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BZT52C8V2LP integrated circuit reference

IC

BZT52C8V2LP

2 manufacturer specifications

Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Rev 18

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Diodes Incorporated
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Diodes Incorporated BZT52C8V2LP overview.

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Summary

Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Rev 18

Description

Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Rev 18

Source title BZT52C8V2LP Datasheet(PDF) - Diodes Incorporated

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