DA16200-00000A32

Dialog Semiconductor

Ultra Low Power Wi-Fi SoC

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DA16200 DIALOG

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 94

Technical content

Datasheet sections

1 Terms and Definitions
2 References
3 Block Diagram
4 Pinout
4.3 Pin Multiplexing
5 Electrical Specification
5.1 Absolute Maximum Ratings
5.2 Recommended Operating Conditions
5.3 Electrical Characteristics
5.3.1 DC Parameters for Normal GPIOs
5.3.2 DC Parameters for RTC Block
5.3.3 DC Parameters for Digital Wake-Up
5.4 Radio Characteristics
5.4.1 WLAN Receiver Characteristics
5.4.2 WLAN Transmitter Characteristics
5.5 Current Consumption
5.6 ESD Ratings
5.7 Brown-Out and Black-Out
5.8 Clock Electrical Characteristics
5.8.1 RTC Clock Source
5.8.2 Main Clock Source
6 Power Management
6.1 Power On Sequence
6.2 Power Management Unit
6.3 Low Power Operation Mode
6.3.1 Sleep Mode
6.3.2 Sleep Mode
6.3.3 Sleep Mode
7 Core System
7.1 Arm Cortex-M4F Processor
7.2 Wi-Fi Processor
7.3 Memory
7.3.1 Internal Memory
7.4 RTC

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 1 of 94 © 2021 Dialog Semiconductor General Description The DA16200 is a highly integrated ultra-low power Wi-Fi system on a chip (SoC), which contains an 802.11b/g/n radio (PHY), a baseband processor, a media access controller (MAC), on-chip memory, and a host networking application processor, all on a single silicon die. The SoC enables full offload capabilities, running the entire networking stack on chip so that no external network processor, CPU, or microcontroller is required, while many other SoCs optionally use a microcontroller. DA16200 is a synthesis of breakthrough ultra-low power technologies that enables extremely low power operation in the SoC. DA16200 shuts down every micro element of the chip that is not in use, which allows a near zero level of power consumption when not actively transmitting or receiving data. Such low power operation can extend the battery life as long as a year or more depending on the application. DA16200 also enables ultra-low power transmitting and receiving modes when the SoC needs to be awake to exchange information with other devices. Advanced algorithms enable staying asleep until the exact moment required to wake up to transmit or receive. The SoC is built from the ground up for the Internet of Things (IoT) and is ideal for door locks, thermostats, sensors, pet trackers, asset trackers, sprinkler systems, connected lighting, video cameras, video doorbells, wearables, and other IoT devices. Key Features ■ Highly integrated ultra-low power Wi-Fi® system on chip ■ Full offload: SoC runs full networking OS and TCP/IP stack ■ Wi-Fi processor □ IEEE 802.11b/g/n, 1×1, 20 MHz channel bandwidth, 2.4 GHz □ IEEE 802.11s Wi-Fi mesh □ On-chip PA, LNA, and RF switch □ Wi-Fi security: WPA/WPA2- Enterprise/Personal, WPA2 SI, WPA3 SAE, and OWE □ Vendor EAP types: EAP- TTLS/MSCHAPv2, PEAPv0/EAP- MSCHAPv2, PEAPv1, EAP-FAST, and EAP-TLS □ Operating modes: Station, SoftAP, and Wi-Fi Direct® Modes (GO, GC, GO fixed) □ WPS-PIN/PBC for easy Wi-Fi provisioning □ Connection manager for autonomous and fast Wi-Fi connections □ Bluetooth coexistence □ Antenna switching diversity ■ Built-in 4-channel auxiliary ADC for sensor interfaces □ 12-bit SAR ADC: single-ended four channels ■ Direct code execution from the external serial flash memory (XIP) □ Provides dynamic auto switching function ■ Supports various interfaces □ eMMC/SD expanded memory □ SDIO Host/Slave function □ QSPI for external flash control □ Three UARTs □ SPI Master/Slave interface □ I2C Master/Slave interface □ I2S for digital audio streaming □ 4-channel PWM □ Individually programmable, multiplexed GPIO pins □ JTAG and SWD ■ Wi-Fi Alliance certifications: □ Wi-Fi CERTIFIED™ b, g, n □ WPA™ - Enterprise, Personal □ WPA2™ - Enterprise, Personal □ WPA3™ - Enterprise, Personal □ Wi-Fi Direct □ Wi-Fi Enhanced Open™ □ WMM □ WMM - Power Save □ Wi-Fi Protected Setup™ ■ CPU core subsystem □ Arm® Cortex®-M4F core w/ clock frequency of 30~160 MHz □ ROM: 256 kB

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 2 of 94 © 2021 Dialog Semiconductor ■ Hardware accelerators □ General HW CRC engine □ HW zeroing function for fast booting □ Pseudo random number generator (PRNG) ■ Complete software stack □ Comprehensive networking software stack □ Provides TCP/IP stack: in the form of network socket APIs ■ Advanced security □ Secure booting □ Secure debugging using JTAG/SWD and UART ports □ Secure asset storage ■ Built-in hardware crypto engines for advanced security □ TLS/DTLS security protocol functions □ Crypto engine for key deliberate generic security functions: AES (128,192,256), DES/3DES, SHA1/224/256, RSA, DH, ECC, CHACHA, and TRNG □ SRAM: 512 kB □ OTP: 8 kB □ Retention Memory: 48 kB ■ Power management unit □ On-Chip RTC □ Wake-up control of fast booting or full booting with minimal initialization time □ Integrated DC-DC and LDOs □ Supports three ultra-low power Sleep modes ■ Clock source □ 40 MHz crystal (± 20 ppm) for master clock (initial + temp + aging) □ 32.768 kHz crystal (± 250 ppm) for RTC clock □ Integrated 32 kHz RC oscillator ■ Supply □ Single operating voltage: 2.1 V to 3.6 V (typical: 3.3 V) □ Digital I/O Supply Voltage: 1.8 V / 3.3 V □ Black-out and brown-out detector ■ Package type □ 6 mm × 6 mm, 0.4 mm pitch, 48-Pin, QFN □ 3.8 mm × 3.8 mm, 0.4 mm pitch, 72-Pin, fcCSP ■ Operating temperature range □ -40 °C to 85 °C

Applications

■ Security systems ■ Door locks ■ Thermostats ■ Garage door openers ■ Blinds ■ Lighting control ■ Sprinkler systems ■ Video camera security systems ■ Smart appliances ■ Video doorbell ■ Asset tracker

1 Terms and Definitions

CRC Cyclic Redundancy Check DMA Direct Memory Access DAC Digital-to-Analog Converter GPIO General Purpose Input/Output HW Hardware I2C Inter-Integrated Circuit I2S Inter-IC Sound IoT Internet of Things JTAG Joint Test Action Group LDO Low-Dropout Regulator LLI Linked-List Item NVIC Nested Vectored Interrupt Controller NVRAM Non-Volatile RAM PLL Phase-Locked Loop PRNG Pseudo Random Number Generator PWM Pulse Width Modulation QSPI Quad-Lane SPI RTC Real-Time Clock SAR ADC Successive Approximation Analog-to-Digital Converter SPI Serial Peripheral Interface SW Software SWD Serial Wire Debug UART Universal Asynchronous Receivers and Transmitter XIP eXecute in Place TAP Test Access Port

2 References

[1] ARM Cortex M4 Processor Technical Reference Manual [2] DA16200_Example_Application_Guide.pdf [3] ITU-T O.150, General Requirements for Instrumentation for Performance Measurements on Digital Transmission Equipment, 1996 [4] Arm TrustZone® CryptoCell-312, Software Integrators Manual, Revision r1p1. [5] IEEE Standard 1149.1, Test Access Port and Boundary-Scan Architecture [6] DA16200_SDK_Programmer_Guide.pdf [7] AMBA AHB bus specification, Revision 3.0 https://developer.arm.com/documentation/ihi0033/bb

3 Block Diagram

Figure 2 shows the DA16200 hardware (HW) block diagram. Figure 2: Hardware Block Diagram Figure 3 shows the DA16200 software (SW) block diagram. Figure 3: Software Block Diagram User Application Home Appliance/Sensor Network/Door Lock/Light, IoT.

80211 Link Layer

DHCP/ DNS/ HTTP1.0 / HTTP1.1 TLS / DTLS NetX-APP TCP/UDP IP NetX-Duo Application Service

802.11 Upper MAC

802.11 Lower MAC

mDNS / xmDNS / DNS-SD / CoAP / Jason Afafa U upper Level CLI Handler Wi-Fi Supplicant

Kernel layer ○ Real Time Operating System
The Wi-Fi layer is divided into four layers: ○ Lower MAC – SW module to control/handle HW Wi-Fi MAC/PHY and interfaces with Upper MAC layer ○ Upper MAC – SW module to control/handle Wi-Fi control/handle to interface with supplicant – Wi-Fi Link layer: Interface layer between Upper MAC and supplicant – Supplicant: SW module to control/management to operate Wi-Fi operation ○ Network subsystem layer – Used to control/handle network operation – Main protocols are IP, TCP, and UDP – Other necessary protocols are supported ○ Security layer – Crypto operation engine is ported to use crypto HW engine
TLS/TCP and DTLS/UDP APIs are supported to handle security operation: ○ User application layer – Variable sample codes are supported in SDK – sample codes use supported APIs – TCP Client/Server, UDP Client/Server, TLS Client/Server – HTTP/HTTPs download, OTA Update usage, and MQTT usage Customer applications can be included and implemented easily in the SDK.

4 Pinout

4.1 48-Pin QFN Figure 4: DA16200 QFN48 Pinout Diagram (Top View)

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 14 of 94 © 2021 Dialog Semiconductor 4.2 72-Pin fcCSP VDD_DA /PA GND A11 ANT GND GND VDD_DA /PA B10 GND B12 GND RTC_XI RTC_XO GND GND C11 GND VDD_DI RTC_WA KE_UP GND D10 GND GPIOA5 GND RTC_GP O GND E11 RBIAS GPIOA6 GPIOA7 GND GND F10 GND F12 GND GPIOA4 GPIOA10 GND GND GND G11 RF_XI GPIOA8 GPIOA11 RTC_WA KE_UP2 GND H10 GND H12 RF_XO GND GPIOA9 F_CSN F_IO2 TCLK J11 TMS GND DCDC_FB F_IO3 F_IO0 F_CLK GND GND F_IO1 UART_T XD L11 GPIOC6 DCDC_LX GND DIO2 M10 UART_R XD M12 GND VDD_FDI O VBAT VDD_DI G K12 GPIOC7 K10 GPIOC8 D12 VDD_AN A RTC_PWR_ KEY GPIOA1 GPIOA3 GPIOA2 GPIOA0 Figure 5: DA16200 fcCSP72 Pinout Diagram (Top View)

Description

1 GND GND Ground

2 D12 VDD_ANA VDD RF VDD

3 E11 RBIAS AIO External reference resistor pin

4 G11 RF_XI AI 40 MHz crystal clock input

5 H12 RF_XO AO 40 MHz crystal clock output

6 J11 TMS DIO 2/4/8/12 I-PU JTAG I/F, SWDIO

7 J9 TCLK DIO 2/4/8/12 I-PD JTAG I/F, SWCLK, General Purpose

8 K10 GPIOC8 DIO 2/4/8/12 I-PD General Purpose I/O

9 K12 GPIOC7 DIO 2/4/8/12 I-PD General Purpose I/O

10 L11 GPIOC6 DIO 2/4/8/12 I-PD General Purpose I/O

11 L9 UART_TXD DO 2/4/8/12 O UART transmit data

12 M10 UART_RXD DI 2/4/8/12 I UART receive data

13 M8 VDD_DIO2 VDD Supply power for digital I/O

GPIOC6~GPIOC8, TMS/TCLK, TXD/RXD

14 K8 F_IO0 DIO External Flash Memory I/F

15 L7 F_IO1 DIO External Flash Memory I/F

16 J7 F_IO2 DIO External Flash Memory I/F

17 K6 F_IO3 DIO External Flash Memory I/F

18 J5 F_CSN DIO External Flash Memory I/F

19 K4 F_CLK DIO External Flash Memory I/F

20 M4 VDD_FDIO VDD Flash IO Power

21 FDIO_LDO_

AIO Flash and IO LDO output and connect to external cap. For flash LDO

22 L3 VDD_DIG VDD Digital power and connect to external

cap. For DIG LDO

23 H6 RTC_WAKE

_UP2 DI RTC block wake-up signal

24 M2 VBAT VDD Supply power for internal DC-DC,

DIO_LDO, and analog IP

25 L1 DCDC_LX AIO Connection from power MOSFETs to

the Inductor in internal DCDC

26 J1 DCDC_FB AIO Feedback voltage from the output of

the power supply in internal DCDC

27 G1 GPIOA11 DIO 2/4/8/12 I-PD General Purpose I/O

28 F2 GPIOA10 DIO 2/4/8/12 I-PD General Purpose I/O

29 H2 GPIOA9 DIO 2/4/8/12 I-PD General Purpose I/O

30 G3 GPIOA8 DIO 2/4/8/12 I-PD General Purpose I/O

31 E1 GPIOA7 DIO 2/4/8/12 I-PD General Purpose I/O

32 E3 GPIOA6 DIO 2/4/8/12 I-PD General Purpose I/O

33 D2 GPIOA5 DIO 2/4/8/12 I-PD General Purpose I/O

34 F4 GPIOA4 DIO 2/4/8/12 I-PD General Purpose I/O

35 C1 VDD_DIO1 VDD Supply power for digital I/O

GPIOA0~GPIOA11 36 D4 GPIOA3 AI/DIO 2/4/8/12 I-PD Aux.ADC input/General Purpose I/O 37 B2 GPIOA2 AI/DIO 2/4/8/12 I-PD Aux.ADC input/General Purpose I/O 38 C3 GPIOA1 AI/DIO 2/4/8/12 I-PD Aux.ADC input/General Purpose I/O 39 A3 GPIOA0 AI/DIO 2/4/8/12 I-PD Aux.ADC input/General Purpose I/O 40 C5 RTC_XO AO 32.768 kHz crystal clock output 41 B4 RTC_XI AI 32.768 kHz crystal clock input

