Driver IC

DA7283

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Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation

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Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation Datasheet Revision 3.0 30-Jul-2019 CFR0011-120-00 1 of 22 © 2019 Dialog Semiconductor General Description DA7283 is a linear resonant actuator (LRA) haptic driver offering automatic closed-loop LRA resonant frequency tracking. The feature guarantees consistency across LRA production tolerances, operating temperature, aging, and mechanical coupling. DA7283 does not require any programming to drive LRA motors within its supported range and will automatically lock to the correct LRA resonant frequency without any actuator information being provided to the device. The differential output drive architecture and continuous actuator motion sensing enable efficient playback. Featuring three low-latency (0.75 ms) wake-up on general purpose input (GPI) sequence triggers, DA7283 automatically returns to a low quiescent current state (typically 0.68 µA) between playbacks. In OFF mode the device consumes only 5 nA, making it the appropriate choice for low power and long standby applications. Three different types of haptic feedback effects can be triggered via the GPIs. Time domain control of these GPIs allows complex haptic effects playback capability at two different drive levels without the need for another digital interface to the device. This feature makes DA7283 perfectly suited for products that require unconditional haptic feedback like security applications or industrial products and small software footprint solutions like wearables or home automation. Key Features ■ LRA drive capability ■ No device programming required ■ Three GPI pins for triggering clicks and complex patterns at two drive levels ■ Automatic LRA resonant frequency tracking ■ Ultra-low power consumption, IQ = 5 nA, when the device is disabled ■ Low latency (0.75 ms) GPI wake-up from low power consumption IDLE state, IQ = 0.68 µA ■ Differential PWM output drive ■ Edge rate control for EMI suppression ■ Current driven system to deliver constant actuator power ■ Automatic short circuit protection ■ Automatic over-temperature protection ■ Automatic under-voltage lockout protection ■ Automatic haptic playback timeout in case of host disappearance ■ Supply monitoring and automatic output limiting ■ Small solution footprint requiring only one decoupling capacitor in both WLCSP and QFN

Applications

■ Security sensitive applications ■ Smartphones, wearables, and hearables ■ Computer peripherals ■ Gaming ■ Automotive and industrial ■ Virtual and augmented reality controllers ■ Disposable consumer products ■ Toys ■ TV remote controllers References Battery Monitor Over- Temperature Protection VDDIO/EN GND GPI_0 GPI_1 GPI_2 DA7283 VDD OUTP OUTN LRA ERC Driver ERC Driver Short Circuit Protection BEMF Sensing and Actuator Diagnostics Resonant Frequency Tracking Automatic Drive Tuning UVLO Regulation Loop

Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation Datasheet Revision 3.0 30-Jul-2019 CFR0011-120-00 2 of 22 © 2019 Dialog Semiconductor System Diagrams VBAT Operation DA7283 OUTN OUTP GPI_0 GPI_1 GPI_2 LRA VDD VDDIO/EN VBAT DA7283 OUTN OUTP GPI_0 GPI_1 GPI_2 LRA VDD VBAT GND GND External Boost up to 5.5 V VBST External Boost Operation VDDIO/EN System VDDIO Host or Sensor Hub or NFC or Button Press Detect System VDDIO Host or Sensor Hub or NFC or Button Press Detect Figure 1: System Diagrams

1 Terms and Definitions

BEMF Back electromotive force CDM Charged device model EMI Electromagnetic interference ERC Edge rate control ESD Electrostatic discharge FET Field-effect transistor GND Ground GPI General purpose input Half-period One half of the LRA resonant frequency period. For example, if fLRA = 200 Hz, one half-period is 2.5 ms. HBM Human body model LRA Linear resonant actuator PCB Printed circuit board PID Proportional-Integral-Derivative PoR Power-on reset PWM Pulse width modulated QFN Quad flat no leads RC Resistor-capacitor WLCSP Wafer level chip scale package PMIC Power Management Integrated Circuit NFC Near Field Communication

