CCA1224 Datasheet | DigiCamel IC Datasheet

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Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 12

Technical content

Datasheet sections

2 Pinout
3 Absolute Maximum Ratings
4 Electrical Characteristics
5 Functional Description
6 Application notes
7 Package Outline
8 Tape and Reel Information
8.1 Tape Information
8.2 Reel Information
9 Ordering Information
10 Revision History
11 Disclaimer

Bus Interface IC (Driver, Receiver) Datasheet Revision 1.4 31-Oct-2019 CFR0011-120-00 1 of 12 © 2019 Dialog Semiconductor General Description The CCA1224 is a bus interface IC with driver and receiver function. The bus driver provides two or combined inputs and a differential current bus output. The receiver uses the driver outputs as input and delivers the signal to an open collector output. This device is functional and pin compatible to the obsolete part no. HA12240. Typical applications are automotive audio equipment controllers.

FEATURES

Two or combined data inputs (3.3 V and 5.0 V)
Hysteresis input comparator
Current drive output typ. 3.8 mA
Hysteresis comparator for receiver
Wide receiver common- mode input range of 0 to 5V typ.
Open collector receiver output
Operating VCC 5 V ±0.5 V
Standby function (IVCC < 1 µA)
ESD protection 2 kV
on all IO pins
SOP8 package
Automotive qualified (AECQ100) SCHEMATIC Figure 1: Block Diagram

2 Pinout

Figure 2: Package SOP8 (3.9x4.9mm) PIN DESCRIPTIONS Table 1: Pin Descriptions Symbol Pin no. Type Description Schematic IN1 1 IN Data input 1 ROUT 2 OUT Receiver output (open collector) IN2 3 IN Data input 2 GND 4 PWR Ground BUSM 5 IN/OUT Minus bus driver output, receiver input BUSP 6 IN/OUT Plus bus driver output, receiver input VCC 7 PWR Voltage supply STB 8 IN Stand by input: H => operating mode; L => standby mode

3 Absolute Maximum Ratings

Table 2: Absolute Maximum Ratings Parameter Symbol Conditions Min Typ Max Unit Supply Voltage VCC static -0.7 36 V Power dissipation QFN48 PTOT_QFN Multilayer PCB, Exp. Pad soldered, ϑAMB = 60°C 2 W Power dissipation QFN24 PTOT_QFN Multilayer PCB, Exp. Pad soldered, ϑAMB = 60°C 1.5 W Junction Temperature ϑJUNC 150 °C ESD-sensitivity VESD Human Body Model EIA/JESD22- A114-B 2 kV Storage Temperature ϑSTORAGE -55 155 °C Soldering Temperature ϑSOLDER 12 s max 260 °C FIT Rate 50 FIT Functional operation is only guaranteed within operating conditions listed under “Electrical Characteristics”. Exposure to absolute maximum rating conditions for extended periods of time may affect device reliability. Exposure to conditions beyond those ratings may cause permanent damage to the device.

4 Electrical Characteristics

Electrical characteristics are valid for the whole specified temperature range and supply voltage range, if not otherwise noted. GENERAL PARAMETERS Table 3: General Parameters Parameter Symbol Conditions Min Typ Max Unit Supply Voltage VCC 4.5 5 5.5 V Supply Current IVCC 0.8 8.5 mA Operating Temperature ϑAMB -40 105 °C Thermal Resistance Ambient ϑJA_SOPN- Junction to Ambient 100 K/W

