CDBF40-HF COMCHIP
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
Features
Low forward Voltage. Designed for mounting on small surface. Extremely thin / leadless package. Majority carrier conduction. Mechanical data Case: 1005(2512) standard package, molded plastic. Terminals: Gold plated, solderable per MIL-STD-750,method 2026. Mounting position: Any Weight: 0.006 gram(approx.). Halogen free. Marking code: cathode band & BC REV:A 0.102(2.60) 0.095(2.40) 0.020(0.50) Typ. 0.051(1.30) 0.043(1.10) 0.035(0.90) 0.027(0.70) Dimensions in inches and (millimeter) 1005(2512) 0.012 (0.30) Typ. 0.040(1.00) Typ. SMD Diodes Specialist (RoHS Device) O Maximum Rating (at TA=25 C unless otherwise noted) Typ IO VR(RMS) VR VRM Average forward rectified current Reverse voltage Peak reverse voltage SymbolParameter Conditions Min Max Unit RMS reverse voltage mA V V V 200 IFSMForward current,surge peak 8.3 ms single half sine-wave superimposed on rate load(JEDEC method) A0.6 PDPower dissipation mW200 TSTG Tj Storage temperature Junction temperature O C O C +125 +125 -65 Symbol TypParameter Conditions Min Max Unit Forward voltage IF = 40mA IF = 1mA VF V1 0.38 O Electrical Characteristics (at TA=25 C unless otherwise noted) Reverse current Capacitance between terminals Reverse recovery time VR = 30V f = 1 MHz, and 0 VDC reverse voltage IF=IR=10mA,Irr=0.1xIR,RL=100 ohm IR CT Trr uA pF nS5 0.2 Comchip Technology CO., LTD.
SMD Schottky Barrier Diode Page 2QW-G1014 REV:A SMD Diodes Specialist Capacitance between terminals (PF) Reverse voltage (V) Fig.3 - Capacitance between terminals characteristics RATING AND CHARACTERISTIC CURVES (CDBF40-HF) Forward current (mA ) 0.2 0.40 100 0.6 0.1 0.8 Forward voltage (V) Fig. 1 - Forward characteristics Reverse current ( A ) Reverse voltage (V) 10u 100u 100n 10n 0 10 20 30 40 Fig. 2 - Reverse characteristics O 25 C O 75 C O 125 C 0 10 20 4030 100 0 25 50 75 100 125 150 O Ambient temperature ( C) Average forward current(%) Mounting on glass epoxy PCBs Fig.4 - Current derating curve 120 1000 1.2 O -25 C 1.0 O 125 C O C O C O -25 C f=1MHzO TA=25 C Comchip Technology CO., LTD.
SMD Schottky Barrier Diode Page 3QW-G1014 REV:A SMD Diodes Specialist Comchip Technology CO., LTD. Index hole o 120 Trailer Device Leader 10 pitches (min)10 pitches (min) d E F B W A P D1 D2 D T C Direction of Feed B C d D D2D1 E F P P0 P1 T F/1005 SYMBOL A W W1 Reel Taping Specification (mm) F/1005 SYMBOL (mm) Polarity 4.00 0.10± 1.55 0.05± 178 1±
SMD Schottky Barrier Diode Page 4QW-G1014 REV:A SMD Diodes Specialist Comchip Technology CO., LTD. Suggested PAD Layout SIZE (inch) 0.083 (mm) 2.10 1.20 1.20 0.047 0.047 F/1005 Marking Code 3.30 0.130 E 0.90 0.035 Standard Package Case Type Qty per Reel (Pcs) 4000F/1005 Reel Size (inch) A B C D A C B E BC D Park Number CDBF40-HF Marking Code BC