42 A5 RTC_PWR_

DI RTC block enable signal

43 D6 RTC_WAKE

_UP DI RTC block wake-up signal

44 E7 RTC_GPO DO General Purpose Output

45 A7,

VDD_DA VDD Tx DA power and RTC block power

46 VDD_PA VDD Supply power for integrated power

47 GND GND Ground

48 A11 ANT AI ANT

fcCSP GND Pin A1, A9, B6, B10, B12, C7, C9, C11, D8, D10, E5, E9, F6, F8, F10, F12, G5, G7, G9, H4, H8, H10, J3, K2, L5, M6, M12 Note 1 Status of RTC_PWR_KEY is asserted and digital power (VDD_DIG) is stable. Table 2: Pin Type Definition Pin Type Description Pin Type Description DI Digital input AI Analog input DO Digital output AO Analog output DIO Digital input/output AIO Analog input/output DIOD Digital input/output open drain BP Back drive protection PU Pull-up resistor (fixed) SPU Switchable pull-up resistor PD Pull-down resistor (fixed) SPD Switchable pull-down resistor PWR Power GND Ground

4.3 Pin Multiplexing

Table 3. Pin control can be realized through register setting. This device can use a maximum of 16

5 Electrical Specification

5.1 Absolute Maximum Ratings

Table 4: Absolute Maximum Ratings Parameter QFN Pins fcCSP Pins Min Max Units VBAT, VDD_DA, VDD_PA 24, 45, 46 M2, A7,B8 VSS 3.9 V VDD_DIO1 35 C1 VSS 3.9 V VDD_DIO2 13 M8 VSS 3.9 V VDD_FDIO 20 M4 VSS 3.9 V FDIO_LDO_OUT 21 - VSS 3.9 V VDD_DIG 22 L3 VSS 1.32 V VDD_ANA 2 D12 VSS 1.65 V Operating temperature range (TA) -40 +85 °C

5.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions Parameter QFN Pins fcCSP Pins Min Typ Max Units VBAT, VDD_DA, VDD_PA 24, 45, 46 M2, A7, B8 (Note 1) 2.1 3.6 V VDD_DA, VDD_PA - A7, B8 (Note 2) 1.45 V VDD_DIO1 35 C1 1.62 3.6 V VDD_DIO2 13 M8 1.62 3.6 V VDD_FDIO 20 M4 1.62 3.6 V FDIO_LDO_OUT 21 - 1.62 1.92 V VDD_DIG 22 L3 1.1 V VDD_ANA 2 D12 1.37 (Note 2) V Operating temperature range (TA) -40 +85 °C Note 1 QFN, fcCSP Normal power mode. Note 2 fcCSP Low power mode.

5.3 Electrical Characteristics

5.3.1 DC Parameters for Normal GPIOs

Table 6: DC Parameters for Normal GPIOs, 1.8 V IO Parameter Symbol Condition Min Typ Max Units Input Low Voltage VIL Guaranteed logic Low level VSS 0.3 × DVDD V Input High Voltage VIH Guaranteed logic High level 0.7 × DVDD DVDD V Output Low Voltage VOL DVDD=Min. VSS 0.2 × DVDD V Output High Voltage VOH DVDD=Min. 0.8 × DVDD DVDD V Pull-up Resistor RPU VPAD=VIH, DIO=Min. 32.4 kΩ Pull-down Resistor RPD VPAD=VIL, DIO=Min. 32.4 (DVDD = 1.8 V, VDD_DIO1, VDD_DIO2 Logic Level) Table 7: DC Parameters for Normal GPIOs, 3.3 V IO Parameter Symbol Condition Min Typ Max Units Input Low Voltage VIL Guaranteed logic Low level VSS 0.8 V Input High Voltage VIH Guaranteed logic High level 2.0 DVDD V Output Low Voltage VOL DVDD=Min. VSS 0.4 V Output High Voltage VOH DVDD=Min. 2.4 DVDD V Pull-up Resistor RPU VPAD=VIH, DIO=Min. 19.4 kΩ Pull-down Resistor RPD VPAD=VIL, DIO=Min. 16.0 (DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 Logic Level)

5.3.2 DC Parameters for RTC Block

There are several control pins in the RTC block. For details, see Section 7.4. Table 8: DC Parameters for RTC Block, 3.3 V VBAT Parameter Symbol Condition Min Typ Max Units Input Low Voltage VIL Guaranteed logic Low level VSS 0.6 V Input High Voltage VIH Guaranteed logic High level 2.2 VBAT V (RTC block: RTC_PWR_KEY, RTC_WAKE_UP, RTC_WAKE_UP2) Table 9: DC Parameters for RTC Block, 2.1 V VBAT Parameter Symbol Condition Min Typ Max Units Input Low Voltage VIL Guaranteed logic Low level VSS 0.3 V Input High Voltage VIH Guaranteed logic High level 1.6 VBAT V (RTC block: RTC_PWR_KEY, RTC_WAKE_UP, RTC_WAKE_UP2)

5.3.3 DC Parameters for Digital Wake-Up

Several GPIOs can be used for wake-up. For details, see Section 7.4.1. To use Digital Wake-up, the IO voltage should not be higher than the VBAT value. Table 10: DC Parameters for Digital Wake-Up, 3.3 V VBAT and 1.8/3.3 V IO Parameter Symbol Condition Min Typ Max Units Input Low Voltage VIL Guaranteed logic Low level VSS 0.5 V Input High Voltage VIH Guaranteed logic High level 1.4 DVDD V (DVDD= 1.8/3.3 V, VDD_DIO1, VDD_DIO2 Logic Level, DVDD should not be higher than the VBAT value) Table 11: DC Parameters for Digital Wake-Up, 2.1 V VBAT and 1.8 V IO Parameter Symbol Condition Min Typ Max Units Input Low Voltage VIL Guaranteed logic Low level VSS 0.3 V Input High Voltage VIH Guaranteed logic High level 1.3 DVDD V (DVDD= 1.8 V, VDD_DIO1, VDD_DIO2 Logic Level, DVDD should not be higher than the VBAT value)

5.4 Radio Characteristics

5.4.1 WLAN Receiver Characteristics

TA = +25 °C, VBAT = 3.3 V. Parameters are measured at ANT pin on CH1 (2412 MHz). Table 12: WLAN Receiver Characteristics – QFN Parameter Condition Min Typ Max Units Sensitivity (8 % PER for 11b rates, 10 % PER for 11g/11n rates) 1 Mbps DSSS -100.5 -99.5 -97.5 dBm

2 Mbps DSSS -96 -95 -93

11 Mbps CCK -91 -90 -88

6 Mbps OFDM -92 -91 -89

9 Mbps OFDM -92 -91 -89

18 Mbps OFDM -90 -89 -87

36 Mbps OFDM -83 -82 -80

54 Mbps OFDM -77 -76 -74

MCS0(GF) -92 -91 -89 MCS7(GF) -74 -73 -71 Maximum input level (8 % PER for 11b rates, 10 % PER for 11g/11n rates) 802.11b -4 0 0 802.11g -10 -4 -3 Table 13: WLAN Receiver Characteristics – fcCSP Parameter Condition Min Typ Max Units Sensitivity (8 % PER for 11b rates, 10 % PER for 11g/11n rates) 1Mbps DSSS -100.5 -99.5 -97.5 dBm 2Mbps DSSS -96 -95 -93 11Mbps CCK -91 -90 -88 6Mbps OFDM -92 -91 -89 9Mbps OFDM -92 -91 -89 18Mbps OFDM -90 -89 -87 36Mbps OFDM -83 -82 -80 54Mbps OFDM -77 -76 -74 MCS0(GF) -92 -91 -89 MCS7(GF) -74 -73 -71 Maximum input level (8 % PER for 11b rates, 10 % PER for 11g/11n rates) 802.11b -4 0 0 802.11g -10 -4 -3

5.4.2 WLAN Transmitter Characteristics

TA = +25 °C, VBAT = 3.3 V. Parameters are measured at ANT pin on CH1 (2412 MHz). Table 14: WLAN Transmitter Characteristics – QFN Parameter Condition Min Typ Max Units Maximum Output Power measured from IEEE spectral mask and EVM 1 Mbps DSSS 17.5 20.0 21.0 dBm 2 Mbps DSSS 17.5 20.0 21.0 5.5 Mbps CCK 17.5 20.0 21.0 11 Mbps CCK 17.5 20.0 21.0 6 Mbps OFDM 16.5 19.0 20.0 9 Mbps OFDM 16.5 19.0 20.0 12 Mbps OFDM 16.5 19.0 20.0 18 Mbps OFDM 16.5 19.0 20.0 24 Mbps OFDM 15.5 18.0 19.0 36 Mbps OFDM 15.5 18.0 19.0 48 Mbps OFDM 14.0 16.5 17.5 54 Mbps OFDM 13.0 15.5 16.5 MCS0 OFDM 16.5 19.0 20.0 MCS7 OFDM 13.0 15.5 16.5 Transmit center frequency accuracy -20 +20 ppm Table 15: WLAN Transmitter Characteristics – fcCSP (Normal Power Mode) Parameter Condition Min Typ Max Units Maximum Output Power measured form IEEE spectral mask and EVM 1 Mbps DSSS 16.0 18.5 19.5 dBm 2 Mbps DSSS 16.0 18.5 19.5 5.5 Mbps CCK 16.0 18.5 19.5 11 Mbps CCK 16.0 18.5 19.5 6 Mbps OFDM 15.5 18.0 19.0 9 Mbps OFDM 15.5 18.0 19.0 12 Mbps OFDM 15.5 18.0 19.0 18 Mbps OFDM 15.5 18.0 19.0 24 Mbps OFDM 14.5 17.0 18.0 36 Mbps OFDM 14.5 17.0 18.0 48 Mbps OFDM 13.0 15.5 16.5 54 Mbps OFDM 12.0 14.5 15.5 MCS0 OFDM 15.5 18.0 19.0 MCS7 OFDM 12.0 14.5 15.5 Transmit center frequency accuracy -20 +20 ppm

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 23 of 94 © 2021 Dialog Semiconductor Table 16: WLAN Transmitter Characteristics – fcCSP (Low Power Mode) Parameter Condition Min Typ Max Units Maximum Output Power measured form IEEE spectral mask and EVM 1 Mbps DSSS 7.5 9.5 10.5 dBm 2 Mbps DSSS 7.5 9.5 10.5 5.5 Mbps CCK 7.5 9.5 10.5 11 Mbps CCK 7.5 9.5 10.5 6 Mbps OFDM 6.0 8.0 9.0 9 Mbps OFDM 6.0 8.0 9.0 12 Mbps OFDM 6.0 8.0 9.0 18 Mbps OFDM 6.0 8.0 9.0 24 Mbps OFDM 3.5 5.5 6.5 36 Mbps OFDM 3.5 5.5 6.5 48 Mbps OFDM 0 2.0 3.0 54 Mbps OFDM 0 2.0 3.0 MCS0 OFDM 6.0 8.0 9.0 MCS7 OFDM 0 2.0 3.0 Transmit center frequency accuracy -20 +20 ppm

5.5 Current Consumption

TA = +25 °C, VBAT = 3.3 V, w/ CPU clock 80 MHz. Table 17: Current Consumption in Active State – QFN Parameter Condition Min Typ Max Units ACTIVE TX 1 Mbps DSSS @ 20.0 dBm 260 280 320 mA 6 Mbps OFDM @ 19.0 dBm 240 260 300 54 Mbps OFDM @ 15.5 dBm 180 200 240 MCS7 @ 15.5 dBm 180 200 240 RX No signal (Note 1) 25 29 51 1 Mbps DSSS (Note 1) 26.5 30.5 53 1 Mbps DSSS 27 37.5 54 54 Mbps OFDM 29 38.5 54 MCS7 29 38.6 54 Note 1 Low Current Mode and CPU clock 30 MHz. Table 18: Current Consumption in Active State – fcCSP (Normal Power Mode) Parameter Condition Min Typ Max Units ACTIVE TX 1 Mbps DSSS @ 18.5 dBm 250 270 310 mA 6 Mbps OFDM @ 18.0 dBm 230 250 290 54 Mbps OFDM @ 14.0 dBm 190 210 250 MCS7 @ 14.0 dBm 190 210 250 RX No signal (Note 1) 25 28.4 51 1 Mbps DSSS (Note 1) 26.5 29.7 53 1 Mbps DSSS 27 36.5 54

54 Mbps OFDM 29 38 54

Note 1 Low Current Mode and CPU clock 30 MHz. Table 19: Current Consumption in Active State – fcCSP (Low Power Mode) Parameter Condition Min Typ Max Units ACTIVE TX 1 Mbps DSSS @ 9.5 dBm 63 85 100 mA 6 Mbps OFDM @ 8.0 dBm 63 85 100 54 Mbps OFDM @ 2.0 dBm 48 70 90 MCS7 @ 2.0 dBm 48 70 90 RX No signal (Note 1) 25 28.4 51 1 Mbps DSSS (Note 1) 26.5 29.7 53 1 Mbps DSSS 27 37.5 54 54 Mbps OFDM 29 39.2 54 MCS7 29 39.2 54 Note 1 Low Current Mode and CPU clock 30 MHz.

