (4, 2, 1 or 0.5) µs via SLEW_RATE control bits. The typical input current when four phases are enabled is in the order of 60 mA and drops to < 1 µA when the buck output is disabled.

8.1.1 Switching Frequency

The 3 MHz switching frequency has been chosen to allow the use of a small 0.47 µH inductor (see the complete list of inductors in Section 10). The buck switching frequency can be tuned via register bits OSC_TUNE. This tunes the internal 6 MHz oscillator frequency in steps of 180 kHz. This impacts the buck converter frequency in steps of 90 kHz. This is used to avoid possible disturbances to other HF systems in the application. If a digital input clock is applied at GPIO4 and the port is configured accordingly on register bit GPIO4_PIN it is possible to apply an external oscillator delivering 6 MHz to the system, thereby allowing multiple devices to be synchronized to the same clock source.

8.1.2 Operation Modes and Phase Selection

The operating mode of the buck converter is selected via bits BUCK_MODE in register BUCK_CONF1. The buck converter can be forced to operate in either Normal mode, where all four phases are enabled, or in low-power mode, where the efficiency is optimized for output currents lower than 1 A. In low-power mode, the buck can be forced to operate either with one (default), two, or four phases active, or in PFM mode where the operating frequency varies with the output load current. NOTE The low -pow er mode configuration is programmed in the device OTP and cannot be changed during normal operation. Please contact your local Dialog Semiconductor support for more information. The BUCK_MODE bits also allow an automatic mode based on the output voltage to be selected. With the BUCK_MODE configured this way the buck will operate in low-power mode as long as the target voltage is lower than the threshold defined in VBUCK_AUTO, or in Normal mode otherwise. If BUCK_MODE bits = 00, the operating mode is selected dependent on the register bit BUCK_SL_A/B, so the operating mode is set simultaneously with the output voltage. In low-power mode, the buck operates according to different options as previously described. The number of active phases can be selected by register bits PHASE_SEL in register BUCK_CONF2. This optimizes the efficiency according to the specific output current needed for the application. If the bit PHASE_SEL is asserted, automatic phase shedding based on the output current load is enabled. The buck automatically changes between 1-phase, 2-phase, and 4-phase operation, thereby optimizing the efficiency in a wide range of output currents. Automatic phase shedding works only in normal mode and the PHASE_SEL field configuration is ignored. An automatic transition to PFM mode (including automatic phase shedding) can be configured via AUTO_DEF. When this bit is set, in addition to the phase shedding, PFM mode is entered when the output load current becomes low ensuring maximum efficiency. When operating in dual parallel mode, the master and the slave device will have up to a total of 8 phases enabled. If a phase is never selected for a certain application, the corresponding LX output pin should be left floating and not connected to any external inductor.

8.1.3 Output Voltage Selection

The switching converter can be configured using the 2-WIRE or 4-WIRE interface, or via the dedicated DVC interface. The DA9210 provides the capability to set two output voltage levels via registers VBUCK_A and VBUCK_B. It is then possible to transition between these two voltages by toggling the register bit BUCK_SEL, or by using a GPI, selected from GPI0, GPI3, or GPI4 in register bit VBUCK_GPI. In addition to setting the output voltage, the VBUCK_A/B registers include the BUCK_MODE setting which allows the selection between normal and low power modes. When triggered, the transition will ramp between the set voltages following the slew rate set by the SLEW_RATE setting in register CONTROL_A. The register VBUCK_MAX will limit the output voltage that can be set for the buck converter. In addition to triggering an A to B voltage transition, the host is able to modify the output voltage by writing to the currently active VBUCK_A/B voltage setting. The current SLEW_RATE setting will be applied to any change triggered by this method. For security reasons the re-programming of registers that may cause damage if wrongly programmed (for example, voltage settings) can be disabled by asserting the control V_LOCK in the CONTROL_A register. When V_LOCK is asserted, reprogramming the registers 0xD0 to 0x14F from control interfaces is disabled.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 37 of 90 © 2016 Dialog Semiconductor DA9210 implements a dedicated control interface supporting direct DVC requests to the buck converter (see also the detailed description in Section 8.5.3). When the buck is disabled a 150 Ω (typ) pull-down resistor is activated for each phase dependent on the value stored in register bit BUCK_PD_DIS. Phases disabled via PHASE_SEL will not have any pull-down. The pull-down resistor is always disabled on all phases when DA9210 is in OFF mode. Figure 31: Concept of Control of DA9210’s Buck Output Voltage The buck current limit should be configured to be at least 40 % higher than the required maximum continuous output current. Table 14: Selection of Buck Current Limit from Coil Parameters Min. ISAT (mA) Frequency (MHz) Buck current limit (mA) Average current (mA) 5060 3 4600 3300 4180 3 3800 2700 3080 3 2800 2000 1760 3 1600 1100

8.1.4 Soft Start-up

To limit the in-rush current from VSYS input, the buck converter can perform a soft start after being enabled. The start-up behavior is a trade-off between acceptable in-rush current from the battery and turn-on time. In DA9210 different options can be selected using STARTUP bits in BUCK_CONF1 register. Rates faster than 20 mV/µs may produce overshoot during the start-up phase, so they should be considered carefully. A ramped power-down can be selected on register bit PWR_DOWN_CTRL. If no ramp is selected, the output node will only be discharged by the pull-down resistor, if enabled via BUCK_PD_DIS.

8.2 Ports Description

8.2.1 VDD_IO Rail

VDD_IO is an independent IO supply rail input that can be assigned to the power manager interface and to the GPIOs (see control PM_IF_V and GPI_V). The rail assignment determines the IO voltage levels and logical thresholds (see also the Digital I/O Characteristics). NOTE The maximum speed of the 4-WIRE interface is only available if the selected supply rail is gre ater than 1.6 V.

8.2.2 EN_CHIP

EN_CHIP is a general enable signal for DA9210, turning on and off the internal circuitry (for example the reference, the digital core, and so on). The control of this port has a direct influence on the quiescent current of the whole application and a low level allows the device to reach the minimum quiescent current state. The voltage at this pin is continuously sensed by a dedicated analog circuit. The EN_CHIP activation threshold is defined with a built-in hysteresis to avoid erroneous transitions being triggered by unstable rising or falling edges. The EN_CHIP port has an integrated pull-down current.

8.2.3 GPIO0

The port behaves like a GPIO extender pin (see Section 8.4). In a typical application GPIO0 can be used as GPI port enable for the buck converter, as shown in Figure 30.

8.2.4 VERROR / GPIO1

This port is multi-functional depending on the configuration of GPIO1_PIN. It can be used as an analog pin to support the dual parallel mode operation of DA9210 (input in case of slave, output in case of master operation, see also Section 8.3.3). Alternatively it behaves like a standard GPIO extender pin, see Section 8.4. If GPIO1_PIN = 01 the port will be configured for VERROR operation operating as an input or an output, depending on the voltage level on the VOUT_SENSE Pin, see Section 8.3.3. In master mode, the port is an output. In slave mode (VOUT_SENSE must be tied high to VDDCORE), the port is an input. If GPIO1_PIN = 01 and master mode is configured, whenever the buck converter is enabled, the signal at the output of the buck error amplifier is internally routed to the VERROR pin and is available externally. This allows the DA9210 to operate as a master together with another slave instance of DA9210 in dual DA9210 operation. If GPIO1_PIN = 01 and slave mode is configured, whenever the buck converter is enabled, the signal applied at the VERROR pin will be internally routed as a replacement for the buck error amplifier output, thereby overriding the functionality of the amplifier in the regulation loop. This allows the DA9210 to operate as a slave together with another master instance of DA9210 in dual DA9210 operation.

8.2.5 IPHASE / GPIO2

This port is multi-functional according to the configuration of GPIO2_PIN. It can be used as an analog pin to support the dual parallel mode operation of DA9210 (input in the case of operation as a slave, output in the case of operation as a master, see Section 8.3.3. Alternatively it behaves like a standard GPIO extender pin, see Section 8.4.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 39 of 90 © 2016 Dialog Semiconductor If GPIO2_PIN = 01 the port will be configured for IPHASE operation as an input or an output, according to the voltage level on the VOUT_SENSE Pin, see Section 8.3.3. In master mode the port is an output. In slave mode (VOUT_SENSE must be tied high to VDDCORE) the port is an input. If GPIO2_PIN = 01 and master mode is configured, whenever the buck converter is enabled, the signal from the current sense amplifier of one phase is internally routed to the IPHASE pin and is available externally. This allows the DA9210 to operate as a master together with another slave instance of DA9210 in dual DA9210 operation. If GPIO2_PIN = 01 and slave mode is configured, whenever the buck converter is enabled, the signal applied at the IPHASE pin will be internally routed as a replacement for the current sense amplifier of one phase, thereby overriding the function of that current sense amplifier in the current regulation loop. This allows the DA9210 to operate as a slave together with another master instance of DA9210 in dual DA9210 operation.