Bus Interface IC (Driver, Receiver) Datasheet Revision 1.4 31-Oct-2019 CFR0011-120-00 4 of 12 © 2019 Dialog Semiconductor DRIVER Table 4: Driver Parameter Symbol Conditions Min Typ Max Unit High-level input voltage IN1 VIHS1 V1 = 0 V -> 5 V; V3 = 0 V; V6 – V5 = 110 mV ↑ 2.1 V Low-level input voltage IN1 VILS1 V1 = 5 V -> 0 V; V3 = 0 V; V6 – V5 = 30 mV ↓ 1.65 V High-level input current IN1 IIHS1 V1 = 5 V -1 0 1 µA Low-level input current IN1 IILS1 V1 = 0 V -1 0.1 1 µA High-level input voltage IN2 VIHS2 V3 = 0 V -> 5 V; V1 = 0 V; V6 – V5 = 110 mV ↑ 2.1 V Low-level input voltage IN2 VILS2 V3 = 5 V -> 0 V; V1 = 0 V; V6 – V5 = 30 mV ↓ 1.65 V High-level input current IN2 IILS2 V3 = 5 V -1 0 1 µA Low-level input current IN2 IILS2 V3 = 0 V -1 0.1 1 µA High-level output voltage BUSP VOHDP V1 or V3 > 2.1 V 1.8 2.5 3.2 V Low-level output voltage BUSM VOHDM V1 or V3 > 2.1 V 1.8 2.5 3.2 V High-level output current (BUSP out; BUSM in) IOH V1 or V3 > 2.1 V 3.1 3.8 4.5 mA Low-level output voltage BUSP, BUSM VOLD V1 and V3 < 1.65 V 2.3 2.5 2.7 V Driver output resistance RO V1 or V3 > 2.1 V Fehler! Verweisquelle konnte nicht gefunden werden.. 3; measure I61 at V6 = VOLD + 0.3 V then measure I62 at V6 = VOLD - 0.3 V; RO = 0.6 V / (I61 - I62) 5 10 15 kΩ Driver delay time low -> high TDDR V1 = 4.5 V ↑; V6 – V5 = 110 mV ↑; 80 150 ns Driver delay time high -> low TDDF V1 = 0.5 V ↓; V6 – V5 = 30 mV ↓; 40 70 ns RECEIVER Table 5: Receiver Parameter Symbol Conditions Min Typ Max Unit High-level input voltage at low common-mode BUSP-BUSM VIH1 V6 = 0 V -> 5 V; V5 = 0 V; V1 = 0 V; V3 = 0 V; V2 = 4 V ↑; VIH1 = V6 – 45 80 110 mV High-level input voltage at high common-mode BUSP-BUSM VIH2 V6 = 0 V -> 5 V; V5 = 4.5 V; V1 = 0 V; V3 = 0 V; V2 = 4 V ↑; VIH2 = V6 – 45 80 110 mV Low-level input voltage at low common-mode BUSP-BUSM VIL1 V6 = 5 V -> 0 V; V5 = 0 V; V1 = 0 V; V3 = 0 V; V2 = 1 V ↓; VIL1 = V6 – 30 50 95 mV High-level input voltage at high common-mode BUSP-BUSM VIL2 V6 = 5 V -> 0 V; V5 = 4.5 V; V1 = 0 V; 30 50 95 mV

Bus Interface IC (Driver, Receiver) Datasheet Revision 1.4 31-Oct-2019 CFR0011-120-00 5 of 12 © 2019 Dialog Semiconductor Parameter Symbol Conditions Min Typ Max Unit V3 = 0 V; V2 = 1 V ↓; VIL2 = V6 – Input hysteresis voltage at low common-mode BUSP-BUSM VIHYS1 VIHYS1 = VIH1 - VIL1 15 30 45 mV Input hysteresis voltage at high common-mode BUSP-BUSM VIHYS2 VIHYS2 = VIH2 - VIL2 15 30 45 mV High-level common-mode input voltage BUSM VHCOM V5 = 0 V -> 5 V; V1 = 0 V; V3 = 0 V; VHCOM = V5 when V2 = 4 V ↓; V6 – V5 = 110 mV 4.5 V Low-level common-mode input voltage BUSM VLCOM V5 = 0 V -> 5 V; V1 = 0 V; V3 =

0 V; VHCOM = V5 when V4 = 1 V

V6 – V5 = 30 mV 5 V Receiver input resistance RI V1 and V3 < 1.65 V Fehler! Verweisquelle konnte nicht gefunden werden.. 3; measure I63 at V6 = VOLD + 0.3 V then measure I64 at V6 = VOLD - 0.3 V; RI = 0.6 V / (I63 - I64) 25 35 45 kΩ High-level receiver output leakage current ROUT IROH V1 = 5 V; V3 = 0 V; V2 = 5 V -1 0 1 µA Standby 1 receiver output leakage current ROUT IROS1 V1 = 0 V; V3 = 0 V; V8 = 0 V; VCC = 0 V; V2 = 5 V -1 0 1 µA Standby 2 receiver output leakage current ROUT IROS2 V1 = 0 V; V3 = 0 V; V8 = 0 V; V2 = 5 V -1 0 1 µA Low-level 1 receiver output voltage ROUT VROL1 V1 = 0 V; V3 = 0 V; I2 = 1.5 mA 0.6 V Low-level 2 receiver output voltage ROUT VROL2 V1 = 0 V; V3 = 0 V; I2 = 200 µA 0.3 V Receiver delay time low -> high TRDR V6 – V5 = 110 mV ↑; V2 = 4.5 V ↑ 600 700 ns Receiver delay time high -> low TRDF V6 – V5 = 30 mV ↓; V2 = 0.5 V ↓ 110 150 ns BIAS AND VCC Table 6: BIAS and VCC Parameter Symbol Conditions Min Typ Max Unit Quiescent current high VCC ICCH V1 or V3 > 2.1 V 3 8.5 mA Quiescent current low VCC ICCL V1 and V3 < 1.65 V 0.8 1.8 mA Standby driver output leakage current BUSP IDOS V8 = 0 V; V1 or V3 > 2.1 V; V6 =

5 V -1 1 µA

Standby supply leakage current VCC IVCCS V8 = 0 V; V1 or V3 > 2.1 V; -1 1 µA Standby high-level input voltage STB VSTBH V8 = 0 V -> 5 V; V1 = 0 V; V3 = 0 V; VSTBH = V8 when V5, V6 = 2.3 V 0.9 2 V Standby low-level input voltage STB VSTBL V8 = 5 V -> 0 V; V1 = 5 V; V3 = 0 V; VSTBH = V8 when IVCC = 1 µA ↓ 0.9 2 V

