CCE4502 DIALOG

Document overview

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Technical content

Datasheet sections

  • 1.1 Features
  • 1.2 Schematic
  • 2 Pinout
  • 2.1 Package
  • 2.2 Pin Descriptions
  • 3 Absolute Maximum Ratings
  • 4 Electrical Characteristics
  • 4.1 General Parameters
  • 4.4 DC / DC Converter
  • 4.5 Inputs / Outputs CQ1, DIO
  • 4.6 IO-Link Protocol
  • 4.7 Digital I / O
  • 5 Functional Description
  • 5.1 Overall Functional Description
  • 5.2 Protection Circuitry
  • 5.3 Power Supply
  • 5.3.1 DC / DC Converter, Supply Modes
  • 5.3.4 VDD5 - 5V Linear Regulator
  • 5.3.5 VREF - Reference Voltage Output
  • 5.4 Power-On Reset
  • 5.5 Configuration Pin K1
  • 5.6 HV-IO Stages
  • 5.7 Operational Modes
  • 5.7.1 Standard I / O (SIO)
  • 5.7.2 UART
  • 5.7.3 Frame Handler (IO-Link Mode)
  • 5.8 Register Description
  • 5.8.1 Register Definitions
  • 5.8.2 CONF1 Register (0x20)
  • 5.8.3 CONF2 (0x40)
  • 5.8.4 OVLD 1 / 2 (0x21 / 0x41)
  • 5.8.5 SLEW 1 / 2 (0x22 / 0x42)
  • 5.8.6 SIO1 (0x23)
  • 5.8.7 SIO2 (0x43)
  • 5.8.8 UART (0x24)
  • 5.8.9 FHC (0x25)

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 1 of 50 © 2020 Dialog Semiconductor General Description

1.1 Features

■ IO-Link Compliant Transceiver1 ■ Integrated UART (COM1-3) ■ Hardware IO-Link Stack support ■ All IO-Link M-sequence types supported ■ One IO-Link slave channel with up to 200mA driving current ■ Programmable PNP-, NPN- and Push-Pull mode ■ Auxiliary multi-purpose 200mA Input-Output-Channel ■ Slew rate control ■ Reverse-polarity protection ■ Low TC on-chip oscillator with ±2% frequency accuracy ■ Overcurrent protection ■ Overvoltage and high temperature detection ■ SPI interface ■ Rich configuration options ■ Evaluation board available ■ QFN24 and CSP24 package

1.2 Schematic

a Linear Voltage Regulators Low Side Driver Current Sense High Side Driver Current Sense IN IN EN EN TXD1 3.3V / 5VVDD L+ CQ1 HV-Input Stage Temperatur- Sensor VSS TXEN1 RXD1 SDX SDXSDX1 BREAK BEFORE MAKE CONTROL CHANNEL1 CHANNEL2 DIO TXD2 SDX2 DC/DC Buck Converter LOGIC CORE SIO Control, UART, Framehandler SSX SCLK MOSI MISO INTX Trimmed Clock Generator VHHVDD5 LEXT SDX2 RXD1 SDX1 TXD1 TXD2 CCE4502 CLK_EXT VDD1V8 Protection Protection Protection Protection VREF Figure 1: Block Diagram High-voltage interface ASSP with overvoltage, high current and high temperature protection, based on a 0.18 µm HV-CMOS technology. There is a wide range of supported applications with different packaging and configuration options. Typical applications are industrial sensors and actuators. 1 IO-Link is a registered trademark of Profibus User Organization (PNO).

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 5 of 50 © 2020 Dialog Semiconductor

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 6 of 50 © 2020 Dialog Semiconductor

2 Pinout

2.1 Package

CLK_EXT PAD VSS 1912 Figure 2: QFN24 Package (4x4 mm, top view) C3 C4 C5 C6 B3 B4 B5 B6 A3 A4 A5 A6 C1 C2 B1 B2 A1 A2 D3 D4 D5 D6D1 D2 CCE4502-X LOT WWYY C3C4C5C6 B3B4B5B6 A3A4A5A6 C1C2 B1B2 A1A2 D3D4D5D6 D1D2 Figure 3: Chip Scale Package (top view left, bottom view right)

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 7 of 50 © 2020 Dialog Semiconductor

2.2 Pin Descriptions

Table 1: Pin Description QFN24 Pin No CSP Pin No Name Type Power domain Function Remarks

1 D5 LEXT PWR VHH DC/DC converter

2 D4 VHH PWR VHH Main supply / output

3,PAD C4 VSS PWR - Ground (Regulator) 4 D3 VDD1V8 PWR VDD1V8 1.8 V Supply Voltage (Internal) 5 C3 VDD PWR VDD 3.3/5 V Supply Voltage Output

6 D2 VDD5 PWR VDD5 5 V Supply Voltage

7 D1 VREF OUT VDD Reference Voltage

8 C1 INTX OUT VDD Interrupt output Push-pull, active-

9 C2 SDX1 OUT VDD Channel 1 short

Push-pull, active- low

10 B1 TXD1 IN VDD Channel 1 signal input Internal pull up

11 A1 MOSI IN VDD SPI Master Out/Slave In Internal hold

12 B2 MISO OUT VDD SPI Master In/Slave Out Push-pull

13 A2 TXEN1 IN VDD Channel 1 driver enable Internal pull down,

14 B3 RXD1 OUT VDD Channel 1 signal output Push-pull

15 A3 SCLK IN VDD SPI Clock Internal pull-down

16 B4 SSX IN VDD SPI Slave Select Internal pull-up

17 A4 TXD2 IN VDD Channel 2 signal input Internal pull-up

18 A5 SDX2 OUT VDD Channel 2 short

Push-pull, low active

19 B5 K1 IN VDD Configuration bit 1 Internal pull down

20 A6 CLK_EXT IN/OUT VDD External clock input /

21 B6 L+ PWR L+ Positive supply (IO-Link)

22 C6 CQ1 IN/OUT L+ IO-Link data channel 1

23 D6 DIO IN/OUT L+ Switching Input / Output

24 C5 L- PWR L+ Ground supply (IO-Link)

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 8 of 50 © 2020 Dialog Semiconductor

3 Absolute Maximum Ratings

Tamb = 25°C+/-1°C unless otherwise specified. Table 2: Absolute Maximum Ratings Parameter Conditions Name Min Typ Max Unit Supply Voltage Static, referenced to VL- VL+ -VL- -40 40 V Supply Voltage Dynamic, pulse width <= 100 ms, delay between pulses >= 100 s VL+ -VL- (pulse) -50 50 V VHH pad max voltage Referenced to VSS VVHH,max -0.3 (VL+ -VL-) +0.3V V Power Dissipation PCB PTOT 1 W Operating Temperature Ambient temperature Tamb -40 105 °C Storage Temperature Tstorage -55 155 °C Junction Temperature Tj -50 150 °C Voltage at pin CQ1/DIO Referenced to VL-: VCQ-VL- VCQ,max -0.3 (VL+ -VL-) +0.3 V Voltage at all other pins Referenced to VSS V…max -0.3 VDD+0.3 V ESD protection JS-001-2012 HBM VESD 4 kV JEDEC JESD78D Class1 Ilatchup 100 mA Soldering Temperature 12 s max. Tsolder 260 °C FIT Rate Tamb,max=70°C 50 FIT

4 Electrical Characteristics

Tamb = -40°C … 105°C, VS = VL+-VL- = 24 V unless otherwise specified.