2 Block Diagram

GPI_0 GPI_1 GPI_2 DA7283 VDD OUTP OUTN LRA ERC Driver ERC Driver Short Circuit Protection BEMF Sensing and Actuator Diagnostics Resonant Frequency Tracking Automatic Drive Tuning UVLO Regulation Loop Figure 2: DA7283 Block Diagram

3 Pinout

A B C D GPI_1 GPI_2 OUTN OUTP GPI_0 VDD VDDIO/EN GND_2 GND_1 Analog signalPower GroundDigital signal Top view GND_3 GND_4 GND_5 WLCSP 4 5 6 101112 VD D OUTP GND_1 GND_5 GND_4 GND_3 3 7 9GPI_2 GPI_1 GPI_0 GND_2 OUTN VD DIO/EN Pin 1 GroundAnalog signal Digital signalPower Top view QFN Figure 3: DA7283 Pinout Diagrams (Top View) for WLCSP and QFN Table 2: Pin Description Pin No. WLCSP Pin No. QFN Pin Name Type (Table 3) Description A1 12 GND_3 GND Ground A2 11 GND_4 GND Ground A3 10 GND_5 GND Ground B1 2 GPI_1 DI GPI sequence trigger 1 B2 1 GPI_2 DI GPI sequence trigger 2 B3 9 VDDIO/ EN PWR Digital IO supply / device enable function, active low. Connect to system VDDIO via push-pull GPIO or small-value resistor C1 3 GPI_0 DI GPI sequence trigger 0 C2 8 OUTN AO Haptic driver negative output C3 7 GND_2 GND Ground D1 4 VDD PWR Haptic power supply; decouple to GND_1 D2 5 OUTP AO Haptic driver positive output D3 6 GND_1 GND Ground Table 3: Pin Type Definition Pin Type Description Pin Type Description DI Digital input AO Analog output DO Digital output PWR Power DIO Digital input/output GND Ground

4 Characteristics

4.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Table 4: Absolute Maximum Ratings Parameter Description Conditions Min Max Unit VDD Haptic power supply (battery or regulated rail) Referenced to GND -0.3 6 V VDDIO_EN Digital IO supply (VDDIO) and device enable -0.3 6 V VOUTN Haptic driver negative output -0.3 6 V VOUTP Haptic driver positive output -0.3 6 V VGPI General purpose inputs -0.3 6 V TA Operating ambient temperature -40 85 °C TJ Operating junction temperature -40 125 °C TSTG Storage temperature -65 150 °C ESDHBM ESD protection Human Body Model (HBM) All non-exposed pins 4 kV ESDCDM ESD protection Charged Device Model (CDM) 1 kV

4.2 Recommended Operating Conditions

Unless otherwise noted, the parameters listed in Table 5 are valid for TA = 25 ºC, VDD = 3.8 V, and VDDIO_EN = 1.8 V. Table 5: Recommended Operating Conditions Parameter Description Min Typ Max Unit VDD Haptic power supply (battery or regulated rail) 2.8 3.8 5.5 V VDDIO_EN Digital IO supply (VDDIO) and device enable (Note 1) 1.35 1.8 5.5 V VGPI GPI pins (GPI_0, GPI_1, and GPI_2) voltage level (Note 2) 1.35 1.8 5.5 V CLD Capacitance to ground on OUTP and OUTN 1 nF ZLD Nominal LRA DC impedance 8 25 Ω LLD Nominal LRA inductance 25 100 1000 µH fLRA Nominal LRA resonant frequency 160 240 Hz VLRA LRA voltage rating 1.2 VRMS Note 1 The supply voltage level at the VDDIO/EN, GPI_0, GPI_1, and GPI_2 pins must be equal. Note 2 Ensure that (VDDIO_EN = VGPI) ≤ VDD Note: When selecting LRAs to be driven by DA7283, ensure that their characteristics are within the recommended range. If the target LRA characteristics are outside Table 5 specifications or if more sophisticated features are needed, use the I2C controlled DA7280, DA7281, or DA7282 devices.