8.2.6 BUCK_CLK / GPIO3

This port is multi-functional according to the configuration GPIO3_PIN. It can be used as a digital pin to support the dual parallel mode operation of DA9210 (input in the case of operation as a slave, output in the case of operation as a master, see Section 8.3.3. Alternatively it behaves like a standard GPIO extender pin, see Section 8.4. If GPIO3_PIN = 01 the port will be configured for buck clock operation as an input or an output, according to the voltage level at VOUT_SENSE pin, see Section 8.3.3. In master mode the port is an output. In slave mode (VOUT_SENSE must be tied high to VDDCORE) the port is an input. If GPIO3_PIN = 01 and master mode is configured, whenever the buck converter is enabled, the clock signal of the buck converter is internally routed to the BUCK_CLK pin and is available externally. This allows to use DA9210 in dual operation as a master together with another slave instance of DA9210. If GPIO3_PIN = 01 and slave mode is configured, whenever the buck converter is enabled, the signal applied at BUCK_CLK pin will be internally routed to the clock generation block of the buck converter, thereby overriding the functionality of the internal buck clock. This allows the DA9210 to operate as a slave together with another master instance of DA9210 in dual DA9210 operation.

8.2.7 Digital External Clock Input / GPIO4

This port is multi-functional according to the configuration of GPIO4_PIN. It can be used as digital external clock input for the system, if a signal of typically 6 MHz is applied to the pin. NOTE The clock must already be running and stable before configuring the port via GPIO4_PIN and before enabling the buck converter. Missing pulses or signals applied at different frequen cies than specified may cause disruption of the IC. Alternatively it behaves like a standard GPIO extender pin, see Section 8.4.

8.2.8 OC_PG / nIRQ

The OC_PG (Over Current alarm and Power Good) is an output port shared with nIRQ and can be either push-pull or open-drain (selected via OC_PG_IRQ_TYPE). The port can be configured as active high or active low via control OC_PG_IRQ_LEVEL. If OC_PG_IRQ_CONF = 0 the port is used as IRQ line. It indicates that an interrupt causing event has occurred and that the event/status information is available in the related registers 0x50 to 0x53. Such information can be a warning of critical temperature, fault conditions, or status changes on GPI ports. The event registers hold information about the events that have occurred. Events are triggered by a status change at the monitored signals. When an event bit is set, the nIRQ signal is asserted (unless this interrupt is masked by a corresponding bit in the IRQ mask registers 0x54 and 0x55). The nIRQ is not released until all event registers with asserted bits have been read and cleared. New

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 40 of 90 © 2016 Dialog Semiconductor events that occur during event register reading are held until the event register has been read and cleared, ensuring that the host processor does not miss them. If OC_PG_IRQ_CONF = 1, the OC_PG functionality is selected. The OC_PG function is valid for Li- Ion battery voltage ranging from 2.8 V to 4.4 V. This can be used for a dedicated communication to the host processor. OC_PG remains asserted while as at least one of the STATUS indicators is active (see registers 0x50 and 0x51). This allows the host processor to be immediately informed and to promptly react by, for example, reducing its operating frequency. After the fast reaction, the host processor can then check the STATUS registers to see what is causing the OC_PG port assertion, if the indicator is still active. If the indicator is not active, the host processor is able to track what has caused the OC_PG port assertion through the EVENT registers. The STATUS indicators causing the assertion of the OC_PG port are reported in the following list:

Not Buck Power Good
Over Current Alarm
Warning Temperature
VBUCK_MAX Voltage
GPI Status When a STATUS bit is set, the OC_PG signal is asserted, unless the related bit is masked in MASK_A and MASK_B registers. An event is produced in parallel when the STATUS bit changes from passive to active state. The OC_PG port is automatically released when no STATUS indicators are active. The EVENT bit remains asserted and needs to be cleared by the host processor. When EN_CHIP is low, the OC_PG port is configured in high impedance state. When EN_CHIP is high and the buck converter is disabled, the OC_PG port is configured to its passive state. Therefore if it is set as open-drain, active low in CONFIG_A register, a pull-up resistor will be required to achieve a high level on the OC_PG port. When disabling the buck converter, if OC_PG_REL = 0, the OC_PG port is held asserted during power down for tOC_PD after the buck has been disabled. When this time expires, the OC_PG port will be released to its passive state. If OC_PG_REL = 1, the OC_PG port is held asserted during power down until the down ramp has completed. After that it will be immediately released to its passive state. Not Buck Power Good This channel monitors the output voltage of the buck converter and signals an invalid output voltage condition. During power up, the nPWRGOOD indicator is active and is released when the buck output voltage is greater than VGOOD. During normal operation, the nPWRGOOD indicator is active when the buck output voltage falls below VGOOD – VGOOD_HYST. The indicator is released when the buck output voltage returns above VGOOD. Over Current Alarm This channel monitors the peak current through the pass devices of the buck converter. The indicator is active as long as the BUCK_IALARM threshold is hit. This is a pre-warning level information for the host processor. The control OC_PG_MASK can be used to mask the assertion of OC_PG due to current alarm during the DVC transition of the buck converter until the power up has completed. If OC_PG_KEEP control bit is asserted, the Over Current Alarm channel is masked for 100 µs after the Power Good condition has been reached, in other words, after the buck rail is valid. This happens when recovering from an out of range condition and during power up of the buck converter. When triggered due to an over current condition, the OC_PG port is asserted within tOC_DEL thereby ensuring fast feedback of information to the host processor.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 41 of 90 © 2016 Dialog Semiconductor After being asserted due to Over Current, the OC_PG port will be released at least tOC_ASSERT after the current has reduced below the BUCK_IALARM threshold. This ensures that very short current spikes triggering the OC_PG will produce pulses with defined minimum width, thereby allowing the host processor to react and take counter-measures. Over Current Alarm is valid only in PWM mode. When the buck is operated in PFM mode or Auto mode, the M_OVCURR bit should be set. Warning Temperature This channel monitors the die temperature of DA9210 and the indicator becomes active as soon as the TEMP_WARN threshold is hit. This is pre-warning level information for the host processor. The indicator returns to inactive only after the die temperature has fallen below TEMP_WARN – TEMP_HYST. VBUCK_MAX Voltage This channel monitors the output voltage configured for the buck converter either via dedicated DVC interface (see status register VBUCK_DVC) or via the VBUCK_A and VBUCK_B registers. The indicator is active as long as the configured output voltage is greater than or equal to VBUCK_MAX. GPI Toggling and External Charger Plugged To extend the OC_PG functionality, if additional external inputs need to be monitored and their activity needs to be combined on the OC_PG, all DA9210 GPIOs can be configured to trigger the assertion of OC_PG port if they are configured as GPI and not overridden by any alternative function or masked. If GPIO1, GPIO2 and GPIO3 are used for dual parallel mode operation (GPIO1_PIN = 01, GPIO2_PIN = 01, GPIO3_PIN = 01), the configuration of these pins is ignored and no signalling on the OC_PG port is possible. GPIO4 is assigned for dedicated communication of an External Charger connection signal. If not masked, it asserts when the charger is disconnected from the system. For this purpose, GPIO4 must be configured as GPI, active low. If GPIO5 and GPIO6 are used as Interface Ports (GPIO5_PIN = 01, GPIO6_PIN = 01), the configuration of these pins is ignored and no signalling on the OC_PG port is possible. If configured for HW control of the switching regulator, GPIO0, GPIO3 or GPIO4 will not assert OC_PG when their status is active.

8.3 DA9210 Operating Modes

8.3.1 ON Mode

DA9210 is in ON mode when the EN_CHIP port is higher than EN_ON. Once enabled, the host processor can start communication with DA9210 via control interface after the tEN delay needed for internal circuit start-up. If BUCK_EN is asserted when DA9210 is in ON mode, the power up of the buck converter is initiated. If the buck is controlled via GPI (see BUCK_GPI, VBUCK_GPI), the level of the controlling ports is checked when entering ON mode, so that an active will immediately affects the buck. If BUCK_EN is not asserted and all controlling GPI ports are not active, the buck converter remains off with output pull-down resistor enabled or disabled according to BUCK_PD_DIS bit.

8.3.2 OFF Mode

DA9210 is in OFF mode when the EN_CHIP port is lower than EN_OFF. In OFF mode, the buck is always disabled and the output pull-down resistor is disabled independently of BUCK_PD_DIS. All I/O ports of DA9210 are configured to be high impedance.

8.3.3 Dual Parallel Mode

DA9210 is capable of delivering up to 24 A for a high current CPU supply, when operated in dual parallel mode. Two instances of DA9210 are needed with parallel connection of VDD and output node, one acting as master and one as slave (see Figure 34). A DA9210 slave is identified by the connection of VOUT_SENSE pin to VDDCORE, whilst a master has the VOUT_SENSE pin in the normal output voltage operational range. A suitable built in filter avoids noise or short spikes on the VOUT_SENSE line causing the wrong operating mode to be sensed. To operate in dual parallel mode, both master and slave instances of DA9210 must have GPIO1, GPIO2, and GPIO3 configured respectively as VERROR, IPHASE, BUCK_CLK in the GPIOx_PIN control field. The configuration of DA9210 in dual parallel mode is transparent to the host processor and does not require any extra effort in terms of register write and maintenance. Only the master device is visible to the host processor. All commands are sent via the control interface by the host processor into the master. In slave mode, DA9210 will not react to any read command from the control interface. Please contact your local Dialog Semiconductor support for more information and dedicated application note on the Dual Parallel Mode.