4.1 General Parameters

Table 3: General Parameters Parameter Conditions Pins Name Min Typ Max Unit Over temperature flag tdeglitch=4096/fclk Tflag 110 120 130 °C Over temperature flag hysteresis Thyst 11 19 °C Over voltage flag threshold VL+ rising 21, 24 VL+,thr+ 38 40 42 V Main Supply Voltage 21, 24 VS (VL+ -VL-) 9 36 V LDO Input Voltage DC/DC disabled (Supply Mode 2 or 3) 2,3 VVHH -VVSS 6 36 V

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 9 of 50 © 2020 Dialog Semiconductor Parameter Conditions Pins Name Min Typ Max Unit Supply voltage ripple Fripple = DC … 100kHz 21 ∆VL+ 1.3 Vp-p Quiescent Main Current VL+ -VL- = 24V 21, 24 IL+ 10 mA Quiescent LDO Current VVHH -VVSS = 7V 2, 3 IVHH 2 mA External capacitor VHH DC/DC enabled, ESR>0.6Ω 2, 3 CVHH,DCDC 17.6 µF DC/DC disabled (Supply Mode 2) 2, 3 CVHH 100 nF External capacitor VDD 5, 3 CVDD 220 470 nF External capacitor VDD5 6, 3 CVDD5 47 100 nF External capacitor VDD1V8 Between VDD1V8 and VSS 4, 3 CVDD1V8 47 100 nF Inductance DC/DC Converter 1, 2 LEXT 22 µH System clock frequency Tamb=25°C 20 Fclk -2% 14.745 +2% MHz Reference Voltage Tamb=25°C, Iload,REF < 100uA 7, 3 VREF 1.12 1.2 1.25 V Reference Voltage Temperature Coefficient 7, 3 TKVREF 80 ppm/K 4.2 3.3V / 5V Voltage Regulator Table 4: Linear Regulator 3.3V / 5V Parameter Conditions Pins Name Min Typ Max Unit Output Voltage VDD

5 V (CCE4502 – 5V),

CL+,L- >= 10µF 5, 3 VDD5V 4.75 5 5.25 V CL+,L- >= 10µF 5, 3 VDD3V3 3.1 3.3 3.5 V Voltage Drop Load Current = 25mA 2, 5 VVHH-VVDD 0.7 V Output Current VDD 5 IVDD 50 mA Line regulation VDD IVDD = 10mA, 9V < VL+ < 36V (Supply mode 1 and 2) 5, 3 10 mV IVDD = 10mA, 6V < VHH < 36V (Supply mode 3) 100 Load regulation VDD DC current up to 50mA 5, 3 1 % Power Supply Rejection Ratio Supply mode 1+2 VL+/VVDD, CVHH=22µF ESR>0.6 Ω; CVDD=220nF, f<200kHz 5, 3 PSRR 40 dB

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 10 of 50 © 2020 Dialog Semiconductor Parameter Conditions Pins Name Min Typ Max Unit Supply mode 3 VVHH/VVDD, CVDD=220nF, f<200kHz 40 dB Power-On Threshold Referenced to VDD target voltage (3.3V or 5V) 5, 3 VRST 85 90 95 % Start-up time After VL+ exceeds minimum value 5, 3 tstart-up 1 ms Glitch blanking tglf 1 µs 4.3 5V Voltage Regulator Table 5: Linear Regulator 5V Parameter Conditions Pins Name Min Typ Max Unit Output Voltage VDD5 CL+,L- >= 10µF 6, 3 VDD5 4.75 5 5.25 V Voltage Drop Load Current = 5mA 2, 6 VVHH- VVDD5 0.7 V Output Current VDD5

6 IVDD5 10 mA

IVDD5 = 5mA, 9V < VL+ < 36V 6, 3 10 mV Load regulation VDD5 DC current up to 5mA 6, 3 0.2 % Power Supply Rejection Ratio VL+/VVDD5, CVDD5=100nF, f<200kHz PSRR 40 dB

4.4 DC / DC Converter

Table 6: DC / DC Converter Parameter Conditions Pins Name Min Typ Max Unit Output Voltage VHH DC/DC in buck mode, CL+,L- >= 10µF 2, 3 VHHDCDC 6.5 7.2 7.9 V Output Voltage LEXT DC/DC in linear mode, VHH and LEXT shorted 1, 3 VLEXT,LDO 5.5 7 8.5 V Ripple VHH LEXT=22µH, CVHH = 22µF, ESRCVHH > 0.6Ω, IVHH=60mA

2 VVHH,pp 200 mV

DC/DC in buck mode fSWITCH 1.5 2.5 MHz DC/DC Output Current

2 IDCDC,out 602 mA

IVHH = 1mA, 9V< VL+ <24V 2 10 %

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 11 of 50 © 2020 Dialog Semiconductor Parameter Conditions Pins Name Min Typ Max Unit Load regulation VHH DC current up to 25mA 2, 3 1 %

4.5 Inputs / Outputs CQ1, DIO

Table 7: Switching Outputs Parameter Conditions Pins Name Min Typ Max Unit Voltage CQ1/DIO 22, 23 VCQ_MAX 36 V Output voltage low level active pull down, IOL = -200mA 22, 23 VOL 2 V Output voltage high level active pull up, IOH = +200mA 22, 23 VOH VS - 2 V Leakage current input disabled 22, 23 Ileak -100 100 µA Maximum Permanent Output Current Current per CQ channel 22, 23 ICQmax 2002 mA Output source current limit SLEW=0 (see section 5.8.5) 22, 23 IlimP 340 mA Output sink current limit 22, 23 IlimN 320 mA Overcurrent detection threshold Source/sink current, SLEW=0 22, 23 IOC 210 mA Peak short circuit current VL+ -VL-=36V Up to 1µs after short 22, 23 Ishort,peak 2 A Load capacitance COM1 or COM2 22, 23 CL 5 nF Inductive load 22, 23 LLoad 50 mH Output slew rate rise/fall Open load, SLEW=0 22, 23 rslew,open 42 60 100 V/µs 5nF Load, SLEW=0 22, 23 rslew,5nF 20 40 V/µs Switch On Time 22, 23 tDLY_LH 500 ns Switch Off Time 22, 23 tDLY_HL 500 ns Break before Make Delay 22, 23 tLH_BBM, tHL_BBM 1 30 ns Short Circuit Detection Time see H/V configuration register 22, 23 tOVLDDET 100 µs Input threshold high level CQ1/DIO 22, 23 VIH 10.5 13 V Input threshold low level 22, 23 VIL 8 11.5 V Hysteresis between input thresholds high and low 22, 23 VHyst 1 V 2 Consider devices total power consumption (see 6.1).

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 12 of 50 © 2020 Dialog Semiconductor TXDx tLH_BBM tHL_BBM tDLY_LH tDLY_HL CQ1 PMOS off on off on CQ1 NMOS on off CQ1 tr tf Figure 4: Timing CQ1 Outputs ("Break before Make") The solid line of CQ1 signal in Figure 4 describes the typical or best case scenario. Depending on the external circuitry, the slew rate can differ from this. This is shown by the shaded area e.g. an external pull-up pulls CQ1 high as soon as the NMOS is switched off.