4.3 Electrical Characteristics

Unless otherwise noted, the parameters listed in Table 6, Table 7, and Table 8 are valid for TA = 25 ºC, VDD = 3.8 V, and VDDIO_EN = 1.8 V. Table 6: Current Consumption Parameter Description Conditions Min Typ Max Unit IQ_OFF VDD current in OFF state VDDIO_EN = 0 V 5 nA IQ_IDLE VDD current in IDLE state System waiting for playback request 0.68 1 μA IQ_EN VDDIO/EN pin current VDDIO_EN = system VDDIO 0.13 μA IQ_NO_LD VDD current with no load High-impedance load >

10 MΩ, H-bridge

1.35 1.5 mA Table 7: Electrical Characteristics Parameter Description Conditions Min Typ Max Unit ISHRT Short circuit protection threshold Short to GND or VDD 400 500 600 mA IOUT_MAX Maximum drive current 230 mA fTRCK_LRA LRA frequency tracking range Automatic tracking limits 150 200 250 Hz fTRCK_ACC_LRA LRA frequency tracking accuracy Frequency tracking accuracy during playback 0.5 Hz fOUT_PWM PWM output frequency OUTP and OUTN switching frequency 183 187.5 192 kHz ERC Output switching pins edge rate control slope OUTP and OUTN slope 100 mV/ns RDS_ON H-bridge drain to source resistance when on High side plus low side FETs 2 Ω ZFLT_UZ Actuator under-impedance threshold 4 Ω ZFTL_OZ Over-impedance threshold 50 Ω ZOUT_OFF Output impedance when H- bridge not switching Pull-down to GND 15 kΩ VDD_POR_FALL VDD Power-on-Reset (PoR) falling threshold 2.4 2.55 2.7 V VIH GPI high level input logic voltage level Measured relative to VDDIO_EN 0.7 * VDDIO_ EN V VIL GPI low level input logic voltage level Measured relative to VDDIO_EN 0.3 * VDDIO _EN V

4.4 Timing Characteristics

Table 8: Timing Characteristics Parameter Description Conditions Min Typ Max Unit tON Cold boot to IDLE state time VDD present; VDDIO_EN = VDDIO 1.5 ms tOUT_IDLE Time to output from IDLE state From GPI or I2C trigger to output drive 0.75 ms

4.5 Thermal Characteristics

Table 9: WLCSP Thermal Ratings Parameter Description (Note 1) Min Typ Max Unit RƟJA Junction-to-ambient thermal resistance 90.3 °C/W RƟJC_TOP Junction-to-case (top) thermal resistance 43.6 °C/W RƟJB Junction-to-board thermal resistance 49.0 °C/W JT Junction-to-top characterization parameter 6.4 °C/W JB Junction-to-board characterization parameter 45.8 °C/W Note 1 Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value. Table 10: QFN Thermal Ratings Parameter Description (Note 1) Min Typ Max Unit RƟJA Junction-to-ambient thermal resistance 88.2 °C/W RƟJC_TOP Junction-to-case (top) thermal resistance 54.6 °C/W RƟJB Junction-to-board thermal resistance 39.3 °C/W JT Junction-to-top characterization parameter 3.4 °C/W JB Junction-to-board characterization parameter 50.0 °C/W RƟJC_BOTTOM Junction-to-case (bottom) thermal resistance 4.4 °C/W Note 1 Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.

5 Functional Description

DA7283 is a haptic driver designed to drive linear resonant actuators (LRAs). The power-optimized architecture and advanced closed-loop digital algorithms achieve a high-fidelity haptic drive. It features three GPI inputs which allow haptic playback of short clicks and complex waveforms at two different levels of drive signal. DA7283 does not require another control interface or device programming to support a specific actuator. The device controls the level of drive across the load and senses the movement of the actuator. The driven waveform is generated by a current regulated loop using a high-frequency PWM modulation. The differential output drive features a switching regulator architecture with H-bridge differential drive across the load at a frequency of 187.5 kHz. DA7283 implements continuous resonant frequency tracking while driving an LRA to track the mechanical resonance of the actuator through closed-loop control. This maximizes electrical to mechanical energy conversion efficiency and is especially useful in applications such as operating system notifications and alarms.