8.4 GPIO Extender

DA9210 includes a GPIO extender that offers up to seven 5 V tolerant, GPIO ports; each controlled via registers from the host processor. The GPIO ports are pin-shared with the control interface, DVC interface, and dual operation. For instance, if GPIO5_PIN = 01, GPIO6_PIN = 01 (Interface selected), the GPIO5 and GPIO6 ports will be exclusively dedicated to chip select and output signalling for 4-WIRE purposes or to clock and input for DVC interface, depending on the setting of IF_TYPE. If the alternate function is selected, all GPIO configurations as per registers 0x58 to 0x5A and 0x145 will be ignored. GPIs are supplied from the internal rail VDDCORE or VDD_IO (selected via GPI_V and can be configured to be active high or active low in GPIOx_TYPE. The input signals can be debounced (debouncing time configurable via control DEBOUNCING, 10 ms default) can directly change the state of the assigned status register GPIx to high or low, dependent on the setting of GPIOx_MODE. If OC_PG_IRQ_CONF = 1, as long as the status is at its configured active state (level sensitive), the OC_PG port is asserted (unless this is masked, see also Figure 32). Whenever the status changes to the active state (edge sensitive), the assigned event register is set (needs to be cleared by the host processor). If OC_PG_IRQ_CONF = 0, whenever the status changes to its configured active state (edge sensitive), the assigned event register is set and the nIRQ signal is asserted (unless the nIRQ is masked, see Figure 35). Whenever DA9210 is enabled and enters ON mode (also when enabled, changing the setting of GPIOx_PIN), the GPI status bits are initiated towards their configured passive state. This ensures that already active signals are detected and create an event immediately after the GPI comparators are enabled. If enabled via buck control BUCK_GPI, port GPI0, GPI3 and GPI4 enable/disable the switching regulator from the rising and falling edges of these signals (changing BUCK_EN). If GPI ports must be enables for HW control of the switching regulator, do not generate an event and do not assert OC_PG independently of the OC_PG_IRQ_CONF setting, the relative mask bit should also be set. GPI0, GPI3 and GPI4 can alternatively be selected to toggle the BUCK_SEL bit with rising and falling edges at these inputs. In addition to changing the regulator output voltage this also provides a HW control of regulator mode (normal/low power mode) from the settings BUCK_SL_A, BUCK_SL_B (enabled via BUCK_MODE = ‘00’). All GPI ports have the additional option of activating a 100 kΩ pull-down resistor via GPIOx_PUPD, which ensures a well-defined level in case the input is not actively driven. If defined as an output, GPIOs can be configured to be open-drain or push-pull. The supply rail in case of push-pull is VDD_IO. By disabling the internal 120 kΩ pull-up resistor in open-drain mode, the GPO can also be supplied from an external rail. The output state will be determined by the GPIO register bit GPIOx_MODE. Whenever the GPIO unit is off (POR or OFF mode), all ports are configured as open-drain active high (pass device switched off, high impedance state). When leaving POR, the pull-up or pull-down resistors are configured from register CONFIG_C

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 47 of 90 © 2016 Dialog Semiconductor Figure 35: GPIO Principal Block Diagram with nIRQ Signal (Example Paths)

8.5 Control Interfaces

The DA9210 can be SW-controlled by the host. The DA9210 offers access to its registers via a serial control interface. The communication is selectable to be either a 2-WIRE (I2C compliant) or a 4-WIRE (SPI compliant) connection via control IF_TYPE which is selected during the initial OTP read. In both configurations, the DA9210 will act as a slave device, data is shifted into or out from DA9210 under the control of the host processor that also provides the serial clock. The interface is usually only configured once from OTP values, which are loaded during the initial start-up of DA9210. NOTE DA9210 reacts only on read/w rite commands w here the transmitted register address (using the actual page bits as an MSB address range extension) is w ithin 0x50 to 0x6F, 0xD0 to DF, 0x140 to 0x14F, or (read only) 0x200 to 0x280. Host access to registers outside these range s w ill be ignored (no acknow ledge after receiving the register address in 2 -WIRE mode, SO stays HI-Z in 4 -WIRE mode). DA9210 reacts only to w rite commands w here the transmitted register address is 0x00, 0x80, 0x100, 0x101, 0x105, 0x106, or 0x200. If STAND_ALONE is asserted (OTP bit), DA9210 also reacts to read commands. If DA9210 is in slave configuration (VOUT_SENSE ti ed to VDDCORE) it does not react to any read command, see Section 8.3.3. DA9210 provides an additional interface supporting direct DVC requests from the host processor to the buck. The DVC interface can be enabled via control DVC_CTRL_EN, provided that the GPIO5_PIN, GPIO6_PIN, and IF_TYPE controls are appropriately configured. 8.5.1 4-WIRE Communication In 4-WIRE mode, the interface uses a chip-select line (nCS/nSS), clock line (SK), data input (SI), and data output line (SO). The DA9210 register map is split into four pages with each page containing up to 128 registers, in order to be transparent to the main PMIC (DA9063) and compliant to its register map. The register at address 0x00 on each page is used as a page control register. The default active page after turn on includes registers 0x50 to 0x6F. Writing to the page control register changes the active page for all subsequent read/write operations unless an automatic return to page 0 was selected by asserting control REVERT. Unless REVERT was asserted, after modifying the active page it is recommended to read back the page control register to ensure that future data exchange is accessing the intended registers. All registers out of the DA9210 range are write only that is the DA9210 will not answer to a read command and the data bus is tri-state (they are implicitly directed to DA9063). In particular, the information contained in registers 0x105 and 0x106 is used by DA9210 to configure the control interface. They must be the same as the main PMIC (DA9063), so that a write to those registers configures both the main PMIC and DA9210. The default OTP settings need also to be identical for correct operation of the system. The 4-WIRE interface features half-duplex operation (data can be transmitted and received within a single 16 bit frame) at an enhanced clock speed (up to 14 MHz). The interface operates at the clock frequency provided by the host.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 49 of 90 © 2016 Dialog Semiconductor A transmission begins when initiated by the host. Reading and writing is accomplished using an 8-bit command, sent by the host prior to the exchanged 8-bit data. The byte from the host begins shifting in on the SI pin under the control of the serial clock SK provided from the host. The first 7 bits specify the register address (0x01 to 0x07) which will be written or read by the host. The register address is automatically decoded after receiving the seventh address bit. The command word ends with an R/W bit, this, together with the control bit R/W_POL, specifies the direction of the following data exchange. During a register write, the host continues sending out data during the following eight SK clocks. For a read, the host stops transmitting and the 8-bit register is clocked out of DA9210 during the following eight SK clocks of the frame. Address and data are transmitted MSB first. The polarity (active state) of nCS is defined by control bit nCS_POL. nCS resets the interface when inactive and must be released between successive cycles. The SO output from DA9210 is normally in a high-impedance state and is active only during the second half of a read cycle. A pull-up or pull-down resistor may be needed on the SO line if a floating logic signal could result in unintended current consumption inside other circuits. The DA9210 4-WIRE interface offers two further configuration bits. Clock polarity (CPOL) and clock phase (CPHA) define when the interface will latch the serial data bits. CPOL determines whether SK idles high (CPOL = 1) or low CPOL= 0). CPHA determines on which SK edge data is shifted in and out. With CPOL = 0 and CPHA = 0, DA9210 latches data on the SK rising edge. If the CPHA is set to 1, the data is latched on the SK falling edge. CPOL and CPHA states allow four different combinations of clock polarity and phase; each setting is incompatible with the other three. The host and DA9210 must be set to the same CPOL and CPHA states to communicate with each other, see Table 15. Table 15: 4-WIRE Clock Configurations CPHA clock polarity CPOL clock phase Output data is updated at SK edge Input data is registered at SK edge CPHA clock polarity 0 (idle low ) 0 falling rising 0 (idle low ) 0 (idle low ) 1 rising falling 0 (idle low ) 1 (idle high) 0 rising falling 1 (idle high) 1 (idle high) 1 falling rising 1 (idle high)

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 52 of 90 © 2016 Dialog Semiconductor Parameter Data rage Effective read/w rite data Up to 7 Mbps Transmission Half-duplex MSB first 16 bit cycles 7bit address, 1 bit read/w rite, 8 bit data Configuration CPOL clock polarity CPHA clock phase nCS_POL nCS is active low /high Note 1 Reading a register at high clock rates directly after w r iting to it does not guarantee a correct value. A delay of one frame is recommended before re-accessing a register that has just been w ritten ( for example by w riting/reading another register address in betw een).