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 25 of 94 © 2021 Dialog Semiconductor Table 20: Current Consumption in Low Power Operation Parameter Condition Min Typ Max Units Low Power Operation Sleep 1 0.2 µA Sleep 2 1.8 Sleep 3 3.5

5.6 ESD Ratings

Table 21: QFN Package Reliability Test Standards Test Conditions Result Human Body Model (HBM) JEDEC EIA/JESD22-A114 ± 2,000 V Pass Charge Device Mode (CDM) JEDEC EIA/JESD22-C101 ± 500 V Pass Table 22: fcCSP Package Reliability Test Standards Test Conditions Result Human Body Model (HBM) JEDEC EIA/JESD22-A114 ± 2,000 V Pass Charge Device Mode (CDM) JEDEC EIA/JESD22-C101 ± 500 V Pass

5.7 Brown-Out and Black-Out

The device enters a brown-out condition whenever the input voltage dips below VBROWN (see Table 23). This condition must be considered during design of the power supply routing, especially if the SoC is operated from a battery. High-current operations, like TX operation, cause a dip in the supply voltage, potentially triggering a Brown-Out. The resistance includes the internal resistance of the battery, contact resistance of the battery holder (for example, four contacts for two AA batteries), wiring resistance, and PCB routing resistance. VBAT(V) Time(sec) Time(sec) Time(sec) BR_OUT_VBAT(V) BL_OUT_VBAT(V) Black-Out Detector Hysteresis Brown-Out Detector Hysteresis Battery Discharge -> Battery Voltage is down Enter ＂Brown-Out＂ Condition Enter ＂Black-Out＂ Condition Exit ＂Black-Out＂ Condition Exit ＂Brown-Out＂ Condition Normal operated Condition Brown-Out Operated Condition Black-Out Operated Condition Brown-Out Operated Condition Normal operated Condition Figure 6: Brown-Out and Black-Out Levels Brown-out and black-out conditions only operate in normal mode. The black-out condition is equivalent to a hardware reset event in which all states within the device are lost. Table 23 lists the brown-out and black-out voltage levels. Table 23: Brown-Out and Black-Out Voltage Levels Condition Voltage Hysteresis Operation Vbrown-out 2.10 V (Note 1) 90 mV S/W Control Vblack-out 1.75 V (Note 1) 90 mV Full boot Note 1 Recommended voltage level. Adjustable depending on the application condition.

5.8 Clock Electrical Characteristics

DA16200 needs two clock sources. One is the 32.768 kHz clock used by the RTC block, and the other is the 40 MHz clock for the internal processor and Wi-Fi system. More specifically, the 40 MHz clock is used as a source clock for the internal PLL, while the PLL output is used for the internal processor and Wi-Fi system block.

5.8.1 RTC Clock Source

The 32.768 kHz RTC clock source is necessary for the free-running counter in the RTC block. The RTC block of the SoC contains an internal 32.768 kHz RC oscillator as well, which is used as a clock for chip initialization before the external 32.768 kHz crystal reaches the stable time in the initial stage. It is necessary to convert it into an external clock for accurate clock counting after the initialization stage. This process is executed through the register setting. Table 24 shows the suitable loading

5.8.2 Main Clock Source

DA16200 contains a crystal oscillator for the main clock source which supports the external crystal clock. Basically, the external clock is 40 MHz. Table 25 shows the load capacitor value and required clock tolerance for 40 MHz. Figure 9 and Figure 10 show the crystal clock connections. RF_XI RF_XO 40MHz Figure 9: Crystal Clock Connections - QFN G11 H12 RF_XI RF_XO 40MHz Figure 10: Crystal Clock Connections - fcCSP Table 25 lists the WLAN crystal requirements. Table 25: WLAN Crystal Clock Requirements Parameter Condition Min Typ Max Units Frequency 40 MHz Frequency accuracy Initial + temp + aging -20 +20 ppm Crystal ESR 40 MHz, C1 = C2 = 6 pF 60 Ω

6 Power Management

DA16200 has an RTC block which provides power management and function control for low power operation. In normal operation, the RTC block is always powered on when RTC_PWR_KEY is enabled. The RTC block also has a control function for DA16200’s internal power supplying components, like LDOs, DC-DCs, and power switches.

6.1 Power On Sequence

The sequence after the initial switching from power-off to power-on is shown in Figure 11. The RTC_PWR_KEY of DA16200 is a pin that enables the RTC block. Once RTC_PWR_KEY is enabled after VBAT power is supplied, all the internal regulators are turned on automatically in the sequence predefined by the RTC block. Once RTC_PWR_KEY is turned on, LDOs for both XTAL and digital I/O are turned on shortly and then the DC-DC regulator is turned on according to the predefined interval. The enabling intervals can also be modified in the register settings after initial power-up. CLK_32K VBAT POWER_KEY IO Voltage 50% VBAT 50% IO 50% VBAT Figure 11: Power On Sequence Table 26: Power On Sequence Timing Requirements Name Description Min Typ Max Unit T0 VBAT power-on time from 10 % to 90 % of VBAT ms T1 IO voltage and VCC supply 0 ms T2 RTC_PWR_KEY turn-on time from 50 % VBAT to 50 % POWER_KEY * Note 1 5*T0 ms T3 Internal RC oscillator wake-up time 217 µs Note 1 if the T0 = 10 ms to turn on VBAT, the recommended T2 is 50 ms for the safe booting operation. It would be externally controlled by MCU or it would be implemented using RC filter at the input of RTC_PWR_KEY. The recommended C is 470 nF or 1uF (not to exceed 1uF) and R value is chosen to have T2 delay. For example, R and C values will be 82 kΩ and 1 uF when T0 = 10 ms.

6.2 Power Management Unit

DA16200 has one internal DC-DC converter and several LDOs to supply power to all internal sub- blocks. Power management does the on-off control of these regulators and is implemented through the register setting inside the RTC block. RF Block Digital Core / Memory Flash control / External Flash Memory RTC Block DCDC DIG_LDO 1.4V 1.1V VDD_PA, VDD_RF VDD_FDIO VBAT FDIO_LDO 1.8V GPIOs VDD_DIO1 VDD_DIO2 QFN, fcCSP normal power fcCSP low power Using the same power supply as external device ( ex.CPU) ( 1.8V or 3.3V) Figure 12: Power Management Block Diagram Details of the internal DC-DC converters and LDOs are explained below:

DC-DC converter: from the power supply of external VBAT input, it generates 1.4 V power for the digital LDO and RF block
LDO for digital Blocks: from the DC-DC output, it generates 1.1 V power which is used for digital blocks
LDO for I/O and external flash memory: ○ This LDO output is used only for 1.8 V digital I/O applications ○ From external VBAT power input, it generates 1.8 V output voltage which is used for digital I/O power domain in 1.8 V digital I/O applications ○ It is also used for external flash memory ○ For 3.3 V digital I/O applications, external power (3.3 V) is directly supplied for digital I/O power
FDIO_LDO_OUT supports only 1.8 V With the internal DC-DC converters and LDOs, all the power necessary for DA16200’s internal sub- blocks are sufficiently generated.

6.3 Low Power Operation Mode

DA16200 provides three Sleep modes as low power operation modes.

6.3.1 Sleep Mode 1

Sleep mode 1 is an operational mode in which the RTC_PWR_KEY is not turned to high yet. The RTC_PWR_KEY is in the LOW state and the DA16200MOD is only supplied with VBAT power. With all the internal blocks off in Sleep mode 1, only the leakage current from a minimal number of internal blocks connected to VBAT remains.

6.3.2 Sleep Mode 2

Sleep mode 2 is an operational mode in which the RTC_PWR_KEY is set to high and the RTC block is running. Sleep mode 2 is activated by setting RTC registers to control the power management unit via a command from the CPU. To turn Sleep mode 2 back to Sleep mode 1, set RTC_PWR_KEY to low. Changing the state of the device from Sleep mode 2 to an ACTIVE state happens in one of two ways:

The counter value is reached that is set by the CPU before entering Sleep mode 2
An external wake-up event occurs via the RTC_WAKE_UP pin

6.3.3 Sleep Mode 3

Sleep mode 3 is a low power but fully connected Wi-Fi mode of operation. Sleep mode 3 checks for incoming Wi-Fi network data traffic at regular intervals set by the user. For example, every one second, three seconds, five seconds, and so on. The exact time interval is programmable. Sleep mode 3 is activated by software commands. For more information, see Ref. [6]. A device can come out of Sleep mode 3 and into a fully ACTIVE state before the next targeted wake- up time interval via a GPIO wake-up.

7 Core System

7.1 Arm Cortex-M4F Processor

The Cortex-M4F processor is a low-power processor that features low gate count, low interrupt latency, low-cost debug, and includes floating point arithmetic functionality. The processor is intended for deeply embedded applications that require fast interrupt response features. The features of the Cortex-M4F processor in DA16200 are summarized below: ■ Operation clock frequency is up to 160 MHz ■ 32-bit Arm Cortex-M4F architecture optimized for embedded applications ■ Thumb-2 mixed 16/32-bit instruction set ■ Hardware division and fast multiplication ■ Includes Nested Vectored Interrupt Controller (NVIC) ■ SysTick timer provided by Cortex-M4F processor ■ Supports both standard JTAG (5-wire) and the low-pin-count Arm SWD (2-wire, TCLK/TMS) debug interfaces ■ Cortex-M4F is binary compatible with Cortex-M3 For more information on the Arm Cortex-M4F, see Ref. [1].

7.2 Wi-Fi Processor

DA16200 includes an internal MCU (Arm Cortex-M4F) to completely offload the host MCU along with an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast and secure WLAN and Internet connections with 256-bit encryption. It supports the station, SoftAP, and Wi-Fi Direct modes. It also supports WPA/WPA2 personal and enterprise security, WPA2 SI, WPA3 SAE, OWE, and WPS 2.0. It includes an embedded IPv4 and IPv6 TCP/IP stack.

7.3 Memory

7.3.1 Internal Memory

DA16200 contains four types of internal memories and also supports an external serial flash memory interface. The roles and functions of each memory are described in the following subsections.

7.3.1.1 ROM

This memory contains boot loader, system kernel, network stack, and various kinds of drivers for interfaces and peripherals.

7.3.1.2 SRAM

This memory is used as data space for all codes running on the internal CPU. All codes run on serial flash memory via I-Cache (XIP mode). All the contents in this memory disappear in the low-power Sleep mode. The address range of the internal SRAM is from 0x0000_8000 to 0x0000_FFFF, and the controller of this memory supports the swap operation for the internal CPU. To do a swap operation of the controller, add the offset value to the SRAM address for read operation only. If the offset value is 0x2080_0000, the controller will do a swap to reverse the byte order for a scalar 32-bit value. If the offset value is 0x2040_0000, the controller will do a swap to reverse the halfword (16-bit) order for a scalar 32-bit value. For example, if the value of address 0x0000_8000 is 0x12345678, reading address 0x2080_8000 will output value 0x78563412 and reading address 0x2040_8000 will output value 0x56781234.

7.3.1.3 Retention Memory

This memory is a kind of non-volatile memory and is used to save and manage essential information that should be preserved even in the low-power Sleep mode of the DA16200.

7.3.1.4 OTP

DA16200 includes a one-time electrically field programmable non-volatile CMOS memory. The array can be programmed by 1 bit and read by 32 bits. Since the OTP controller is designed internally, it is possible to execute read/write by commands through register setting.

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 33 of 94 © 2021 Dialog Semiconductor AHB-CPU AHB Slave OTP IF OTP Controller OTP Memory Figure 13: OTP Block Diagram This memory is to protect and manage major information essential for mass production and management of products, such as booting information, MAC address, serial number, and others. The OTP is also used for storing secret information which is used for the advanced security functions like secure booting, secure debugging, and secure asset storage. But this secret information cannot be accessed in a normal way of CPU read or write access so that it is protected from the external access. The OTP controller translates a request into the corresponding control sequence for the OTP cell to be in one of the following modes:

Standby mode: it is used to reduce the power consumption when the OTP is not used ○ The OTP cell is powered but is less than the power consumption in Active mode
Operation mode: for the OTP to operate correctly, OTP must be in Operation mode ○ Program, Read, or Test mode can be operated after the Operation mode is set
Program mode: when OTP is instantiated, the SoC has all bits in 0s and 1s are loade d into the SoC through programming ○ The program mode provides the functionality for programming a 1-bit into an OTP position ○ Immediately after programming the bit at the selected memory cell (program operation), a verification operation follows to check for successful programming results with sufficient margin
Read mode: in this mode, the contents of the OTP cell are read at reactive AHB address space
Test mode: tests can be performed during wafer sort, final test, or in-system/in-field, depending on the test plan used by the end users

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 34 of 94 © 2021 Dialog Semiconductor Table 27: OTP Map Offset Field Size (Bytes) 0x000 Dialog Reserved 1024 0x100 MAC Address #0 Low 4 0x101 MAC Address #0 High 4 0x102 MAC Address #1 Low 4 0x103 MAC Address #1 High 4 0x104 MAC Address #2 Low 4 0x105 MAC Address #2 High 4 0x106 MAC Address #3 Low 4 0x107 MAC Address #3 High 4 0x10A XTAL Offset #0 4 0x10B XTAL Offset #1 4 0x10C to 0x7FF User Area 7128

7.3.1.5 Serial Flash Interface

DA16200 supports an external serial memory interface, QSPI, explained in Section 9.1. This memory is used for storing DA16200’s software code, including user application code, its predefined data, and various configuration data in the form of NVRAM.