5.1 Features Description

DA7283 drives LRA actuators with parameters within the specified limits in Table 5. No Need to Program the Device DA7283 does not require any programming of actuator datasheet characteristics. The device playback is controlled by GPI inputs only and does not need an SPI or I2C interface. DA7283 haptic playback can be triggered directly by the interrupt output of an NFC device, a touchscreen controller, capacitive touch sensors, or a PMIC. More complex sequencing is also possible based on GPI trigger timing, see Section 5.2.2. Automatic LRA Resonant Frequency Tracking LRA resonant frequency shifts over time due to changing operating conditions, such as temperature or position, and manufacturing spread. LRAs are high-Q systems; if driven at a fixed frequency, the consequences are loss of electrical to mechanical energy conversion efficiency, weaker than nominal actuator acceleration output, and significant part-to-part variation in the end-product haptic feel. Figure 4 illustrates that if the drive frequency is fixed, for example at 200 Hz, variation in the resonant peak of only 10 Hz can result in a loss of 50 % of the output acceleration. Frequency [Hz] Acceleration Output [g] 0.5 200 210190 Typical Resonant Peak Variation (part-to-part, across temperature, drive signal level, and manufacturing lots) Resonant Peak with Max Accel. 250150 Figure 4: LRA Output Acceleration Swept in Frequency with Constant Power Input Signal For a consistent user experience, DA7283 automatically locks onto and tracks the resonant frequency of the LRA through active back electromotive force (BEMF) sensing and closed-loop digital control. This ensures optimal output acceleration on every individual LRA throughout its lifetime and consistent part-to-part haptic feedback in the final product.

Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation Datasheet Revision 3.0 30-Jul-2019 CFR0011-120-00 11 of 22 © 2019 Dialog Semiconductor Ultra-Low Power Consumption when Disabled In the OFF state when VDDIO_EN = 0 V, DA7283 has an ultra-low current consumption from the VDD power supply, at typically 5 nA. This is the lowest power state of the device. In the OFF state the Low Latency GPI Wake-Up from Low Power Consumption IDLE State The device has low latency (0.75 ms) wake-up from IDLE state, which takes typically 0.68 µA of current from VDD. Wake-up is triggered by GPI activity requesting playback and DA7283 returns automatically to IDLE state after completing the requested playback. The device retains its setup in all states (including IDLE) apart from the OFF state, see Section 5.2.1. Three GPI Sequence Triggers DA7283 supports up to three GPI inputs which can be used to trigger low-latency playback of three specific effects from IDLE state. Triggering is activated on events caused by falling edges. The user can choose to create more complex effects by modulating the GPI triggering, see Section 5.2.2. Differential PWM Output Drive DA7283 includes a full H-bridge differential output PWM drive that has the advantage of maximizing the power delivered to the LRA from a given supply. This doubles the voltage swing across the actuator and significantly increases system efficiency relative to a single transistor/LDO solution in legacy LRA applications. Current Driven System The device outputs regulated current, rather than voltage, which allows BEMF tracking without the need to stop driving to sense the BEMF. This maximizes power delivery to the actuator per unit time when compared to voltage driven solutions, resulting in shorter and sharper haptic clicks. In addition, constant current drive provides constant force into the actuator independently of BEMF amplitude. Rate Control for EMI suppression Switching node edge rate control (ERC) on the OUTP and OUTN pins reduces e lectromagnetic interference (EMI) and electrical interference via capacitive coupling in the end application. This eliminates any need for resistor-capacitor (RC) or ferrite bead filtering of the outputs, resulting in simpler system design and a lower-cost bill of materials. Automatic Short Circuit Protection Automatic low-latency short circuit protection detects shorts on the OUTP and OUTN pins to supply, ground, or between OUTP and OUTN, and protects DA7283 by forcing the H-bridge into a high- impedance state. Once the short circuit protection is triggered, playback is stopped. The device will then attempt to drive only at the next GPI request for playback. Automatic Over-Temperature Protection Automatic over-temperature protection detects when the device temperature exceeds 125 °C and protects DA7283 by stopping playback. The device will then attempt to drive only at the next GPI request for playback. Automatic Under-Voltage Lockout Protection Automatic under-voltage lockout protection (UVLO) detects when VDD drops below 2.8 V and protects DA7283 by stopping playback. The device will then attempt to drive only at the next GPI request for playback.

Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation Datasheet Revision 3.0 30-Jul-2019 CFR0011-120-00 12 of 22 © 2019 Dialog Semiconductor Automatic Haptic Playback Timeout The longest sequences provided by the device are 60 seconds long via GPI_1 and GPI_2. If the host crashes after starting a pattern and does not send a negative edge to stop it, DA7283 will stop playback after 60 seconds and return to an IDLE state. This guarantees that the haptic device will not completely discharge the battery in case of a software crash. Supply Monitoring and Automatic Output Limiting DA7283 monitors the power supply voltage level and adjusts the drive voltage accordingly, so that the output does not clip to the supply voltage. This feature guarantees controlled output allowing continued resonant frequency tracking functionality even when the device is operating under low power supply conditions or heavy battery load, see Section 5.3.2. Small Solution Footprint Available in an ultra-small 1.35 mm x 1.75 mm, 0.4 mm pitch, 0.545 mm height, 3 x 4 WLCSP, or a 3.0 mm x 3.0 mm, 0.65 mm pitch, 0.78 mm height, 12 lead QFN package, DA7283 minimizes the required PCB size and overall solution cost. In the typical application case, only a single 100 nF decoupling capacitor is required. See Section 8 and Section 9.

5.2 Functional Modes

5.2.1 System States

The device states and the transitions into and out of each state are shown in Figure 5. When a power supply is applied on the VDD pin and VDDIO/EN pin is set high, DA7283 loads its initial boot settings. Once BOOT is complete, DA7283 remains in the IDLE state, ensuring low power consumption and low start-up latency, and awaits GPI triggering. DA7283 enters the DRIVE state and starts playback when one of the three GPI pins receives a falling edge from the host controlling the device, see Section 5.2.2. On playback completion, caused either by a GPI triggered sequence reaching its end or a second negative edge on any of the GPIs, DA7283 leaves the DRIVE state and returns to IDLE. If a fault condition arises during playback, DA7283 cancels the ongoing playback and returns to the IDLE state. Possible fault conditions include an UVLO event, an over-temperature event, a short circuit protection event, and an actuator over- or under-impedance event. IDLE (IQ = 0.68 µA) BOOT Boot complete in 1.5 ms OFF (IQ = 5 nA) DRIVE Start driving 0.75 ms after GPI trigger VDD V VDDIOEN V Stop driving after timeout or GPI trigger DA7283 returns to the IDLE state in a fault condition Return to OFF at any time if: VDDIOEN = 0 V or VDD < 2.6 V Figure 5: System State Diagram Note: An optional one-time device configuration can be performed after the initial BOOT sequence by going once through the DRIVE state via GPI_2, see Section 5.3.1.

5.2.2 Playback via Edge Triggering

DA7283 playback is triggered by a negative edge provided to any of the three device GPIs. Their configuration is summarized in Table 11. When a sequence finishes, the device automatically goes to the low power IDLE state and honors any subsequent playback requests, see Figure 6. Table 11: GPI Drive Level Behavior GPI Drive Level Duration Sequence Description GPI_0 1.8 VRMS 25 ms drive, 10 ms brake, 20 ms silence Click effect GPI_1 1.8 VRMS 60 seconds drive Maximum strength, buzz effect GPI_2 1 VRMS 60 seconds drive Medium strength, buzz effect The majority of LRAs are rated at 1.2 VRMS or in the range of 1.8 VRMS to 2.5 VRMS. Table 12 shows the recommended triggers for the two ranges. If more sophisticated features are needed, use the I2C controlled DA7280, DA7281, and DA7282 devices. Table 12: GPI Trigger Ranges LRA Rating (VRMS) GPI Triggers to Use Comments