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 53 of 90 © 2016 Dialog Semiconductor 8.5.2 2-WIRE Communication With control IF_TYPE, the DA9210 power manager interface can be configured towards a 2-WIRE serial data exchange. It has a configurable device write address (default: 0xD0) and a configurable device read address (default: 0xD1). For details of configurable addresses, see control IF_BASE_ADDR. The SK pin provides the 2-WIRE clock (SCL), and SI carries all the power manager bidirectional 2- WIRE data, (SDA). The 2-WIRE interface is open-drain supporting multiple devices on a single line. The bus lines require external pull-up resistors (2 kΩ to 20 kΩ range). The attached devices only drive the bus lines LOW. As a result, two devices cannot conflict if they drive the bus simultaneously. In standard/fast mode, the highest frequency of the bus is 400 kHz. The exact frequency can be determined by the application and does not have any relation to the DA9210 internal clock signals. DA9210 follows the host clock speed within the described limitations and does not initiate any clock arbitration or slow down. An automatic reset of the interface can be triggered via control 2WIRE_TO if the clock signal stops toggling for more than 35 ms (compatible with SMBus). The interface supports operation compatible with Standard, Fast, Fast-Plus and High Speed modes of the I2C bus specification Rev 4 (UM10204_4). Operation in high speed mode at 3.4 MHz requires mode changing in order to change spike suppression and slope control characteristics to be compatible with the I2C bus specification. The high speed mode can be enabled on a transfer by transfer basis by sending the master code (0000 1XXX) at the beginning of the transfer. DA9210 does not make use of clock stretching and delivers read data up to 3.4 MHz, without additional delay. Communication on the 2-WIRE bus always takes place between two devices, one acting as the master and the other as the slave. The DA9210 only operates as a slave. Unlike 4-WIRE mode, the 2-WIRE interface has direct access to two pages of the register map (up to 256 addresses). The register at address 0x00 on each page is used as a page control register (with the 2-WIRE bus ignoring the LSB of control REG_PAGE). Writing to the page control register changes the active page for all subsequent read/write operations, unless an automatic return to page 0 is selected by asserting control REVERT. After modifying the active page, unless REVERT is asserted, it is recommended to read back the page control register to ensure that future data exchange accesses the intended registers. In 2-WIRE operation DA9210 offers an alternative way to access register page 2 and 3. It removes the need for the preceding page selection writes by increasing the device write/read address by one (default 0xD2/0xD3) for any direct access of page 2 and 3 (page 0 and 1 access requires the basic write/read device address with the MSB of REG_PAGE ‘0’). Details of the 2-WIRE Control Bus Protocol The following description uses the standard terms SDA for the serial data, pin SI, and SCL for the serial clock, pin SK. All data is transmitted across the 2-WIRE bus in 8-bit groups. To send a bit, the SDA line is driven at the intended state while the SCL is low. Once the SDA has settled, the SCL line is brought high and then low. This pulse on SCL stores the SDA bit in the receiver’s shift register. A 2-byte serial protocol is used: one address byte and one data byte. The data and address are transmitted MSB first for both read and write operations. All transmissions begin with the START condition from the master, during which the bus is in IDLE state (the bus is free). It is initiated by a high-to-low transition on the SDA line while the SCL is in high state. A STOP condition is indicated by a low-to-high transition on the SDA line while the SCL is in high state. The START and STOP conditions are illustrated in Figure 40.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 55 of 90 © 2016 Dialog Semiconductor S SLAVEadr W A REGadr A SLAVEadr A S = START condition A = Acknowledge (low) Sr = Repeat START condition A* = No Acknowledge P = STOP condition W = Write (low) R = Read (high) Master to Slave Slave to Master 7-bits 1 bit 8-bits 7-bits DATA A Sr R 1-bit 8-bits S SLAVEadr W A REGadr A SLAVEadr A 7-bits 1-bit 8-bits 7-bits DATA P S R 1-bit 8-bits P A A* P DATA DATA A A* DATA 8-bits 8-bits 8-bits Figure 43: 2-WIRE Page Read The slave address after the repeated START condition must be the same as the previous slave address. Consecutive (page) write mode is supported if the master sends several data bytes after sending the register address. The 2-wire control block then increments the address pointer to the next 2-wire address, stores the received data, and sends an ACK until the master sends a STOP condition. The page write mode is illustrated in Figure 44. S SLAVEadr W A REGadr A DATA A S = START condition A = Acknowledge (low) Sr = Repeat START condition A* = No Acknowledge P = STOP condition W = Write (low) R = Read (high) Master to Slave Slave to Master 7-bits 1 bit 8-bits 8-bits DATA A 1-bit 8-bits A P DATA ………. A 8-bits Repeated writes Figure 44: 2-WIRE Page Write A repeated write mode can be enabled with WRITE_MODE control. In this mode, the master can execute back-to-back write operations to non-consecutive addresses by transmitting register addresses and data pairs. The data is stored in the address specified by the preceding byte. The repeated write mode is illustrated in Figure 45. S SLAVEadr W A REGadr A DATA A S = START condition A = Acknowledge (low) Sr = Repeat START condition A* = No Acknowledge P = STOP condition W = Write (low) R = Read (high) Master to Slave Slave to Master 7-bits 1 bit 8-bits 8-bits REGadr A 1-bit 8-bits A P DATA ………. A 8-bits Repeated writes Figure 45: 2-WIRE Repeated Write If a new START or STOP condition occurs within a message, the bus returns to idle mode.

8.5.3 DVC Interface

With control DVC_CTRL_EN, GPIO5 and GPIO6 can be dedicated to an alternative mode of defining the buck output voltage (supporting direct DVC) from the host processor to the buck. This is only enabled if GPIO5 and GPIO6 are configured for interface (setting 01) and IF_TYPE is asserted. Since the logical levels of the I/O are referenced to VDD_IO, a valid voltage at this port is needed. After the DVC interface has been activated and synchronized, the buck converter target voltage is derived by adding a delta value to the voltage base register configured in VBUCK_BASE. The delta value is decoded by DA9210 from the number of clock rising edges at the SYNC pin while INPUT is

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 56 of 90 © 2016 Dialog Semiconductor kept high. During control via the DVC interface, the setting of registers VBUCK_A, VBUCK_B are ignored and the target output voltage is calculated as: VOUT = VBUCK_BASE + (N x VSTEPS) Where VVSTEPS is 10 mV and N can range from 0 to 32. The principle derivation of the target voltage is shown in Figure 46. Example The INPUT port is sampled high for 16 of the 32 samples, thus N = 16. If VBUCK_BASE = 0.8 V, the target voltage is VOUT = 0.8 V + (16 x 10 mV) = 0.96 V. Once the DVC interface is enabled, DA9210 will maintain the voltage set in VBUCK_A/VBUCK_B until the valid completion of the first 32 clock sample. The new value of the output voltage is automatically updated after the completion of 32 clock sample. The clocking SYNC signal can be stopped after a multiple of 32 cycles or it can run continuously. The value used for setting the target voltage is always based on the last 32 clock sample frame. There is no explicit frame sync signal. Once the DVC interface is enabled, the frame sync is implicit on the rising edge of the INPUT port, which indicates the start of a 32 clock frame. If a new rising edge occurs before the previous 32 clocks have been sampled, the current accumulated sample is discarded and a new 32 clock sample is started. The previous voltage setting for the buck converter is used as target in the meantime, until a valid sequence is decoded. If a zero value is sent to the INPUT port, VOUT will be equal to VBUCK_BASE so there is no rising edge and thus no frame sync. DA9210 will keep counting the clock edges at the SYNC port. In a similar way, if a high value is continuously sent to the INPUT port, VOUT will be equal to VBUCK_BASE + (32 x vSTEPS) although no frame sync takes place. The host processor can monitor the configured target voltage on the (read only) register VBUCK_DVC. The DVC interface is interrupted when DVC_CTRL_EN is released or the IF_TYPE/GPI4/GPIO5 configuration is changed. After disabling the DVC interface, the normal control of the output voltage via select register VBUCK_A, VBUCK_B will revert automatically. If FORCE_DVC_IF is not asserted, the DVC interface is disabled when the buck is disabled (this automatically clears DVC_CTRL_EN bit). Otherwise the DVC interface remains armed and, at the next enable of the buck converter, the target output value will be derived from the SYNC and INPUT ports, as soon as a valid completion of the first 32 clock sample takes place. Until a valid 32 clock sample is received, the output voltage is set via select register BUCK_SEL and VBUCK_A or VBUCK_B values. If DVC_STEP_SIZE is asserted the output voltage will increase by double the amount of consecutive asserted bits (VVSTEPS will correspond to 20 mV instead of 10 mV). Example The INPUT port is sampled high for 16 of the 32 samples, thus N = 16. If DVC_STEP_SIZEis asserted and VBUCK_BASE = 0.8 V, the target voltage is VOUT = 0.8 V + (16 x 20 mV) = 1.12 V. To limit the buck output voltage and prevent any failures in case of a communication error, a maximum value for the buck output target voltage can be stored in VBUCK_MAX. This value represents the absolute maximum voltage and it has priority over any value resulting from the addition of VBUCK_BASE and (N x VSTEPS) as well as over any value set on VBUCK_A and VBUCK_B, if the DVC interface is disabled. When the output voltage exceeds VBUCK_MAX, an event is generated and the OC_PG port is asserted, if not masked by M_VMAX. If the OC_PG port is configured for IRQ operation, an interrupt is generated instead.

8.6 Internal Temperature Supervision

To protect the DA9210 from damage due to excessive power dissipation, the internal temperature is continuously monitored. There are three temperature thresholds, TEMP_WARN, TEMP_CRIT, and TEMP_POR, respectively at typically 125 °C, 140 °C, and 150 °C. When the junction temperature reaches the TEMP_WARN threshold, DA9210 asserts the bit TEMP_WARN and generates the event E_TEMP_WARN. If not masked via bit M_TEMP_WARN, the output port OC_PG/nIRQ is asserted. The status bit TEMP_WARN remains asserted while the junction temperature is higher than TEMP_WARN. When the junction temperature increases further over TEMP_CRIT, the DA9210 immediately disables the buck converter, asserts the bit TEMP_CRIT and generates the event E_TEMP_WARN. If not masked via bit M_TEMP_WARN, the output port OC_PG/nIRQ is asserted. The status bit TEMP_CRIT remains asserted while the junction temperature is higher than TEMP_CRIT. The buck converter is disabled as long as the junction temperature is greater than TEMP_CRIT and is automatically re-enabled after the temperature recovers below the valid threshold (even if the controlling GPI is asserted). A direct write into BUCK_EN or a toggling of the controlling GPI is needed to enable the buck converter. Whenever the junction temperature exceeds TEMP_POR, a power-on reset to the digital core is immediately asserted, which stops all functionality in DA9210. This is needed to prevent possible permanent damage in case of a fast temperature increase.

