CC3100MOD SimpleLink™ Wi-Fi CERTIFIED™ Network Processor IoT Module Solution datasheet (Rev. B)
Document overview
- Manufacturer or author: Texas Instruments, Incorporated [SWRS161,B]
- PDF pages: 49
Technical content
CC3100MOD SimpleLink™ Wi-Fi CERTIFIED™ Network Processor Internet-of-Things Module Solution for MCU Applications
1 Features
- The CC3100MOD is a Wi-Fi ® module consisting of the CC3100R11MRGC Wi-Fi network processor and power management subsystems. This fully integrated module includes all required clocks, serial peripheral interface (SPI) flash, and passives.
- Modular FCC, IC, TELEC, and CE certifications save customer effort, time, and money
- Wi-Fi CERTIFIED ™ modules, with ability to request certificate transfer for Wi-Fi Alliance members
- Wi-Fi network processor subsystem – Featuring Wi-Fi Internet-on-a chip ™ circuits – Dedicated Arm ® microcontroller (MCU) Completely offloads Wi-Fi and Internet protocols from the external MCU – Wi-Fi driver and multiple Internet protocols in ROM – 802.11 b/g/n radio, baseband, and medium access control (MAC), Wi-Fi driver, and supplicant – TCP/IP stack
- Industry-standard BSD socket application programming interfaces (APIs)
- 8 simultaneous TCP or UDP sockets
- 2 of the 8 sockets can be TLS and SSL sockets – Powerful crypto engine for fast, secure Wi-Fi and Internet connections with 256-bit AES encryption for TLS and SSL connections – Station, AP, and Wi-Fi Direct ® modes – WPA2 Personal and Enterprise Security – SimpleLink ™ connection manager for autonomous and fast Wi-Fi connections – SmartConfig ™ technology, AP mode, and WPS2 for easy and flexible Wi-Fi provisioning – TX power
- 17 dBm at 1 DSSS
- 17.25 dBm at 11 CCK
- 13.5 dBm at 54 OFDM – RX sensitivity
- –94.7 dBm at 1 DSSS
- –87 dBm at 11 CCK
- –73 dBm at 54 OFDM – Application throughput
- UDP: 16 Mbps
- TCP: 13 Mbps
- Host interface – Wide range of power supply (2.3 to 3.6 V) – Interfaces with 8-, 16-, and 32-bit MCU or ASICs over a SPI or UART interface – Low footprint host driver: less than 6KB – Supports RTOS and no-OS applications
- Power-management subsystem – Integrated DC-DC converter suports a wide range of supply voltage:
- Direct battery mode: 2.3 V to 3.6 V – Low power consumption at 3.6 V
- Hibernate with real-time clock (RTC): 7 μA
- Standby: 140 μA
- RX traffic: 54 mA at 54 OFDM
- TX traffic: 223 mA at 54 OFDM
- Integrated components on module – 40.0-MHz crystal with internal oscillator – 32.768-kHz crystal (RTC) – 8-Mbit SPI serial flash – RF filter and passive components
- 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm LGA package for easy assembly and low-cost PCB design
- Operating temperature range: –20°C to +70°C
- Module supports SimpleLink Developers Ecosystem www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 1 Product Folder Links: CC3100MOD CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
2 Applications
For Internet-of-Things (IoT) applications, such as:
- Cloud connectivity
- Internet gateway
- Home automation
- Home appliances
- Access control
- Security systems
- Smart energy
- Industrial control
- Smart plug and metering
- Wireless audio
- IP network sensor nodes
- Wearables
3 Description
Add Wi-Fi® to low-cost, low-power MCU for IoT applications. The CC3100MOD is an FCC, IC, CE, and Wi-Fi CERTIFIED™ module that is part of the SimpleLink ™ Wi-Fi family, which dramatically simplifies the implementation of Internet connectivity. The CC3100MOD integrates all protocols for Wi-Fi and Internet, which greatly minimize host MCU software requirements. With built-in security protocols, the CC3100MOD solution provides a robust and simple security experience. Additionally, the CC3100MOD is a complete platform solution including various tools and software, sample applications, user and programming guides, reference designs, and the TI E2E™ support community. The CC3100MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filter, crystal, and passive components that are fully integrated. The Wi-Fi network processor subsystem features Wi-Fi Internet-on-a chip ™ circuitry and contains an additional dedicated Arm® MCU that off-loads the host MCU. This subsystem includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The CC3100MOD module supports station, access point, and Wi-Fi direct modes. The module supports WPA2 personal and enterprise security and also WPS 2.0. This subsystem includes embedded TCP/IP, TLS/SSL stacks, an HTTP server, and multiple Internet protocols. The power-management subsystem includes an integrated DC-DC converter with support for a wide range of supply voltages. This subsystem enables low-power consumption modes such as hibernate with RTC , which requires approximately 7 µA. The CC3100MOD module can connect to any 8-, 16-, or 32-bit MCU over the SPI or UART Interface. The device driver minimizes the host memory footprint requirements of less than 7KB of code memory and 700B of RAM for a TCP client application. Table 3-1. Module Information PART NUMBER(1) PACKAGE BODY SIZE CC3100MODR11MAMOB MOB (63) 20.5 mm × 17.5 mm (1) For more information, see Section 13. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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4 Functional Block Diagrams
Figure 4-1 shows the functional block diagram of the CC3100MOD module. CC3100MOD VCC HOST I/F RF Filter Serial Flash 8Mbit Pull-up resistors CC3100R11MRGC Power Inductors Caps 32-KHz Crystal 40-MHz Crystal Figure 4-1. CC3100MOD Functional Block Diagram www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: CC3100MOD