1.2 GPI_2 only

GPI_0 and GPI_2 drive above the 1.2 VRMS rating. They may be used only for short time periods at the system designer discretion. 1.8 to 2.5 GPI_0, GPI_1, GPI_2 Any GPI trigger may be used GPI_0 Signal Across LRA GPI_0 Triggered Playback 0.75 ms 25 ms 10 ms

1.8 VRMS

Minimum pulse length 25 µs GPI_1 Signal Across LRA GPI_1 Triggered Playback 0.75 ms 60 s Minimum pulse length 25 µs Drive BrakeStartup GPI_2 Signal Across LRA GPI_2 Triggered Playback 0.75 ms 60 s Minimum pulse length 25 µs

1 VRMS

Figure 6: Simple GPI Behavior

5.3 Advanced Operation

5.3.1 Device Configuration

Optional one-time configuration is recommended on enabling the device. It is done by creating one 250 ms long sequence, see Figure 10. This allows DA7283 to automatically lock to the LRA resonant frequency, adjust its drive level for the actuator impedance, and use this information in subsequent playbacks. If the VDDIO/EN pin is set low, information from this configuration sequence is lost. The initial configuration can be skipped; however, haptic playback consistency may be reduced during the first playback after enabling the device. GPI_2 Signal Across LRA ... 250 ms Figure 10: Optional Calibration Sequence

5.3.2 Supply Monitoring and Automatic Output Limiting

DA7283 monitors the level of the supply during playback and uses this information to prevent the device from clipping to supply by limiting the drive to a value 1.12 V below the supply, see Figure 11. This functionality allows the frequency tracking loop to work across all supply conditions and provides limiting of the power across the LRA for low supply values to prevent a battery brownout. Output drive clipping to V DD – V, not the drive level Time [s] Voltage [V] VDD Drive Level VDD – V 1.12 V Figure 11: Automatic Output Limiting

5.3.3 VDDIO/EN Pin Control

The VDDIO/EN pin controls the entry and exit of the device from the OFF state. When V DDIO_EN = 0 V, DA7283 is OFF and consumes typ. 5 nA of current from the VDD pin. Setting V DDIO_EN ≥ 1.35 V enables the device and after the initial boot sequence it reaches the IDLE state with typ. 680 nA of current consumption. Note that the device will have been hardware reset when it comes out of the OFF mode. For lowest OFF mode current consumption control the enable function via a host-side GPIO push- pull that connects the VDDIO/EN pin either to GND or to the system VDDIO supply. If the VDDIO/EN pin is only needed as a device hardware reset, where it will only be pulled low for a short time (therefore IDLE state power consumption is not an issue), a possible system solution is to use an open-drain output with a pull-up resistor to the system VDDIO supply. In this configuration, it is recommended to use a pull-up resistor smaller than 10 kΩ.

6 Package Information

6.1 WLCSP Package Outline

Figure 12: WLCSP Package Outline Drawing

6.2 QFN Package Outline

Figure 13: QFN Package Outline Drawing

6.3 Moisture Sensitivity Level

The Moisture Sensitivity Level (MSL) is an indicator for the maximum allowable time period (floor lifetime) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a specified maximum temperature and a maximum relative humidity before the solder reflow process. The MSL classification is defined in Table 13. For detailed information on MSL levels refer to the IPC/JEDEC standard J -STD-020, which can be downloaded from http://www.jedec.org. The WLCSP package is qualified for MSL 1. The QFN package is qualified for MSL 3. Table 13: MSL Classification MSL Level Floor Lifetime Conditions MSL 4 72 hours 30 °C / 60 % RH MSL 3 168 hours 30 °C / 60 % RH MSL 2A 4 weeks 30 °C / 60 % RH MSL 2 1 year 30 °C / 60 % RH MSL 1 Unlimited 30 °C / 85 % RH

6.4 WLCSP Handling

Manual handling of WLCSP packages should be reduced to the absolute minimum. In cases where it is still necessary, a vacuum pick-up tool should be used. In extreme cases plastic tweezers could be used, but metal tweezers are not acceptable, since contact may easily damage the silicon chip. Removal of a WLCSP package will cause damage to the solder balls. Therefore, a removed sample cannot be reused. WLCSP packages are sensitive to visible and infrared light. Precautions should be taken to properly shield the chip in the final product.

