CM201212_MDS BOURNS
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Headquarters Riverside CA www.bourns.compage 1 of 2 MATERIAL DECLARATION SHEET Material CM201212 Series Product Line Wirewound Chip Inductor Date 27-April-2006 No.Construction ElementMaterial GroupMaterial Weight (g)MaterialCAS If applicable Average Mass (%) Sum (%)Remark 1 Core Bobbin 0.004 Polyester Resin 60068-52-0 69 100 Glass 65997-17-3 30 Teflon 9002-84-0 0.5 Carbon Black 1333-86-4 0.5
2 Solder Internal
0.0005Tin 7440-31-5 14.5 100RoHS exempted: High-melting point solder Lead 7439-92-1 85.5
3 Pad Terminal
0.0015Phosphor Bronze - 100 100
4 Solder Plate Terminal
0.0005Tin 7440-31-5 99.3 100 Copper 7439-92-1 0.7 5 Wire Coated Wire 0.0005 Copper 7440-50-8 95 100 Polyurethane Resin - 5 6 Coating Resin 0.003 Epoxy Resin 29690-82-2 18 100 Phenol Novolac 9003-35-4 10 Antimony Trichloride 1309-64-4 3 Brominated epoxy 40039-93-8 2 Fused Silica 60676-86-0 67 Total Weight 0.010
Headquarters Riverside CA www.bourns.compage 2 of 2 MATERIAL DECLARATION SHEET Contact person Cathy Godfrey Bourns location Riverside, CA Phone Ext. 5008 Fax e-mail Cathy_Godfrey@bourns.com Bourns , Inc. 1200 Columbia Ave. Riverside, CA 92507 USA phone: 909 781-5690 fax: 909 781-5273 Important remarks: 1. Traces are product parts substances etc. that are below a percentage of 0.1% of total weight. 2. A list of the legally regulated substances or materials is available at internet address http://www.eicta.org/content.asp?pageID=113 3. Substances, materials etc. with possible harm to men and environment are listed. 4. There are no risks for human beings and to the environment if products are used properly as designated. This shall not apply to risks caused during procedures for disposal etc. 5. All statements herein are based on our present knowledge.