4.6 IO-Link Protocol

Table 8: IO-Link specification Parameter Conditions Pins Name Min Typ Max Unit Transmission rate COM1 COM2 COM3 fDTR 4,8 38,4 230,4 kbit/s Bit time COM1 COM2 COM3 TBIT 208,3 26,0 4,34 µs UART frame transmission delay of the Device TdD 0 3 TBIT Response time of Devices TDev_resp 1 10 TBIT Cycle time M-sequence Type_2_1 COM1 COM2 COM3 TCYC 2,3 0,4 ms

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 13 of 50 © 2020 Dialog Semiconductor

4.7 Digital I / O

Table 9: Digital Inputs Parameter Conditions Name Min Typ Max Unit Input Voltage LOW VDD - VSS = 3.3 V VIN_L_3V3 1.5 V Input Voltage HIGH VDD - VSS = 3.3 V VIN_H_3V3 1.8 V Input Voltage LOW VDD - VSS = 5.0 V VIN_L_5V 2.1 V Input Voltage HIGH VDD - VSS = 5.0 V VIN_H_5V 2.9 V Input Capacitance CIN 5 pF Input Leakage Current IILEAK -5 5 µA Input Pull-Up current VDD - VSS = 3.3 V, Vpin=0V IPU_3V3 10 40 µA Input Pull-Up current VDD - VSS = 5.0 V, Vpin=0V IPU_5V 25 100 µA Input Pull-Down current VDD - VSS = 3.3 V, Vpin=3.3V IPD_3V3 20 70 µA Input Pull-Down current VDD - VSS = 5.0 V, Vpin=5.0V IPD_5V 20 70 µA Table 10: Digital Outputs Parameter Conditions Name Min Typ Max Unit Output Voltage LOW VDD - VSS = 3.3 V IOUT_LOW = 2 mA VOUT_L 0.5 V VDD - VSS = 5.0 V IOUT_LOW = 2 mA VOUT_L 0.5 V Output Voltage HIGH VDD - VSS = 3.3 V IOUT_HIGH = 2 mA VOUT_H 2.8 V VDD - VSS = 5.0 V IOUT_HIGH = 2 mA VOUT_H 4.5 V Output Leakage Current Tristate active IOLEAK -5 5 µA Output Capacitance COUT 5 pF

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 14 of 50 © 2020 Dialog Semiconductor

5 Functional Description

5.1 Overall Functional Description

The IC integrates one IO-Link capable bidirectional switching interface connected to CQ1. It can be used as a SIO, UART transceiver or IO-Link slave port. It includes a hardware IO-Link frame handler based on the UART interface, which provides IO-Link protocol handling facilities. The pin DIO is configured as an output. Both pins, CQ1 and DIO, are individually configured as push -pull, open drain (PMOS or NMOS) or input only. The CCE4502 is controlled via IO pins or the SPI. An integrated oscillator provides the core logic clock. Alternatively, an external 14.745 MHz clock can be provided at pin CLK_EXT.

5.2 Protection Circuitry

The CCE4502 has following protection circuitry: 1. All pins are protected against ESD. 2. The CQ1 and DIO outputs, the L+ and L- Pins are protected against reverse polarity connections according to Table 11. 3. CQ1 and DIO output transistors are protected against overcurrent. 4. On-chip over temperature is detected and notified.

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 15 of 50 © 2020 Dialog Semiconductor ESD Protection CQ1/ DIO ESD Protection ESD Protection Reverse Polarity Protection Reverse Polarity Protection Overcur- rent Pro- tection Overcur- rent Pro- tection Temperature Sensor Figure 5: Protection circuitry at CQ1, DIO, L+ and L- Table 11: Allowed reverse polarity connections Case L- L+ CQ1/DIO Remark 1 0 1 0 Regular connection (output shorted to ground) 2 0 1 1 Regular connection (output shorted to Plus) 3 0 1 H Regular connection (output open)

4 H 1 0 Missing ground (IC get current by output)

5 0 H 1 Missing Plus (IC get current by output), see notes below 6 1 0 1 Reverse polarity (output shorted to Plus) 7 1 0 H Reverse polarity (output open)

8 H 0 1 Missing ground (IC get current by output)

9 1 0 0 Reverse polarity (output shorted to ground) 10 1 H 0 Missing Plus (IC get current by output)

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 16 of 50 © 2020 Dialog Semiconductor Notes to Table 11:

  • “0” means connected to ground
  • “1” means connected to Plus (VS)
  • “H” means connection left open
  • Non–regular connection means the IC will not operate
  • In case of a non-regular connection either CQ1 or DIO has to be left open
  • In case of reverse polarity case 5 the channel connected to supply must not drive low (0 V) and L+ must not be connected to any loads. Any connected microcontroller should be inactive.

5.3 Power Supply

The CCE4502 implements five regulators for the power supply of the IC and external components. 1. A DC/DC converter at pin LEXT/VHH is permanently configured for either buck mode or linear regulation mode by factory setup (see ordering information). This converter may supply external circuitry. 2. A linear regulator with output at pin VDD, which is permanently configured for 3.3V or 5V output voltage by factory setup (see ordering information), and can supply external circuitry. 3. A 5V linear regulator with output at pin VDD5. This regulator may supply external circuitry. 4. A 1.8V core supply regulator with output at pin VDD1V8. External load must not be connected to pin VDD1V8. 5. A buffered reference voltage of 1.2V is provided at pin VREF. DCDC Converter LEXT VHH VSS 1.8V linear regulator VDD 3.3/5V linear regulator VDD1V8 Digital Core 10µF 22µF22µH 100nF 9V 36V supply IO-Cells CCE4502 External load 1.6V External load 5V linear regulator VDD5 470nF HV IO CQ1 DIO 100nF Bandgap Reference VREF External load 4.6V 5.6V -2.5V Reset logic Figure 6: Power supply block diagram. DC/DC converter in switch mode (Supply Mode 1) Note 1 Always calculate the maximum IC junction temperature to decide if the IC can supply the required currents for external circuitry. In particular, the IO-Link output stage currents, LDOs supply currents and thermal coupling of the IC to the PCB will affect the junction temperature.

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 17 of 50 © 2020 Dialog Semiconductor

5.3.1 DC / DC Converter, Supply Modes

A DC/DC converter is provided which either acts as a buck mode switching converter, requiring an external inductor, or as a linear regulator. The function of the converter is factory programmed (see Ordering Information). Supply Mode 1 – DC/DC converter in buck mode The main purpose of the buck converter mode is to limit the on-chip power dissipation by converting the main supply voltage at L+ and L- to an intermediate level of about 7V. See Figure 6 and Figure 13 for the recommended application schematic in this supply mode. The output of the buck converter can be used to drive external circuitry connected to pin VHH. In total, the external load current must not exceed 60mA at VHH and VDD. The buck converter is designed for an external 22µH inductor between pins LEXT and VHH. The inductor’s saturation current must higher than 300mA. A 22µF capacitor is required between pins VHH and VSS to buffer the buck converters output. The ESR of this capacitor must be higher than 0.6Ω. This may require a 0.6Ω resistor in series to the 22µF capacitor. A 10µF capacitor is recommended between L+ and L-. Supply Mode 2 – DC/DC converter in linear regulator mode If the DC/DC converter is configured for linear regulation mode, it provides about 7V at LEXT. LEXT and VHH must then be shorted externally. See Figure 14 for the recommended application schematic in this supply mode. Supply Mode 3 – DC/DC converter not used If the DC/DC converter is not required by the application, leave pin LEXT floating. The 3.3V/5 V and 1.8V regulators must then be supplied by an external 6V to 36V supply connected to pin VHH. It is recommended to use devices with factory configuration "linear mode" if supply mode 3 is used. See Figure 15 for the recommended application schematic in this supply mode. 5.3.2 VDD - 3.3V / 5V Linear Regulator The 3.3V/5V regulator provides power for all logic level in- and outputs (pins 8 to 20) at pin VDD. The output voltage (3.3V or 5V) is permanently set during the final test of the IC. See section 9 for corresponding order codes. A capacitor with at least 220nF from pin VDD to VSS is required for stable regulator operation and provides a buffer for currents spikes of switching digital outputs. The regulator input is connected to VHH, which can be supplied by the on-chip DC/DC converter or an external supply. See Figure 13, Figure 14 and Figure 15 for possible connection options. The LDO output can supply external circuitry (e.g. microcontrollers). In total, the external load current must not exceed 50mA. Always calculate that the ICs junction temperature does not exceeded specified limits, when using the regulator outputs for external load. 5.3.3 VDD1V8 - 1.8V Linear Regulator The 1.8V regulator provides power for internal logic blocks. A 100nF capacitor from pin VDD1V8 to VSS is required. Do not connect external load to pin VDD1V8.