6.5 Soldering Information

Refer to the IPC/JEDEC standard J-STD-020 for relevant soldering information. This document can be downloaded from http://www.jedec.org.

7 Ordering Information

The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability, please consult Dialog Semiconductor’s customer support portal or your local sales representative. Table 14: Ordering Information Part Number Package Size (mm) Shipment Form Pack Quantity DA7283-01V42 WLCSP 1.35 x 1.75 Tape and reel 4500 DA7283-01V4C WLCSP 1.35 x 1.75 Tape and reel 250 DA7283-01FV2 QFN 3.0 x 3.0 Tape and reel 6000 DA7283-01FVC QFN 3.0 x 3.0 Tape and reel 250

8 Application Information

GPI_0 GPI_1 GPI_2 VDDIO/EN GND_2 VDD GND_1 VDD LRA OUTN OUTP 100 nF GND_3 GND_4 GND_5 Figure 14: External Components Diagram Note: Drive the GPI pins and the VDDIO/EN pin from the same voltage level. Note: Ground any unused GPI pins. Note: Due to ultra-low power considerations, GPI pins are true high impedance inputs and have no internal pulldown resistors. It is recommended to drive GPI pins either via a push-pull or open drain GPIO on the host side. In either case, the duration of the triggering pulse must be longer than 25 µs. When using an open drain GPIO to trigger a haptic effect, the pullup resistor must be selected to satisfy the 25 µs condition while considering PCB parasitic capacitance. A 10 kΩ resistor would satisfy most use cases. Note: Capacitor C1 should be placed as close as possible to, and between, VDD and GND_1 pins. It removes high-frequency noise only; ensure additional decoupling (typ. 10 µF) is included elsewhere in the system.

9 Layout Guidelines

For optimal layout, place the 100 nF capacitor C1 as close to the VDD and the GND_1 pins as possible. It is also advisable to use solid a ground plane under the device. The QFN can be routed out on a single layer. It is recommended to connect GND_1 and GND_2 to a local ground plane on the top layer with a low-impedance via connection to the main ground plane, see Figure 16. VIAVIA VIAVIA VIA TO VDD LAYER VIA TO GND LAYER SOLID GND CONNECTION ON TOP LAYER 100 nF Capacitor 0201 (0603) GPI_1 GPI_2 VDDIO/ EN GPI_0 OUTN GND_2 VDD OUTP GND_1 GND_3 GND_4 GND_5 Figure 15: WLCSP Example PCB Layout VIAVIA VIAS TO GND LAYER SOLID GND CONNECTION ON TOP LAYER 100 nF Capacitor 0603 (1608) VIAVIA nIRQ SCL SDA VDDIO/EN OUTN GND_1 GND_2 OUTPVDD GPI_2 GPI_1 GPI_0 GND_3 GND_5 GND_4 Figure 16: QFN Example PCB Layout

Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation Datasheet Revision 3.0 30-Jul-2019 CFR0011-120-00 22 of 22 © 2019 Dialog Semiconductor Status Definitions Revision Datasheet Status Product Status Definition 1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog-semiconductor.com. 4.<n> Obsolete Archived This datasheet contains the specifications for discontinued products. The information is provided for reference only. Disclaimer Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this docum ent are not designed, authorized or warranted to be suitable for use in life support, life -critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or us e is at the customer’s own risk. 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Selected Specification

Dialog Semiconductor DA7283 overview.

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Summary

Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation

Description

Ultra-Low Power LRA Haptic Driver with Multiple Input Triggers and Software-Free Operation

Source title DA7283 Datasheet(PDF) - Dialog Semiconductor

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