C0BQ-10N-10

Semikron International

CERAMIC CHIP INDUCTORS

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PDF pages: 8

Technical content

Page 1

B	C	D	L	G	H
0.03 0.30± 0.03	0.30± 0.03	0.10± 0.05	0.80 Ref.	0.20~0.30	0.25~0.40

0.60± 0.03

Page 2

Part Number	Inductance (nH)	Tolerance	Test Frequency ( MHz )	Q Min	Q(Typ.) Frequency(Hz)					Rated Current (mA) Max	DCR ( Ω ) Max.
Part Number	Inductance (nH)	Tolerance	Test Frequency ( MHz )	Q Min	500M	800M	1.8G	2.0G	2.4G	Rated Current (mA) Max	DCR ( Ω ) Max.
C0BQ-0N6□-10	0.6	B,C,S	500	14	>35	>47	>75	>80	>88	900	0.06
C0BQ-0N7□-10	0.7	B,C,S	500	14	>35	>47	>75	>80	>88	900	0.06
C0BQ-0N8□-10	0.8	B,C,S	500	14	>35	>47	>75	>80	>88	900	0.06
C0BQ-0N9□-10	0.9	B,C,S	500	14	>35	>47	>75	>80	>88	900	0.06
C0BQ-1N0□-10	1.0	B,C,S	500	14	>35	>47	>75	>80	>88	850	0.07
C0BQ-1N1□-10	1.1	B,C,S	500	14	>35	>47	>75	>80	>88	850	0.07
C0BQ-1N2□-10	1.2	B,C,S	500	14	35	47	75	80	88	800	0.08
C0BQ-1N3□-10	1.3	B,C,S	500	14	32	43	70	74	82	760	0.09
C0BQ-1N4□-10	1.4	B,C,S	500	14	29	39	63	67	75	640	0.12
C0BQ-1N5□-10	1.5	B,C,S	500	14	27	36	59	62	69	600	0.15
C0BQ-1N6□-10	1.6	B,C,S	500	14	25	33	54	57	63	510	0.19
C0BQ-1N7□-10	1.7	B,C,S	500	14	25	32	52	54	61	680	0.11
C0BQ-1N8□-10	1.8	B,C,S	500	14	25	32	51	53	59	640	0.12
C0BQ-1N9□-10	1.9	B,C,S	500	14	24	31	50	53	58	620	0.13
C0BQ-2N0□-10	2.0	B,C,S	500	14	24	31	50	53	58	600	0.15
C0BQ-2N1□-10	2.1	B,C,S	500	14	24	31	50	53	58	550	0.16
C0BQ-2N2□-10	2.2	B,C,S	500	14	24	31	50	53	58	500	0.20
C0BQ-2N3□-10	2.3	B,C,S	500	14	24	31	49	52	58	460	0.24
C0BQ-2N4□-10	2.4	B,C,S	500	14	22	28	45	48	53	430	0.26
C0BQ-2N5□-10	2.5	B,C,S	500	14	22	29	46	49	54	415	0.28
C0BQ-2N6□-10	2.6	B,C,S	500	14	21	27	44	46	51	405	0.30
C0BQ-2N7□-10	2.7	B,C,S	500	14	20	26	41	43	48	400	0.32
C0BQ-2N8□-10	2.8	B,C,S	500	14	20	26	41	43	47	500	0.20
C0BQ-2N9□-10	2.9	B,C,S	500	14	20	26	41	43	47	480	0.22
C0BQ-3N0□-10	3.0	B,C,S	500	14	20	26	41	43	47	460	0.24
C0BQ-3N1□-10	3.1	B,C,S	500	14	20	26	41	43	47	450	0.25
C0BQ-3N2□-10	3.2	B,C,S	500	14	20	26	40	43	47	415	0.28
C0BQ-3N3□-10	3.3	B,C,S	500	14	20	26	40	43	47	415	0.28
C0BQ-3N4□-10	3.4	B,C,S	500	14	20	25	40	43	47	410	0.29
C0BQ-3N5□-10	3.5	B,C,S	500	14	20	25	40	42	46	405	0.30
C0BQ-3N6□-10	3.6	B,C,S	500	14	19	25	40	42	46	400	0.32
C0BQ-3N7□-10	3.7	B,C,S	500	14	19	25	40	42	46	370	0.36
C0BQ-3N8□-10	3.8	B,C,S	500	14	19	25	39	41	45	355	0.40

( MHz ) Min.

10000

9500

9300

9100

8900

8700

8600

8400

8200

8100

8000

7800

Page 3

Part Number	Inductance (nH)	Tolerance	Test Frequency ( MHz )	Q Min	Q(Typ.) Frequency(Hz)					Rated Current (mA) Max	DCR ( Ω ) Max.
Part Number	Inductance (nH)	Tolerance	Test Frequency ( MHz )	Q Min	500M	800M	1.8G	2.0G	2.4G	Rated Current (mA) Max	DCR ( Ω ) Max.
C0BQ-4N0□-10	4.0	B,C,S	500	14	18	25	39	41	45	335	0.44
C0BQ-4N1□-10	4.1	B,C,S	500	14	19	25	39	41	45	320	0.48
C0BQ-4N2□-10	4.2	B,C,S	500	14	18	24	37	39	43	320	0.48
C0BQ-4N3□-10	4.3	C,S	500	14	18	24	37	39	43	320	0.48
C0BQ-4N6□-10	4.6	C,S	500	14	18	24	37	39	42	360	0.39
C0BQ-4N7□-10	4.7	C,S	500	14	19	24	37	39	42	350	0.42
C0BQ-5N0□-10	5.0	C,S	500	14	19	24	37	39	42	335	0.44
C0BQ-5N1□-10	5.1	C,S	500	14	19	24	37	39	42	330	0.45
C0BQ-5N4□-10	5.4	C,S	500	14	18	24	36	38	42	315	0.49
C0BQ-5N6□-10	5.6	C,S	500	14	18	24	36	37	41	325	0.47
C0BQ-5N9□-10	5.9	C,S	500	14	18	23	35	36	39	325	0.47
C0BQ-6N2□-10	6.2	C,S	500	14	18	23	35	36	39	305	0.52
C0BQ-6N5□-10	6.5	C,S	500	14	18	23	35	36	39	305	0.52
C0BQ-6N8□-10	6.8	H,J	500	14	18	23	35	36	39	305	0.55
C0BQ-7N1□-10	7.1	H,J	500	14	18	23	35	36	39	305	0.55
C0BQ-7N5□-10	7.5	H,J	500	14	18	23	34	35	38	305	0.55
C0BQ-7N8□-10	7.8	H,J	500	14	17	22	33	34	36	310	0.51
C0BQ-8N2□-10	8.2	H,J	500	14	17	22	33	34	36	290	0.57
C0BQ-8N5□-10	8.5	H,J	500	14	17	22	33	34	36	290	0.57
C0BQ-9N1□-10	9.1	H,J	500	14	17	22	33	34	36	270	0.65
C0BQ-9N4□-10	9.4	H,J	500	14	17	22	33	34	36	250	0.73
C0BQ-10N□-10	10.0	H,J	500	14	17	22	33	34	36	230	0.85
C0BQ-12N□-10	12.0	H,J	500	14	17	22	31	32	33	230	0.85
C0BQ-15N□-10	15.0	H,J	500	14	17	21	28	29	29	220	0.89
C0BQ-18N□-10	18.0	H,J	500	14	16	21	26	26	25	205	1.05
C0BQ-22N□-10	22.0	H,J	500	14	16	21	26	26	24	190	1.29

( MHz ) Min.

7600

7500

7300

6500

6400

6200

6100

5900

5500

5100

4800

4600

4300

4000

3800

3300

2600

2300

1900

Page 4

Page 5

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

Unit:m/m

L	G	H
0.80	0.20~0.30	0.25~0.40

PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.

8-2. Soldering

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk

8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1.

8-2.2 Soldering Iron (Figure 2) :

Products attachment with soldering iron is discouraged due to the inherent process Control limitations. In the event that a soldering iron must be employed the following precautions are reCommended. Note : a) Preheat circuit and products to 150° C. b) 350° C tip temperature (max) c) Never Contact the ceramic with the iron tip

Preheating Soldering Natural Cooling 20~40s

TP(260° C/40s max.)

217 200 150

60~150s

60~180s 480s max. 25

Time(sec.)

Figure 1. Re-flow Soldering : 3 times max

d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 4 ~ 5 secs.

Preheating Soldering Natural Cooling Within 4~5s

350

150

Gradual

Over 1min.

C0oling

Figure 2. Hand Soldering : 1 times max

NOTE : Specifications subject to change without notice. Please check our website for latest information.

28.01.2015

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

Page 6

Page 7

Type	A(mm)	B(mm)	C(mm) D	(mm)
" x 8mm	9.0±0.5	60±2	13.52±0.5 17	8.0±2.0

Size	Bo(mm)	Ao(mm)	Ko(mm)	P(mm) t(mm)
C0	0.70± 0.06	0.40± 0.06	0.45 max	2.0± 0.05 0.45 ma

Page 8

9-4. Tearing Off Force

F 165° C to 180° C

Top cover tape

Base tape

Application Notice

Storage Conditions : To maintain the solderabililty of terminal electrodes :

The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.

Room Temp. (° C)	Room Humidity (%)	Room atm Tearin (hPa) (mm
5~35	45~85	860~1060 3

Tearing Speed (mm/min)

300

a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air.

Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.

NOTE : Specifications subject to change without notice. Please check our website for latest information.

28.01.2015

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 8

Selected Specification

Semikron International C0BQ-10N-10 overview.

Overview

C0BQ-10N-10 is listed in the IC category. Available datasheets include documents from Semikron International. DigiCamel provides a local PDF and searchable HTML technical text for online reference.

Summary

CERAMIC CHIP INDUCTORS

Description

CERAMIC CHIP INDUCTORS

Source title C0BQ-10N-10 Datasheet(PDF) - Semikron International

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