2SC1906 HITACHI
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Silicon NPN Epitaxial Planar Application
- VHF amplifier
- Mixer, Local oscillator Outline 1. Emitter 2. Collector 3. Base TO-92 (2)
Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to base voltage V CBO 30 V Collector to emitter voltage V CEO 19 V Emitter to base voltage V EBO 2V Collector current I C 50 mA Emitter current I E –50 mA Collector power dissipation P C 300 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test conditions Collector to base breakdown voltage V(BR)CBO 30 — — V I C = 10 mA, IE = 0 Collector to emitter breakdown voltage V(BR)CEO 19 — — V I C = 3 mA, RBE = ¥ Emitter to base breakdown voltage V(BR)EBO 2— — VI E = 10 mA, IC = 0 Collector cutoff current I CBO — — 0.5 mAV CB = 10 V, IE = 0 DC current transfer ratio hFE 40 — — V CE = 10 V, IC = 10 mA Gain bandwidth product f T 600 1000 — MHz V CE = 10 V, IC = 10 mA Collector output capacitance Cob — 1.0 2.0 pF V CB = 10 V, IE = 0, f = 1 MHz Collector to emitter saturation voltage VCE(sat) — 0.2 1.0 V I C = 20 mA, IB = 4 mA Base time constant r bb’ • C C —1 02 5p sV CB = 10 V, IC = 10 mA, f = 31.8 MHz Power gain PG — 33 — dB V CE = 10 V, IC = 5 mA f = 45 MHz — 18 — dB V CE = 10 V, IC = 5 mA f = 200 MHz
Ambient Temperature Ta (°C) Collector Power Dissipation PC (mW) Maximum Collector Dissipation Curve 100 150 0 Collector to Emitter Voltage VCE (V) Collector Current IC (mA) Typical Output Characteristics 12 16 20 IB = 20 µA P C = 300 mW 100 120 140 160 180 0.40.2 Base to Emitter Voltage VBE (V) Collector Current IC (mA) Typical Transfer Characteristics 0.6 0.8 1.0 VCE = 10 V 120 100 250.5 1.00.1 0.2 Collector Current IC (mA) DC Current Transfer Ratio hFE DC Current Transfer Ratio vs. Collector Current 10 20 50 100 VCE = 10 V
Collector to Emitter Voltage VCE (V) Collector Current IC (mA) Gain Bandwidth Product Curve 12 16 20 fT = 1,000 MHz 500 600 900 800700 200 600 400 1,200 1,000 800 31.00.1 0.3 Collector Current IC (mA) Gain Bandwidth Product fT (MHz) Gain Bandwidth Product vs. Collector Current 10 30 100 VCE = 10 V f = 100 MHz 200 100 0.1 0.2 0.5 1.0 Collector Current IC (mA) Base time Constant rbb'•CC (ps) Base Time Constant vs. Collector Currnt 25 1 0 VCB = 10 V f = 31.8 MHz 4682 Input Conductance gie (mS) Input Suceptance bie (mS) Input Admittance vs. Frequency 10 12 yie = gie+jbie VCE = 9 Vf = 25 MHz IC = 1 mA 2 mA 4 mA 8 mA 12 mA 100 200 250
0.4 0.6 0.80.2 Output Conductance goe (mS) Output Suceptance boe (mS) Output Admittance vs. Frequency 1.0 1.2 yoe = goe+jboe VCE = 9 V f = 25 MHz IC = 1 mA 100 200 250 12842 –1.6 –1.2 –0.8 –0.4 –2.0 Reverse Transfer Conductance g re (mS) Reverse Transfer Suceptance bre (mS) Reverse Transfer Admittance vs. Frequency yre = gre+jbre VCE = 9 V f = 25 MHz IC = 21 mA 100 200 250 8 4 2 1 –100 –40 –20 –120 Forward Transfer Conductance gfe (mS) Forward Transfer Suceptance bfe (mS) Forward Transfer Admittance vs. Frequency 100 120 140806020 400 yfe = gfe+jbfe VCE = 9 V f = 25 MHz IC = 1 mA 5080100 150 8200 –60 –80 0.1 0.20 Injection Voltage Vinj (V) Conversion Gain CG (dB) Conversion Gain vs. Local Oscillating Injection Voltage 0.3 VCB = 9 V IE = 3.5 mA fs = 200 MHz fosc = 245 MHz fIF = 45 MHz Emitter Inject
Emitter Current IE (mA) Conversion Gain CG (dB) Conversion Gain vs. Emitter Current VCB = 9 V Vinj = 150 mV fs = 200 MHz fosc = 245 MHz fIF = 45 MHz Emitter Inject
0.60 Max
0.45 – 0.1 5.0 – 0.2 0.7
2.3 Max
12.7 Min 0.5 1.27 2.54 Hitachi Code JEDEC EIAJ Weight (reference value) TO-92 (2) Conforms Conforms 0.25 g Unit: mm
- Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 Copyright © Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Tel: 535-2100 Fax: 535-1533 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Fax: <49> (89) 9 29 30 00 Hitachi Semiconductor (America) Inc.
179 East Tasman Drive,
San Jose,CA 95134 For further information write to: