BM6213FS-E2 Datasheet PDF & Specifications

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Online Datasheet

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BM6214FS ROHM

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 31

Technical content

Features

 250V MOSFET built-in  Output current 2.0A  Bootstrap operation by floating high side driver (including diode)  150° commutation logic  PWM control (Upper arm switching)  Phase control supported from 0° to +30° at 1° intervals  Rotational direction switch  FG signal output with pulse number switch (4 or 12)  VREG output (5V/30mA)  Protection circuits provided: CL, OCP, TSD, UVLO, MLP and the external fault input  Fault output (open drain)

Applications

 Air conditioners; air purifiers; water pumps; dishwashers; washing machines Key Specifications  Output MOSFET Voltage: 250V  Driver Output Current (DC): ±2.0A (Max)  Driver Output Current (Pulse): ±4.0A (Max)  Output MOSFET DC On Resistance: 1.3 Ω (Max)  Duty Control Voltage Range: 2.1V to 5.4V  Phase Control Range: 0° to +30°  Operating Case Temper ature: -20°C to +100°C  Junction Temperature: +150°C  Power Dissipation: 3.00W Package W (Typ) x D (Typ) x H (Max) SSOP-A54_36 22.0 mm x 14.1 mm x 2.4 mm Typical Application Circuit SSOP-A54_36 Figure 1. Application Circuit Example

1 VCC Low voltage power supply 36 VDC High voltage power supply

2 GND Ground - VDC

3 GND Ground

4 GND Ground

5 VCC Low voltage power supply 35 BU Phase U floating power supply

6 VSP Duty control voltage input pin - U

7 VREG Regulator output 34 U Phase U output

9 HWN Hall input pin phase W-

10 HWP Hall input pin phase W+ 33 BV Phase V floating power supply

11 HVN Hall input pin phase V- - V

12 HVP Hall input pin phase V+ 32 V Phase V output

13 HUN Hall input pin phase U-

14 HUP Hall input pin phase U+

15 PCT VSP offset voltage output pin

16 PC Phase control input pin - VDC

17 CCW Direction switch (H:CCW) 31 VDC High voltage power supply

18 FGS FG pulse # switch (H:12, L:4)

19 FG FG signal output

20 FOB Fault signal output (open drain)

21 SNS Over current sense pin 30 BW Phase W floating power supply

22 NC - W

23 RT Carrier frequency setting pin 29 W Phase W output

24 GND Ground

25 GND Ground

26 GND Ground - PGND

27 VCC Low voltage power supply 28 PGND Ground (current sense pin)

Note) Pin cut surface visible from the side of package is same voltage as the pin which name is same.

31 VDC

Carrier Frequency Setting

FGS pin to VREG voltage when malfunctioning because of the noise.

Direction of Motor Rotation Setting

Table 1. 120° Commutation (Six-State) Truth Table (CW)

Under Voltage Lock Out (UVLO) Circuit

operation, the output begins from the following control input signal.

Thermal Shutdown (TSD) Circuit

the chip returns to normal operation when the junction temper ature falls below the preset temperature (100°C nominal). and do not use the IC in an environment where activation of the circuit is assumed. chip that monitors the temperature and it is likely not to function effectively.

Motor Lock Protection (MLP) Circuit

is forced to ground level once, the protection can be canceled immediately.

Hall Signal Wrong Input Detection

latches the state. It is released if the duty control voltage VSP is forced to ground level once.