TCP/IP & TLS/SSL Stacks ARM Processor MAC Processor Crypto Engine Synthesizer PA LNA SWAS031-A Figure 4-2. CC3100 Hardware Overview External Microcontroller ARM Processor (Wi-Fi Network Processor) Wi-Fi Baseband Wi-Fi MAC Wi-Fi Radio Wi-Fi Driver Supplicant TCP/IP TLS/SSL Internet Protocols User Application Embedded Wi-Fi Embedded Internet SimpleLink Driver SPI or UART Driver SWAS031-B Figure 4-3. CC3100 Software Overview CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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5 Functional Block Diagrams
Figure 5-1 shows the functional block diagram of the CC3100MOD module. CC3100MOD VCC HOST I/F RF Filter Serial Flash 8Mbit Pull-up resistors CC3100R11MRGC Power Inductors Caps 32-KHz Crystal 40-MHz Crystal Figure 5-1. CC3100MOD Functional Block Diagram www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: CC3100MOD
TCP/IP & TLS/SSL Stacks ARM Processor MAC Processor Crypto Engine Synthesizer PA LNA SWAS031-A Figure 5-2. CC3100 Hardware Overview External Microcontroller ARM Processor (Wi-Fi Network Processor) Wi-Fi Baseband Wi-Fi MAC Wi-Fi Radio Wi-Fi Driver Supplicant TCP/IP TLS/SSL Internet Protocols User Application Embedded Wi-Fi Embedded Internet SimpleLink Driver SPI or UART Driver SWAS031-B Figure 5-3. CC3100 Software Overview CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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8.6 TX Power and IBAT versus TX Power Level
8.11 Thermal Resistance Characteristics for MOB
11 Environmental Requirements and Specifications....34
13 Mechanical, Packaging, and Orderable
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from December 6, 2014 to September 22, 2020 (from Revision A () to Revision B ()) Page
- Added graphs representing TX Power and IBAT vs TX Power Level Settings (1 DSSS, 6 OFDM, and 54
- Changed minimum clock period to 50 ns, maximum clock low period to 25 ns, and maximum clock high
- Changed minimum clock period to 50 ns, maximum clock low period to 25 ns, and maximum clock high www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: CC3100MOD
SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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7 Terminal Configuration and Functions
7.1 CC3100MOD Pin Diagram
Figure 7-1 shows the pin diagram for the CC3100MOD device. 28 29 30 31 3332 34 35 36 37 38 39 40 41 42 43 16 15 14 13 1112 10 9 8 7 6 5 4 3 2 1 62 61 57 56 GND NC NC SOP1 SOP2 NC RESERVED NC RESERVED NC NC GND NC NC NC NC HOST_INTR FORCE_AP NC HOST_SPI_nCS HOST_SPI_DOUT HOST_SPI_DIN HOST_SPI_CLK nHIB NC GND GND UART1_nRTS NC UART1_TX UART1_RX TEST_58 TEST_59 TEST_60 UART1_nCTS TEST_62 NC NC GND NC GND RF _BG GND NC SOP nRESETVBAT _DCDC _ANA VBAT _DCDC _PA GND NC VBAT _DCDC _DIG _IO NC NC GND GND GND GND GND GND GND GND GND CC3100MOD Figure 7-1 shows the approximate location of pins on the module. For the actual mechanical diagram, refer to Section 13. Figure 7-1. CC3100MOD Pin Diagram Bottom View www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: CC3100MOD
7.2 Pin Attributes
Table 7-1 lists the pin descriptions of the CC3100MOD module. Note If an external device drives a positive voltage to signal pads when the CC3100MOD is not powered, DC current is drawn from the other device. If the drive strength of the external device is adequate, an unintentional wakeup and boot of the CC3100MOD can occur. To prevent current draw, TI recommends one of the following:
- All devices interfaced to the CC3100MOD must be powered from the same power rail as the CC3100MOD.
- Use level-shifters between the CC3100MOD and any external devices fed from other independent rails.
- The nRESET pin of the CC3100MOD must be held low until the V BAT supply to the device is driven and stable. Leaving the nRESET pin unconnected ensures this (_____) automatically due to the internal RC circuit. Table 7-1. Module Pin Attributes PIN(1) DEFAULT FUNCTION TYPE DESCRIPTION
1 GND – Ground
2 GND – Ground
3 NC – Reserved. Do not connect. 4 nHIB I Hibernate signal, active low. Refer to Figure 8-7.
5 HOST_SPI_CLK I Host interface SPI clock
6 HOST_SPI_DIN I Host interface SPI data input
7 HOST_SPI_DOUT O Host interface SPI data output
8 HOST_SPI_nCS I Host interface SPI chip select (active low)
9 NC – Reserved. Do not connect. 10 NC – Reserved. Do not connect.
11 HOST_INTR O Interrupt output
12 NC – Reserved. Do not connect.
13 FLASH_SPI_MISO I Serial flash interface: SPI data in (active high)
14 FLASH_SPI_nCS_IN O Serial flash interface: SPI chip select (active low)
15 FLASH_SPI_CLK O Serial flash interface: SPI clock
16 GND – Ground
17 FLASH_SPI_MOSI O Serial flash interface: SPI data out
18 NC – Reserved. Do not connect. 19 RESERVED – Reserved. Do not connect. 20 NC – Unused. Do not connect. 21 RESERVED – Add 100-kΩ external pulldown resistor. Not adding this resistor can lead to higher current in LPDS mode. 23 SOP2/TCXO_EN – Add 10-kΩ pulldown to ground. 24 SOP1 – Add 100k pulldown to ground. 25 NC – Reserved. Do not connect. 26 NC – Reserved. Do not connect. 27, 28 GND – Ground 29 NC – Do not connect. 30 GND – Ground. Reference for RF signal. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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Table 7-1. Module Pin Attributes (continued) PIN(1) DEFAULT FUNCTION TYPE DESCRIPTION 31 RF_BG I/O 2.4-GHz RF input/output 32 GND – Ground. Reference for RF signal. 33 NC – Reserved. Do not connect. 34 SOP0 – Add 100k pulldown to ground. 35 nRESET I Power on reset. Does not require external RC circuit. 36 VBAT_RESET – Power supply to internal pull-up resistor on nRESET pin (2.3 V to 3.6 V) 37 VBAT1 – Power supply for the module, can be connected to battery (2.3 V to 3.6 V).
