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Technical content

Features

 On- -chip matching (50 ohm input, DC blocked)  Integrated quiescent current temperature compensation with enable/disable function(2)  Designed for digital predistortion error correction systems  Optimized for Doherty applications Figure 1. Functional Block Diagram Figure 2. Pin Connections the source terminal for the transistor.

  1. All data measured in fixture with device soldered to heatsink.
  2. Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987,Quiescent Current

Control for the RF Integrated Circuit Device Family.G ot ohttp://www.nxp.com/RF and search for AN1977 or AN1987.

Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available athttp://www.nxp.com/RF/calculators.

Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted)

  1. Each side of device measured separately.

Table 5. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued) ACPR measured in 3.84 MHz Channel Bandwidth @5M H zO f f s e t . Table 6. Ordering Information

  1. Part internally input and output matched.
  2. Measurements made with device in straight leadconfiguration before any lead forming operation is applied. Lead forming is used for gull
  3. All data measured in fixture with device soldered to heatsink.
  4. P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W- -CDMA single- -carrier input signal where

output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.

  1. Refer to AN1977,Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family, and to AN1987,Quiescent Current

Control for the RF Integrated Circuit Device Family.G ot ohttp://www.nxp.com/RF and search for AN1977 or AN1987.

Figure 3. A2I09VD050NR1 Test Circuit Component Layout not include device soldered to heatsink. Table 7. A2I09VD050NR1 Test Circuit Component Designations and Values

A2I09VD050NR1 A2I09VD050GNR1 PACKAGE DIMENSIONS

A2I09VD050NR1 A2I09VD050GNR1 RF Device Data NXP Semiconductors

A2I09VD050NR1 A2I09VD050GNR1

A2I09VD050NR1 A2I09VD050GNR1 RF Device Data NXP Semiconductors

A2I09VD050NR1 A2I09VD050GNR1

A2I09VD050NR1 A2I09VD050GNR1 RF Device Data NXP Semiconductors

A2I09VD050NR1 A2I09VD050GNR1 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes  AN1907: Solder Reflow Attach Method for High Power RF Devices in Over- -Molded Plastic Packages  AN1955: Thermal Measurement Methodology of RF Power Amplifiers  AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family  AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family Engineering Bulletins  EB212: Using Data Sheet Impedances for RF LDMOS Devices Software  Electromigration MTTF Calculator  RF High Power Model  .s2p File Development Tools  Printed Circuit Boards To Download Resources Specific to a Given Part Number: 1. Go tohttp://www.nxp.com/RF 2. Search by part number 3. Click part number link 4. Choose the desired resource from the drop down menu

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Sept. 2018  Initial release of data sheet

A2I09VD050NR1 A2I09VD050GNR1 RF Device Data NXP Semiconductors Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2018 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Document Number: A2I09VD050N Rev. 0, 09/2018