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 18 of 50 © 2020 Dialog Semiconductor

5.3.4 VDD5 - 5V Linear Regulator

A 5V regulator provides power for internal and external circuitry at pin VDD5. The regulator input is connected to VHH, which can be supplied by the on-chip DC/DC converter or an external supply. See Figure 13, Figure 14 and Figure 15 for possible connection options. A 100nF capacitor from pin VDD5 to VSS is recommended. External load connected to VDD5 must not draw more than 10mA.

5.3.5 VREF - Reference Voltage Output

An internal bandgap circuit provides a reference voltage at pin VREF. External load current at pin VREF must not exceed 100µA.

5.4 Power-On Reset

The power on reset circuitry supervises the main (L+/L-), IO (3.3V/5V) and core (1.8V) supplies to ensure proper initialization of all registers (see Figure 6). If the internal power on reset signal is activated, the logic core is reset to defaults and all outputs are in high impedance state. A glitch filter is implemented to suppress supply voltage sags shorter than tglf. See Figure 7. VVHH VVDD1V8 VPOR tres tgl tgltres Figure 7: Power-On Reset timing (only core voltage 1.8V POR depicted)

5.5 Configuration Pin K1

The configuration pin K1 defines whether the internal or an external oscillator is used to clock the core logic. If an external clock is used the internal clock generator is disabled. Table 12 lists configuration options. Connect pin K1 to VSS or leave it unconnected to use the internal oscillator. Table 12: K1 Configuration Bit K1 CLK_EXT Functional Mode VSS Output Functional Mode using internal oscillator (default) VDD Input Functional Mode using external crystal oscillator

5.6 HV-IO Stages

Two identical output stages drive the channel 1 and channel 2 pins (CQ1/DIO). Each output transistor pair has individual slew rate control and current limiting circuitry. The output slew rate, output current limit and output overcurrent detection threshold can be adjusted for each channel via the SLEW1/2 registers (5.8.5). The control logic is shown in Figure 8. Channel 1 provides an input buffer compatible to the IO-Link standard. The input buffer can be disabled via the CONF1.DIS register. See Table 13.

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 19 of 50 © 2020 Dialog Semiconductor Table 13: Channel 1 input buffer truth table CQ1 CONF1.DIS RXD High 0 0 Low 0 1 X 1 1 Slew Rate & Current Limiter Overcurrent Detection CSS2 OUT2 TXD2 DRV2[1] SLEW1[1:0] CSS1 TXEN1 TXD1 OUT1 CQ1 DIO DRV1[1] DRV1[0] SSX SCLK MISO MOSI IN1 RXD1 SDX1 SDX2 SDX2 SDX1 Overcurrent Detect Channel 2 Overcurrent Detect Channel 1 Slew Rate & Current Limiter Overcurrent Detection PMOS on NMOS on PMOS on NMOS on SLEW2[1:0] Input Buffer channel 1DRV2[0] DIS1 Logic core Input Buffer channel 2 DIS2 IN2 Figure 8: HV-Output stage If the output current of channel 1 or channel 2 exceeds the output current limit defined via the SLEW1/2 registers (5.8.5), an overcurrent detection signal is available at SDX1 and SDX2 respectively. The logic core also receives this information and disables the output stages if configured in OVLD1/2 registers (see 5.8.4).

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 20 of 50 © 2020 Dialog Semiconductor Table 14: Overcurrent detection truth table Output state SDXx Output current below overcurrent detection threshold 1 Output current above overcurrent detection threshold 0 Each channel can be controlled either by dedicated control pins (TXD1, TXEN1, TXD2) or the SPI by the dedicated pins or SPI. This allows the IC to be used as level shifter only, without using the S PI interface. The logic core defines the configuration of the output stages (High-Z, Open-Drain, Push-Pull) via the programmed during final test of the IC. A One-Time-Programmable memory element is used to store this information. The memory content cannot be changed after the ICs final test. Changing the CONF1 and CONF2 registers in the application requires SPI access. To control the output stages via SPI only, the registers CSS1 and CSS2 must be set to one, thus ignoring the dedicated control pins (TXD1, TXEN1, TXD2). See Table 15 and Table 16 for the full output stages logic. Table 15: Channel 1 output stage truth table TXEN1 TXD1 CONF1.CSS SIO1.OUT CONF1.DRV[1:0] CQ1 1 0 0 X 0 High-Z 1 0 0 X 1 High-Z 1 0 0 X 2 High 1 0 0 X 3 High 1 1 0 X 0 High-Z 1 1 0 X 1 Low 1 1 0 X 2 High-Z 1 1 0 X 3 Low

0 X 0 X X High-Z

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 21 of 50 © 2020 Dialog Semiconductor Table 16: Channel 2 output stage truth table TXD2 CONF2.CSS SIO2.OUT CONF2.DRV[1:0] DIO 0 0 X 0 High-Z 0 0 X 1 High-Z 0 0 X 2 High 0 0 X 3 High 1 0 X 0 High-Z 1 0 X 1 Low 1 0 X 2 High-Z 1 0 X 3 Low X 1 0 0 High-Z X 1 0 1 High-Z X 1 0 2 High X 1 0 3 High X 1 1 0 High-Z X 1 1 1 Low X 1 1 2 High-Z

5.7 Operational Modes

There are three possible operational modes for channel1 – Standard I/O, UART and Frame Handler (IO-Link3 ) Mode. The channel mode can be configured via the MODE-bits of the CONF1 register Push-Pull driving, can be configured via the DRV-bits of the CONF1/2 register.

5.7.1 Standard I / O (SIO)

If a channel is configured in the Standard I/O Mode, the output driver can be directly controlled via CQ1 pin. In this mode, it is also possible to control and observe the channel using the TXD1/2, TXEN1 and RXD1 pins. To distinguish between pin- and logic-control, the Channel-Source-Select-bit (CSS) of register CONF1/2 has to be set accordingly. Since the sense of TXD1/2 to CQ is inverted, it is possible to connect a standard microcontroller UART interface with a high idle state to the TXD/RXD pins.

5.7.2 UART

The UART mode of channel 1 is designed to send and receive 8 bits of data per character followed by an even parity bit. If this mode is enabled the used COM speed needs to be set in the CONF1 register. 3 „IO-Link Interface and System“ Specification Version 1.1.2, July 2013

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 22 of 50 © 2020 Dialog Semiconductor By default, the channel will listen for incoming UART transactions at the CQ1 pin. If a character is received, an interrupt is triggered and the data can be read back from the UART register (5.8.8). A transaction is started by writing the data to the UART register. The received UART data is not buffered. Receiving multiple characters, while not reading them back, causes data loss. This will be indicated by the OFLW-bit in the STAT-register 5.8.18).