38 GND – Ground
39 NC – To be left unconnected. Used for prototype samples only. 40 VBAT2 – Power supply for the module, can be connected to battery (2.3 V to 3.6 V). 41, 42 NC – Reserved. Do not connect.
43 GND – Ground
44 UART1_nRTS O
UART request to send, connect to external test point. Used for on-module flash reprogramming. Add 100-kΩ pulldown to ground when using UART for host interface. 45 NC – Reserved. Do not connect. 46 UART1_TX O UART transmit, connect to external test point. Used for on-module flash reprogramming.
47 UART1_RX I
UART receive, connect to external test point. Used for on-module flash reprogramming. TI recommends using a 100-kΩ pullup resistor to save a few tens of µA in hibernate state. 48 TEST_58 O Connect to external test point. 49 TEST_59 I Connect to external test point. 50 TEST_60 O Connect to external test point. 51 UART1_nCTS I UART clear to send, connect to external test point. Used for on-module flash reprogramming. 52 TEST_62 O Connect to external test point. 53, 54 NC – Reserved. Do not connect. 55, 56, 57, 58, 59, 60, 61, 62, GND – Thermal Ground (1) Using a configuration file stored on flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: CC3100MOD
8 Specifications
8.1 Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term reliability of the module (1) (2). MIN TYP MAX UNIT VBAT and VIO Respect to GND –0.5 3.3 3.8 V Digital I/O –0.5 VBAT + 0.5 V RF pin (Pin 31) –0.5 2.1 V Analog pins –0.5 2.1 V Operating temperature, TA –40 85 °C Storage temperature, Tstg –55 125 °C Junction temperature, Tj 104 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to V SS, unless otherwise noted.
8.2 ESD Ratings
Electrostatic discharge (ESD) performance Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1) ±1000 VCharged device model (CDM), per JESD22-C101(2) All pins ±250 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Power-On Hours (POH)
This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products. OPERATING CONDITION JUNCTION TEMPERATURE (Tj) POH 20% active mode 80% sleep mode TAmbient up to 85°C(2) 17500(1) (1) The CC3100MOD device can be operated reliably for 10 years. (2) The TX duty cycle (power amplifier ON time) is assumed to be 10% of the device POH. Of the remaining 90% of the time, the device can be in any other state.
8.4 Recommended Operating Conditions
Function operation is not ensured outside this limit, and operation outside this limit for extended periods can adversely affect long-term reliability of the module(1) (2). MIN TYP MAX UNIT VBAT and VIO 2.3 3.3 3.6 V Operating temperature –20 25 70 °C Ambient thermal slew –20 20 °C/minute (1) Operating temperature is limited by crystal frequency variation. (2) To ensure WLAN performance, the ripple on the power supply must be less than ±300 mV. The ripple should not cause the supply to fall below the brown-out voltage. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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8.5 Power Consumption Summary
TA = 25°C, VBAT = 3.6 V PARAMETER TEST CONDITIONS(1) (2) MIN TYP MAX UNIT TX
1 DSSS
TX power level = 0 272 mA TX power level = 4 188
6 OFDM
TX power level = 0 248 TX power level = 4 179
54 OFDM
TX power level = 0 223 TX power level = 4 160 RX(3) 1 DSSS 53 mA
54 OFDM 53
Idle connected(4) 0.715 mA LPDS 0.140 mA Hibernate 7 µA Peak calibration current(3) (5) VBAT = 3.3 V 450 mA VBAT = 2.3 V 620 (1) TX power level = 0 implies maximum power (see Figure 8-1, Figure 8-2, and Figure 8-3). TX power level = 4 implies output power backed off approximately 4 dB. (2) The CC3100 system is a constant power-source system. The active current numbers scale inversely on the V BAT voltage supplied. (3) The RX current is measured with a 1-Mbps throughput rate. (4) DTIM = 1 (5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is performed sparingly, typically when coming out of Hibernate and only if the temperature has changed by more than 20°C, or the time elapsed from prior calibration is greater than 24 hours.
8.6 TX Power and IBAT versus TX Power Level Settings
Note: The area enclosed in the circle represents a significant reduction in current during transition from TX power level 3 to 4. In the case of lower range requirements (13-dBm output power), TI recommends using TX power level 4 to reduce the current. Figure 8-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS) www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: CC3100MOD
Figure 8-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM) Figure 8-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM) CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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8.7 Brownout and Blackout Conditions
The module enters a brownout condition when the input voltage dips below V BROWNOUT (see Figure 8-4 and Figure 8-5). This condition must be considered during design of the power supply routing, especially if operating from a battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance includes the internal resistance of the battery, contact resistance of the battery holder (four contacts for a 2× AA battery), and the wiring and PCB routing resistance. Note When the device is in the Hibernate state, brownout is not detected; only blackout is in effect during the Hibernate state. Figure 8-4. Brownout and Blackout Levels (1 of 2) Figure 8-5. Brownout and Blackout Levels (2 of 2) In the brownout condition, all sections of the CC3100MOD (including the 32-kHz RTC) shut down except for the Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout condition is equivalent to a hardware reset event in which all states within the module are lost. Vbrownout = 2.1 V and Vblackout = 1.67 V www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: CC3100MOD
8.8 Electrical Characteristics (3.3 V, 25°C) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS DRIVE SETTING STRENGTH MIN TYP MAX UNIT CIN Pin capacitance 4 pF VIH High-level input voltage 0.65 × VDD VDD + 0.5 V V VIL Low-level input voltage –0.5 0.35 × VDD V IIH High-level input current 5 nA IIL Low-level input current 5 nA VOH High-level output voltage (VDD = 3.0 V) VCC = 3 V, IOL = 2 mA 2 mA 2.4 V VOL Low-level output voltage (VDD = 3.0 V) VCC = 3 V, IOL = 2 mA 2 mA 0.4 V IOH High-level source current, VOH = 2.4 6 mA IOL Low-level sink current, VOH = 0.6 6 mA PIN INTERNAL PULLUP and PULLDOWN (25°C) IOH Pullup current, (VDD = 3.0 V) 5 10 µA IOL Pulldown current, (VDD = 3.0 V) 5 µA VIL nRESET(1) 0.6 V (1) The nRESET pin must be held below 0.6 V for the module to register a reset.