7.3.1.6 Memory Map

Figure 15 shows the various peripherals that are part of the DA16200 and how they are mapped to the processor memory. Address Map of Memories for Masters Mask ROM 0x0000_0000 0x0004_0000 0x0008_0000 0x0010_0000 0x0020_0000 0x0030_0000 Not used 0x2000_0000 Memories 0x0000_0000 0x2000_0000 0x3000_0000 Not used 0x4000_0000 System Peripherals 0x5000_0000 Not used 0x6000_0000 APB Peripherals 0xE000_0000 System Control Space(for CM4F) Not used 0xF000_0000 0xFFFF_FFFF Address Map of DA16200 Reserved PHY 0x7000_0000 Not used Int. SRAM I-Cache Not used 0x00F8_0000 Retention Memory 0x00FC_0000 Figure 14: Memory Map Timer0 Timer1 Dual Timer Reserved 0x4000_0000 0x4000_1000 0x4000_2000 0x4000_3000 0x4000_8000 WatchDog Timer Reserved 0x4000_9000 0x4000_F000 0x4001_0000 PWM 0x4000_A000 0x4000_B000 GPIO0 UART0 Reserved 0x4001_0000 0x4001_1000 0x4001_2000 0x4001_3000 0x4001_5000 I2C Master Aux. ADC 0x4001_6000 0x4001_7000 0x4002_0000 CC312_APBS CC312_APBC 0x4010_0000 0x4011_0000 0x4011_8000 Not used 0x4020_0000 System Controller Security SD/eMMC (SDIO Host) 0x5000_0000 0x5001_0000 0x5002_0000 0x5003_0000 SDIO Device 0x500F_0000 0x5004_0000 Fast HW 0x5005_0000 0x5006_0000 DMA2 0x5007_0000 0x5008_0000 Slave Interface 0x5009_0000 RTC Interface 0x500A_0000 TA2SYNC 0x500B_0000 Flash Host Ctrl. 0x500C_0000 HSU 0x500D_0000 I-Cache Ctrl. 0x500E_0000 Reserved Reserved DMA1 0x4000_E000 GPIO1 Reserved Not used PSK_SHA1 0x5010_0000 Reserved GPIO2 0x4001_8000UART2 UART1 0x4000_7000 System Peripherals APB Peripherals Figure 15: Memory Map: Peripherals

7.4 RTC

Among the pins in DA16200, four special pins are directly connected to the RTC block, which are RTC_PWR_KEY, RTC_GPO, RTC_WAKE_UP, and RTC_WAKE_UP2. Table 28: RTC Pin Description Pin Name Pin Number RTC_PWR_KEY 42 A5 RTC_PWR_KEY represents a power key for the RTC block. When this pin is enabled, the RTC starts to work by following a predefined power-up sequence and eventually all the necessary power is supplied to all the sub-blocks including the main digital block in DA16200. When disabled, all blocks are powered off and this mode is defined as Sleep mode 1. DA16200 consumes minimum leakage current in Sleep mode 1. RTC_GPO 44 E7 This pin is an output and high level is 'VBAT'. It has three different functions:

GPO function: its output value can be set as ‘1’ or ‘0’ via register setting. It can keep the value even in Sleep mode
Flash control function: when in Sleep mode, it becomes ‘0’; when in Active mode, it is ‘1’
Sensor wake-up function: when the sensor wake-up function is used (Section 9.8.4), a programmable periodic signal is provided for an external device. Inside the RTC, there are registers to set count values RTC_WAKE_UP 43 D6 This pin is an input pin for receiving an external event signal from an external device like a sensor. The RTC block detects an external event signal via this pin and wakes up DA16200 from Sleep mode 2 or Sleep mode 3. RTC_WAKE_UP2 23 H6 DA16200 contains not only an on-chip oscillator that uses a 32.768 kHz external crystal but also an internal 32.768 kHz RC oscillator for faster initialization, which leads to prompt clock generation after power-up and is used until the external crystal becomes stable. Afterwards, the input source can be switched to the external crystal via a register setting. The RTC block has a 36-bit real time counter. Its resolution is equal to one clock period of 32.768 kHz. The count value can be read via the register read command.

7.4.1 Wake-up Controller

The wake-up controller is designed to wake up DA16200 from a Sleep mode by an external signal. It detects an edge trigger of the wake-up signal and selects either the rising edge or the falling edge. Also, the wake-up signal must be maintained for at least 200 µs upon occurrence of transition on one side. When it comes to the source of wake-up, 11 digital I/Os in addition to the two pins directly connected to the RTC block can be used. Although up to 11 digital I/Os are available for use, the maximum number of digital I/Os that are simultaneously available is eight. Table 29 describes the digital I/Os that are available for simultaneous use. Table 29: Wake-up Sources QFN and fcCSP Package Input Selection = 0 Input Selection = 1 GPIOA4 X GPIOA5 X GPIOA6 X

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 37 of 94 © 2021 Dialog Semiconductor QFN and fcCSP Package Input Selection = 0 Input Selection = 1 GPIOA7 X GPIOA8 X GPIOA9 GPIOC6 GPIOA10 GPIOC7 GPIOA11 GPIOC8 For more information on the wake-up source selection, see the input selection register: 0x50091008[25:16]. The wake-up controller is in the RTC block. RTC registers can set several parameters and identify which pin is used to wake up the SoC by checking the status register after wake -up. DA16200 has another wake-up function using analog sources, which is described in Section 9.8.4. Using the Aux-ADC, DA16200 detects whether it exceeds the predefined threshold value. If it detects the wanted condition, it will wake up from a Sleep mode. Four ports (GPIOA[3:0]) are used for this function.

7.4.2 Retention I/O Function

DA16200 I/O has a Retention mode. During this mode, I/O cells retain the previous state values at the core side inputs. When it is required to maintain the value of a specific GPIO in Sleep mode, this function will be used. For example, to maintain HIGH value on GPIOA4 in Sleep mode, it is required to set the value of GPIOA4 to HIGH and set the register bit of RTC block (0x5009_1018:BIT[27:24]) to enable retention to the proper value described in Table 30 before going to the Sleep mode. For GPIOA4, BIT[25] should be set to HIGH, then GPIOA4 can keep the value HIGH during the Sleep mode. The retention enable register is comprised of three bits in total, and the I/O power domains covered by each of the bits are described in Table 30. Table 30: I/O Power Domain [25] DIO1 [26] DIO2 [27] FDIO GPIOA[11:4] GPIOC[8:6] F_CLK TCLK/TMS F_CSN UART0_RXD/UART0_TXD F_IO0 to F_IO3

7.5 Pulse Counter

7.5.1 Introduction

The pulse counter is a module that counts the number of rising or falling edges of input signals. And this counter module can run even in Sleep mode. It includes one 32-bit up-counter. The input channel can be set with a register setting among the 11 digital I/Os. It also has a glitch filter that is designed to remove the unwanted trigger of an input signal.

7.5.2 Functional Description

Ext. Pad Mux. Mux_SEL Glitch Filter Edge Select Counter Int Gli_En Gli_Thresh Edge_Sel Count_En Count_Rst Int_Clr Int_Thresh IntPCLK Pulse Edge Pulse CountCLK_32kHz ㅣ ㅣ Figure 16: Pulse Counter Block Diagram

7.5.2.1 Input

Available input channels are described in Table 29. It uses the same input sources with the wake-up controller. By register setting, input channels can be selected among 11 digital I/Os.

7.5.2.2 Clock

The operation clock of the pulse counter is 32 kHz.

7.5.2.3 Counter

As described in Figure 16, the pulse counter is activated by several counter control signals. With a register setting, input signals can be selected on either the rising edges or falling edges. To enable the glitch filter module, the Gli_En and Gli_Thresh register values need to be set. The pulses whose cycles are shorter than the Gli_Thresh value are removed. The counter is a 32-bit up-counter and the counter value can be reset to zero by Count_Rst.

7.5.2.4 Interrupts

An interrupt occurs when the counter values reaches the Interrupt Threshold value (Int_Thresh). In Sleep mode, this interrupt can be used as a wake-up source.

7.6 HW Accelerators

7.6.1 Zeroing of SRAM

DA16200 provides a function to quickly set a constant value for the set SRAM area. This function is mainly used to initialize the set SRAM area to zero and can be used even when SRAM is used. For example, assuming that the entire 512 KB SRAM is being initialized, the processing time is 8192 cycles based on the CPU clock, that is, the maximum processing time is 8192 cycles irrespective of the SRAM size to be initialized. For more information to use this function, see Ref. [2].

7.6.2 CRC Calculation

The CRC algorithm detects the corruption of data during transmission and detects a higher percentage of errors than a simple checksum. The CRC calculation consists of an itera tive algorithm involving XOR and shifts operations that is executed much faster in hardware than in software. The CRC calculator is mainly used to check the flash image and the features of CRC calculator in DA16200 are summarized below: ■ Operation clock frequency is up to 160 MHz, the same as CPU clock ■ Supports 8-bit, 16-bit, and 32-bit data paths ■ Performs CRC operation simultaneously in real time during data transfer on the selected AHB bus ■ Operation type of CRC calculation □ CRC-32: generator polynomial is G(x) = x^32 + x^26 + x^23 + x^22 + x^16 + x^12 + x^11 + □ CRC-16 CCITT: generator polynomial is G(x) = x^16 + x^12 + x^5 +1 □ CRC-16 IBM: generator polynomial is G(x) = x^16 + x^15 + x^2 +1 For more information to use this function, see Ref. [2].

7.6.3 Pseudo Random Number Generator (PRNG)

DA16200 provides a function, PRNG, to generate a pseudo random number. The featur es of PRNG in DA16200 are summarized as follows: ■ Operation clock frequency is up to 160 MHz, the same as CPU clock ■ Supports partial parallel processing of 8-bit, 16-bit, and 32-bit unit Generator polynomial is G(x) = x^31 + x^28 + 1 (Ref. [3])

7.7 DMA Operation

7.7.1 DMA1

DA16200 includes a DMA controller of its own with a single AHB master. The DMA1 has sixteen channels for fast data transfers from/to I2S, I2C, UARTs, and ADC to/from any on-chip RAM. The DMA requests of each module are directly connected to the dedicated DMA channels. Each DMA channel has a priority level, a smaller channel number standing for a higher priority. Figure 17: DMA1 Controller Block Diagram

IDLE: waits for the DMA request. When the DMA request appears, the state moves to R_FIRST
R_FIRST: reads the address of the first DMA descriptor (head node of the linked list)
R_COMMAND: reads the Command Field of the DMA descriptor
R_SRC_ADDR: reads the Src_start_addr Field of the DMA descriptor
R_DST_ADDR: reads the Dst_start_addr Field of the DMA descriptor
R_DATA: reads the data from the source address
W_DATA: writes the data read in the R_DATA state to the destination address. By the information written in the DMA descriptor, if data read/write is required, the state moves to R_DATA. If the DMA task is required to be suspended or stopped, the state moves to W_COMMAND
R_NEXT: reads the next_descriptor field to check whether the next DMA task exists or not, before stopping the current DMA task
W_FIRST: writes the address of the next DMA descriptor read in R_NEXT to the memory region where the first address of the DMA descriptor is stored. If arbitration is required, the state moves to IDLE state. If the current DMA channel is required to be operated, the state mov es to R_FIRST state
INIT, R_FIRST_LOAD, R_NEXT_LOAD, and C_NEXT: reduce the critical path delay in the DMA block. These states generate one clock delay

7.7.2 DMA2 (Fast DMA)

DMA2 (Fast DMA) controller consists of a master read port, a master write port, and a sl ave port for configuration register setting. Fast DMA performs bulk data transfers, data reading from the source address range, and data writing to the destination address range. Fast DMA is mainly used for fast data transfer from memory to memory. The features of Fast DMA in DA16200 are summarized as follows: ■ Transfer size is programmable from 1 byte to 1 Megabytes ■ Up to four channels can be set at the same time ■ LLI function of ring type is supported by using configuration registers of four channels ■ Interrupt enable can be set for each channel ■ Provides a hold function to pause data transfer for each channel The basic unit of bus transmission is 32-bit and has a function to automatically correct address align, even if the source and destination addresses are not in word units. For example, assuming that the transfer size is 23 bytes, the source base address is 0x001 for read access, and the destination base address is 0x102 for write access, the number of bytes per transaction is performed as follows:

Source base address [1:0] = 0x1: the master read port of fast DMA performs read access with the following sequences:
Destination base address [1:0] = 0x2: the master write port of fast DMA performs write access with the following sequences:

7.8 Simple Memory Protection

DA16200 provides simple protection for internal SRAM, ROM, and Retention Memory. The memory controllers are AMBA AHB slaves and simple protection operates between the main AHB bus and the AHB slave port of the memory controllers. The features of memory protection in DA16200 are summarized as follows: ■ Memory protection provides the function to set the security area of each memory that should be protected ■ The setting unit to set the security area for each memory is different: □ SRAM: 1 kB/unit □ MROM: 16 bytes/unit □ Retention Memory: 4 bytes/unit ■ Provides the access protection for the security zone for each AHB master ■ Provides the write protection function for each AHB master ■ Provides the read protection function for each AHB master ■ Latency is 0 cycle The index numbers to distinguish AHB masters are:

0x0: Cortex M4 – DCode bus
0x1: Cortex M4 – ICode bus
0x2: Cortex M4 – System bus
0x3: MAC DMA
0x4: DMA1
0x5: SD/eMMC (SD Host)
0x6: Serial Slave Interface (SPI, I2C, SDIO)
0x7: DMA2_M0 (read port)

0x8: DMA2_M1 (write port)
0x9: DMA of Crypto Engine
0xA: QSPI master – flash controller with XIP
0xB: Hardware Security Unit for Temporal Key Integrity Protocol (HSU for TKIP)
0xC: SPI master for another external SPI slaves For more information to use this function, see Ref. [2].

7.9 Bus Protection of Serial Slave Interfaces

DA16200 supports a variety of serial slave interfaces, including SPI, I2C, and SDIO slaves. When DA16200 interfaces with an external host, it is necessary to provide the access to the authorized area. Therefore, DA16200 provides bus protection for serial slave interfaces. The features of bus protection in DA16200 are summarized as follows: ■ Up to two accessible areas can be set and the setting unit is 4-byte ■ The bus protection provides the write/read protection function outside the set area For more information to use this function, see Ref. [2].

