CT100

CT100 ALLEGRO

Document overview

• Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
• PDF pages: 14

Technical content

955 Perimeter Road

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com SELECTION GUIDE Part Number Operating Temperature Range (°C) Output Type Package Packing CT100LW-IS6 –40 to 85 Differential 6-lead SOT23 2.90 mm × 2.80 mm × 1.20 mm Tape and ReelCT100LW-HS6 –40 to 125 CT100LW-FS6 –40 to 150 CT100LW-ID6 –40 to 85 Differential 6-lead DFN 1.50 mm × 1.50 mm × 0.45 mm Tape and ReelCT100LW-HD6 –40 to 125 CT100LW-FD6 –40 to 150 CT100LW-KGD –40 to 150 Differential Wafer Form Unsawn Wafer ABSOLUTE MAXIMUM RATINGS [1] Characteristic Symbol Notes Rating Unit Supply Voltage Strength VDD –0.3 to 6.0 V Analog Output Pins Maximum Voltage VOUT ±1560 mV Electrostatic Discharge Protection Level ESD Human Body Model (HBM) per JESD22-A114 ±4.0 (min) kV Charged Device Model (CDM) per JESD22-C101 ±1.0 (min) kV Maximum Magnetic Field BMAX TA = 25°C ±200 mT Storage Temperature TSTG –65 to 160 °C Lead Soldering Temperature TL 10 seconds 260 °C [1] Stresses exceeding the absolute maximum ratings may damage the CT100 and may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. RECOMMENDED OPERATING CONDITIONS [1] Characteristic Symbol Notes Min. Typ. Max. Unit Supply Voltage Range VDD 1.0 3.0 5.5 V Output Voltage Range VOUT –1430 – 1430 mV Operating Magnetic Field BOP – – ±50 mT Operating Ambient Temperature TA Industrial –40 25 85 °C Extended Industrial –40 25 125 °C Full Range –40 25 150 °C [1] The Recommended Operating Conditions table defines the conditions for actual operation of the CT100. Recommended operating conditions are specified to ensure optimal performance to the specifications. Allegro does not recommend exceeding them or designing to absolute maximum ratings. Table of Contents

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Terminal List Number Name Function

1 X2 Differential Output X2

2 N/C No Connect

3 X1 Differential Output X1

4 GND Ground

5 N/C No Connect

6 VDD Supply Voltage

PINOUT DIAGRAMS AND TERMINAL LISTS Figure 3: SOT23-6 Package, Top-Down View Figure 4: CT100 Axis of Sensitivity for SOT23-6 (Top Down View)

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Figure 5: DFN-6,Top-Down View Figure 6: DFN-6, Bottom-Up View Terminal List Number Name Function

1 VDD Supply Voltage

3 GND Ground

4 X1 Differential Output X1

6 X2 Differential Output X2

Figure 7: CT100 Axis of Sensitivity for DFN-6 (Top Down View)

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Pad List Number Name Function

2 X2 Differential Output X2

Figure 8: CT100 Die Layout and Axis of Sensitivity, Top-Down View

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com ELECTRICAL CHARACTERISTICS: Valid for VDD = 1.0 V to 5.5 V and TA = –40°C to 150°C, typical values are VDD = 3.0 V and TA = 25°C, unless otherwise specified Characteristics Symbol Test Conditions Min. Typ. Max. Unit MAGNETIC Operating Magnetic Field BOP – – ±50 mT ELECTRICAL Bridge Resistance RBRIDGE 20 – 40 kΩ Power Consumption PD VDD = 3.0 V, RBRIDGE = 30 kΩ – 0.30 – mW Offset Voltage VOFFSET BOP = ±20 mT –5 +5 mV/V Sensitivity (Full-Bridge Gain) S BOP = ±20 mT 3.8 4.5 5.2 mV/V/mT Bridge Temperature Coefficient Resistance [1] TCRBRDIGE – – –750 ppm/°C Offset Voltage Temperature Coefficient [1] TCO – – ±4.0 µV/V/°C Sensitivity Temperature Coefficient [1] TCS – –250 –350 ppm/°C Linearity L BOP = ±20 mT – – ±0.5 % Hysteresis Error EHYST BOP = ±20 mT, TA = 25°C – – 0.05 % Output Noise [1] eN f = 10 Hz, VDD = 1.0 V, BOP = 0 mT, TA = 25°C – 700 – nVRMS/√Hz [1] Guaranteed by design and characterization; not tested in production.