8.9 WLAN RF Characteristics
8.9.1 WLAN Receiver Characteristics
TA = 25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz). PARAMETER RATE MIN TYP MAX UNIT Sensitivity (8% PER for 11b rates, 10% PER for 11g or 11n rates) (10% PER)(1) 1 DSSS –94.7 dBm 2 DSSS –92.6 11 CCK –87.0 6 OFDM –89.0 9 OFDM –88.0 18 OFDM –85.0 36 OFDM –79.5 54 OFDM –73.0 MCS7 (Mixed Mode) –69.0 Maximum input level (10% PER) 802.11b –3.0 dBm 802.11g –9.0 (1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).
8.9.2 WLAN Transmitter Characteristics
TA = 25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz)(1). PARAMETER RATE MIN TYP MAX UNIT Max RMS Output Power measured at 1 dB from IEEE spectral mask or EVM
1 DSSS 17
11 CCK 17.25 CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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TA = 25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz)(1). PARAMETER RATE MIN TYP MAX UNIT 6 OFDM 16.25 9 OFDM 16.25
18 OFDM 16
36 OFDM 15
54 OFDM 13.5 MCS7 (Mixed Mode) 12 Transmit center frequency accuracy –20 20 ppm (1) Channel-to-channel variation is up to 2 dB. The edge channels (2412 MHz and 2462 MHz) have reduced TX power to meet FCC emission limits.
8.10 Reset Requirement
PARAMETER MIN TYP MAX UNIT VIH Operation mode level 0.65 × VBAT V VIL Shutdown mode level(1) 0 0.6 V Minimum time for nReset low for resetting the module 5 ms Tr and Tf Rise and fall times 20 µs (1) The nRESET pin must be held below 0.6 V for the module to register a reset.
8.11 Thermal Resistance Characteristics for MOB Package
NAME DESCRIPTION °C/W AIR FLOW (m/s) RΘJC Junction-to-case 9.08 0.00 RΘJB Junction-to-board 10.34 0.00 RΘJA Junction-to-free air 11.60 0.00 RΘJMA Junction-to-moving air 5.05 <1.00 PsiJT Junction-to-package top 9.08 0.00 PsiJB Junction-to-board 10.19 0.00 www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: CC3100MOD
8.12 Timing and Switching Characteristics
8.12.1 Wake-Up Sequence
RESET HW INIT FW INIT Device ready to serve API calls tT2t tT3t Figure 8-6. Wake-Up Sequence Table 8-1. First-Time Power-Up and Reset Removal Timing Requirements (32-kHz XTAL) ITEM NAME DESCRIPTION MIN TYP MAX UNIT T1 Supply settling time Depends on application board power supply, decap, and so on 3 ms T2 Hardware wake-up time — 25 ms T3 Initialization time 32-kHz XTAL settling + firmware initialization time + radio calibration 1.35 s CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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8.12.2 Wake Up From Hibernate
Figure 8-7 shows the timing diagram for wake up from the hibernate state. VBAT and VIO nRESET nHIB STATE tTHIB_MINt ACTIVE HIBERNATE HW + FW INIT HIBERNATE tTWAKEUP_FROM_HIBt ACTIVE Figure 8-7. nHIB Timing Diagram Note The internal 32.768-kHz crystal oscillator is kept enabled by default when the chip goes to hibernate in response to nHIB being pulled low. Section 8.12.2.1 describes the timing requirements for nHIB. 8.12.2.1 nHIB Timing Requirements (1) ITEM NAME DESCRIPTION MIN TYP MAX UNIT Thib_min Minimum hibernate time Minimum LOW pulse width of nHIB 10 ms Twake_from_hib Hardware wake-up time plus firmware initialization time See(2) 50 ms (1) Ensure that the nHIB low duration is not less than the specified width under all conditions, including power-ON, MCU hibernation, and so forth. (2) If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration.
8.12.3 Interfaces
This section describes the interfaces that are supported by the CC3100 module:
- Host SPI
- Host UART
8.12.3.1 Host SPI Interface Timing
Figure 8-8 shows the host SPI timing diagram. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: CC3100MOD
Figure 8-8. Host SPI Timing Table 8-2. Host SPI Interface Timing Parameters PARAMETER NUMBER DESCRIPTION MIN MAX UNIT I1 F(1) Clock frequency at VBAT = 3.3 V 20 MHz Clock frequency at VBAT ≤ 2.1 V 12 I2 tclk (1) (2) Clock period 50 ns I5 D(1) Duty cycle 45% 55% I6 tIS (1) RX data setup time 4 ns I7 tIH (1) RX data hold time 4 ns I8 tOD (1) TX data output delay 20 ns I9 tOH (1) TX data hold time 24 ns (1) The timing parameter has a maximum load of 20 pf at 3.3 V. (2) Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. The nCS signal can be deasserted 10 ns after the clock edge.