9 Register Definitions

9.1 Register Map

All bits loaded from OTP are marked in bold. Figure 47: Register Map

9.2 Register Page Control

Table 17: PAGE_CON (0x00) Bit Type Label Description

7 R/W REVERT Resets REG_PA GE to 000 after read/w rite

6 R/W WRITE_MODE

2-WIRE multiple w rite mode 0: Page Write mode 1: Repeated Write mode 5:3 R/W (Reserved) 2:0 R/W REG_PAGE I2C: 00x: Selects register 0x00 to 0xFF 01x: Selects register 0x100 to 0x17F SPI: 000: Selects r egister 0x00 to 0x7F 001: Selects register 0x80 to 0xFF 100: Selects r egister 0x100 to 0x17F >010: Reserved for production and test Note 1 Not used for 4-WIRE-IF

9.3 Register Page 0

9.3.1 System Control and Event

The STATUS registers report the current value of the various signals at the time that it is read out. NOTE All the status bits have the same polarity as their corresponding signals. Table 18: PAGE_CON (0x50) Bit Type Label Description

7 R Reserved

6 R GPI6 GPI6 level

5 R GPI5 GPI5 level

4 R GPI4 GPI4 level

3 R GPI3 GPI3 level

2 R GPI2 GPI2 level

1 R GPI1 GPI1 level

0 R GPI0 GPI0 level

4 R VMAX Asserted as long as the voltage configured for

the buck converter is equal or greater than VBUCK_MAX

3 R TEMP_CRIT Asserted as long as the thermal shutdow n

2 R TEMP_WA RN Asserted as long as the thermal w arning

1 R nPWRGOOD Asserted as long as the buck output voltage is

0 R OVCURR Asserted as long as the buck is in overcurrent

The EVENT registers hold information about events detected by the DA9210. If the OC_PG port is configured as IRQ line:

The events are triggered by a change in the status register which contains the status of monitored signals.
When an EVENT bit is set in the event register the IRQ signal shall be asserted, unless the event is masked by setting the associated bit in the mask register. The IRQ triggering event register is cleared from the host by writing back its read value. New events occurring during clearing is delayed before they are passed to the event register, ensuring that the host controller does not miss them. If the OC_PG port is configured for dedicated communication to the host processor as described in Section 8.2.8, the port will be asserted according to the STATUS bits and the polarity of the STATUS indication (active high/low) can be selected separately (see GPIOxx_TYPE control). An EVENT is generated only during transition of the STATUS from inactive to active. Table 20: EVENT_A (0x52) Bit Type Label Description

6 R E_GPI6 GPI6 event according to active state setting

5 R E_GPI5 GPI5 event according to active state setting

4 R E_GPI4 GPI4 event according to active state setting

3 R E_GPI3 GPI3 event according to active state setting

2 R E_GPI2 GPI2 event accord ing to active state setting

1 R E_GPI1 GPI1 event according to active state setting

Table 21: EVENT_B (0x053) Bit Type Label Description 7:5 R Reserved

4 R E_VMAX VMAX caused event

3 R E_TEMP_CRIT TEMP_CRIT caused event

2 R E_TEMP_WA RN TEMP_WA RN caused event

1 R E_nPWRGOOD nPWRGOOD caused event

0 R E_OVCURR OVCURR caused event

Table 22: MASK_A (0x54) Bit Type Label Description

7 R/W Reserved

6 R/W M_GPI6 GPI6 nIRQ Mask

5 R/W M_GPI5 GPI5 nIRQ Mask

4 R/W M_GPI4 GPI4 nIRQ Mask

3 R/W M_GPI3 GPI3 nIRQ Mask

2 R/W M_GPI2 GPI2 nIRQ Mask

1 R/W M_GPI1 GPI1 nIRQ Mask

0 R/W M_GPI0 GPI0 nIRQ Mask

Table 23: MASK_B (0x55) Bit Type Label Description 7:5 R/W Reserved

4 R/W M_VMAX VMAX nIRQ / OC_PG Event Mask

3 R/W M_TEMP_CRIT Mask TEMP_CRIT nIRQ / OC_PG Event

2 R/W M_TEMP_WARN TEMP_WA RN nIRQ / OC_PG Event Mask

1 R/W M_nPWRGOOD PWRGOOD nIRQ / OC_PG Event Mask

0 R/W M_OVCURR OVCURR IRQ / OC_PG Event Mask

Table 24: CONTROL_A (0x56) Bit Type Label Description

5 R/W V_LOCK

0: Allow s host w rites into registers 0xD0 to 0x14F 1: Disables register 0xD0 to 0x14F re - programming from control interfaces 4:3 R/W SLEW_RATE DVC slew ing is executed at 00: 10 mV every 4.0 µs 01: 10 mV every 2.0 µs 10: 10 mV every 1.0 µs 11: 10 mV every 0.5 µs

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 63 of 90 © 2016 Dialog Semiconductor Bit Type Label Description 2:0 R/W DEBOUNCING GPI debounce time: 000: no debounce time 001: 0.1 ms 010: 1.0 ms 011: 10 ms 100: 50 ms 101: 250 ms 110: 500 ms 111: 1000 ms

9.3.2 GPIO Control

Table 25: GPIO0-1 (0x58) Bit Type Label Description

7 R/W GPIO1_MODE

0: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

6 R/W GPIO1_TY PE 0: GPI: active low

1: GPI: active high 5:4 R/W GPIO1_PIN PIN assigned to: 00: GPI 01: Verror signal 10: GPO ( open-drain) 11: GPO ( push-pull)

3 R/W GPIO0_MODE

0: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

2 R/W GPIO0_TY PE

0: GPI: active low 1: GPI: active high 1:0 R/W GPIO0_PIN PIN assigned to: 00: GPI 01: Reserved 10: GPO ( open-drain) 11: GPO ( push-pull)

7 R/W GPIO3_MODE

0: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

6 R/W GPIO3_TY PE 0: GPI: active low

1: GPI: active high 5:4 R/W GPIO3_PIN PIN assigned to: 00: GPI 01: BUCK_CLK signal 10: GPO ( open-drain) 11: GPO ( push-pull)

3 R/W GPIO2_MODE

00: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

2 R/W GPIO2_TY PE 0: GPI: active low

1: GPI: active high 1:0 R/W GPIO2_PIN PIN assigned to: 00: GPI 01: Iphase signal 10: GPO ( open-drain) 11: GPO ( push-pull) Table 27: GPIO4-5 (0x54) Bit Type Label Description

7 R/W GPIO5_MODE

0: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

6 R/W GPIO5_TY PE

0: GPI: active low 1: GPI: active high 5:4 R/W GPIO5_PIN PIN assigned to: 00: GPI 01: Interface 10: GPO (open-drain) 11: GPO (push -pull)

3 R/W GPIO4_MODE

0: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

2 R/W GPIO4_TY PE 0: GPI: active low

1: GPI: active high

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 65 of 90 © 2016 Dialog Semiconductor Bit Type Label Description 1:0 R/W GPIO4_PIN PIN assigned to: 00: GPI (AC_OK) 01: Digital external clock input 10: GPO (open-drain) 11: GPO (push -pull) Table 28: GPIO6 (0x5B) Bit Type Label Description 7:4 R/W Reserved

3 R/W GPIO6_MODE

0: GPI: debounce off GPO: Sets output to low level 1: GPI: debounce on GPO: Sets output to high level

2 R/W GPIO6_TY PE

0: GPI: active low 1: GPI: active high 1:0 R/W GPIO6_PIN PIN assigned to: 00: GPI 01: Interface 10: GPO (open-drain) 11: GPO (push -pull)

9.3.3 Regul ator Control

Table 29: BUCK_CON (0x5D) Bit Type Label Description

7 R/W DVC_CTRL_EN

Main control of the dedicated DVC Interface: 0: Disabled 1: Enabled 6:5 R/W VBUCK_GPI GPIO select target voltage VBUCK_B on passive to active tran sition, selects target voltage VBUCK_A on active to passive transition (ramping) 00: Not controlled by GPIO 01: GPIO0 controlled 10: GPIO3 controlled 11: GPIO4 controlled

4 R/W VBUCK_SEL

BUCK voltage is selected from (ramping): 0: VBUCK_A 1: VBUCK_B

3 R/W BUCK_PD_DIS

0: Enable pull-dow n resistor in disabled mode 1: No pull-dow n resistor in disabled mode

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 66 of 90 © 2016 Dialog Semiconductor Bit Type Label Description 2:1 R/W BUCK_GPI GPIO enables the BUCK on passive to active state transition, disables the BUCK on a ctive to passive state transition 00: Not controlled by GPIO 01: GPIO0 controlled 10: GPIO3 controlled 11: GPIO4 controlled

0 R/W BUCK_EN 0: BUCK disabled

1: BUCK enabled Note 1 Automatically set to 0 by default w hen the buck converter is enabled, except w hen the output voltage is controlled via GPI port .