5.7.3 Frame Handler (IO-Link Mode)

The Frame Handler Mode extends the UART interface. It is required to define the used COM speed in the CONF1 register. The frame handler mostly automates the transceiving of M-sequences as defined by the IO-Link protocol. It buffers frames of incoming master messages and outgoing device messages in its internal frame buffer. The buffer can be accessed by reading or writing the register FHD ( 5.8.14). The CRC checksums of all incoming messages are automatically checked. Any UART parity bit errors and CRC errors are indicated. For outgoing messages, the CRC checksums are automatically calculated and inserted into the messages. The frame handler monitors the specified timing constraints of the IO-Link standard and takes care to comply with them as well. These constraints are the delay between UART frames in the device message, the delay between UART frames in the master message, and the response time between master message and device message. A violation of any of these constraints is detected as a timeout.

5.7.3.1 Configuration

The length of each message is influenced by the ODL, MPDL and DPDL registers. It also depends on the access type, addressed channel and M-sequence type which is defined in the second byte of each M-sequence. M-sequences of type 0 (FT0) always use one byte on-request data. M-sequences of type 1 (FT1) use the MPDL or DPDL lengths, if the address channel is the Process Data Channel; otherwise the ODL length is used. M-sequences of type 2 (FT2) always use the MPDL, DPDL and ODL lengths (see Figure 9). CMD FT/CHKS OD EVNT/CHKS CMD FT/CHKS MPD/DPD EVNT/CHKS CMD FT/CHKS OD EVNT/CHKS MPD DPD Master Message Device Message FT2 FT1-PD FT0 FT1-OD one byte variable length variable length write access: part of master message read access: part of device message Figure 9: M-sequences of different types

5.7.3.2 Operation

The frame handler listens for incoming master messages and triggers an interrupt if a part or the complete message is received. The interrupt behavior can be modified using the INT_EN_FH (5.8.14) by multiple SPI transactions or single/multiple bulk SPI transactions.

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 23 of 50 © 2020 Dialog Semiconductor After successfully receiving an incoming master message, the frame handler waits for the user to write the complete device message data into the frame buffer via the FHD register, including the CHKS byte. The access to the FHD register can be done by multiple SPI transactions or by a single bulk SPI transaction. The six least significant bits of the CHKS byte are automatically replaced with the compressed checksum of the device message. The UART transmission always starts immediately after the first byte is written into the frame buffer. It is possible to reset the frame handler or skip an invalid M-sequence from any state. This can be done by writing ‘1’ to the RST- or SKIP-bit of the FHC register 5.8.9). Skipping a M-sequence causes the frame handler to ignore the rest of an incoming message, without triggering any additional interrupt. Another way to alter the operational flow is a soft reset. A soft reset is done after receiving the rest of the invalid message or if a timeout was detected. A soft reset will immediately reset the frame handler to its idle state. The state diagram of the frame handler is depicted in Figure 10. RECEIVE TRANSMITIDLE transmission done reset triggered reset triggered start of master message first byte of device message buffered Figure 10: Frame handler state diagram

5.8 Register Description

Registers are used to configure the ICs behavior. These registers can be read or written via the SPI interface. They are divided into three functional groups: 1. The logic connected to pin CQ – also referred to as channel 1 2. The logic connected to pin DIO – also referred to as channel 2 3. General purpose.

5.8.1 Register Definitions

Table 17: Register Definitions Address Name Description 0x00-0x1F - reserved Channel 1 Regs 0x20 CONF1 Channel Configuration 0x21 OVLD1 Overload Protection 0x22 SLEW1 Slew Rate Control 0x23 SIO1 SIO Control 0x24 UART UART Data 0x25 FHC Frame Handler Control

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 24 of 50 © 2020 Dialog Semiconductor Address Name Description 0x26 ODL On-Request Data Length 0x27 MPDL Master Process Data Length 0x28 DPDL Device Process Data Length 0x29 BLVL Frame Handler Buffer Level 0x2A FHD Frame Handler Data 0x2B - reserved (must not be used by future regs) 0x2C-0x2D - reserved 0x2E TRSH Threshold Level Interrupt Triggering 0x30-0x3F - reserved Channel 2 Regs 0x40 CONF2 Channel Configuration 0x41 OVLD2 Overload Protection 0x42 SLEW2 Slew Rate Control 0x43 SIO2 SIO Control 0x44 – 0x5F - reserved Common Regs 0x60 REV Revision Code 0x61 PROT Channel Protection 0x62 STAT Channel Status 0x63 INT_SRC_STAT Status Interrupt sources 0x64 INT_EN_STAT Status Interrupt enables 0x65 INT_SRC_SIO Interrupt sources of SIO-mode 0x66 INT_EN_SIO Interrupt enables of SIO-mode 0x67 INT_SRC_UART Interrupt sources of UART-mode 0x68 INT_EN_UART Interrupt enables of UART-mode 0x69 INT_SRC_FH Interrupt sources of FH-mode 0x6A INT_EN_FH Interrupt enables of FH-mode 0x6B - reserved 0x6C CLK_OUT Output-Clock control 0x6D – 0x7F - reserved

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5.8.2 CONF1 Register (0x20)

This is the configuration register for IO-Link-channel 1. It is possible to configure the channel mode and the communication speed used by the integrated UART, or to generally disable the input stage. Further the channel source and the output stage type can be configured. The output stage can be configured as P-, N-Mode or Push-Pull. Table 18: CONF1 register Bit 7 6 5 4 3 2 1 0 Name DIS DRV CSS COM MODE Access R/W R/W R/W R/W R/W Default 0 11b 0 0 0 MODE Channel Mode 0h: SIO Mode (default) 1h: UART Mode 2h: Frame Handler (IO-Link) Mode 3h: reserved COM UART communication mode 0h: UART disabled (default) 1h: COM1 (4.8 kBit/s) 2h: COM2 (38.4 kBit/s) 3h: COM3 (230.4 kBit/s) CSS Channel Source Select 0: Channel inputs TXD1 and TXEN_1 are controlled via pins 1: Channel inputs TXD1 and TXEN_1 are controlled via internal logic core DRV Output stage configuration 00b CQ1 disabled 01b N-Mode 10b P-Mode 11b Push-Pull DIS IO-Link input stage disable 0: Input stage enabled 1: Input stage disabled (RXD1 = 1)

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5.8.3 CONF2 (0x40)

This is the configuration register for channel 2. The channel source and the output stage type can be configured. The output stage can be configured as P-, N-Mode or Push-Pull. Table 19: CONF2 register Bit 7 6 5 4 3 2 1 0 Name DIS DRV CSS reserved Access R/W R/W R/W - Default 0 11b 0 - CSS Channel Source Select 0: Channel input TXD2 is controlled via pins 1: Channel input TXD2 is controlled via internal logic core DRV Output stage configuration 00b DIO disabled 01b N-Mode 10b P-Mode 11b Push-Pull DIS IO-Link input stage disable 0: Input stage enabled 1: Input stage disabled