8.12.3.2 SPI Host Interface
The device interfaces to an external host using the SPI. The CC3100 device can interrupt the host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a speed of 20 MHz. Figure 8-9 shows the SPI host interface. CC3100 (slave) MCU HOST_SPI_CLK HOST_SPI_nCS HOST_SPI_MISO HOST_SPI_MOSI HOST_INTR SPI_CLK SPI_nCS SPI_MISO SPI_MOSI INTR SWAS031-027 GPIOnHIB Figure 8-9. SPI Host Interface Table 8-3 lists the SPI host interface pins. Table 8-3. SPI Host Interface PIN NAME DESCRIPTION HOST_SPI_CLK Clock (up to 20 MHz) from MCU host to CC3100 device HOST_SPI_nCS CS (active low) signal from MCU host to CC3100 device CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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Table 8-3. SPI Host Interface (continued) PIN NAME DESCRIPTION HOST_SPI_MOSI Data from MCU host to CC3100 device HOST_INTR Interrupt from CC3100 device to MCU host HOST_SPI_MISO Data from CC3100 device to MCU host nHIB Active-low signal that commands the CC3100 device to enter hibernate mode (lowest power state)
8.13 Host UART
The SimpleLink device requires the UART configuration described in Table 8-4. Table 8-4. SimpleLink™ UART Configuration PROPERTY SUPPORTED CC3100 CONFIGURATION Baud rate 115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command Data bits 8 bits Flow control CTS/RTS Parity None Stop bits 1 Bit order Least significant bit (LSB) first Host interrupt polarity Active high Host interrupt mode Rising edge or level 1 Endianness Little-endian only(1) (1) The SimpleLink device does not support automatic detection of the host length while using the UART interface. 8.13.1 5-Wire UART Topology Figure 8-10 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ line from the device to the host controller to allow efficient low power mode. HOST MCU UART RTS CTS TX RX HOST_INTR(IRQ) CC3100 SL UART RTS CTS TX RX HOST_INTR(IRQ) SWAS031-088 Figure 8-10. Typical 5-Wire UART Topology Figure 8-10 shows the typical and recommended UART topology because it offers the maximum communication reliability and flexibility between the host and the SimpleLink device. 8.13.2 4-Wire UART Topology The 4-wire UART topology eliminates the host IRQ line (see Figure 8-11). Using this topology requires one of the following conditions to be met:
- Host is always awake or active.
- Host goes to sleep, but the UART module has receiver start-edge detection for automatic wake up and does not lose data. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: CC3100MOD
H_IRQ CC3100 SL UART RTS CTS TX RX H_IRQ SWAS031-089 X Figure 8-11. 4-Wire UART Configuration 8.13.3 3-Wire UART Topology The 3-wire UART topology requires only the following lines (see Figure 8-12).
- RX
- TX
- nCTS HOST MCU UART RTS CTS TX RX H_IRQ CC3100 SL UART RTS CTS TX RX H_IRQ SWAS031-090 X X Figure 8-12. 3-Wire UART Topology Using 3-wire topology requires one of the following conditions to be met:
- Host always stays awake or active.
- Host goes to sleep, but the UART module has receiver start-edge detection for auto wake up and does not lose data.
- Host can always receive any amount of data transmitted by the SimpleLink device because there is no flow control in this direction. Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the following parameters must be carefully considered:
- Maximum baud rate
- RX character interrupt latency and low-level driver jitter buffer
- Time consumed by the user's application CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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9 Detailed Description
9.1 Overview
The CC3100MOD is a Wi-Fi Module that consists of the CC3100R11MRGC Wi-Fi network processor and power- management subsystems. This fully integrated Module includes all required clocks, SPI flash, and passives.
9.2 Module Features
9.2.1 WLAN
The WLAN features are as follows:
- 802.11 b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK and OFDM rates in the 2.4-GHz ISM band.
- Autocalibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without requiring expertise in radio circuit design.
- Advanced connection manager with multiple user-configurable profiles stored in an NVMEM allows automatic, fast connection to an access point without user or host intervention.
- Supports all common Wi-Fi security modes for personal and enterprise networks, with on-chip security accelerators.
- SmartConfig technology: A 1-step, 1-time process to connect a CC3100MOD-enabled device to the home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, it is usable by deeply embedded applications.
- 802.11 transceiver mode transmits and receives proprietary data through a socket without adding MAC or PHY headers, and provides the option to select the working channel, rate, and transmitted power. The receiver mode works together with the filtering options.
9.2.2 Network Stack
The network stack features are as follows:
- Integrated IPv4, IPv6, and TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU, microprocessor, or ASIC
- Support of 8 simultaneous TCP, UDP, or RAW sockets
- Built-in network protocols: ARP, ICMP, DHCP client, and DNS client for easy connection to the local network and the Internet
- Service discovery: Multicast DNS service discovery allows a client to advertise its service without a centralized server. After connecting to the access point, the CC3100MOD provides critical information, such as device name, IP, vendor, and port number.
9.2.3 Host Interface and Driver
- Interfaces over a 4-wire SPI with any MCU or a processor at a clock speed of 20 MHz
- Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided for TI MCUs and is easily ported to any processor or ASIC.
- Simple APIs enable easy integration with any single-threaded or multithreaded application.
9.2.4 System
- Works from one preregulated power supply or connects directly to a battery
- Ultra-low leakage when disabled (hibernate mode) with a current of less than 7 µA with the RTC running
- Integrated clock sources
9.3 Functional Block Diagram
Figure 9-1 shows the functional block diagram of the CC3100MOD SimpleLink Wi-Fi solution. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: CC3100MOD
HOST_INTR nHIB SPI/UART VCC Figure 9-1. Functional Block Diagram
9.4 Wi-Fi Network Processor Subsystem
The Wi-Fi network processor subsystem includes a dedicated ARM MCU to completely offload the host MCU along with an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast, secure WLAN and Internet connections with 256-bit encryption. The CC3100MOD supports station, AP, and Wi-Fi Direct modes. The module also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi network processor includes an embedded IPv4 TCP/IP stack. Table 9-1 summarizes the NWP features. Table 9-1. Summary of Features Supported by the NWP Subsystem ITEM DOMAIN CATEGORY FEATURE DETAILS
1 TCP/IP Network Stack IPv4 Baseline IPv4 stack
2 TCP/IP Network Stack TCP/UDP Base protocols
3 TCP/IP Protocols DHCP Client and server mode
4 TCP/IP Protocols ARP Support ARP protocol
5 TCP/IP Protocols DNS/mDNS DNS Address resolution and local server
6 TCP/IP Protocols IGMP Up to IGMPv3 for multicast management
7 TCP/IP Applications mDNS Support multicast DNS for service publishing over IP
8 TCP/IP Applications mDNS-SD Service discovery protocol over IP in local network
9 TCP/IP Applications Web Sever/HTTP Server URL static and dynamic response with template
10 TCP/IP Security TLS/SSL TLS v1.2 (client/server) / SSL v3.0
11 TCP/IP Security TLS/SSL For the supported Cipher Suite, go to SimpleLink Wi-Fi
CC3100 SDK.
