CDBB220LR-HF COMCHIP

Document overview

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Technical content

Features

-Ultra high-speed switching. Mechanical data -Case: Molded plastic, DO-214AA / SMB -Terminals: solderable per MIL-STD-750, method 2026. -Polarity: Indicated by cathode band. -Weight: 0.091 grams -Low Profile surface mount applications in order to optimize board space. -Low power loss, high efficiency. -Hight current capability, low forward voltage drop. -Hight surge capability. -Guardring for overvoltage protection. -Epoxy: UL94-V0 rate flame retardant. -Silicon epitaxial planar chip,metal silicon junction. CDBB 220LR-HF Max. Repetitive peak reverse voltage Max. DC blocking voltage Max. RMS voltage CDBB 240LR-HF CDBB 260LR-HF CDBB 2100LR-HF CDBB 2150LR-HF UnitsSymbolParameter VRRM VDC VRMS 100 100 150 150 105 V V V CDBB 2200LR-HF 200 200 140 Max. Instantaneous forward voltage Operating Temperature TJ -50 to +150 -50 to +175 °C Forward surge current Reverse Current Storage temperature A A mA Parameter Conditions on rate load (JEDEC method) 8.3ms single half sine-wave superimposed Forward rectified current see Fig.1 Thermal Resistance Diode Junction capacitance VR =VRRM TA=25°C VR =VRRM TA=100°C f=1MHZ and applied 4V DC reverse Voltage Junction to ambient Symbol IO IFSM IR RθJA CJ TSTG IR MIN. TYP. MAX. mA °C/W pF 2.0 0.5 -50 +175 Units Halogen Free Maximum Ratings and Electrical CharacteristicsRatings at Ta=25°C unless otherwise noted. Single phase, half wave, 60Hz, resistive or inductive loaded. For capacitive load, derate current by 20% . Dimensions in inches and (millimeter) DO-214AA (SMB) 0.098 (2.50) 0.083 (2.10) 0.087 (2.20) 0.075 (1.90) 0.157 (4.00) 0.130 (3.30) 0.189 (4.80) 0.157 (4.00) 0.012 (0.31) MAX. 0.220 (5.60) 0.197 (5.00) 0.063 (1.60) 0.028 (0.70) 0.008(0.21) MAX.

RATING AND CHARACTERISTIC CURVES (CDBB220LR-HF Thru. CDBB2200LR-HF) Forward Voltage, (V) 0.1 0.01 0.1 1.0 100 0.9 Reverse Voltage, (V) 0.01 200 700 1 10 100 Ambient Temperature, (°C) 1.2 1.6 1.1 1.50 100 175 0.4 2.4 0.5 1.3 0.8 Number of Cycles at 60Hz Peak Forward Surge Current, (A) 100 1 10 100 TJ=25°C 8.3ms single half sine wave, JEDEC method 25 50 75 150125 2.0 0.1 100 400 300 600 500 Average Forward Current, (A) Instantaneous Forward Current, (A) Pulse Width 300us 1% Duty Cycle 0.70.3 Junction Capacitance, (pF) Fig.4 Typical Junction Capacitance - Fig.3 Maximum Non-repetitive - Forward Surge Current Fig.2 Typical Forward Characteristics - Fig.1 - Typical Forward Current 33.0 Percent of Rated Peak Reverse Voltage, (%) Fig.5 Typical Reverse Characteristics - Reverse Leakage Current, (mA) 1408060 1200 0.1 100 0.01 40 100 Low VF Low IR SMD Schottky Barrier Rectifiers Page 2 REV:A Comchip Technology CO., LTD. Derating Curve TJ=25°C 1.0 CDBB2150LR-HF~CDBB2200LR-HF CDBB220LR-HF~CDBB2100LR-HF CDBB2100LR-HF~CDBB2200LR-HFCDBB220LR-HF~CDBB240LR-HF CDBB260LR-HF TJ=125 TJ=25 °C QW-JL027

Low VF Low IR SMD Schottky Barrier Rectifiers Page 3 REV:A Comchip Technology CO., LTD. QW-JL027 Trailer Device Leader 10 pitches (min)10 pitches (min) Direction of Feed Reel Taping Specification B C d D D2D1SYMBOL (mm) (inch) 1.969 MIN. 8.00 ± 0.10 330 ± 2.00 SYMBOL (mm) E F P P0 P1 W W1 1.75 ± 0.10 0.069 ± 0.004 5.50 ± 0.10 0.217 ± 0.004 4.00 ± 0.10 0.157 ± 0.004 5.90 ± 0.10 0.232 ± 0.004 3.00 ± 0.10 0.118 ± 0.004 0.60 ± 0.10 0.236 ± 0.004 T 0.472 ±0.012 (SMB) DO-214AA (SMB) DO-214AA o 120 D1 D2 D T C Index hole d E F B W P A A

Low VF Low IR SMD Schottky Barrier Rectifiers Page 4 REV:A Comchip Technology CO., LTD. XXXXX Cathod Band XXXXX = Product type marking code QW-JL027 Suggested PAD Layout SIZE (inch) 0.169 (mm) 4.30 2.50 2.30 0.098 0.091 6.80 0.268 E 1.80 0.071 A B C D DO-214AA (SMB) A B C E D Standard Packaging Case Type 3,000 REEL ( pcs ) Reel Size (inch) REEL PACK DO-214AA (SMB)