7.10 Watchdog Timer

The watchdog timer in DA16200 is based on a 32-bit down-counter that is initialized from the reload register, WDOGLOAD. The watchdog timer generates a regular interrupt, WDOGINT, depending on the programmed value. The counter decrements by one on each positive clock edge of WDOGCLK when the clock enable, WDOGCLKEN, is HIGH. The watchdog monitors the interrupt and asserts a reset request signal, WDOGRES, when the counter reaches 0, and the counter is stopped. On the next enabled WDOGCLK clock edge, the counter is reloaded from the WDOGLOAD register and the countdown sequence continues. If the interrupt is not cleared by the time the counter reaches 0 for a second time, the watchdog timer reasserts the reset signal. The watchdog timer applies a reset to the system in the event of a software failure, providing a way to recover from software crashes. The watchdog unit can be enabled or disabled as required. Figure 20 shows the watchdog timer block diagram. Figure 20: Watchdog Timer Block Diagram

7.11 Clock Generator

The generation of the system's clocks is described in detail in Figure 22. PLL480M XTAL40M Divide by PLL_CLK_DIV_0_CPU Free running modules HCLK_FR CPU Core (CM4F) BusMatrix Internal SRAM Mask ROM PHY Bus SD/eMMCDivide by CLK_DIV_EMMC Divide by PLL_CLK_DIV_1_XFC QSPI Flash Controller HCLK_XFC 2nd SPI Host Controller Divide by PLL_CLK_DIV_2_UART UART_0CLK_UART UART_1 UART_2 Divide by PLL_CLK_DIV_3_OTP OTPCLK_OTP Divide by 2 Divide by PLL_CLK_DIV_5_I2S I2SCLK_I2S I/O PAD Divide by CLK_DIV_I2S Divide by PLL_CLK_DIV_6_AUXA CLK_AUXA Divide by PLL_CLK_DIV_7_C312 CC312 (Security IP) HCLK_CC312 PHY Clock Generator CK EN CG CK EN CG CK EN CG CK EN CG CK EN CG CK EN CG CK EN CG CK EN CG Aux. ADCDivide by CLK_DIV_AUXA Figure 22: Clock Tree Diagram

8 Crypto Engine

HW crypto engine can be used for accelerating many crypto algorithms, such as hashing, secret key generation, and others. Table 32 shows the supported HW acceleration crypto algorithms in DA16200. This table is cited from Ref. [4]. How to use these crypto functions is explained in Ref. [2]. Table 32: HW Acceleration Crypto Algorithms in DA16200 Algorithm Mode Key Sizes AES ECB, CBC, CTR, OFB, CMAC, CBC-MAC, AESCCM, AES-CCM*, AES- GCM 128 bits, 192 bits, and 256 bits. AES key wrapping N/A All Chacha and Chacha-Poly1305 N/A N/A Diffie-hellman

ANSI X9.42-2003: Public Key Cryptography for the Financial Services Industry: Agreement of Symmetric Keys Using Discrete Logarithm Cryptography
Public-Key Cryptography Standards (PKCS) #3: Diffie Hellman Key Agreement Standard N/A 1024 bits, 2048 bits, and 3072 bits. ECC key generation N/A NIST curves and 25519 curves. ECIES N/A NIST curves and 25519 curves. ECDSA N/A NIST curves and ED25519. ECDH N/A NIST curves and 25519 curves. Hash SHA1, SHA224 and SHA256. N/A HKDF N/A N/A HMAC SHA1, SHA224 and SHA256. N/A KDF NIST SP 800-108: Recommendation for Key Derivation Using Pseudorandom Functions CMAC or HMAC. N/A RSA PKCS#1 operations
Public-Key Cryptography Standards (PKCS) #1 v2.1: RSA Cryptography Specifications
Public-Key Cryptography Standards (PKCS) #1 v1.5: RSA Encryption Encryption and signature schemes. 2048 bits, 3072 bits, and 4096 bits. RSA key generation N/A 2048 bits and 3072 bits.

9 Peripherals

This section describes the peripherals that are supported by the DA16200 device.

9.1 QSPI Master with XIP Feature

QSPI master supports 4-line SPI communication with commercial flash memory devices and uses a Motorola SPI-compatible interface among SPI communication modes. The highest communication speed is the same as the AMBA bus clock, and the speed is adjustable in integer multiples. The designed QSPI supports 4-/2-/1-line types depending on the purpose. These types should be combined. Especially when the 1-line communication mode is used, it can be used as the SPI master. QSPI master is an IP for communication between the flash memory and AMBA AHB bus and is designed to support XIP. The features of the QSPI master are summarized as follows: Serial flash interface:

SPI compatible serial bus interface ○ Configurable SPI I/O modes: – Single I/O mode – Dual I/O mode – Quad I/O mode ○ JEDEC Standard: JESD216B ○ 24-bit and 32-bit addressing ○ Supports to access flash with XIP mode – Read access without command – Read access without address and command ○ Programmable SPI clock phase and polarity ○ Maximum number of SPI CS is four that can be operated
Compatible with serial NOR flash devices, such as Macronix, Micron, Spansion, ESMT, and ISSI AMBA slave interface
Compliance to the AMBA AHB bus specification, Rev 3.0 [7]
Direct code execution: directly addressable access without additional driver software
Supports single and incrementing burst transfer (SINGLE, INCR, INCR4, INCR8, INCR16)
Supports byte, half-word, and word transaction
AMBA slave interface is optional to access configuration and status registers
Simple timer is used to check the completion time of flash operation
XIP path of QSPI master supports HW remapping function to execute selected boot image for over-the-air programming (OTA) AMBA master interface
Compliance to the AMBA AHB bus specification, Rev 3.0 [7]
Supports DMA operation to access serial flash devices ○ Automatic copy of code image from serial flash to system RAM ○ Automatic programming of code image from system RAM to serial flash
Performs a mem-to-mem copy in units of 32 bits, regardless of the address and length
Supports single and incrementing burst transfer (SINGLE, INCR, INCR4, INCR8, INCR16)
Supports byte, half-word, and word transaction

9.2 SPI Master

QSPI can use the SPI master with the use of a single line interface. Table 34 shows the pin definition of the SPI master interface. SPI signal timing is the same as QSPI. To use DA16200 as an SPI master, the CSB signal can be used with any of the GPIO pins. CSB [3:1] can be selected from the GPIO special function by setting the registers in the GPIO. Table 34: SPI Master Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOx O E_SPI_CSB[3:1] GPIOA6 32 E3 O E_SPI_CSB[0] GPIOA7 31 E1 O E_SPI_CLK GPIOA8 30 G3 I/O E_SPI_MOSI or E_SPI_D[0] GPIOA9 29 H2 I/O E_SPI_MISO or E_SPI_D[1] GPIOA10 28 F2 I/O E_SPI_D[2] GPIOA11 27 G1 I/O E_SPI_D[3] E_SPI_CSB E_SPI_CLK E_SPI_D[3:0] TCLK.ON TDO.DLY TDI.SU TCSB.OF F Figure 25: SPI Master Timing Diagram (Mode 0) Table 35: SPI Master Timing Parameters Parameter Symbol Min Typ Max Unit QSPI_CLK frequency FCLK 5 60 MHz QSPI_CLK clock duty 50 % 1st CLK active rising transition time TCLK.ON 0.5 × TCLK TCLK (Note 1) ns QSPI_CSB non-active rising transition time TCSB.OFF 0 TCLK ns QSPI_D[3:0] input setup time TDI.SU 6 ns QSPI_D[3:0] output delay time TDO.DLY 2 ns Note 1 TCLK = (FCLK× 106)-1 seconds.

9.3 SPI Slave

The SPI slave interface supports that an external host can control the DA16200. The range of the SPI clock speed is the same as that of the internal bus clock speed. The SPI slave supports both the Burst mode and Non-burst mode. In the Burst mode, SPI_CSB remains active from the start to the end of communication. In the Non-burst mode, SPI_CLK remains active at every eight bits. SPI Signals Address Decoder Command Decoder Data Decoder APB bus Controller Figure 26: SPI Slave Block Diagram Communication protocols of the SPI slave interface use either 4-byte or 8-byte control signals. Between the two available communication protocols, the CPU chooses one before initiat ing the control. Figure 27 and Figure 28 shows the 8-byte and 4-byte control types. SPI_CSB SPI_CLK SPI_MOSI A [ 31 : 24 ] A [ 7 : 0 ]A [ 15 : 8 ]A [ 23 : 16 ] C [ 7 : 0 ] L [ 23 : 16 ] L [ 15 : 8 ] L [ 7 : 0 ] D [ 7 : 0 ] D [ 15 : 8 ] D [ 23 : 16 ] D [ 31 : 24 ] Figure 27: 8-byte Control Type SPI_CSB SPI_CLK SPI_MOSI A [ 15 : 8 ] L [ 7 : 0 ]C [ 7 : 0 ]A [ 7 : 0 ] D [ 7 : 0 ] D [ 15 : 8 ] D [ 23 : 16 ] D [ 31 : 24 ] Figure 28: 4-byte Control Type The 8-byte control type uses a 4-byte address, 1-byte control, and 3-byte length. The 4-byte address displays the address of registers subject to internal access. The 1-byte control is for communication control and 3-byte length shows the length of data subject to continuous access in bytes. Hence, when the 8-byte control type is applied, the maximal length of data subject to continuous access is 16 MB. The 4-byte control type uses a 2-byte address, 1-byte control, and 1-byte length. The 2-byte address displays the address of registers subject to internal access. The 1-byte control is for communication control and 1-byte length shows the length of data subject to continuous access in bytes. Since the 32-bit address map is used internally, the 2-byte address is not enough to express everything. Thus, the upper 2-byte base address is designated, and then the lower 2-byte address is used. Table 36 and Table 37 shows the meaning of each bit in the 1-byte control in the 8-byte control type and the 4-byte control type, respectively. Table 36: Control Field of the 8-byte Control Type Control Bit Abr. Description 7 Auto Inc. 1 = Internal Address auto-increment 0 = Address fixed

6 Read/Write 1 = Read 0 = Write

5:0 Not used. Set all bits to ‘0’ Table 37: Control Field of the 4-byte Control Type Control Bit Abr. Description 7 Auto Inc. 1 = Internal address auto-increment 0 = Address fixed

5 Common 1 = Refer base address as common area 0 = Refer base address

4 Length section 1 = Refer to register value 0 = Refer to length field

3:0 Length[12:8] Length field upper Table 38 shows the pin definition of the SPI slave interface. Table 38: SPI Slave Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA2 37 B2 I SPI_CSB GPIOA6 32 E3 I GPIOA3 36 D4 I SPI_CLK GPIOA7 31 E1 I GPIOA1 38 C3 I SPI_MOSI GPIOA9 29 H2 I GPIOA11 27 G1 I GPIOA0 39 A3 O SPI_MISO GPIOA8 30 G3 O GPIOA10 28 F2 O

9.4 SDIO

SDIO is a full/high speed card suitable for memory card and I/O card applications with low power consumption. The full/high speed card supports SPI, 1-bit SD, and 4-bit SD transfer modes at the full clock range of 0 to 50 MHz. To be compatible with the serviceable SDIO clock, the internal BUS clock needs to be set to minimum 50 MHz. The CIS and CSA areas are located inside the internal memory and the SDIO registers (CCCR and FBR) are programmed by the SD host. Command Decoder APB bus Interface REG. Control Fn0 / Fn1 Decoder DAT Decoder Response Generator CRC Generator 2 port Memory DMA Controller Figure 30: SDIO Slave Block Diagram Table 40 shows the pin definition of the SDIO interface. The GPIOA4 and GPIOA5 pins are set to SDIO CMD and CLK by default. If SDIO initialization is done and SDIO communication is enabled, then the SDIO data pin setting is done automatically. In other words, when the SDIO communication is detected, the pin used as the SDIO data among the GPIO pins is automatically activated in the SDIO use mode. However, the auto setting function is not supported for the F_xxx pin used as the flash function. Table 40: SDIO Slave Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA4 34 F4 I/O SDIO_CMD GPIOA5 33 D2 I SDIO_CLK GPIOA9 29 H2 I/O SDIO_D0 GPIOA8 30 G3 I/O SDIO_D1 GPIOA7 31 E1 I/O SDIO_D2 GPIOA6 32 E3 I/O SDIO_D3

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 55 of 94 © 2021 Dialog Semiconductor Figure 31 shows the timing diagram for the SDIO slave. SDIO_CLK SDIO_D[3:0] SDIO_CMD TCO.DLY TDO.DLY TCI.SU TDI.SU Figure 31: SDIO Slave Timing Diagram Table 41 lists the timing parameters for the SDIO slave. Table 41: SDIO Slave Timing Parameters Parameter Symbol Min Typ Max Unit SDIO_CLK frequency FSCLK - - 50 MHz SDIO_CLK clock duty 50 % SDIO_CMD input setup time TCI.SU 3 ns SDIO_CMD output delay time TCO.DLY 11 (Note 1) ns SDIO_D[3:0] input setup time TDI.SU 3 ns SDIO_D[3:0] output delay time TDO.DLY 11 (Note 1) ns Note 1 SDIO signals can set previous output from half cycle.