12 TCP/IP Sockets RAW Sockets User-defined encapsulation at WLAN MAC/PHY or IP
13 WLAN Connection Policies Allows management of connection and reconnection
14 WLAN MAC Promiscuous mode Filter-based Promiscuous mode frame receiver
15 WLAN Performance Initialization time From enable to first connection to open AP less than
16 WLAN Performance Throughput UDP = 16 Mbps
17 WLAN Performance Throughput TCP = 13 Mbps
18 WLAN Provisioning WPS2 Enrollee using push button or PIN method. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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Table 9-1. Summary of Features Supported by the NWP Subsystem (continued) ITEM DOMAIN CATEGORY FEATURE DETAILS
19 WLAN Provisioning AP Config AP mode for initial product configuration (with
configurable Web page and beacon Info element)
20 WLAN Provisioning SmartConfig Alternate method for initial product configuration
21 WLAN Role Station 802.11bgn Station with legacy 802.11 power save 22 WLAN Role Soft AP 802.11 bg single station with legacy 802.11 power save
23 WLAN Role P2P P2P operation as GO
24 WLAN Role P2P P2P operation as CLIENT
25 WLAN Security STA-Personal WPA2 personal security
26 WLAN Security STA-Enterprise WPA2 enterprise security
27 WLAN Security STA-Enterprise EAP-TLS
28 WLAN Security STA-Enterprise EAP-PEAPv0/TLS
29 WLAN Security STA-Enterprise EAP-PEAPv1/TLS
30 WLAN Security STA-Enterprise EAP-PEAPv0/MSCHAPv2
31 WLAN Security STA-Enterprise EAP-PEAPv1/MSCHAPv2
32 WLAN Security STA-Enterprise EAP-TTLS/EAP-TLS
33 WLAN Security STA-Enterprise EAP-TTLS/MSCHAPv2
34 WLAN Security AP-Personal WPA2 personal security
9.5 Power-Management Subsystem
The CC3100 power-management subsystem contains DC-DC converters to accommodate the differing voltage or current requirements of the system. The module can operate from an input voltage ranging from 2.3 V to 3.6 V and can be directly connected to 2× AA Alkaline batteries. The CC3100MOD is a fully integrated module-based WLAN radio solution used on an embedded system with a wide-voltage supply range. The internal power management, including DC-DC converters and LDOs, generates all of the voltages required for the module to operate from a wide variety of input sources. For maximum flexibility, the module can operate in the modes described in the following sections.
9.5.1 VBAT Wide-Voltage Connection
In the wide-voltage battery connection, the module is powered directly by the battery. All other voltages required to operate the device are generated internally by the DC-DC converters. This scheme is the most common mode for the device because it supports wide-voltage operation from 2.3 to 3.6 V.
9.6 Low-Power Operating Modes
This section describes the low-power modes supported by the module to optimize battery life.
9.6.1 Low-Power Deep Sleep
The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered automatically during periods of inactivity based on internal power optimization algorithms. The module draws about 7 µA from the supply in this low-power mode. The module can wake up in less than 3 ms from the internal timer or from any incoming host command. Typical battery drain in this mode is 140 µA. During LPDS mode, the module retains the software state and certain configuration information. The operation is transparent to the external host; thus, no additional handshake is required to enter or exit this sleep mode.
9.6.2 Hibernate
The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small section of the logic powered directly by the main input supply is retained. The real-time clock (RTC) is kept running and the module wakes up when the n_HIB line is asserted by the host driver. The wake-up time is longer than LPDS mode at about 50 ms. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: CC3100MOD
Wake-up time can be extended to 75 ms if a patch is loaded from the serial flash. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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10 Applications, Implementation, and Layout
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: CC3100MOD
10.1 Reference Schematics
Figure 10-1 shows the reference schematic for the CC3100MOD module. The complete schematic can be downloaded from http://www.ti.com/lit/zip/ swrc293. HOST CONTROL LOGGING (DEBUG) HOST CONTROL/ FLASH PROGRAM The bulk capacitor is to be added based on the battery type, routing resistance and current drawn by the CC3100 (optional) Matching circuit shown below is for the antenna. The module is matched internally to 50 Ohm VCC (2.3 V to 3.6 V) 100 kΩ TP1 10 kΩ 2x100 F μ TP3 1.0 pF L1 3.6 nH Feed 2.45-GHz Ant TP2 CC3100MOD GND1 GND2 NC3 nHIB 4 HOST_SPI_CLK 5 HOST_SPI_DIN 6 HOST_SPI_DOUT 7 HOST_SPI_nCS 8 NC 9FORCE_AP 10 HOST_INTR 11 NC12 NC 13NC 14NC 15 GND16 NC 17 NC18 RESERVED19 NC20 RESERVED21 NC22 TCXO_EN/SOP2 23SOP1 24 NC 25 NC 26 GND27 GND28 NC29 GND30 RF_BG 31 GND32 NC33 SOP0 34 nRESET35 VBAT_DCDC_ANA36 VBAT_DCDC_PA37 GND38 NC39 VBAT_DCDC_DIG_IO40 NC41 NC42 GND43 UART1_nRTS 44 NC45 UART1_TX 46 UART1_RX 47 TEST_58 48 TEST_59 49 TEST_60 50 UART1_nCTS 51 TEST_62 52 NC 53NC 54 GND55 GND56 GND57 GND58 GND59 GND60 GND61 GND62 GND63 TP4 100 kΩ R1 is needed only if UART is used as host interface. (2) (1) A. If the GPIO from the MCU can float while the MCU enters low power, consider adding a pulldown resistor on the board to avoid floating. B. TI recommends using a 100-kΩ pullup resistor to save a few tens of µA in hibernate state. This is the reference schematic and not an actual board design. For the board files, refer to the CC3100MODBOOST in the CC3100MOD Tools Folder . Figure 10-1. CC3100MOD Module Reference Schematic CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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10.2 Design Requirements
Table 10-1 lists the bill of materials for a typical application using the CC3100 device. Table 10-1. Bill of Materials QUANTITY PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION
1 U1 CC3100MOD Texas Instruments CC3100MODR11MAMOB SimpleLink Wi-Fi MCU Module
1 E1 2.45-GHz Ant Taiyo Yuden AH316M245001-T ANT Bluetooth WLAN ZigBee® WIMAX 1 C2 1.0 pF Murata Electronics North America GJM1555C1H1R0BB01D CAP CER 1 pF 50 V NP0 0402 1 L1 3.6 nH Murata Electronics North America LQP15MN3N6B02D INDUCTOR 3.6 nH 0.1 NH 0402 www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: CC3100MOD
10.3 Layout Recommendations
10.3.1 RF Section (Placement and Routing)
(optional) U.FL (opt) CC3100MOD Figure 10-2. RF Section Layout The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the device. A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations.
