BTA04-600SW

BTA04-600SW LEIDITECH

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Technical content

SCRIPTION: With high ability to withstand the shock loading of large current, BTA04 series triacs provide high dv/dt rate with strong resistance to electromagnetic interface. With high commutation performances, 3 quadrants products especially recommended for use on inductive load. Package TO-252 is RoHS compliant. (2011/65/EU) MAIN FE ATURES ABSOL UTE MAXIMUM RATINGS Parameter Sy mbol Value Unit Storage junction temperature range Tstg -40 - 150 ℃ Operating junction temperature range Tj -40 - 125 ℃ Repetitive peak of f-state voltage (Tj=25℃) V DRM 600/800 V Repetitive peak reverse voltage (Tj=25℃) V RRM 600/800 V RMS on-state current T O-252-4R (TC=100℃) IT(RMS) 4 A Non repetitive surge peak on-state current (full cycle, F=50Hz) I TSM 40 A I2t value for fusing (tp=10ms) I2t 8 A2s Critical rate of rise of o n-state current (IG =2×IGT) dI/dt 50 A/μs Peak gate current IGM 4 A A verage gate power dissipation PG( AV) 1 W Peak gate power PGM 5 W Symbol V alue Unit VDRM /VRR M 600/800 V IT(RMS) 4 A (1) G(3) T2(2) 1 3 TO-252 BTA04-600SW Rev

CTRICAL CHARACTERISTICS (Tj=25℃ unless otherwise spec ified) Symbol Test Condition Quadrant Value Unit TW SW CW BW IGT VD =12V RL =33Ω Ⅰ-Ⅱ-Ⅲ MAX 5 10 35 50 mA VGT Ⅰ-Ⅱ-Ⅲ MAX 1.5 V VGD VD =VDR M Tj =125℃ RL =3.3KΩ Ⅰ-Ⅱ-Ⅲ MIN 0.2 V IL IG =1.2IGT Ⅰ-Ⅲ MAX 10 20 50 mA Ⅱ 15 35 60 80 IH IT =100mA MAX 10 15 35 60 mA dV/dt V D=2/3VDR M Gate Open Tj =125℃ MIN 50 100 400 1000 V/ μs ST ATIC CHARACTERISTICS Sy mbol Parameter Value(MAX) Unit VTM I TM =5.5A tp=380μs T j=25℃ 1.5 V IDRM VD =VDR M VR =VRRM Tj=25℃ 10 μA IRRM Tj=125℃ 0.75 mA THERMAL RE SISTANCES Sy mbol Parameter Value Unit Rth(j -c) junction to case(AC) T O-252 2.8 ℃/W Rth(j -a) junction to ambient BTA04-600SW Rev

D imensions Millimeters InchesRef. A B C D E G H L 2.10 0.66 0.40 2.50 0.10 0.86 0.60 0.083 0.026 0.016 0.098 0.004 0.034 0.024 6.40 9.50 10.70 0.374 0.421 0.053 0.065 5.90 6.30 0° 6° 0.232 0.248 6.80 0.252 0.268 4.47 4.67 0.176 0.184 1.09 1.21 0.043 0.048 1.35 1.65 0° 6° B2 5.18 5.48 0.202 0.216 C2 0.44 0.58 0.017 0.023 5.30REF 4.63 0.182 0.209REF E H B G L D ETAIL A D ETAIL A A C D T O-252-4R F OOTPRINT‐TO‐252 (dimensions in mm) 4.572 336. 1.6 MARKING BTA 04K 600BW XXX XXX XXX XXX Y ear Month Production Code BTA04-600SW Rev

P ACKAGE OUTLINE REEL (PCS) PER CART ON (PCS) T APE & REEL FI G.1: Maximum power dissipation versus RMS on-state current FIG.2: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness:35μm)(full cycle) IT( RMS) (A )P(w)

0 IT(RMS)

(A) Ta ()℃0 2.0 TO -252-4R α=180° 1.6 1.2 0.8 0.4 FI G.3: Surge peak on-state current versus number of cycles FIG.4: On-state characteristics (maximum values) 100 Number of cycles0 ITS M (A ) ITM VTM 50 40 Tj =25℃ Tj =Tjmax t =20ms One cycle T O-252 TAPING 2,500 13 inch BTA04-600SW Rev

G.6: Relative variations of gate trigger current, holding current and latching current versus junction temperature FIG.5: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp<20ms and corresponding value of I t (dI/dt < 50A/ μs) tp(m 0.01 0 20 ITSM ( A), I t (A s) -40 -20 100 120 140 IGT,IH,IL(Tj )/IGT,IH,IL(Tj =25 )℃ 0.5 1.5 2.0 2 2 2.5 Tj( )℃ 500 IGT I t IH&IL d I/dt ITSM SOLDERING P ARAMETERS Reflow Co ndition Pb-Free assembly (see figure at right) Pre Heat -Temperature Min s(m in)) +150℃ emperature Max (Ts(m ax)) +200℃ ime (Min to Max) (ts) 60-180 secs. A verage ramp up rate (Liquidus Temp (TL)to peak) 3℃/sec. Max Ts(m ax) to TL - Ramp-up R ate 3℃/sec. Max Reflow -Temperature(TL) (Liquid us) +217℃ emperature(tL) 60-1 50 secs. Peak T emp (Tp) +260( +0/-5)℃ T ime within 5℃of actual Peak Temp (tp) 20-40secs. Ramp-d own Rate 6℃/sec. Max Ti me 25℃ to Peak Temp (TP) 8 min. Max Do not exce ed +260℃ Re flow condition Temp eratur e TS( min) TS( max) TL TP tp tL ti me to peak temperatue Ti me 25 to peak)℃ Ramp- up Ramp-down Preheat Critical Zone TL to TP ts BTA04-600SW Sha nghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev