BS107P

Document overview

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Technical content

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200V N-CHANNEL ENHANCEMENT MODE VERTICAL DMOSFET

Features

 BVDSS > 200V  RDS(ON) ≤ 23Ω @ VGS= 2.6V  ID = 120mA Maximum Continuous Drain Current  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q101, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.  This part is qualified to JEDEC standards (as references in AEC-Q101) for High Reliability.  https://www.diodes.com/quality/product-definitions/

E-Line

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(TO-92 Compatible)

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Device Symbol

Flat Face View

Ordering Information (Note 4)

Mechanical Data

 Case: E-Line (TO-92 Compatible)  Case Material: Molded Plastic, “Green” Molding Compound UL Flammability Rating 94V-0  Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208  Weight: 0.159 grams (Approximate)

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Rounded Face View

Product Marking Package Leads Quantity
BS107P BS107 E-Line Straight 4,000 Loose in a Box
BS107PSTZ BS107 E-Line Joggled 2,000 Taped per Ammo Box

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information

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BS107 = Product Type Marking Code

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Page 2

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
Drain-Source Voltage VDSS 200 V
Gate-Source Voltage VGSS ±20 V
Continuous Drain Current ID 120 mA
Pulsed Drain Current IDM 2 A

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
Power Dissipation (Note 5) PD 500 mW
Thermal Resistance, Junction to Ambient (Note 5) RθJA 200 °C/W
Thermal Resistance, Junction to Leads (Note 6) RθJL 71 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C

Notes: 5. For a through-hole device mounted on the minimum recommended pad layout with 12mm lead length from the bottom of package to the single-sided FR-4 PCB; device is measured under still air conditions whilst operating in a steady-state. 6. Thermal resistance from junction to solder-point at the seating plane (2.5mm from the bottom of package along the drain lead).

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage BVDSS 200 230 V ID = 100µA, VGS = 0V
Zero Gate Voltage Drain Current IDSS 30 nA VDS = 130V, VGS = 0V
Drain Cut-Off Current IDSX 1 µA VDS = 70V, VGS = 0.2V
Gate-Source Leakage IGSS ±10 nA VGS = 15V, VDS = 0V
ON CHARACTERISTICS
Gate Threshold Voltage VGS(TH) 1.0 3.0 V ID = 1mA, VDS = VGS
Static Drain-Source On-Resistance (Note 7) RDS(ON) 15 23 Ω VGS = 2.6V, ID = 25mA
30 VGS = 5V, ID = 100mA
Forward Transconductance (Notes 7 & 9) gfs 100 mS VDS = 25V, ID = 250mA
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance Ciss 85 pF VDS = 25V, VGS = 0V f = 1.0MHz
Output Capacitance Coss 20
Reverse Transfer Capacitance Crss 7
Turn-On Delay Time (Note 8) tD(ON) 7 ns VDD = 25V, ID = 250mA
Turn-On Rise Time (Note 8) tR 8
Turn-Off Delay Time (Note 8) tD(OFF) 16
Turn-Off Fall Time (Note 8) tF 8
  1. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%. Notes: 8. Switching characteristics are independent of operating junction temperature. Switching times are measured with 50Ω source impedance and <5ns rise time on a pulse generator. 9. For design aid only, not subject to production testing.

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Page 3

Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

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Page 4

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

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A

E-Line
Dim Min Max Typ
A 2.16 2.41
b 0.41 0.495
b1 0.41 0.495
D 4.37 4.77
E 3.61 4.01
e 1.27
e2 2.54
F 2.50
L 13.00 13.97
L1 2.50 3.50
All Dimensions in mm

e2 e2

AMMO

b1

R 1.14 (.045)

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Page 5

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

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Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

  1. are intended to implant into the body, or
  1. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.

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Copyright © 2019, Diodes Incorporated

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