ELECTRICAL CHARACTERISTICS

VDD = 1.0 V and TA = 25°C (unless otherwise specified) Figure 9: Sensitivity – Output Voltage vs. Magnetic Field vs. Temperature Figure 10: Offset Voltage vs. Temperature

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com RECOMMENDED APPLICATION CIRCUIT Figure 11: CT100 (SOT23-6) Application Diagram Table 1: Recommended External Components Component Description Vendor and Part Number Parameter Min. Typ. Max. Unit CBYP 0.1 µF, X7R Murata GRM033Z71A104KE14 C – 0.1 – µF

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Applications Information The XtremeSense TMR sensor location for the CT100 for the x, y dimensions are shown in Figure 12 and Figure 13 for the SOT23-6 and DFN-6 packages, respectively. Figure 14 and Figure 15 illustrates the location of the CT100 XtremeSense TMR sensor from the z dimension. All dimensions in the figures below are nominal. Figure 12: XtremeSense TMR Sensor Location in x-y Plane for CT100 in SOT23-6 Package Figure 13: XtremeSense TMR Sensor Location in x-y Plane for CT100 in DFN-6 Package Figure 14: XtremeSense TMR Sensor Location in z Dimension for CT100 in SOT23-6 Package Figure 15: XtremeSense TMR Sensor Location in z Dimension for CT100 in DFN-6 Package

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com PACKAGE OUTLINE DRAWINGS Figure 16: 6-Lead SOT23 Package Drawing Table 2: CT100 6-Lead SOT23 Package Dimensions Symbol Dimensions in Millimeters (mm) Min. Typ. Max. A 1.05 1.20 1.35 A1 0.00 0.10 0.15 A2 1.00 1.10 1.20 b 0.40 – 0.50 b1 0.40 – 0.45 b2 0.30 – 0.40 c 0.08 – 0.22 c1 0.08 0.13 0.20 D 2.80 2.90 3.00 E 2.60 2.80 3.00 E1 1.50 1.60 1.70 Symbol Dimensions in Millimeters (mm) Min. Typ. Max. e 0.95 BSC e1 1.90 BSC L 0.35 0.43 0.60 L1 0.60 REF L2 0.25 BSC R 0.10 – – R1 0.10 – 0.25 θ 0° 4° 8° θ1 5° 6° 15° θ2 5° 8° 15°

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Figure 17: DFN-6 Package Drawing Table 3: CT100 DFN-6 Package Dimensions Symbol Dimensions in Millimeters (mm) Min. Typ. Max. A 0.40 0.45 0.50 A1 0.00 0.02 0.05 b 0.15 0.20 0.25 c – 0.15 REF – D 1.40 1.50 1.60 D2 1.15 1.20 1.25 E 1.40 1.50 1.60 E2 0.65 0.70 0.75 e – 0.50 – L 0.15 0.20 0.25 y 0.000 – 0.075

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com TAPE AND REEL POCKET DRAWINGS AND DIMENSIONS Figure 18: Tape and Pocket Drawing for SOT23 Package NOTES: 1. Material: Conductive Polystyrene. 2. Dimensions in mm. 3. 10 sprocket hole pitch cumulative tolerance ±0.20 mm. 4. Camber not to exceed 1 mm in 100 mm. 5. Pocket position relative to sprocket hole measured as true position of pocket and not pocket hole. 6. (S.R. Ω/sq) means surface electric resistivity of the carrier tape.

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Figure 19: Tape and Pocket Drawing for DFN-6 Package NOTES: 1. Measured from centerline of sprocket hole to centerline of pocket. 2. Cumulative tolerance of 10 sprocket holes is ±0.20. 3. Measured from centerline of sprocket hole to centerline of pocket. 4. Other material available. Table 4: DFN-6 Tape and Pocket Dimensions Symbol Dimension (mm) Ao 1.70 ± 0.05 Bo 1.70 ± 0.05 Ko 0.60 ± 0.05 F 3.50 ± 0.05 P1 4.00 ± 0.10 DW 8.00 ± 0.30

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com

PACKAGE INFORMATION

Table 5: CT100 Package Information Part Number Package Type # of Leads Package Quantity Lead Finish Eco Plan [1] MSL Rating [2] Operating Temperature [3] Device Marking [4] CT100LW-IS6 SOT23 6 3000 Sn Green & RoHS 1 –40°C to 85°C CT YWWS CT100LW-HS6 SOT23 6 3000 Sn Green & RoHS 1 –40°C to 125°C CT YWWS CT100LW-FS6 SOT23 6 3000 Sn Green & RoHS 1 –40°C to 150°C CT YWWS CT100LW-ID6 DFN 6 3000 Sn Green & RoHS 1 –40°C to 85°C C YZ CT100LW-HD6 DFN 6 3000 Sn Green & RoHS 1 –40°C to 125°C C YZ CT100LW-FD6 DFN 6 3000 Sn Green & RoHS 1 –40°C to 150°C C YZ [1] RoHS is defined as semiconductor products that are compliant to the current EU RoHS requirements. It also will meet the requirement that RoHS substances do not exceed 0.1% by weight in homogeneous materials. Green is defined as the content of chlorine (Cl), bromine (Br), and antimony trioxide based flame retardants satisfy JS709B low halogen requirements of ≤ 1,000 ppm. [2] MSL Rating = Moisture Sensitivity Level Rating as defined by JEDEC standard classifications. [3] Package will withstand ambient temperature range of –40°C to 150°C and storage temperature range of –65°C to 160°C. [4] Device Marking for SOT23 is defined as XZ YWWS where XZ = part number, Y = year, WW = work week, and S = sequential number. DFN is defined as X where X = part number and YZ = date code information.

Manchester, NH 03103-3353 U.S.A. www.allegromicro.com For the latest version of this document, visit our website: www.allegromicro.com

Revision History

3 November 2, 2023 Document rebranded and minor editorial updates

Copyright 2023, Allegro MicroSystems. Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Copies of this document are considered uncontrolled documents.