5.8.4 OVLD 1 / 2 (0x21 / 0x41)

This is the configuration register for the detection of a high channel load. The detection time of high load and the corresponding disable time of a channel can be configured. If the automatic channel disable function is active and an overcurrent condition at this channel is present for t OVLDDET, the channel gets disabled. After tOVLDDIS passed, the channel is enabled again. CAUTION: Disabling this feature may cause damage to the device! tOVLDDET = 100us * (1 + MULT) tOVLDDIS = 100us * (1 + MULT) * FACTOR Table 20: OVLD register Bit 7 6 5 4 3 2 1 0 Name ADIS MULT Access R/W R/W Default 11b 000000b

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5.8.5 SLEW 1 / 2 (0x22 / 0x42)

This is the slew rate control register for the IO-Link device. Table 21: SLEW register Bit 7 6 5 4 3 2 1 0 Name Reserved SLEW Access - R/W Default - 0 SLEW CQ Output slew rate, current limit and overcurrent detection threshold 0h: Slew rate: 60V/µs Current limit: 300mA Overcurrent threshold: 210mA 1h: Slew rate: 30V/µs Current limit: 150mA Overcurrent threshold: 105mA 2h: Slew rate: 20V/µs Current limit: 100mA Overcurrent threshold: 70mA 3h: Slew rate: 15V/µs Current limit: 75mA Overcurrent threshold: 53mA (default: 0h)

5.8.6 SIO1 (0x23)

This register controls the IO-Link-channel (channel1) if it is configured in SIO mode. Please note the inverted logic! Table 22: SIO1 register Bit 7 6 5 4 3 2 1 0 Name Reserved IN OUT Access - R R/W Default - 0 0 OUT CQ1 Driver Output Value 0b Set CQ1 to high level 1b Set CQ1 to low level IN Status of Pin CQ1 0b Pin CQ1 is at high level 1b Pin CQ1 is at low level

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5.8.7 SIO2 (0x43)

This register controls the output and can read the input at the pin DIO. Please note the inverted logic! Table 23: SIO2 register Bit 7 6 5 4 3 2 1 0 Name Reserved IN OUT Access - R R/W Default - 0 0 OUT DIO Driver Output Value 0b Set DIO to high level 1b Set DIO to low level IN Status of Pin DIO 0b Pin DIO is at high level 1b Pin DIO is at low level

5.8.8 UART (0x24)

If channel1 is configured in UART mode, reading this register returns a received UART character. Writing to this register sends the given character using the integrated UART. Table 24: UART register Bit 7 6 5 4 3 2 1 0 Name DATA (UART_TX write / UART_RX read) Access R/W Default 00h DATA UART character

5.8.9 FHC (0x25)

This register is used to configure and control the behaviour of the frame handler (IO-Link mode) of channel 1. Table 25: FHC register Bit 7 6 5 4 3 2 1 0 Name RST SKIP Reserved TOUT Access W W - R/W Default 0 0 00h 0 TOUT Set this bit to relax each timing constraint by +3TBIT SKIP Skip current frame (Note: while writing to this bit, other register values won’t be changed) RST Reset frame handler (Note: while writing to this bit, other register values won’t be changed)

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5.8.10 ODL (0x26)

This register configures the length of the on-request data in bytes. According to the IO-Link specification, valid values are 1, 2, 8 or 32. (Note: Writing to this register causes a reset of the frame handler.) Table 26: ODL register Bit 7 6 5 4 3 2 1 0 Name LEN Access R/W Default 01h LEN On-Request Data Length

5.8.11 MPDL (0x27)

This register configures the length of the master process data in bytes. Valid values are 0 -32. (Note: Writing to this register causes a reset of the frame handler.) Table 27: MPDL register Bit 7 6 5 4 3 2 1 0 Name LEN Access R/W Default 00h LEN On-Request Data Length

5.8.12 DPDL (0x28)

This register configures the length of the device process data in bytes. Valid values are 0-32. (Note: Writing to this register causes a reset of the frame handler.) Table 28: DPDL register Bit 7 6 5 4 3 2 1 0 Name LEN Access R/W Default 00h LEN On-Request Data Length

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5.8.13 BLVL (0x29)

This register returns the current fill level of the frame handlers input buffer. This can be used for bulk access to the FHD register. Table 29: BLVL register Bit 7 6 5 4 3 2 1 0 Name FCNT Access R Default 00h FCNT Fill count of the frame handlers input buffer

5.8.14 FHD (0x2A)

If channel1 is configured in IO-Link mode, reading this register returns the buffered UART characters of a received message. Writing to this register buffers the given characters for an outgoing message (via a ringbuffer), which gets sent over the integrated UART. Table 30: FHD register Bit 7 6 5 4 3 2 1 0 Name DATA Access R/W Default - DATA Message character

5.8.15 TRSH (0x2E)

This register is used to set a threshold level which is used for level interrupt triggering. (see 5.8.25) Table 31: TRSH register Bit 7 6 5 4 3 2 1 0 Name Reserved LVL Access - R/W Default - 00h LVL Threshold for level interrupt triggering (after TLVL received characters)

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5.8.16 REV (0x60)

This register contains the CCE4502 revision code. Table 32: REV register Bit 7 6 5 4 3 2 1 0 Name MAJ MIN Access R R Default 4h 0h MAJ Major revision code MIN Minor revision code

5.8.17 PROT (0x61)

This channel protection register controls if the IO-Link channel should become disabled by on chip high temperature or high VCC voltage protection. (NOTE: disabling this function may cause damage to master and/or device) Table 33: PROT register Bit 7 6 5 4 3 2 1 0 Name Reserved PTEMP PVCCH Reserved Access - R/W R/W - Default - 1b 1b - PTEMP Channel disable on over temperature 0b Channel is not disabled if over-temperature was flagged 1b Channel is disabled if over-temperature was flagged PVCCH Channel disable on over voltage 0b Channel is not disabled if over-voltage was flagged 1b Channel is disabled if over-voltage was flagged

5.8.18 STAT (0x62)

This register contains some status information depending on the current mode that channel 1 is in. Table 34: STAT register Mode Bit 7 6 5 4 3 2 1 0 SIO Reserved WURQ RXD OUT2 OUT1 UART OFLW RXERR RXRDY TXRDY FH TOUT STATE Access R R R R Default 0 x 0 0

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 32 of 50 © 2020 Dialog Semiconductor OUT1 Channel output value 0b CQ1 is driven high 1b CQ1 is driven low OUT2 Channel output value 0b DIO is driven high 1b DIO is driven low RXD Input state 0b High level detected at input CQ1 1b Low level detected at input CQ1 WURQ Internal wakeup request detection pulse which is reset at the end of any following SPI access 0b No wakeup request (IO-Link) received 1b Wakeup request (IO-Link) received TXRDY UART Transmit state 0b UART is busy transmitting 1b UART is ready to send RXRDY UART receive state 0b UART is ready to receive new data 1b New Data is available in UART RXERR UART parity error flag 0b Last byte was received without parity error 1b Last byte received with parity error OFLW UART receive buffer overflow 0b No receive buffer overflow 1b UART received byte, but receive buffer was not empty STATE Frame Handler state (see section 5.7.3) 000b IDLE 001b Transmission inactive; frame handler waits for data at register FHD 010b Transmission active; no further data required 011b Transmission active; frame handler waits for data at register FHD 100b Receiving active 101b Receiving active; new input available, read register FHD 110b Receiving active; received message is erroneous 111b Receiving active; received message is erroneous; new input available, read register FHD TOUT Frame handler timeout (see section 5.7.3) 0b No timeout detected 1b Timeout detected