9.5 I2C Interface

9.5.1 I2C Master

DA16200 includes an I2C master module. Four ranges of clock speed are supported: standard (100 kHz), fast (400 kHz), fast plus (1.0 MHz) and High Speed (3.4 MHz) mode. Table 42 shows the pin definition of the I2C master interface. Table 42: I2C Master Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA1 38 C3 O I2C_CLK GPIOA5 33 D2 O GPIOA9 29 H2 O GPIOA0 39 A3 I/O I2C_SDA GPIOA4 34 F4 I/O GPIOA8 32 G3 I/O

9.5.2 I2C Slave

The I2C slave interface supports that an external host can control the DA16200. The pin mux condition is defined in Table 44. Four ranges of clock speed are supported: standard (100 kHz), fast (400 kHz), fast plus (1.0 MHz) and High Speed (3.4 MHz) mode. Table 44: I2C Slave Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA1 38 C3 I I2C_CLK GPIOA3 36 D4 I GPIOA5 33 D2 I GPIOA7 31 E1 I GPIOA0 39 A3 I/O I2C_SDA GPIOA2 37 B2 I/O GPIOA4 34 F4 I/O GPIOA6 32 E3 I/O Figure 33 shows the I2C slave timing diagram. THD;STA S SDA SCL TR TSU;DAT THIGH TLOW TR THD;DAT TVD;ACK cont. ... ... SDA SCL cont. ... ... TSU;STA THD;STA Sr TBUF P TSU;STO S Figure 33: I2C Slave Timing Diagram Table 45 lists the I2C slave timing parameters. Table 45: I2C Slave Timing Parameters Parameter Symbol Fast Mode High Speed Mode Unit Min Max Min Max SCL clock frequency FSCLK 100 400 100 3400 (Note 2) kHz Clock Duty (Note 1) 40 60 40 60 % Hold time of START THD;STA 0.6 - 0.26 - μs Low period of the SCL clock TLOW 1.3 - 0.15 - μs High period of the SCL clock THIGH 1.2 - 0.14 - μs Setup time for START condition TSU;STA 0.6 - 0.26 - μs

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 58 of 94 © 2021 Dialog Semiconductor Parameter Symbol Fast Mode High Speed Mode Unit Min Max Min Max Data hold time THD;DAT 0 - 0 - μs Data setup time TSU;DAT 0.1 - 0.05 - μs Rise time of both SDA and SCL TR 0.02 0.3 - 0.12 μs Setup time for STOP condition TSU;STO 0.6 - 0.26 - μs Data valid acknowledge time TVD;ACK - - - - μs Buffer free time between START and STOP condition TBUF 1.3 - 0.5 - μs Note 1 Clock duty ratio = (THIGH/TSCLK) × 100[%], TSCLK = 1/FSCLK. Note 2 Max. clock = 3.4 MHz (TSCLK = 294 ns) over 40 MHz of the Fop_clk. Max. clock = 1.0 MHz (TSCLK = 1000 ns) under 40 MHz of the Fop_clk.

9.6 SD/SDeMMC

The SD/eMMC host IP provides the function for DA16200 to access SD or eMMC cards. This SD/eMMC host IP only supports a 4-bit data bus and the maximum clock rate is 50 MHz. The maximum data rate is 25 MB/s (200 Mbps) under the 4-bit data bus and 50 MHz clock. The SD/eMMC pin mux condition is defined in Table 46. Table 46: SD/eMMC Master Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA4 34 F4 I/O SD/eMMC_CMD GPIOA5 33 D2 O SD/eMMC_CLK GPIOA9 29 H2 I/O SD/eMMC_D0 GPIOA8 30 G3 I/O SD/eMMC_D1 GPIOA7 31 E1 I/O SD/eMMC_D2 GPIOA6 32 E3 I/O SD/eMMC_D3 GPIOA10 28 F2 I SD/eMMC_WRP GPIOA1 38 C3 I

9.6.1 Block Diagram

Figure 34 shows the block diagram of the SD/eMMC host IP and includes the control register, clock control, command/response pipe, data pipe, and AHB master interface blocks.

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 59 of 94 © 2021 Dialog Semiconductor AHB Slave Control Registers Data Pipe AHB Master Clock Control HCLK HCMD HDATA[3:0] CMD/RSP Pipe AHB FIFO Figure 34: SD/eMMC Block Diagram Figure 35 shows the timing diagram for the SD/eMMC master. SD/eMMC_CLK SD/eMMC_D[3:0] SD/eMMC_CMD TCO.DLY TDO.DLY TCI.SU TDI.SU Figure 35: SD/eMMC Master Timing Diagram Table 47 lists the timing parameters for the SD/eMMC master. Table 47: SD/eMMC Master Timing Parameters Parameter Symbol Min Typ Max Unit SD/eMMC_CLK frequency FSCLK - - 50 MHz SD/eMMC_CLK clock duty 50 % SD/eMMC_CMD input setup time TCI.SU 8 ns SD/eMMC_CMD output delay time TCO.DLY 3 ns SD/eMMC_D[3:0] input setup time TDI.SU 8 ns SD/eMMC_D[3:0] output delay time TDO.DLY 8 ns

9.7 I2S

DA16200 provides an I2S interface. Once an I2S block receives audio data through the DMA, that audio data is sent to the external port according to the I2S standard. To use the external DAC, output through the GPIO port is possible when a register setting is made according to the pin configuration (Table 48). The I2S also provides a receive function. However, I2S transmission and reception functions cannot be used at the same time. The transmit and receive functions can be selected by register setting. If the I2S signal is input from outside after the reception function is set, the audio signal can be decoded, stored in the FIFO, and read out through the DMA. The decodable reception function provides 8/16/24/32-bit modes and can receive either mono or stereo. Using the I2S clock divider register, the internal PLL clock can be variably applied to the I2S clock source. The available I2S clock source is 24/48 MHz. There is also a way to apply the I2S clock source directly from outside using the GPIO pin. For accurate I2S audio sampling, the I2S clock source can be input to external GPIO pins. It needs to select the GPIO pin setting as the I2S clock input and apply the appropriate clock source. The available I2S clock pins are shown in Table 48.

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 60 of 94 © 2021 Dialog Semiconductor Table 48: I2S Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA1 38 C3 O I2S_MCLK GPIOA5 33 D2 O GPIOA9 29 H2 O GPIOA0 39 A3 O I2S_BCLK GPIOA4 34 F4 O GPIOA8 30 G3 O GPIOA3 36 D4 O I2S_LRCK GPIOA7 31 E1 O GPIOA2 37 B2 I/O I2S_SDO GPIOA6 32 E3 I/O GPIOA3 36 D4 I I2S_CLK_IN GPIOA10 28 F2 I

9.7.1 Block Diagram

I2S has the following features: ■ Master Clock Mode only ■ I2S Data pin can work in either Input mode or Output mode ■ Clock source can be "internal 480 MHz/N" (currently using 24 MHz) or "external clock source" ■ Max Sampling Rate: 48 KHz ■ Mono/Stereo Mode Figure 36: I2S Block Diagram

9.7.2 I2S Clock Scheme

The I2S uses a 24 MHz clock as default from the RF reference clock (40 MHz), so it can support 46.875 KHz of sampling rate. External clock sources are needed to support the standard sampling rate. See Table 49. Figure 37: I2S Clock Scheme Table 49: I2S Clock Selection Guide Parameter Units LRCK Fs 8 12 16 24 32 44.1 46.875 48 KHz Clk Div2 N (=1,2,3…) 6 4 3 2 2 1 1 1 I2S_CLK (Internal PLL)

24.576 MHz

To confirm the exact LRCK operation, drive the Clock source at I2S_CLK.

9.7.3 I2S Transmit and Receive Timing Diagram

I2S output is possible in the following three modes. The main clock (MCLK) always outputs in 512×fs.

I2S Mode LRCK SCLK SDATA MSB -1 -2 -3 +3 +2 +1 LSB MSB -1 -2 -3 -4 +3 +2 +1 LSB Left Channel Right Channel Figure 38: I2S Timing Diagram
Left Justified Mode LRCK SCLK SDATA MSB -1 -2 -3 +3 +2 +1 LSB MSB -1 -2 -3 -4 +3 +2 +1 LSB Left Channel Right Channel Figure 39: Left Justified Mode Timing Diagram
Right Justified Mode LRCK SCLK SDATA 15 14 2 1 0 Left Channel Right Channel 13 15 14 2 1 013 Figure 40: Right Justified Mode Timing Diagram I2S_BCLK I2S_SDO (falling edge) T2 T3 fBCLK I2S_SDO (rising edge) Figure 41: I2S Transmit Timing Diagram T4 T2T3 fBCLK I2S_BCLK I2S_SDO Figure 42: I2S Receive Timing Diagram

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 63 of 94 © 2021 Dialog Semiconductor Table 50: I2S Transmit Timing Parameters Description Timing Min Typ Max Unit I2S_BCLK frequency fBCLK - 3.072 MHz High period of the BCLK clock T2 - ½ fBCLK ns Low period of the BCLK clock T3 - ½ fBCLK ns I2S_SDO output hold (falling edge) T4 160 - ns I2S_SDO output hold (rising edge) T5 160 - ns Table 51: I2S Receive Timing Parameters Description Timing Min Typ Max Unit I2S_BCLK frequency fBCLK - 3.072 MHz High period of the BCLK clock T2 - ½ fBCLK ns Low period of the BCLK clock T3 - ½ fBCLK ns I2S_SDO input setup time T4 15 - ns I2S_SDO input hold time T5 60 - ns

9.8 ADC (Aux 12-bit)

9.8.1 Overview

DA16200 includes a high precision, ultra-low power, and wide dynamic range SAR ADC with a 12-bit resolution. It has a 4-channel single-end ADC. Analog input is measured by four pins from GPIOA0 to GPIOA3, and pin selection is changed through the register setting. Figure 43 shows the control block diagram. ADC 12b Max : 1Ms Counter 16-bit ADC Controller Ready CH_SEL SWITCH VI_N[1] VI_N[2] VI_N[3] VI_N[4] Switch Figure 43: ADC Control Block Diagram

9.8.2 Timing Diagram

The input is digitized at a maximum of 1.0 Msps throughput rate. And the maximum input clock rate is 15 MHz. Figure 44 shows the conversion timing, and Table 52 describes the DC specifications. Figure 44: 12-bit ADC Timing Diagram CLK 15MHz SAMPLE CLKOUT AUXADC_EN OSC_EN D<11:0> 15*CLK N 15*CLK N+1 15*CLK N+2 15*CLK N+3 15*CLK N+4 N N+1 N+2 N+3 15*CLK

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 65 of 94 © 2021 Dialog Semiconductor Table 52: DC Specification Description Min Typ Max Unit Resolution 4 12 12 Bits Max clock input 15 MHz Conversion frequency 1 MHz Accuracy:

SNR
SNDR
67.2
61.7
dB
dB Analog input voltage 0 1.4 V Reference voltage 0.7 V Input tolerance (approximately) 10 mV

9.8.3 DMA Transfer

There are four ADC channel settings available. Once the input data of each channel reaches the FIFO level, it is possible to read the data through the DMA path.

9.8.4 Sensor Wake-up

The DA16200 has an external sensor wake-up function that uses the analog input signal through an Aux ADC. Even in Sleep modes, it detects the change of an external analog signal, wakes up from Sleep mode, and converts the DA16200 into a normal operation. This function can be used in up to four channels. Also, when multiple external sensors are used, analog signals are detected while the channel are automatically changed. For example, if all four channels are set as input sources which have their threshold register respectively, the channels are measured sequentially from 0 to 3. If one of the four values exceeds the allowed range of values set by the threshold register, the DA16200 awakes from the Sleep mode. The value setting of the input change can be either over threshold or under threshold.

9.8.5 ADC Ports

Table 53 shows the pin definition of the ADC. Table 53: ADC Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOA3 36 D4 A Analog signal GPIOA2 37 B2 A Analog signal GPIOA1 38 C3 A Analog signal GPIOA0 39 A3 A Analog signal

9.9 GPIO

All digital pads can be used as GPIO, and each GPIO port is mixed with a multi-functional interface. The GPIO features of DA16200 are listed below: ■ Input or output lines in a programmable direction ■ Word and half word read/write access ■ Address-masked byte writes to facilitate quick bit set and clear operations ■ Address-based byte reads to facilitate quick bit test operations ■ Maskable interrupt generation based on input value change ■ Possible to be output signal of PWM[3:0], external interrupt, QSPI_CSB[3:1], RF_SW[1:0], and UART_TXDOE[2:0] on the GPIO pins: □ It provides special functions for GPIO pin use. PWM [3:0], external interrupt, QSPI_CSB [3:1], RF_SW [1:0], and UART_TXDOE [2:0] signals can be output by selecting unused pins among the GPIO pins. It is possible to select the function to be output from the GP IO register setting and select the remaining GPIO pin without using it to output the specific function to the desired GPIO pins

9.9.1 Antenna Switching Diversity

DA16200 provides the antenna switching diversity function for performance improvement in a multi- path environment. A PHY block measures the RSSI of each antenna and selects the antenna with the largest RSSI. The selected antenna is also used for transmission. To use this function, an external switching element is required, and switching control is done through the GPIO. Two GPIOs can be used for switching control, and for this purpose any unused pins among the GPIO pins can be selected. The control signal can be changed by register setting to suit the external switching device. RF Switch DA16200 GPIO ANT Antenna1 Antenna2 Figure 45: Antenna Switching Internal Block Diagram

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 67 of 94 © 2021 Dialog Semiconductor If the Antenna Switching Diversity function is enabled, the function is automatically done by PHY hardware block. The basic operation scheme is as follows:

The antenna's RSSI decision is made for 11b PPDU, except for 11g/n PPDU
When PHY hardware detects the existence of 11b PPDU, it stores the RSSI
After the switch to another antenna, the RSSI is stored and a decision is made about which antenna has better RSSI
This operation is done during 11b PPDU's preamble duration to protect corruption of 11b PPDU data reception
The decided antenna is not changed until there is a new 11b PPDU 11b PPDU Preamble Header PSDU 1Antenna 2 Time 11g/n PPDU 1 2 11b PPDU Preamble Header PSDU Example case when RSSI of Antenna 2 is higher Figure 46: Antenna Switching Timing Diagram For reference, this antenna switching diversity is different from MRC (Maximum Ratio Combining).