9.4 Register Page 1

Table 30: PAGE_CON (0x80) Bit Type Label Description 2-WIRE multiple w rite mode 0: Page w rite mode 1: Repeated w rite mode 5:3 R/W Reserved 2:0 R/W REG_PAGE I2C: 00x: Selects register 0x00 to 0xFF 01x: Selects register 0x100 to 0x17F SPI: 000: Selects r egister 0x00 to 0x7F 001: Selects register 0x80 to 0xFF 100: Selects r egister 0x100 to 0x17F >010: Reserved for production and test Note 1 Not used for 4-WIRE-IF.

9.4.1 Regulators Settings

Table 31: BUCK_ILIM (0xD0) Bit Type Label Description 7:5 R/W Reserved

4 R/W BUCK_IALARM

Current Alarm threshold is: 0: BUCKILIM – 300 mA 1: BUCKILIM – 600 mA

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 68 of 90 © 2016 Dialog Semiconductor Bit Type Label Description 3:0 R/W BUCK_ILIM Current limit per phase: 0000: 1600 mA 0001: 1800 mA 0010: 2000 mA 0011: 2200 mA 0100: 2400 mA 0101: 2600 mA 0110: 2800 mA 0111: 3000 mA 1000: 3200 mA 1001: 3400 mA 1010: 3600 mA 1011: 3800 mA 1100: 4000 mA 1101: 4200 mA 1110: 4400 mA 1111: 4600 mA Table 32: BUCK_CONF1 (0xD1) Bit Type Label Description 7:5 R/W PWR_DOWN_CTRL Voltage ramping during pow er dow n 000: 1.25 mV/µs 001: 2.5 mV/µs 010: 5 mV/µs 011: 10 mV/µs 100: 20 mV/µs 101: 30 mV/µs 110: 40 mV/µs 111: no ramped pow er dow n 4:2 R/W STARTUP_CTRL Voltage ramping during start -up 000: 1.25 mV/µs Soft startup w ith controlled slew rate 001: 2.5 mV/µs 010: 5 mV/µs 011: 10 mV/µs 100: 20 mV/µs Note 1 101: 30 mV/µs 110: 40 mV/µs 111: target voltage applied immediately (no soft start) 1:0 R/W BUCK_MODE 00: Low Pow er/Normal mode controlled via voltage A and B registers 01: BUCK alw ays operates in Low pow er mode 10: BUCK alw ays operates in Normal mode 11: Automatic mode

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 69 of 90 © 2016 Dialog Semiconductor Note 1 Settings higher than 20 mV/µs may cause significant overshoot Table 33: BUCK_CONF2 (0xD2) Bit Type Label Description 7:5 R/W Reserved

4 R/W AUTO_DEF

The buck Automatic Mode functions: 0: based on the voltage threshold VBUCK_AUTO 1: based on the output current load

3 R/W PH_SH_EN Enable current dependent phase shedding

2:0 R/W PHASE_SEL Phase selection of the multi-phase buck in synchronous mode: 000: 1 phase is selected 001: 2 phases are selected 010: 3 phases are selected (uneven 0/90/180 phase shift) 011: 4 phases are selected 1xx: 8 phases are selected (dual mode only) Table 34: VBUCK_AUTO (0xD4) Bit Type Label Description 6:0 R/W VBUCK_AUTO Threshold voltage for the Automatic mode: 0000000: 0.30 V 0000001: 0.31 V 0000010: 0.32 V 1000110: 1.0 V 1111101: 1.55 V 1111110: 1.56 V 1111111: 1.57 V Table 35: VBUCK_BASE (0xD5) Bit Type Label Description

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 70 of 90 © 2016 Dialog Semiconductor Bit Type Label Description 6:0 R/W VBUCK_BASE Sets the base voltage for the buck output w hen using the DVC interface 0000000: 0.30 V 0000001: 0.31 V 0000010: 0.32 V 1000110: 1.0 V 1111101: 1.55 V 1111110: 1.56 V 1111111: 1.57 V Table 36: VBUCK_MAX (0xD6) Bit Type Label Description 6:0 R/W VBUCK_MAX Sets the maximum voltage allow ed for the buck output voltage 0000000: 0.30 V 0000001: 0.31 V 0000010: 0.32 V 1000110: 1.0 V 1111101: 1.55 V 1111110: 1.56 V 1111111: 1.57 V Table 37: VBUCK_DVC (0xD7) Bit Type Label Description 6:0 R VBUCK_DVC Internal status of actual target voltage configured via DVC interface 0000000: 0.30 V 0000001: 0.31 V 0000010: 0.32 V 1000110: 1.0 V 1111101: 1.55 V 1111110: 1.56 V 1111111: 1.57 V

7 R/W BUCK_SL_A

0: Configures the BUCK to Normal mode, w henever selecting A voltage settings 1: Configures the BUCK to Low Pow er mode, w henever selecting A voltage settings 6:0 R/W VBUCK_A 0000000: 0.30 V 0000001: 0.31 V 0000010: 0.32 V 1000110: 1.0 V 1111101: 1.55 V 1111110: 1.56 V 1111111: 1.57 V Table 39: VBUCK_B (0xD9) Bit Type Label Description

7 R/W BUCK_SL_B

0: Configures the BUCK to Normal mode, w henever selecting B voltage settings 1: Configures the BUCK to Low Pow er mode, w henever selecting B voltage settings 6:0 R/W VBUCK_B 0000000: 0.30 V 0000001: 0.31 V 0000010: 0.32 V 1000110: 1.0 V 1111101: 1.55 V 1111110: 1.56 V 1111111: 1.57 V

9.5 Register Page 2

Table 40: PAGE_CON (0x100) Bit Type Label Description 2-WIRE multiple w rite mode 0: Page Write mode 1: Repeated Write mode 5:2 R/W Reserved

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 72 of 90 © 2016 Dialog Semiconductor Bit Type Label Description 2:0 R/W REG_PAGE 000: Selects register 0x01 to 0x3F 001: Selects register 0x81 to 0xCF 010: Selects reg ister 0x101 to 0x1CF >010: Reserved for production and test Note 1 Not used for 4-WIRE-IF

9.5.1 Interface and OTP Settings (shared with DA9063)

Table 41: INTERFACE (0x105) Note 1 Bit Type Label Description 7:4 R IF_BASE_ADDR

4 MSB of 2-WIRE control interfaces base

11010000 = 0xD0 w rite address of PM 2 - WIRE interface (page 0 and 1) 11010001 = 0xD1 read address of PM 2 -WIRE interface (page 0 and 1) 11010010 = 0xD2 w rite address of PM-2- WIRE interface (page 2 and 3) 11010011 = 0xD3 read address of PM -2-WIRE interface (page 2 and 3) Code ‘0000’ is reserved for unprogrammed OTP (triggers start -up w ith hardw are default interface address)

3 R R/W_POL

4-WIRE: Read/Write bit polarity 0: Host indicates reading access via R/W bit = ‘0’ 1: Host indicates reading access via R/W bit = ‘1’

2 R CPHA 4-WIRE IF clock phase (see Table 3: 4 -WIRE

Clock Configurations)

1 R CPOL

0: SK is low during idle 1: SK is high during idle

0 R nCS_POL

4-WIRE chip select polarity 0: low , (nCS) 1: high, (CS) Note 1 The interface configuration can be w ritten/modified for unmarked samples having the control OTP_APPS_LOCK not been asserted/fused. If STAND_ALONE = 0, DA9210 w ill not respond to read commands from the host processor.

7 R22 IF_TYPE

0: Pow er manager IF is 4-WIRE 1: Pow er manager IF is 2-WIRE

6 R/W PM_IF_HSM

Enables continuous high speed mode on 2 - WIRE interface if asserted (no master code required)

5 R/W PM_IF_FMP Enables 2-WIRE interface operating w ith fast

4 R/W PM_IF_V

Pow er manager IF in 2-WIRE mode is supplied from: 0: VDDCORE 1: VDD_IO (4-WIRE alw ays from VDD_IO) 3:0 R/W Reserved

9.5.2 Application Configuration Settings

Table 43: CONFIG_A (0x143) Bit Type Label Description 7:5 R Reserved

4 R/W 2WIRE_TO

Enables automatic reset of 2-WIRE IF in case of clock stays low for >35 ms 0: Disabled 1: Enabled

3 R/W GPI_V

GPIs (not configured as Pow er Manager control inputs) are supplied from: 0: VDDCORE 1: VDD_IO

2 R/W OC_PG_IRQ_CONF

Configuration for the OC_PG port: 0: Interrupt line 1: Over Current and Pow er Good

1 R/W OC_PG_IRQ_TY PE

OC_PG output port is: 0: Push-pull 1: Open-drain (requires external pull -up resistor)

0 R/W OC_PG_IRQ_LEV EL

OC_PG output port is: 0: Active low 1: Active high

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 74 of 90 © 2016 Dialog Semiconductor Table 44: CONFIG_B (0X144) Bit Type Label Description 7:0 R/W Reserved Table 45: CONFIG_C (0X145) Bit Type Label Description

6 R/W GPIO6_PUPD

0: GPI: pull-dow n resistor disabled GPO (open-drain): pull-up resistor disable d (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor enabled

5 R/W GPIO5_PUPD

0: GPI: pull-dow n resistor disabled GPO (open drain): pull-up resistor disabled (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor enabled

4 R/W GPIO4_PUPD

0: GPI: pull-dow n resistor disabled GPO (open drain): pull-up resistor disabled (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor enab led