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5.8.19 INT_SRC_STAT (0x63)

The status interrupt-source-register contains various relevant status information of the IC. All bits are set by hardware. An interrupt is generated if at least one of these bits is enabled via INT_EN_STAT and contains a ‘1’. Writing a ‘1’ to either of these bits clears this interrupt-source individually. Writing a ‘0’ to any of these bits has no effect. Table 35: INT_SRC_STAT register Bit 7 6 5 4 3 2 1 0 Name Reserved HIGH_T HIGH_VS Reserved CH_DIS2 CH_DIS1 SD2 SD1 Access - R/W1 R/W1 - R/W1 R/W1 R/W1 R/W1 Default - 0 0 - 0 0 0 0 SD1/2 Short detected at pin CQ1 and DIO CH_DIS1/2 Channel CQ1 and DIO disabled due to a detected overload HIGH_VS High voltage detected HIGH_T High temperature detected

5.8.20 INT_EN_STAT (0x64)

The status interrupt-enable-register allows the user to enable each status interrupt-source individually. Table 36: INT_EN_STAT register Bit 7 6 5 4 3 2 1 0 Name - HIGH_T_EN HIGH_VS_EN - CH_DIS2_EN CH_DIS1_EN SD2_EN SD1_EN Access - R/W R/W - R/W R/W R/W R/W Default - 0 0 - 0 0 0 0 SD1/2_EN Enables the interrupt source SD (0b: disabled 1b: enabled) CH_DIS1/2_EN Enables the interrupt source CH_DIS (0b: disabled 1b: enabled) HIGH_VS_EN Enables the interrupt source HIGH_VS (0b: disabled 1b: enabled) HIGH_T_EN Enables the interrupt source HIGH_T (0b: disabled 1b: enabled)

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5.8.21 INT_SRC_SIO (0x65)

The SIO interrupt-source-register contains all relevant information of the SIO-mode. All bits are set by hardware. An interrupt is generated if at least one of these bits is enabled via INT_EN_SIO and contains a ‘1’. Writing a ‘1’ to either of these bits clears this interrupt-source individually. Writing a ‘0’ to any of these bits has no effect. Table 37: INT_SRC_SIO register Bit 7 6 5 4 3 2 1 0 Name Reserved WURQ CQ1_FALL CQ1_RISE Access - R/W1 R/W1 R/W1 Default - 0 0 0 CQ1_RISE Rising edge at Pin CQ1 (voltage changes from 0V to VS) CQ1_FALL Falling edge at Pin CQ1 (voltage changes from VS to 0V) WURQ Wakeup Request detected

5.8.22 INT_EN_SIO (0x66)

The SIO interrupt-enable-register allows the user to enable each SIO interrupt-source individually. Table 38: INT_EN_SIO register Bit 7 6 5 4 3 2 1 0 Name Reserved WURQ_EN CQ1_FALL_EN CQ1_RISE_EN Access - R/W R/W R/W Default - 0 0 0 CQ1_RISE_EN Enables the interrupt source CQ1_RISE (0b: disabled 1b: enabled) CQ1_FALL_EN Enables the interrupt source CQ1_FALL (0b: disabled 1b: enabled) WURQ_EN Enables the interrupt source WURQ (0b: disabled 1b: enabled)

5.8.23 INT_SRC_UART (0x67)

The UART interrupt-source-register contains all relevant information of the UART-mode. All bits are set by hardware. An interrupt is generated if at least one of these bits is enabled via INT_EN_UART and contains a ‘1’. Writing a ‘1’ to either of these bits clears this interrupt-source individually. Writing a ‘0’ to any of these bits has no effect. Table 39: INT_SRC_UART register Bit 7 6 5 4 3 2 1 0 Name Reserved RX_OVFLW RX_REC TX_RDY Access - R/W1 R/W1 R/W1 Default - 0 0 0

IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 35 of 50 © 2020 Dialog Semiconductor TX_RDY UART is ready to send data. Data can be written to (0x24) RX_REC UART received one octet. Received data can be fetched from (0x24) RX_OVFLW UART receive overflow

5.8.24 INT_EN_UART (0x68)

The UART interrupt-enable-register allows the user to enable each UART interrupt-source individually. Table 40: INT_EN_UART register Bit 7 6 5 4 3 2 1 0 Name Reserved RX_OVFLW_EN RX_REC_EN TX_RDY_EN Access - R/W R/W R/W Default - 0 0 0

5.8.25 INT_SRC_FH (0x69)

The FH interrupt-source-register contains all relevant information of the frame handler mode. All bits are set by hardware. An interrupt is generated if at least one of these bits is enabled via INT_EN_FH and contains a ‘1’. Writing a ‘1’ to either of these bits clears this interrupt-source individually. Writing a ‘0’ to any of these bits has no effect. Table 41: INT_SRC_FH register Bit 7 6 5 4 3 2 1 0 Name Reserved TOUT SOT SOR LVL MSG Access - R/W1 R/W1 R/W1 R/W1 R/W1 Default - 0 0 0 0 0 MSG End of Message (Triggers after the last character of a message was received) LVL Message Level (Triggers if a defined amount of buffered characters is reached, see 5.8.15) SOR Start of Receiving (Triggers as soon as the device starts receiving a message) SOT Start of Transmitting (Triggers when the device starts transmitting its message) TOUT Timeout detected Figure 11: Interrupt Trigger Positions

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5.8.26 INT_EN_FH (0x6A)

The FH interrupt-enable-register allows the user to enable each FH interrupt-source individually. Table 42: INT_EN_FH register Bit 7 6 5 4 3 2 1 0 Name Reserved TOUT_EN SOT_EN SOR_EN LVL_EN MSG_EN Access - R/W R/W R/W R/W R/W Default - 0 0 0 0 0 MSG_EN Enables the interrupt source MSG (0b: disabled 1b: enabled) LVL_EN Enables the interrupt source LVL (0b: disabled 1b: enabled) SOR_EN Enables the interrupt source SOR (0b: disabled 1b: enabled) SOT_EN Enables the interrupt source SOT (0b: disabled 1b: enabled) TOUT_EN Enables the interrupt source TOUT (0b: disabled 1b: enabled)

5.8.27 CLK_OUT (0x6C)

This register controls the clock output of the chip. If the clock is not externally needed, the output pad for port CLK_EXT can be disabled via bit CLK_OUT_DIS. Table 43: CLK_OUT register Bit 7 6 5 4 3 2 1 0 Name Reserved CLK_OUT_DIS Access - R/W Default - 1b CLK_OUT_DIS Output Clock disable 0b CLK_EXT is not disabled 1b CLK_EXT is disabled

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5.9 Interruption Handling

enabled by configuring their corresponding interrupt enable registers. All enabled interrupt flags are logically “or”ed and the inverted result is connected to the pin INTX. By default, all interrupt sources are disabled at startup. There is no global interrupt enable. The interrupt source bits are always set when a transition to the active state is observed at the related signals. This setting of bits is not disabled when the interrupt source is not enabled. To clear an interrupt the user (e.g. MCU) has to write a ‘1’ to the specific bit of the interrupt source register

5.10 SPI (Serial Peripheral Interface)

5.10.1 Signal Description

Table 44: Signal Description Name Type Description MOSI Input Data input MISO Output Data output SCLK Input Clock input (fMAX = 20 MHz) SSX Input Slave select (active-low) INTX Output Interrupt output for microcontroller (active-low)