Bus Interface IC (Driver, Receiver) Datasheet Revision 1.4 31-Oct-2019 CFR0011-120-00 6 of 12 © 2019 Dialog Semiconductor Parameter Symbol Conditions Min Typ Max Unit Standby high-level input current STB ISTBH V8 = 5 V; V1 = 5 V; V3 = 0 V; 50 100 µA Standby low-level input current STB ISTBL V8 = 0 V; V1 = 5 V; V3 = 0 V; -1 0 1 µA Figure 3: Measurement Circuits

5 Functional Description

The “Driver block” has two inputs and a differential current output. The inputs IN1 (Pin 1) and IN2 (Pin 3) are “or” -connected and their switching level and hysteresis are 3.3V and 5V compatible. The output BUSP (Pin 6) delivers a source current and BUSM (Pin 5) delivers a sink current of the same amount, so that with an external 60 Ohm Resistor between BUSP and BUSM the differential voltage is 230 mV (high) and 0 mV (low). The common-mode voltage is about 2.5 V, but the output can withstand external voltage up to VCC + 0.3V.

Bus Interface IC (Driver, Receiver) Datasheet Revision 1.4 31-Oct-2019 CFR0011-120-00 7 of 12 © 2019 Dialog Semiconductor RECEIVER The “Receiver block” has a differential voltage input and an open collector output. It share the Pins BUSP (Pin 6) and BUSM (Pin 5) with the driver block, but for the receiver block they are the differential voltage input. They have a large common- mode operating voltage from 0 V to 4.5 V and can withstand external voltage up to VCC + 0.3V. The receiver output ROUT is open collector, so that the supply voltage for the external resistor at this Pin determines the following logic level. BIAS The “Bias block” delivers an internal reference voltage (2.5 V), several reference currents and the chance with the signal of Pin STB (Pin 8) to activate or deactivate the supply for all function blocks, so that in the standby mode (V(STB) < 0.9 V) the power supply current falls to less than 1µA.

6 Application notes

Figure 4: Application

7 Package Outline

7.1 SOP8 Package

Figure 5: SOP8 Package Symbol A A1 A2 b C D E E1 e L h Ɵ° BSC. 6.00 BSC. 3.90 BSC 1.27 BSC. 0.40 0.25 5.15

8 Tape and Reel Information

8.1 TAPE INFORMATION

Figure 6: Tape Information

8.2 Reel Information

Figure 7: Reel Information Symbol A B C D W1 Minimal - 1.5 12.8 20.2 13.25 Typical - - 13.0 - - Maximum 330 - 13.5 - 13.75

9 Ordering Information

Table 7: Ordering Information Part Order No. Package Delivery Quantity CCA1224 CCA1224_SO-P8 SOPN-8 Tape & Reel 3.800 parts per reel

Bus Interface IC (Driver, Receiver) Datasheet Revision 1.4 31-Oct-2019 CFR0011-120-00 11 of 12 © 2019 Dialog Semiconductor Revision Date Description 1.4 31-Oct-2019 Updated Template 1.3 24-Jul-2015 Updated Form 1.2 30-Apr-2015 Change of Part Number 1.1 25-Mar-2015 Changes in Timing and Bus 1.0 28-Aug-2014 Initial version

11 Disclaimer

Information in this document is believed to be accurate and reliable. However, Dialog Semiconductor does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information. Dialog Semiconductor furthermore takes no responsibility whatsoever for the content in this document if provided by any information source outside of Dialog Semiconductor. Dialog Semiconductor reserves the right to change without notice the information published in this document, including without limitation the specification and the design of the related semiconductor products, software and applications. Applications, software, and semiconductor products described in this document are for illustrative purposes only. Dialog Semiconductor makes no representation or warranty that such applications, software and semiconductor products will be suitable for the specified use without further testing or modification. Unless otherwise agreed in writing, such testing or modification is the sol e responsibility of the customer and Dialog Semiconductor excludes all liability in this respect. Customer notes that nothing in this document may be construed as a license for customer to use the Dialog Semiconductor products, software and applications referred to in this document. Such license must be separately sought by customer with Dialog Semiconductor. All use of Dialog Semiconductor products, software and applications referred to in this document are subject to Dialog Semiconductor’s Standard Terms and Conditions of Sale, available on the company website (www.dialog-semiconductor.com) unless otherwise stated. Dialog and the Dialog logo are trademarks of Dialog Semiconductor plc or its subsidiaries. All other product or service names are the property of their respective owners. © 2019 Dialog Semiconductor. All rights reserved.

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Bus Interface IC (Driver, Receiver)

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Bus Interface IC (Driver, Receiver)

Source title CCA1224 Datasheet(PDF) - Dialog Semiconductor

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