3 R/W GPIO3_PUPD

0: GPI: pull-dow n resistor disabled GPO (open drain): pull-up resistor disabled (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor

2 R/W GPIO2_PUPD

0: GPI: pull-dow n resistor disabled GPO (open drain): pull -up resistor disabled (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor enabled

1 R/W GPIO1_PUPD

0: GPI: pull-dow n resistor disabled GPO (open drain): pull-up resistor disabled (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor enabled

0 R/W GPIO0_PUPD

0: GPI: pull-dow n resistor disabled GPO (open drain): pull-up resistor disabled (external pull-up resistor) 1: GPI: pull-dow n resistor enabled GPO (open-drain): pull-up resistor

7 R/W OC_PG_KEEP

0: Normal operation of OC_PG port 1: Over current alarm at OC_PG is masked for 100 µs after the buck rail is valid (w hen recovering from an out of range condition and during pow er up)

6 R/W OC_PG_REL

0: OC_PG port is released 250 µs after BUCK_EN goes low 1: OC_PG port is released after the ramp dow n has completed 5:4 R/W OC_PG_MASK Over current alarm at OC_PG port is: 00: alw ays active during DVC transitions of the buck converter 01: masked during DVC transitions of the buck converter + 2 µs extra masking at the end 10: masked during DVC transitions of the buck converter + 10 µs extra masking at the end 11: masked during DV C transitions of the buck converter + 50 µs extra masking at the end

3 R/W READY_EN

GPIO3 is used as READY signal to inform the host processor of DVC ongoing (the GPIO3 needs to be configured as output and any w rite to GPIO3_MODE w ill be ignored): 0: Disabled 1: Enabled

2 R/W FORCE_DVC_IF

0: The DVC_CTRL_EN is automatically reset w hen the buck converter is disabled 1: The DVC_CTRL_EN is not reset w hen the buck converter is disabled

1 R/W DVC_STEP_SIZE

0: VSTEPS is configured to 10 mV w hen using the DVC interface 1: VSTEPS is configured to 20 mV w hen using the DVC interface

0 R/W Reserved

Table 47: CONFIG_E (0x147) Bit Type Label Description 7:6 R/W Reserved 5:4 R/W OSC_TUNE Tune the main 6 MHz oscillator frequency: 00: no tune 01: +180 kHz 10: +360 kHz 11: +540 kHz 3:1 R/W Reserved

0 R/W STAND_ALONE

0: DA9210 is used as companion IC to DA9063 or compliant 1: DA9210 is stand alone or as companion IC w ith another PMU not DA9063 compliant Table 48: MISC_SUPP (0x14F) Bit Type Label Description 7:1 R/W Reserved

0 R/W OTP_CLK_ON Forces the oscillator and the OTP clock on if

Table 49: DEVICE_ID (0x201) Bit Type Label Description 7:0 R DEV_ID Device ID Table 50: DEVICE_ID (0x203) Bit Type Label Description 7:4 R MRC Mask Revision Code 3:0 R VRC Chip Variant Code Table 51: DEVICE-ID (0x203) Bit Type Label Description 7:0 R CUST_ID Customer ID Table 52: CONFIG_ID (0x204) Bit Type Label Description 7:0 R CONFIG_REV OTP Settings Revision

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 77 of 90 © 2016 Dialog Semiconductor The components recommended in this section are examples selected from requirements of a typical application.

10.1 Capacitor Selection

Ceramic capacitors are used as bypass capacitors on all VDD and output rails. When selecting a capacitor, especially for types with high capacitance and small physical dimension, the DC bias characteristic has to be taken into account. Table 53: Recommended Capacitor Types Application Value Size Temp. Char. Tol Rated Voltage Type VDDCORE, output bypass 220 nF 0402 X5R +/- 15% +/-10% 6.3 V Murata GRM155R60J224KE01(M E01) 220 nF 0201 X5R +/- 15% +/-20% 6.3 V Murata GRM033R60J224ME90 200 nF 0201 X5R +/- 15% +/-10% 16 V Semco CL03A224KO3NNNC 220 nF 0402 X7R +/- 15% +/-10% 16 V Murata GRM155R71C224KA12D (automotive) VOUT_SENSE output bypass 47 µF 0805 X5R +/- 15% +/-20% 4 V Murata GRM21BR60G476ME15 47 µF 0603 X5R +/- 15% +/-20% 4 V Semco CL10A476MR8NZN 22 µF 0402 X5R +/- 15% +/-20% 4 V Semco CL05A226MR5NZNC 47 µF 0805 X5R +/- 15% +/-20% 10 V Murata GRM21BR61A476ME15L (automotive) 22 µF 0603 X5R +/- 15% +/-20% 10 V Murata GRM188R61A226ME15D (automotive) 22 µF 0805 X6S +/- 22% +/-20% 10 V Murata GRM21BC81A226ME44L (automotive) VDDx bypass 10 µF 0603 X5R +/- 15% +/-20% 6.3 V Murata GRM188R60J106ME84 10 µF 0805 X7R +/- 15% +/-10% 6.3 V Murata GRM21BR70J106KE76L (automotive) 10 µF 0603 X6S +/- 22% +/-20% 10 V Murata GRM188C81A106MA73D (automotive) VSYS bypass 1 µF 0402 X5R +/- 15% +/-10% 10 V Murata GRM155R61A105KE15#

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 78 of 90 © 2016 Dialog Semiconductor Application Value Size Temp. Char. Tol Rated Voltage Type 1 µF 0402 X6S +/- 22% +/-10% 10 V Murata GRM155C81A105KA12D (automotive)

10.2 Inductor Selection

Inductors should be selected based upon the following parameters:

Rated maximum current: Usually a coil provides two current limits: The Isat specifies the maximum current at which the inductance drops by 30 % of the nominal value. The Imax is defined by the maximum power dissipation and is applied to the effective current.
DC resistance: Critical to converter efficiency and should therefore be minimized.
Inductance: Given by converter electrical characteristics; 0.47 µH for all DA9210 phases. Table 54: Recommended Inductor Types (including only typical values for the parts Application Value Size Imax(dc) Isat Tolerance DC Res. Type BUCK 4x 0.47 µH 2.0x1.6x1.0 mm mΩ TOKO DFE201610C 1285AS-H-R47M 4x 0.47 µH 2.0x1.6x1.2 mm mΩ TOKO DFE201612C 1286AS-H-R47M 4x 0.47 µH 2.5x2.0x1.0 mm 3.6 A

3.9 A +/-20% 35

mΩ TOKO DFE252010C 1269AS-H-R47M 4x 0.47 µH 2.5x2.0x1.2 mm mΩ TOKO DFE252012C 1239AS-H-R47M 4x0.47 µH 2.0x1.6x1.0 mm 2.7 A

3.5 A +/-20% 38

mΩ TDK TFM201610A R47M 4x0.47 µH 2.5x2.0x1.0 mm 2.8 A

4.5 A +/-20% 34

mΩ TDK TFM252010A R47M 4x0.47 µH 2.0x1.6x1.0 mm 2.7 A 3.56 A +/-20% 38 mΩ Cyntec PIFE20161T 4x0.47 µH 2.5x2.0x1.0 mm mΩ Cyntec PIFE25201T 4x0.47 µH 2.5x2.0x1.2 mm mΩ Cyntec PIFE25201B 4x0.47 µH 2.5x2.0x1.2 mm mΩ Cyntec PST25201B 4x0.47 µH 2.0x2.0x1.2 mm 2.8 A

4.2 A +/-30% 30

mΩ Taiyo Yuden MDMK2020T R47M 4x0.47 µH 2.5x2.0x1.2 mm mΩ Taiyo Yuden MAMK2520T R47M 4x0.47 µH 2.0x1.6x1.0 mm mΩ Murata LQM2MPNR47MGH 4x 0.47 µH 4x4x1.2 mm 8.7 A 6.7 A +/-20% 14mΩ Coilcraft XFL4012- 471ME

10.3 Layout Guidelines

10.3.1 General Recommendations

Appropriate trace width and amount of vias should be used for all power supply paths. Too high trace resistances can prevent the system operating correctly, for example, efficiency and current ratings of switch mode converters and charger might be degraded. Furthermore the PCB might be exposed to thermal hot spots, which can lead to critical overheating due to the positive temperature coefficient of copper. Special care must be taken with the DA9210 pad connections. The traces of the outer row should be connected with the same width as the pads and should become wider as soon as possible. For supply pins in the second row, connection to an inner layer is recommended (depending on the maximum current two or more vias might be required).
A common ground plane should be used, which allows proper electrical and thermal performance. Noise sensitive references like VREF should be referred to a silent ground which is connected at a star point underneath or close to the DA9210 main ground connection.
Generally all power tracks with discontinuous and / or high currents should be kept as short as possible.
Noise sensitive analog signals like feedback lines should be kept away from traces carrying pulsed analog or digital signals. This can be achieved by separation (distance) or shielding of quiet signals by ground traces.

10.3.2 Switched Mode Supplies

The placement of the distributed capacitors at VSYS must ensure that all VDD inputs are connected to a bypass capacitor close to the pads. Using a local power plane underneath the chip for VSYS might be considered.
The area of switched mode converter transient current loops should be minimized.
Output capacitors of the LDOCORE should be placed close to DA9210.
Care must be taken that no current is carried on feedback lines of the buck output voltage VOUT_SENSE.
The inductor placement is less critical as parasitic inductances do not matter.