10.3.2 Antenna Placement and Routing
The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data rates. Table 10-2 provides a summary of the recommended antennas to use with the CC3120MOD module. Table 10-2. Antenna Guidelines SR NO. GUIDELINES 1 Place the antenna on an edge or corner of the PCB.
2 Ensure that no signals are routed across the antenna elements on all the layers of the
PCB. Most antennas, including the chip antenna used on the booster pack, require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well. Ensure that there is provision to place matching components for the antenna. These must be tuned for best return loss when the complete board is assembled. Any plastics or casing must also be mounted while tuning the antenna because this can impact the impedance. Ensure that the antenna impedance is 50 Ω because the device is rated to work only with a 50-Ω system. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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Table 10-2. Antenna Guidelines (continued) SR NO. GUIDELINES
6 In case of printed antenna, ensure that the simulation is performed with the solder mask
in consideration. 7 Ensure that the antenna has a near omni-directional pattern. The feed point of the antenna is required to be grounded. This is only for the antenna type used on the CC3200MOD Launchpad. Refer to the specific antenna data sheets for the recommendations.
9 To use the FCC certification of the module, refer to CC31xx and CC32xx Radio
Certifications wiki page on CC3200 Radio certification Table 10-3 lists the recommended antennas to use with the CC3120MOD module. Table 10-3. Recommended Components CHOICE PART NUMBER MANUFACTURER NOTES
1 AH316M245001-T Taiyo Yuden Can be placed at the edge of the PCB using the
least amount of PCB area. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: CC3100MOD
10.3.3 Transmission Line Considerations
The RF signal from the device is routed to the antenna using a Coplanar Waveguide with ground (CPW-G) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding. Figure 10-3 shows a cross section of the coplanar waveguide with the critical dimensions. Figure 10-3. Coplanar Waveguide (Cross Section) Figure 10-4 shows the top view of the coplanar waveguide with GND and via stitching. S W Figure 10-4. CPW With GND and Via Stitching (Top View) CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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The recommended values for the PCB are provided for 2-layer boards in Table 10-4 and 4-layer boards in Table 10-5. Table 10-4. Recommended PCB Values for 2-Layer Board (L1 to L2 = 40 mils) PARAMETER VALUE UNIT W 35 mils S 6 mils H 40 mils Er (FR-4 substrate) 3.9 Table 10-5. Recommended PCB Values for 4-Layer Board (L1 to L2 = 10 mils) PARAMETER VALUE UNITS W 20 mils S 18 mils H 10 mils Er (FR-4 substrate) 4 www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: CC3100MOD
11 Environmental Requirements and Specifications
11.1 Temperature
11.1.1 PCB Bending
The PCB bending specification will maintain planeness at a thickness of less than 0.1 mm.
11.2 Handling Environment
11.2.1 Terminals
The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not touch the LGA portion by hand.
11.2.2 Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product to malfunction.
11.3 Storage Condition
11.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.
11.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
11.4 Baking Conditions
Products require baking before mounting if:
- Humidity indicator cards read > 30%
- Temp < 30°C, humidity < 70% RH, over 96 hours Baking condition: 90°C, 12–24 hours Baking times: 1 time CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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11.5 Soldering and Reflow Condition
- Heating method: Conventional convection or IR convection
- Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method
- Solder paste composition: Sn/3.0 Ag/0.5 Cu
- Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 11-1)
- Temperature profile: Reflow soldering will be done according to the temperature profile (see Figure 11-1)
- Peak temp: 245°C Figure 11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint) www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: CC3100MOD
12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio ™ Integrated Development Environment (IDE). The following products support development of the CC3100MOD applications: Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE) includes Editor C/C++/Assembly Code Generation and Debug plus additional development tools Scalable Real-Time Foundation Software ( DSP/ BIOS™) provides the basic run-time target software needed to support any CC3100MOD application. Hardware Development Tools: Extended Development System ( XDS™) Emulator For a complete listing of development-support tools for the CC3100MOD platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
12.1.1.1 Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes, TI recommends that the user has the latest service pack in his or her module for production. To stay informed, sign up for the SDK Alert Me button on the tools page or visit www.ti.com/tool/cc3100sdk.