5.10.2 Data Format

The CCE4502 is configured as SPI slave and uses the CPOL=0, CPHA=0 configuration, i. e. SCLK is low in idle mode and the data has to be valid on the rising edge of SCLK. During each transaction, a minimum of 2 bytes have to be transferred. For bulk access to the frame -handler-buffer via the FHD register, n bytes can be transferred. The first received byte after a falling SSX edge always reflects the current status of the two channels. The format depends on the configured modes. Figure 12 illustrates the timing of a SPI access and Table 45 contains the related timing characteristics. SCLK SSX Bit 7MOSI MISO Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Byte 0 Byte 1 Byte n tspi_clk tssx,idle tssx,l tssx,h Figure 12: SPI timing diagram

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5.10.3 MOSI Format

Table 46: MOSI Format Bit 7 6 5 4 3 2 1 0 1st Byte ADR R/W 2nd Byte DATA nth Byte DATA ADR Address for register access 0x20-0x3F Channel 1 registers 0x40-0x5F Channel 2 registers 0x60-0x7F Common registers R/W Register access type b0 write to address b1 read from address DATA Value for write access 3rd – nth byte is optional; ignored on read access

5.10.4 MISO Format

Table 47: MISO Format Bit 7 6 5 4 3 2 1 0 1st Byte STAT 2nd Byte DATA nth Byte DATA STAT status of the IC (see 5.10.5) DATA Current value on read access to register 3rd – nth byte is optional; not valid on write access

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5.10.5 STAT Format

Table 48: STAT Format Mode Mode Name 7 6 5 4 3 2 1 0 0b00 SIO Mode HIGH_T HIGH_VS - WURQ SD2 SD1 MODE 0b01 UART Mode HIGH_T RX_ERR RX_RDY TX_RDY SD2 SD1 MODE 0b10 IO-Link Mode TOUT FH_STAT SD2 SD1 MODE MODE IC mode 0h: SIO Mode (default) 1h: UART Mode 2h: IO-Link Mode 3h: reserved SD1/SD2 Short Detection on CQ1 and DIO WURQ Wake-Up on CQ1 detected, identical to INT_SRC_SIO.WURQ HIGH_VS High voltage indicator HIGH_T High temperature indicator TX_RDY UART transmitter ready RX_RDY UART receiver ready (input available) RX_ERR UART parity error FH_STAT Frame Handler state (see section 5.7.3) 000b: IDLE 001b: Transmission inactive; frame handler waits for data at register FHD 010b: Transmission active; no further data required 011b: Transmission active; frame handler waits for data at register FHD 100b: Receiving active 101b: Receiving active; new input available, read register FHD 110b: Receiving active; received message is erroneous 111b: Receiving active; received message is erroneous; new input available TOUT Frame handler timeout (see section 5.7.3) 0b: No timeout detected 1b: Timeout detected

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6 Application notes

6.1 Power Dissipation Constraints

The CCE4502 QFN24 package has a thermal resistance of 40 K/W from silicon junction to ambient using an optimized PCB design. With maximum ambient temperature of 105°C and maximum junction temperature of 150°C a maximum power dissipation of 1.125W can be handled by the thermal capabilities of the QFN package. Following table gives an exemplary overview of the power contributions of the different circuit blocks contained in the CCE4502 and calculated at nominal condition V(L+) = 24V and VHH = 7V. Table 49: CCE4502 Power contributions Circuit Block Voltage Drop Current Power IO Channel 1 2 V 200 mA 0.400 W IO Channel 2 2 V 200 mA 0.400 W 5/3.3V Regulator (at 3.3V), Reference 3.7 V 50 mA 0.185 W 5V Regulator 19 V 10 mA 0.190 W 1.8V Regulator (internal) 5.2 V 3 mA 0.016 W DC/DC Converter (in buck mode) 17 V 60 mA 0.204 W DC/DC Converter (in linear mode) 17 V 60 mA 1.020 W The calculated power sum with nearly 1.4 Watt (DC/DC in buck mode) shows that tradeoffs must be made in the overall system design and by using the different features of the CCE4502 IC.

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6.2 Application with DC / DC Converter in Buck Mode

3.3V / 5V 100nF 22µF 3) ESR=0.6 22µH 2) 14.745MHz 1) TVS diode such as SMAJ33A 2) e.g. 744032220 /Würth 3) e.g. TPSB226K016R0600/AVX 10µF CCE4502 LEXT VHH VSS VDD1V8 VDD INTX SDX1 TXD1 MOSI MISO TXEN1 RXD1 SDX2 TXD2 SSX SCLK DIO CQ1 CLKEXT 3.3V / 5V from µC from µC VDD5 VREF 470nF 100nF5V from µC from µC to µC to µC 1.2V from µC to µC to µC to µC DCDC regulator in Buck Mode from µC Sensor/Board EnvironmentL- DIO CQ1 L+ Figure 13: Application with active DC/DC Converter (Supply Mode 1)

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6.3 Application with DC / DC Converter in Linear Mode

1) TVS diode such as SMAJ33A CCE4502 LEXT VHH VSS VDD1V8 VDD INTX SDX1 TXD1 MOSI MISO TXEN1 RXD1 SDX2 TXD2 SSX SCLK DIO CQ1 CLKEXT Sensor/Board Environment 3.3V / 5V 100nF 100nF L- DIO CQ1 L+ 1.2V from µC 14.745MHz 10µF from µC to µC from µC VDD5 VREF 470nF 100nF5V to µC from µC from µC to µC to µC to µC DCDC regulator in Linear Mode from µC Figure 14: Application with disabled DC/DC Converter (Supply Mode 2)

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6.4 Application with External Supply

3.3V / 5V 100nF 100nF L- DIO CQ1 L+ 1.2V from µC 14.745MHz External 6V-36V supply 1) TVS diode such as SMAJ33A 10µF from µC to µC from µC VDD5 VREF 470nF 100nF5V to µC from µC from µC to µC to µC to µC from µC Figure 15: Application with external supply (Supply Mode 3)

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7 Package Outline

7.1 QFN24 Package

Figure 16: QFN24 Package. Drawing not to scale! Symbol A A1 A3 b D E e L K D2 E2 Min 0.70 0.00 0.20 REF. 0.18 4.00 BSC. 4.00 BSC. 0.50 BSC. 0.35 0.20 2.50 2.50 UNIT: mm

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7.2 Chip Scale Package (Bumped Die)

Figure 17: CSP package drawing

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8 Tape and Reel Information

8.1 Tape QFN24 Package

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8.2 Reel Information

Figure 18: Reel Dimensions Symbol A B C D W1 QFN24 Min - 1.5 12.8 20.2 13.25 Typ - - 13.0 - - Max 330 - 13.5 - 13.75

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9 Ordering Information

Parts are available as in QFN or CSP package, delivered in tape&reel or tray, with buck mode or linear mode DC/DC converter function and 3.3V or 5V VDD output voltage. Please find your order code below and visit dialog-semiconductor.com/contact/inquiry for an individual quote. CCE4502 B QFN3.3 VDD output voltage 3.3 – 3.3 V 5 – 5 V DC/DC mode B – Buck mode L – Linear mode Latest revision CC – Revision CC Package QFN – QFN24 CSP – CSP Order code: CC –

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IO-Link Device IC with integrated Frame Handler Datasheet Revision 2.4 31-JUL-2020 CFR0011-120-00 50 of 50 © 2020 Dialog Semiconductor Status Definitions Revision Datasheet Status Product Status Definition 1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. 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