10.3.3 DA9210 Thermal Connection, Land Pad and Stencil Design

The DA9210 provides a center ground area of balls, which are soldered to the PCB’s center ground pad. This PCB ground pad must be connected with as many vias and as direct as possible to the PCB’s main ground plane in order to achieve good thermal performance.
Solder mask openings for the ball landing pads must be arranged to prohibit solder balls flowing into vias.

11.1 Package Outline Drawing (48 WLCSP)

Figure 48: Package Outline Drawing (48 WLCSP) The package uses Dialog’s innovative RouteEasyTM technology (Patent pending) implementing a high number of IOs on a small footprint package without the need for cost intensive PCB technology. All signals can be routed within two signal layers of a standard PCB (single trace between IC lands) and the inter layer connection uses drilled VIAs (no need for micro-VIA or VIA-in-land technology). Please contact your local Dialog Semiconductor support for more information about PCB Layout Guidelines

11.1.1 RouteEasyTM Technology Chart

BGA ball diameter: 0.27 (10 mm) BGA land size: 0.25 (10 mm) Via hole size (FHS):  0.2 - 0.25 (8 – 10 mm) Via pad size:  0.45 (18 mm) Anti-pad size:  0.65 (26 mm) Trace width: ≥ 0.1 – 0.125 (4 – 5 mm) Trace/Trace space: ≥ 0.1 – 0.125 (4 – 5 mm) Trace/Pad/Land space: ≥ 0.1 (4 mm) NOTE Dimensions are in millimeter. The PCB design complexity is compatible w ith 0.8 mm BGA pin pitch (similar to IPC 6012B Class 2). Bet ter thermal relief and improved high current return paths are achieved by using a reduced copper -to-hole distance for the inner layer reference planes (inner anti -pad s ize: 0.55 mm or 0.6 mm).

11.2 Package Outline Drawing (42 VF-BGA)

Figure 49: Package Outline Drawing (42 VF -BGA)

11.3 Soldering Information

Refer to the JEDEC standard J-STD-020 for relevant soldering information. This document can be downloaded from http://www.jedec.org.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 84 of 90 © 2016 Dialog Semiconductor The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability, please consult Dialog Semiconductor’s customer portal or your local sales representative. Table 55: Ordering Information Part number Package Size (mm) Shipment form Pack quantity Comments DA9210-xxUK2 48 WLCSP Tape and Reel 5000 DA9210-xxFN2-A 42 VFBGA Tape and Real 5000 Automotive AEC-Q100 Grade 3

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 85 of 90 © 2016 Dialog Semiconductor Appendix A Definitions A.1 Power Dissipation and Thermal Design When designing with the DA9210, consideration must be given to power dissipation as if the device exceeds the package power dissipation, the internal thermal sensor will shut down the device until. until it has cooled sufficiently. The package includes a thermal management paddle to enable improved heat spreading on the PCB. Linear regulators operating with a high current and high differential voltage between input and output will dissipate the following power: Pdiss = (Vin - Vout)*Iout Example – a regulator supplying 150 mA @ 2.8 V from a fully charged lithium battery (VDD = 4.1 V) Pdiss = (4.1 V - 2.8 V) * 0.15 A = 195 mW For switching regulators POUT = PIN * efficiency Therefore Pdiss = PIN – POUT Pdiss = Pout - Pout Efficiency Pdiss = Pout * Efficiency - 1 Pdiss = Iout * Vout * Efficiency - 1 Example – an 85 % efficient buck converter supplying 1.2V@ 400 mA Pdiss = 1.2V * 0.4A * - 11 0.85 = 85mW As the DA9210 is a multiple regulator configuration each supply must be considered and summed to give the total device dissipation (current drawn from the reference and control circuitry can be considered negligible in these calculations).

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 86 of 90 © 2016 Dialog Semiconductor A.2 Regulator Parameter - Dropout Voltage In the DA9210, a regulator’s dropout voltage is defined as the minimum voltage differential between the input and output voltages whilst regulation still takes place. Within the regulator, voltage control takes place across a PMOS pass transistor and when entering the dropout condition the transistor is fully turned on and therefore cannot provide any further voltage control. When the transistor is fully turned on the output voltage tracks the input voltage and regulation ceases. As the DA9210 is a CMOS device and uses a PMOS pass transistor, the dropout voltage is directly related to the ON resistance of the device. In the device, the pass transistors are sized to provide the optimum balance between required performance and silicon area. By employing a 0.25 µm process, Dialog are able to achieve very small pass transistor sizes for superior performance. VDROPOUT = VIN – VOUT = RDSON * IOUT When defining dropout voltage, it is specified in relation to a minimum acceptable change in output voltage. For example, all Dialog regulators have the dropout voltage defined as the point at which the output voltage drops 10 mV below the output voltage at the minimum guaranteed operating voltage. The worst case conditions for dropout are high temperature (highest ON resistance for internal device) and maximum load current. A.3 Regulator Parameter – Power Supply Rejection Power supply rejection (PSRR) is especially important in the supplies to the RF and audio parts of the telephone. In a TDMA system such as GSM, the 217 Hz transmit burst from the power amplifier results in significant current pulses being drawn from the battery. These can peak at up to 2 A before reaching a steady state of 1.4 A (see Figure 50). Due to the battery having a finite internal resistance (typically 0.5 Ω), these current peaks induce ripple on the battery voltage of up to 500 mV. As the supplies to the audio and RF are derived from this supply, it is essential that this ripple is removed, otherwise it would show as a 217 Hz tone in the audio and could also affect the transmit signal. Power supply rejection should always be specified under worst case conditions when the battery is at its minimum operating voltage, when there is minimum headroom available due to dropout. A.4 Regulator Parameter – Line Regulation Static line regulation is a measurement that indicates a change in the regulator output voltage Vreg (regulator operating with a constant load current) in response to a change in the input voltage Vin. Transient line regulation is a measurement of the peak change Vreg in regulated voltage seen when the line input voltage changes. 4.6ms TDMA frame rate Vreg static VinVreg transient 577µS Vbat Vreg Figure 50: Line Regulation

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 87 of 90 © 2016 Dialog Semiconductor A.5 Regulator Parameter – Load Regulation Static load regulation is a measurement that indicates a change in the regulator output voltage ∆Vreg in response to a change in the regulator loading ∆load whilst the regulator input voltage remains constant. Transient load regulation is a measurement of the peak change in regulated voltage ∆Vreg seen when the regulator load changes. Vreg static Vreg transient Vreg Iload max Iload min Figure 51: Load Regulation Please contact Dialog Semiconductor for latest application information on the DA9210 and other power management devices.

Revision History

1.0 Oct 2011 Initial release

1.1 to 1.x Mar 2015 Regular updates for development and specification alignment

2.0 Sep 2016 Updated and standardized to latest publishing guidelines

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 89 of 90 © 2016 Dialog Semiconductor Status Definitions Rev ision Datasheet Status Product Status Definition 1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characte rization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifica tions may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog -semiconductor.com. 4.<n> Obsolete Archived This datasheet contains the specifications for discontinued products . The information is provided for reference only. Disclaimer Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in th is document if provided by any information source outside of Dialog Semiconductor. Dialog Semiconductor reserves the right to change without notice the information published in this document, including withou t limitation the specification and the design of the related semiconductor products, software and applications. Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty that such applicatio ns, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the customer and Dialog Semiconductor exc ludes all liability in this respect. Customer notes that nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor. All use of Dialog Semiconductor products, software and applications referred to in this document are subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale , available on the company website (www.dialog -semiconductor.com) unless otherwise stated. Dialog and the Dialog logo are trademarks of Dialog Semiconductor pl c or its subsidiaries. All other product or service names are the property of their respective owners. © 2016 Dialog Semiconductor. All rights reserved.

DA9210 Multi-Phase 12 A DC-DC Buck Converter Datasheet Revision 2.0 09-Sep-2016 CFR0011 -120-00 90 of 90 © 2016 Dialog Semiconductor RoHS Compliance Dialog Semiconductor’s suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request. Contacting Dialog Semiconductor United Kingdom (Headquarters) Dialog Sem iconductor (UK) LTD Phone: +44 1793 757700 Germany Dialog Sem iconductor Gm bH Phone: +49 7021 805-0 The Netherlands Dialog Sem iconductor B.V. Phone: +31 73 640 8822 North America Dialog Sem iconductor Inc. Phone: +1 408 845 8500 Japan Dialog Sem iconductor K. K. Phone: +81 3 5425 4567 Taiwan Dialog Sem iconductor Taiwan Phone: +886 281 786 222 Singapore Dialog Sem iconductor Singapore Phone: +65 64 8499 29 Hong Kong Dialog Sem iconductor Hong Kong Phone: +852 3769 5200 Korea Dialog Sem iconductor Korea Phone: +82 2 3469 8200 China (Shenzhen) Dialog Sem iconductor China Phone: +86 755 2981 3669 China (Shanghai) Dialog Sem iconductor China Phone: +86 21 5424 9058

Selected Specification

Dialog Semiconductor DA9210-XXFN2-A overview.

Summary

Multi-Phase 12 A DC-DC Buck Converter

Description

Multi-Phase 12 A DC-DC Buck Converter

Source title DA9210-XXFN2-A Datasheet(PDF) - Dialog Semiconductor

Related Parts

More parts from the same family.

Browse manufacturer