12.1.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the CC3100MOD and support tools (see Figure 12-1). X PREFIX X = preproduction device no prefix = production device CC 3 1 0 0 MOD R 1 1M A MOB R DEVICE FAMILY CC = wireless connectivity SERIES NUMBER 3 = Wi-Fi Centric PACKAGE DESIGNATOR MOB = module PACKAGING R = tape/reel T = small reel Figure 12-1. CC3100 For orderable part numbers of CC3100MOD modules in the MOB package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
12.2 Documentation Support
The following documents describe the CC3100MOD processor/MPU. Copies of these documents are available on the Internet at www.ti.com. SWRU368 CC3100/CC3200 SimpleLink™ Wi-Fi® Internet-on-a Chip User's Guide CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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12.3 Trademarks
Wi-Fi CERTIFIED™ is a trademark of Wi-Fi Alliance. Internet-on-a chip™, E2E™, XDS™ are trademarks of Texas Instruments. SimpleLink™ and SmartConfig™ are trademarks of TI. Code Composer Studio™ is a trademark of Texas Instruments. Wi-Fi® and Wi-Fi Direct® are registered trademarks of Wi-Fi Alliance. Arm® are registered trademarks of Arm Limited. ZigBee® is a registered trademark of ZigBee Alliance. All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: CC3100MOD
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.
13.1 Mechanical Drawing
Figure 13-1 shows the CC3100MOD module. Figure 13-1. Mechanical Drawing Note 1. The total height of the module is 2.33 mm. 2. The weight of the module is 0.00175 kg ±3%. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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Figure 13-2. Land Pattern Drawing Note 1. All dimensions are in mm. 2. Solder mask should be the same or 5% larger than the dimension of the pad 3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make the solder paste 20% smaller than the pad. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: CC3100MOD
13.2 Package Option
We offer two reel size options for flexibility: a 750-unit reel and a 250-unit reel. CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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13.2.1 Packaging Information
Orderable Device Status (1) Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL, Peak Temp (3) Op Temp (°C) Device Marking(4) (5) CC3100MODR11MAMOBR ACTIVE MOB 63 750 RoHS Exempt Ni Au 3, 250°C –20 to 70 CC3100MODR11MAMOB CC3100MODR11MAMOBT ACTIVE MOB 63 250 RoHS Exempt Ni Au 3, 250°C –20 to 70 CC3100MODR11MAMOB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. space (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) space (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space (5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 41 Product Folder Links: CC3100MOD
13.2.2 Tape and Reel Information
Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant CC3100MODR11MAMOB CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 www.ti.com
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Product Folder Links: CC3100MOD
TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC3100MODR11MAMOBR MOB 63 750 354.0 354.0 55.0 CC3100MODR11MAMOBT MOB 63 250 354.0 354.0 55.0 www.ti.com CC3100MOD SWRS161B – NOVEMBER 2014 – REVISED SEPTEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 43 Product Folder Links: CC3100MOD
www.ti.com 6-Feb-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) CC3100MODR11MAMOBR Active Production QFM (MOB) | 63 750 | LARGE T&R Exempt NIAU Level-3-260C-168 HR -20 to 70 (CC3100MODR11MAMOB , CC3100MODR1M 2AMOB) (Z64-CC31000MODR1, Z64-CC3100MOD R1) (2015DJ3068(M), 45 1L-CC3100MODR1 (3.3V, 400MA, 3.3V , 400MA) (001-A08147, 451L- CC3100MODR1) MO-VVSS CC3100MODR11MAMOBT Active Production QFM (MOB) | 63 250 | SMALL T&R Exempt NIAU Level-3-260C-168 HR -20 to 70 (CC3100MODR11MAMOB , CC3100MODR1M 2AMOB) (Z64-CC31000MODR1, Z64-CC3100MOD R1) (2015DJ3068(M), 45 1L-CC3100MODR1 (3.3V, 400MA, 3.3V , 400MA) (001-A08147, 451L- CC3100MODR1) MO-VVSS (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. Addendum-Page 1
www.ti.com 6-Feb-2026 (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
www.ti.com PACKAGE OUTLINE C 2X (0.38) 2X (0.45) 2.40 2.03 0.88 0.72 2X 12.7 19.05 30X 1.27 54X 0.81 0.08 2 0.05 1.5 1.5 6X 3 6X 3 20X 1.27 A 17.75 17.25 B 20.75 20.25 (0.3) TYP (0.3) TYP (0.32) PADS 1,16,28 & 43 QFM - 2.4 mm max heightMOB0063A QUAD FLAT MODULE 4221462/D 06/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. AREA PIN 1 INDEX 0.1 X1)(45 PIN 1 ID 17 27 434454
0.15 C A B
0.05 C 56 59 62 SCALE 0.650
www.ti.com EXAMPLE BOARD LAYOUT 54X ( 0.81) (1.27) TYP 2X (19.1) 9X ( 2) (1.5) 6X (3) (1.5) 6X (3) 2X (16.1)
0.05 MIN
(0.65) TYP (0.65) TYP ( 0.2) TYP VIA (R0.05) ALL PADS ( 8.1)
0.05 MIN TYP
QFM - 2.4 mm max heightMOB0063A QUAD FLAT MODULE 4221462/D 06/2019 NOTES: (continued) 3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE:6X PKG PKG SEE DETAIL 17 27 4454 METAL UNDER SOLDER MASK SOLDER MASK OPENING (45 X 1) SOLDER MASK OPENING METAL UNDER SOLDER MASK SIGNAL PADS DETAIL
www.ti.com EXAMPLE STENCIL DESIGN 54X ( 0.81) (1.27) TYP 2X (19.1) 2X (16.1) (3) TYP (1.5) TYP (1.5) TYP (3) TYP (R0.05) TYP (0.55) TYP (R0.05) TYP (0.45) (1.54) (0.55) TYP (0.55) TYP( 0.89) TYP (R0.05) TYP QFM - 2.4 mm max heightMOB0063A QUAD FLAT MODULE 4221462/D 06/2019 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. PKG PKG 17 27 4454 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA PAD 55: 77.5 %, PADS 56 - 63: 79% SCALE:6X SEE DETAILS SOLDER MASK EDGE SOLDER MASK EDGE, TYP PAD 55 DETAIL SCALE:10X METAL TYP PADS 56 - 63 DETAIL SCALE:10X
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