9.10 UART

DA16200 provides three UARTs, features of which are described below: ■ Programmable use of UART (UART1 and UART2) ■ Compliance to the AMBA AHB bus specification [7] for easy integration into SoC implementation ■ Supports both byte and word access for reduction of bus burden ■ Supports both RS-232 and RS-485 ■ Separate 32×8 bit transmit and 32×12 bit receive FIFO memory buffers to reduce CPU interrupts ■ Programmable FIFO disabling for 1-byte depth ■ Programmable baud rate generator ■ Standard asynchronous communication bits (start, stop, and parity), which are added prior to transmission and removed on reception ■ Independent masking of transmit FIFO, receive FIFO, and receive timeout ■ Supports for DMA ■ False start bit detection ■ Programmable flow control (CTS/RTS, UART1) ■ Fully programmable serial interface characteristics: □ Data can be of 5, 6, 7, or 8 bits □ Even, odd, stick, or no-parity bit generation and detection □ 1- or 2- stop bit generation □ Baud rate generation

9.10.1 RS-232

As the serial communication between the UART and the selected device is asynchronous, additional bits (start and stop) are inserted into the data line to indicate the beginning and end. With these bits, two devices can be synchronized. This structure of serial data accompanied by start and stop bits is referred to as a character, as shown in Figure 48. Data Start Bit Time Data bits 5 - 8 Parity 1- or 2-Stop One Character Figure 48: Serial Data Format An additional parity bit may be added to the serial character. This bit appears between the last data bit and the stop bit(s) in the character structure. It provides the UART with the ability to do simple error checking on the received data. The UART Line Control Register is used to control the serial character characteristics. The individual bits of the data word are sent after the start bit, starting with the least significant bit (LSB). These are followed by the optional parity bit, followed by the stop bit(s), which can be 1 or 2. Serial Data In 8 16 16 Start Data Bit 0 (LSB) Data Bit 1 Figure 49: Receiver Serial Data Sampling Points All the bits in the transmission are transmitted for exactly the same time duration. This is referred to as a Bit Period or Bit Time. One Bit Time equals 16 baud clocks. To ensure stability on the line, the receiver samples the serial input data at approximately the mid-point of the Bit Time, once the start bit has been detected. As the exact number of baud clocks that each bit was transmitted for is known, calculating the mid-point for sampling is not difficult, that is every 16 baud clocks after the mid-point sample of the start bit. Figure 49 shows the sampling points of the first couple of bits in a serial character.

9.10.2 RS-485

DA16200 UART supports RS-485. A UART485EN register (0x054) is required to be assigned to enable the RS-485. In order to use RS-485, an additional signal (UARTTXDOE) is required to notice TXD intervals. This signal can be an output by selecting any of the unused GPIO pins. Figure 50: UARTTXDOE Output Signal for UART RS-485

9.10.3 Baud Rate

The UART clock frequency (FUARTCLK) is fixed at 80 MHz. The Baud Rate Divisor can be calculated as (FUARTCLK / (16 x Baud Rate)). The Baud Rate Divisor is comprised of the integer part (UART_INTBRDIV) and fractional part (UART_FRABRDIV). The maximum baud rate of DA16200 UART is 2.5 MBaud. The example below shows how to calculate the divisor value. If the required baud rate is 921600 with 80 MHz FUARTCLK, the Baud Rate Divisor becomes: (8 x 107) / (16 x 921600) = 5.425. This means that the integer value is 5 and the fractional value is 0.425. Then, the fraction part becomes integer ((0.425 x 64) + 0.5) = 27. Then, the generated baud rate divider is 5 + 27/64 = 5.422. Finally, the generated baud rate becomes (8 x 107) / (16 x 5.422) = 922169. And the error between the required baud rate and the generated baud rate is: (922169 – 921600) / 921600 x100 = 0.062 %

9.10.4 Hardware Flow Control

The hardware flow control feature is fully selectable, and serial data flow is controlled by using nUARTRTS output and nUARTCTS input signals. Figure 51 shows how two different UARTs can communicate using hardware flow control. Figure 51: UART Hardware Flow Control When RTS flow control is enabled, nUARTRTS signal is asserted until the receive FIFO is filled up to programmed level. When CTS flow control is enabled, the transmitter can transmit the data when the nUARTCTS signal is asserted. CTSEn (CTS enable) and RTSEn (RTS enable) bits are determined by 14th (RTS) and 15th bit (CTS) of UARTCR register. Table 54: Control Bits to Enable and Disable Hardware Flow Control CTSEn RTSEn Description 1 1 Both RTS and CTS flow control are enabled 1 0 Only CTS flow control is enabled 0 1 Only RTS flow control is enabled 0 0 Both RTS and CTS flow control are disabled

9.10.5 Interrupts

The DA16200 UART block provides five interrupt signals by separate interrupt lines. Each interrupt conditions are Modem Status, Receive FIFO Request, Transmit FIFO Request, Receive Timeout and Reception Error. These conditions are logically ORed to provide a single combined interrupt, UARTINTR. Table 55 shows the interrupt signals. Table 55: UART Interrupt Signals Signal Name Description UARTMSINTR UART Modem Status Interrupt UARTRXINTR UART Receive FIFO Interrupt UARTTXINTR UART Transmit FIFO Interrupt UARTRTINTR UART Receive Timeout Interrupt UARTEINTR UART Error Interrupt UARTINTR UART Interrupt. Five Interrupt signals are combined by OR function

9.10.6 DMA Interface

The DA16200 UART block can generate DMA request signals with register settings by using a DMA interrupt generator module to connect to DA16200 DMA Controller (DMA1). The DMA operation of the UART is controlled with the DMA Control Register. The DA16200 UART provides four DMA signals and receives two DMA signals, two signals to transmit (TXDMASREQ, TXDMABREQ), which are cleared by a TX clear signal (TXDMACLR) and two signals to receive (RXDMASREQ, RXDMABREQ), which are cleared by a RX clear signal (RXDMACLR). When the DMA interface is not used, the TXDMACLR and RXDMACLR lines should be connected to a logic 0. Table 56 shows the pin definition of the UART interface. Table 56: UART Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP UART0_RXD 12 M10 I UART0_RXD UART0_TXD 11 L9 O UART0_TXD GPIOA7 31 E1 I UART1_RXD GPIOA5 33 D2 I GPIOA3 36 D4 I GPIOA1 38 C3 I GPIOA6 32 E3 O UART1_TXD GPIOA4 34 F4 O GPIOA2 37 B2 O GPIOA0 39 A3 O GPIOA5 33 D2 I UART1_CTS GPIOA4 34 F4 O UART1_RTS GPIOA11 27 G1 I UART2_RXD GPIOC7 9 K12 I

9.11 PWM

Pulse Width Modulation (PWM) is a modulation technique used to encode a message into a pulse signal. The blocks are designed to adjust output pulse duration by the CPU bus clock (HCLK). Figure 52 shows the structure of the PWM block. AHB Bus Matrix PWM OUTPWM Block 0 Counter (Period) Register Counter (High Duty) PWM Block 1 Counter (Period) Register Counter (High Duty) PWM Block 2 Counter (Period) Register Counter (High Duty) PWM Block 3 Counter (Period) Register Counter (High Duty) PWM OUT PWM OUT PWM OUT HCLK Counter Register AHB Bus Figure 52: PWM Block Diagram Table 57 shows the pin definition of the PWM interface. GPIOx means that PWM signals can go out through any GPIO pins via a register setting. Table 57: PWM Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP GPIOx PWM[3:0] output

9.11.1 Timing Diagram

Table 58 shows the relation between the internal bus clock and PWM output wave patterns. Figure 53 shows the conversion timing diagram. a and b can be adjusted through the register setting, and PWM wave patterns vary depending on the ratio. a controls the high width of pulses (nCycle High), while b controls the general cycle (nCycle Period). PWM a b BUS CLK Figure 53: PWM Timing Diagram Table 58: PWM Timing Diagram Description Time Description a Bus Clock Period × (nCycle High + 1) b Bus Clock Period × (nCycle Period + 1)

9.12 Debug Interface

DA16200 supports both IEEE Standard 1149.1 JTAG (5-wire) and the low-pin-count Arm SWD (2- wire, TCLK/TMS) debug interfaces. The SWD protocol can handle the same debug features as the JTAG. The JTAG port is an IEEE standard that defines a test access port (TAP) and boundary scan architecture for digital integrated circuits and provides a standardized serial interface to control the associated test logic. For detailed information on the operation of the JTAG port and TAP controller, see Ref. [5]. Figure 54 shows the JTAG timing diagram. Figure 54: JTAG Timing Diagram

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 74 of 94 © 2021 Dialog Semiconductor Table 59 shows the JTAG timing parameters. Table 59: JTAG Timing Parameters Parameter Number Parameter Parameter Name Min Max Unit J1 fTCK Clock Frequency 15 MHz J2 tTCK Clock Period 1/fTCK ns J3 tCL Clock Low Period tTCK/2 ns J4 tCH Clock High Period tTCK/2 ns J7 tTMS_SU TMS Setup Time 1 J8 tTMS_HO TMS Hold Time 16 J9 tTDI_SU TDI Setup Time 1 J10 tTDI_HO TDI Hold Time 16 J11 tTDO_HO TDO Hold Time 15 Table 60 shows the pin definition of the JTAG interface. Table 60: JTAG Pin Configuration Pin Name Pin Number I/O Function Name QFN fcCSP TMS 6 J11 I/O Data TCLK 7 J9 I Clock GPIOC8 8 K10 I TDI: Data Input GPIOC7 9 K12 O TDO: Data Output GPIOC6 10 L11 I nTRST: Reset

9.13 Bluetooth Coexistence

DA16200 provides the Bluetooth coexistence function to be properly aligned with external devices activated at 2.4 GHz.

9.13.1 Interface Configuration

The following three pins can be set in pin multiplexing:

BT_sig0 (oWlanAct) ○ It indicates that Output, WLAN is currently active
BT_sig1 (iBtAct) ○ It indicates that Input, BT/BLE is currently active
BT_sig2 (iBTPri) ○ It indicates that Input (Optional), BT/BLE has a higher priority A variety of configurable settings are available, including active high/low, manual force mode, use status of the optional iBTPri function, and whether or not to switch oWlanAct to active in the event of TX/RX/TRX. oWlanAct iBtAct iBtPri DA16200 BT/BLE Figure 55: Bluetooth Coexistence Interface

9.13.2 Operation Scenario

The Bluetooth coexistence can be turned on/off by the configurable register, and the activation scenarios based on the status of each pin are described below:

BT_sig0 (oWlanAct) ○ When asserted, external BT/BLE is expected to stop occupying RF
BT_sig1 (iBtAct) ○ When asserted, DA16200 stops occupying RF
BT_sig2 (iBTPri) ○ It is optional and thus may not be used ○ If it is used and DA16200’s iBtAct = Active while iBTPri = Non-Active, DA16200 may ignore iBtAct

10 Applications Schematic

10.1 Typical Application: QFN, 3.3 V Flash Figure 56 shows the schematics for an application that uses the DA16200 in 3.3 V Flash mode. VSS VDD_ANA RBIAS RF_XI RF_XO TMS TCLK GPIOC8 GPIOC7 GPIOC6 UART_TXD UART_RXD VDD_DIO2 F_IO0 F_IO1 F_IO2 F_IO3 F_CSN F_CLK VDD_FDIO FDIO_LDO_OUT VDD_DIG RTC_WAKE_UP2 VBAT GPIOA3 VDD_DIO1 GPIOA4 GPIOA5 GPIOA6 GPIOA7 GPIOA8 GPIOA9 GPIOA10 GPIOA11 DCDC_FB DCDC_LX DA16200 QFN VBAT (3.3V) C4 C5 C10C11 C13 R3 C12 RTC_GPO (High/Low)U1 RF1 C17 C19C18 C15 VDD_DIO2 (1.8V ~ 3.3V) VDD_DIO1 (1.8V ~ 3.3V) VDD_FDIO ( Connect to External Flash) Note: Remove R3 and C12 when MCU controls RTC_PWR_KEY Figure 56: Typical Application – QFN, 3.3 V Flash The power supply of the External Flash memory is the same as VDD_FDIO. VDD_DIO1/2 can be connected to the same power source as the external component that is connected to the DA16200. Remove R3 and C12 when MCU control ‘RTC_PWR_KEY’. Table 61 lists the components for an application that uses the DA16200 QFN in 3.3 V Flash mode.

1 R1 30 kΩ (1 %)

2 C2, C3 1.2pF These values may be changed by crystal component characteristics and board condition. Part: FCX-07L

5 C1, C4, C5, C7, C9 1µF

1 C6 470nF

1 R2 10 kΩ

1 L1 4.7µH LQM21PN4R7MGH (Murata)

1 C8 10µF

2 C10, C11 15pF

These values may be changed by crystal component characteristics and board condition. Part: TFX-03

1 R3 470 kΩ

Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. For detail information, see Section 6.1

1 C12 1uF

1 C15 DNI Optional

1 L3 2.2 nH 1 C17 0.5pF Optional

2 C18, C19 1pF Optional

1 L2 1.8nH Optional

1 U1 Optional, load switch for disconnecting VBAT for

VDD_FDIO (Use any 5 % tolerance) Table 62: IO Power Domain IO Power Domain VDD_DIO1 GPIOA[11:0] VDD_DIO2 GPIOC[8:6], TMS, TCLK, UART_TXD, UART_RXD VDD_FDIO F_IO[3:0], F_CSN, F_CLK

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 79 of 94 © 2021 Dialog Semiconductor Table 63: Component for DA16200 QFN, 1.8 V Flash Mode Quantity Part Reference Value Description 2 C2, C3 1.2 pF These values may be changed by crystal component characteristics and board condition. Part: FCX-07L

5 C1, C4, C5, C7, C9 1 µF

1 C6 470 nF

1 L1 4.7 µH LQM21PN4R7MGH (Murata)

1 C8 10 µF

2 C10, C11 15 pF

These values may be changed by crystal component characteristics and board condition. Part: TFX-03 Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. For detail information, see Section 6.1 Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. Not to exceed 1uF. For detail information, see Section 6.1 2 R4, R5 4.7 kΩ 1 C13 4.7 µF 1 L3 2.2 nH 1 C17 0.5 pF Optional

2 C18, C19 1 pF Optional

1 L2 1.8 nH Optional (Use any 5 % tolerance) Table 64: IO Power Domain IO Power Domain VDD_DIO1 GPIOA[11:0] VDD_DIO2 GPIOC[8:6], TMS, TCLK, UART_TXD, UART_RXD VDD_FDIO F_IO[3:0], F_CSN, F_CLK

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 81 of 94 © 2021 Dialog Semiconductor Table 65: Component for DA16200 fcCSP, 1.8 V Flash, Normal Power Mode Quantity Part Reference Value Description 2 C2, C3 1.2 pF These values may be changed by crystal component characteristics and board condition. Part: FCX-07L

4 C1, C4, C5, C9 1 µF

1 C7 2.2 µF 1 L1 4.7 µH LQM21PN4R7MGH (Murata)

2 C10, C11 15 pF These values may be changed by crystal component

characteristics and board condition. Part: TFX-03 1 R3 470 kΩ Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. For detail information, see Section 6.1

1 C12

Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. Not to exceed 1uF. For detail information, see Section 6.1 1 R4, R5 4.7 kΩ 1 C13 4.7 µF 1 C15 0.5 pF Normal power mode 1 L3 2.7 nH Normal power mode 1 C17 0.5 pF Optional 1 L2 1.8 nH Optional (Use any 5 % tolerance) Table 66: IO Power Domain IO Power Domain VDD_DIO1 GPIOA[11:0] VDD_DIO2 GPIOC[8:6], TMS, TCLK, UART_TXD, UART_RXD VDD_FDIO (Note 1) F_IO[3:0], F_CSN, F_CLK Note 1 VDD_FDIO is internally connected to FDIO_LDO_OUT.

