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Features

 Frequency: 2300–2400 MHz  Advanced high performance in- -package Doherty  Fully matched (50 ohm input/output, DC blocked)  Designed for low complexity analog ordigital linearization systems Document Number: AFSC5G23E37 Rev. 0, 04/2021 NXP Semiconductors Technical Data 2300–2400 MHz, 34 dB, 5 W Avg. AIRFAST POWER AMPLIFIER MODULE AFSC5G23E37 10 mm 6 mm Module  2021 NXP B.V.

Figure 1. Pin Connections Note: Exposed backside of the package is DC and RF ground.

  1. VDP2 and VDC2 are DC coupled internal to the package and must be powered by a single DC power supply.

Table 1. Functional Pin Description

3 VDP2 Peaking Drain Supply, Stage 2

4 VDP1 Peaking Drain Supply, Stage 1

5 RFin RF Input

6 VGP2 Peaking Gate Supply, Stage 2

7 VGP1 Peaking Gate Supply, Stage 1

8 VGC1 Carrier Gate Supply, Stage 1

9 VGC2 Carrier Gate Supply, Stage 2

10 VDC1 Carrier Drain Supply, Stage 1

11 VDC2 Carrier Drain Supply, Stage 2

17 RFout RF Output

Table 2. Maximum Ratings Table 3. Lifetime Table 4. ESD Protection Characteristics Table 5. Moisture Sensitivity Level

Table 6. Electrical Characteristics(TA =2 5C unless otherwise noted)

  1. Each side of device measured separately.

Table 6. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) ISBW of 400 MHz at 30 Vdc, 3 dB Input Overdrive from 5 W Avg. Table 7. Ordering Information

  1. Part input and output matched to 50 ohms.
  2. ATE is a socketed test environment.
  3. All data measured in fixture with device soldered in NXP reference circuit.
  4. Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987,Quiescent Current

and search for AN1977 or AN1987.

  1. Gain flatness = Max(G(fLow to fHigh)) – Min(G(fLow to fHigh))

Figure 2. AFSC5G23E37 Reference Circuit Component Layout Table 8. AFSC5G23E37 Reference Circuit Component Designations and Values Note: Component numbers C2, C5, C7, C8, C9, C11, C12, R2 and R3 are intentionally omitted.

Figure 3. Product Marking

PACKAGE INFORMATION

PRODUCT DOCUMENTATION AND TOOLS Refer to the following resources to aid your design process. Application Notes  AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family  AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family Development Tools  Printed Circuit Boards FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where NXP is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local NXP Sales Office.

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Apr. 2021  Initial release of data sheet

Document Number: AFSC5G23E37 Rev. 0, 04/2021 Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, orguarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo, Freescale, the Freescale logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2021 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support