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 83 of 94 © 2021 Dialog Semiconductor Table 67: Component for DA16200 fcCSP, 1.8 V Flash, Low Power Mode Quantity Part Reference Value Description 2 C2, C3 1.2 pF These values may be changed by crystal component characteristics and board condition. Part: FCX-07L 1 C7 2.2 µF 1 L1 4.7 µH LQM21PN4R7MGH (Murata) characteristics and board condition. Part: TFX-03 1 R3 470 kΩ Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. For detail information, see Section 6.1 Remove when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. Not to exceed 1uF. For detail information, see Section 6.1 1 R4, R5 4.7 kΩ 1 C13 4.7 µF

1 C15 DNI Low power mode

1 L3 2.2 nH Low power mode 1 C17 0.5 pF Optional 1 L2 1.8 nH Optional (Use any 5 % tolerance) Table 68: IO Power Domain IO Power Domain VDD_DIO1 GPIOA[11:0] VDD_DIO2 GPIOC[8:6], TMS, TCLK, UART_TXD, UART_RXD VDD_FDIO (Note 1) F_IO[3:0], F_CSN, F_CLK Note 1 VDD_FDIO is internally connected to FDIO_LDO_OUT.

11.1 Moisture Sensitivity Level (MSL)

The MSL is an indicator for the maximum allowable time period (floor life time) in which a moisture sensitive plastic device, once removed from the dry bag, can be exposed to an environment with a maximum temperature of 30 °C and a maximum relative humidit y of 60 % RH before the solder reflow process. QFN and fcCSP packages are qualified for MSL 3. MSL Level Floor Life Time MSL 4 72 hours MSL 3 168 hours MSL 2A 4 weeks MSL 2 1 year MSL 1 Unlimited at 30 °C/85 %RH

11.2 Top View: QFN and fcCSP

Figure 60: DA16200 48-Pin QFN Package Figure 61: DA16200 72-Pin fcCSP Package

11.3 Dimension: 48-Pin QFN

Figure 62: Top View Figure 63: Bottom View Figure 64: Side View Figure 65: DA16200 48-Pin QFN Package Dimensions

11.4 Dimension: 72-Pin fcCSP

Figure 66: Top View Figure 67: Bottom View Figure 68: Side View Figure 69: DA16200 72-Pin fcCSP Package Dimensions

11.5 Land Pattern: 48-Pin QFN

Unit: Millimeters (mm) Pad: Metal mask = 1:1 4.66.6 0.4 0.22 4.6 6.6 0.7 1324 37 48 0.3 Figure 70: DA16200 48-Pin QFN Land Pattern

11.6 Land Pattern: 72-Pin fcCSP

Unit: Millimeters (mm) Pad: Metal mask = 1:1 Figure 71: DA16200 72-Pin FcCSP Land Pattern A B C D E F G H J K L M 1 2 3 4 5 6 7 8 9 10 1112 0. 4 0. 25 3. 83. 11 3. 11 3. 8

11.7 Soldering Information

11.7.1 Recommended Condition for Reflow Soldering

Figure 72 shows the typical process flow to install surface mount packages to the PCB. The reflow profile depends on the solder paste being used and the recommendations from the paste manufacturer should be followed to determine the proper reflow profile. Figure 72 shows a typical reflow profile when a no-clean paste is used. Oven time above liquidus (260 °C for lead-free solder) is 30 to 60 seconds. Since solder joints are not exposed in QFN packages, any retouch is not possible and the whole package has to be removed if the surface mount process results in shorts or opens. Furthermore, rework of QFN packages can be a challenge due to their small size. In most applications, QFNs will be installed on smaller, thinner, and denser PCBs, and introduces further challenges due to handling and heating issues. Since reflow of adjacent parts is not desirable during rework, the proximity of other components may further complicate this process. Because of the product dependent complexities, the following steps only provide a guideline and a starting point for the development of a successful rework process for the QFN packages. The rework process involves the following steps: 1. Component removal 2. Site redress 3. Solder paste application 4. Component placement 5. Component attachment Figure 72: Typical PCB Mounting Process Flow

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 90 of 94 © 2021 Dialog Semiconductor Table 69: Typical Reflow Profile (Lead Free): J-STD-020C Profile Feature Lead Free SMD Average ramp up rate (Tsmax to Tp) 3 °C/s Max. Preheat

Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (Tsmax to Tsmin)
150 °C
200 °C
60 to 180 seconds Time maintained above
Temperature (TL)
Time (tL)
217 °C
60 to 150 seconds Peak/Classification temperature (Tp) 260 °C Time within 5 °C of peak temperature (tp) 20 to 40 seconds Ramp down rate 6 °C/s Max. Time from 25 °C to peak temperature 8 minutes Max. Figure 73: Reflow Condition

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 91 of 94 © 2021 Dialog Semiconductor The ordering number consists of the part number followed by a suffix indicating the packing method. For details and availability, please consult Dialog Semiconductor’s customer support portal or your local sales representative. Table 70: Ordering Information (Samples) Part Number Package Size (mm) Shipment Form Pack Quantity DA16200-00000A32 QFN48 6 × 6 Reel 100/500 DA16200-00000F22 fcCSP72 3.8 × 3.8 Reel 100/500 Table 71: Ordering Information (Production) Part Number Package Size (mm) Shipment Form Pack Quantity DA16200-00000A32 QFN48 6 × 6 Reel 3000 DA16200-00000F22 fcCSP72 3.8 × 3.8 Reel 4000 Part Number Legend: DA16200-RRXXXYYZ RR: Chip revision number XXX: variant (000: No Flash) YY: package code (A3: QFN48, F2: fcCSP72) Z: packing method (1: Tray, 2: Reel, A: Mini-Reel)

Revision History

3.3 03-Fab-2021

Table 1 Updated Pinout Description
Section 6.1 Added Note for Power on Sequence and Updated Table 26 and Figure 11
Section 9.7.3 Fixed typo
Section 10 Updated RC Delay Description (Table 61, Table 63, Table 65, Table 67 and Figure 56, Figure 57, Figure 58, Figure 59) 3.2 28-Sep-2020
Section 6.3 Updated Sleep mode Description
Removed F_xx pins in Interface Parts
Section 4.3 (Table 3) Updated Pin Multiplexing
Section 9.8 (Table 52) Updated ADC Reference Voltage
Section 9.5.1 and 9.5.2 Updated I2C Speed Description
Section 9.5 Updated I2C interface (Table 43) and (Table 45)
Section 9.7.1 and 9.7.2 Added, I2S Description, Block Diagram, and Clock Scheme
Section 9.8.2 Table 52 Swapped SNDR, SNR value 3.1 3-Jul-2020
Section 3, Modified Description to Network subsystem layer.
Section 3, Figure 2 Modified Hardware Block diagram
Section 4.2 (Table 1), Reset state changed to Initial state.
Section 4.3 (Table 3) Updated Pin multiplexing.
Section 5.2 (Table 5) Updated FDIO_LDO_OUT value
Section 5.3 Updated Electrical Characteristics
Section 5.4.2 (Table 14) Updated fcCSP TX min/max value
Section 5.5 Updated Current Consumption value
Section 6.2 Added Description and Updated Power management block diagram (Figure 12).
Section 6.3 Updated Sleep mode Description
Section 7.4 (Table 28) Updated RTC_PWR_KEY description and Remove one sentence which leads to misunderstanding.
Section 9.5.1 (Table 43),(Table 45) Updated I2C Speed
Section 9.9.1 Added Diversity Description and (Figure 46)
Section 9.10.3 Added UART Baud rate Description
Section 10.1, 10.2 Updated QFN Application Schematic (Figure 56),(Figure 57) and Description.
Section 10.3, 10.4 Updated fcCSP Application Schematic (Figure 58),(Figure 59) and Description, (Table 65),(Table 67). And Added note after table IO Power Domain
Page 93 Updated Description about Reach and RoHS Compliance 3.0 26-Mar-2020 ● Final release

Feature, Wi-Fi Alliance certification: Detailed added
Section 5.4.1 and 5.4.2 measurement condition CH1 added
Section 9.10.1 RS-232 added
Section 9.10.3 Hardware Flow Control added
Section 9.10.4 Interrupts added
Table 3 Pin Multiplexing changed
Section 11.1 MSL added
Figure 54. DA16200 fcCSP Package Top view added
Application circuit (QFN, fcCSP) BOM changed
Feature deleted: DPD function support
Rx and Tx min/max value added for the QFN package (Table 12 and Table 14)
Rx and Tx min/max value added for the fcCSP package (Table 13 and Table 15)
Table 17 and Table 20 updated
ESD ratings added for the QFN and fcCSP packages in Table 21 and Table 22 2.3 5-Sep-2019
Pin name "RTC_SEN_OUT" changed to "RTC_GPO"
Pull-down resistor added in Figure50, Figure51, Figure52
QFN48 package "RTC_WAKE_UP" and "RTC_WAKE_UP2"
fcCSP72 package "RTC_WAKE_UP"
Ordering information sample and production pack quantity updated
Application circuit revised in QFN and fcCSP package
RTC_WAKE_UP pull-down resistor added 2.2 12-Aug-2019
Added Figure 71: DA16200 72-Pin fcCSP Land Pattern
AC characteristics and current consumption of fcCSP data updated in Table 13, Table 15, and Table 18
Ordering information added 2.1 30-Jul-2019
Added "3.8 mm × 3.8 mm, 0.4 mm pitch, 72-Pin, fcCSP" in package type in key features
Added Figure 5, Figure 8, and Figure 10
Added pin numbers for fcCSP package in Table 1, Table 28, Table 34, Table 38, Table 40, Table 42, Table 44, Table 46, Table 48, Table 53, Table 56, and Table 60
Added "GPIOC6~GPIOC8, TMS/TCLK, TXD/RXD" in the description of Pin13/M8 in Table 1
Added "GPIOA0~GPIOA11" in the description of Pin35/C1 in Table 1
Added "fcCSP GND Pin A1,A9,B6,B10,B12,C7,C9,C11,D8,D10,F6,F8,F10,F12,G5,G7,G9, H4,H8,H10,J3,K2,L5,M6,M12,E5" in Table 1
In Table 3 SPI master contents updated
Added information on fcCSP pins in section 5.1 and 5.2
Added Table 13, Table 15, and Table 18
Added section 10.3
Updated section 11.1 to include information on fcCSP
Added section 11.4
Changed the caption of Table 27 to "OTP Map" 2.0 03-Jul-2019 Preliminary datasheet

Datasheet Revision 3.3 03-Feb-2021 CFR0011-120-00 94 of 94 © 2021 Dialog Semiconductor Status Definitions Revision Datasheet Status Product Status Definition 1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.dialog-semiconductor.com. 4.<n> Obsolete Archived This datasheet contains the specifications for discontinued products. The information is provided for reference only. Disclaimer Unless otherwise agreed in writing, the Dialog Semiconductor products (and any associated software) referred to in this docum ent are not designed, authorized or warranted to be suitable for use in life support, life -critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Dialog Semiconductor product (or associated software) can reasonably be expected to result in personal injury, death or severe property or environmental damage. Dialog Semiconductor and its suppliers accept no liability for inclusion and/or use of Dialog Semiconductor products (and any associated software) in such equipment or applications and therefore such inclusion and/or us e is at the customer’s own risk. Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any represent ations or warranties, express or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in this document if provided by any information source outside of Dialog Semiconduc tor. Dialog Semiconductor reserves the right to change without notice the information published in this document, includin g, without limitation, the specification and the design of the related semiconductor products, software and applications. Notwithstanding the foregoing, for any automotive grade version of the device, Dialog Semiconductor reserves the right to change the i nformation published in this document, including, without limitation, the specification and the design of the related semiconductor products, software and applications, in accordance with its standard automotive change notification process. Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semi conductor makes no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sole responsibility of the c ustomer and Dialog Semiconductor excludes all liability in this respect. Nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor. All use of Dialog Semiconductor products, software and applications referred to in this document is subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated. Dialog, Dialog Semiconductor and the Dialog logo are trademarks of Dialog Semiconductor Plc or its subsidiaries. All other pr oduct or service names and marks are the property of their respective owners. © 2021 Dialog Semiconductor. All rights reserved. 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Selected Specification

Dialog Semiconductor DA16200-00000A32 overview.

Summary

Ultra Low Power Wi-Fi SoC

Description

Ultra Low Power Wi-Fi SoC

Source title DA16200-00000A32 Datasheet(PDF) - Dialog Semiconductor

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