Internal Voltage Regulator

ground in order to stabilize output, a value of 1 µF or more should be used. In this case, be sure to confirm that there is no oscillation in the output. Figure 6. VREG Output Pin Application Example

DatasheetDatasheetBM6214FS TSZ02201-0828AB400370-1-2© 2016 ROHM Co., Ltd. All rights reserved. 27.Jun.2016 Rev.001 http://www.rohm.com TSZ22111 · 15 · 001 Controller Outputs and Operation Mode Summary Conditions Detected direction Forward (CW:U~V~W, CCW:U~W~V) Reverse (CW:U~W~V, CCW:U~V~W) Hall sensor frequency < 1.4H z 1.4Hz < < 1.4Hz 1.4Hz < Normal operation VSP < VSPMIN (Duty off) Upper and lower arm off VSPMIN < VSP < VSPMAX (Control range) 120° Upper and lower switching 150° Upper switching 120° Upper and lower switching 120° Upper switching VSPTST < VSP (Testing mode) 150° Upper switching (No lead angle) Protect operation Current limiter (Note 1) Upper arm off Upper and lower arm off Overcurrent (Note 2) Upper and lower arm off TSD (Note 2) External input (Note 2) UVLO (Note 3) Motor lock Hall sensor abnormally Upper and lower arm off and latch (Note) The controller monitors both edges of three hall sensors for detecting frequency. (Note) Phase control function only operates at 150° commutation mode. However, the controller forces no lead angle during the testing mode. (Note 1) It returns to normal operation by the carrier frequency synchronization. (Note 2) It works together with the fault operation, and retu rns after the release time synchronizing with the carrier frequency. (Note 3) It returns to normal operation afte r 32 cycles of the carrier oscillation period. Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Ratings Unit Output MOSFET V DSS 250 (Note 1) V Supply Voltage V DC -0.3 to +250 (Note 1) V Output Voltage V U, VV, VW -0.3 to +250 (Note 1) V High Side Supply Pin Voltage V BU, VBV, VBW -0.3 to +250 (Note 1) V High Side Floating Supply Voltage V BU-VU, VBV-VV, VBW-VW -0.3 to +20 V Low Side Supply Voltage V CC -0.3 to +20 V Duty Control Voltage V SP -0.3 to +20 V All Others V I/O -0.3 to +5.5 V Driver Outputs (DC) I OMAX(DC) ±2.0 (Note 1) A Driver Outputs (Pulse) I OMAX(PLS) ±4.0 (Note 1, 2) A Fault Signal Output I OMAX(FOB) 15 (Note 1) mA Power Dissipation Pd 3.00 (Note 3) W Thermal Resistance ΨJT 15 °C/W Operating Case Temperature T C -20 to +100 °C Storage Temperature T STG -55 to +150 °C Junction Temperature T jmax 150 °C (Note) All voltages are with respect to ground. (Note 1) Do not, however, exceed Pd or ASO. (Note 2) Pulse Width ≤ 10µs, Duty cycle ≤ 1% (Note 3) Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board wi th less than 3% copper foil. Derated at 24mW/°C above 25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a f use, in case the IC is operated over the absolute maximum ratings.

DatasheetDatasheetBM6214FS TSZ02201-0828AB400370-1-2© 2016 ROHM Co., Ltd. All rights reserved. 27.Jun.2016 Rev.001 http://www.rohm.com TSZ22111 · 15 · 001 Recommended Operating Conditions (Tc=25°C) Parameter Symbol Min Typ Max Unit Supply Voltage V DC - 140 200 V High Side Floating Supply Voltage V BU-VU, VBV-VV, VBW-VW 13.5 15 16.5 V Low Side Supply Voltage V CC 13.5 15 16.5 V Bootstrap Capacitor C B 1.0 - - µF VREG Bypass Capacitor C VREG 1.0 - - µF Shunt Resistor (PGND) R S 0.5 - - Ω Junction Temperature T j - - 125 °C (Note) All voltages are with respect to ground. Electrical Characteristics (Driver part, unless otherwise specified, Ta=25°C and VCC=15V) Parameter Symbol Min Typ Max Unit Conditions Power Supply HS Quiescence Current I BBQ 30 70 150 µA VSP=0V, each phase LS Quiescence Current I CCQ 0.2 0.7 1.3 mA VSP=0V Output MOSFET D-S Breakdown Voltage V (BR)DSS 250 - - V I D=1mA, VSP=0V Leak Current I DSS - - 100 µA V DS=250V, VSP=0V DC On Resistance R DS(ON) - 0.93 1.30 Ω I D=1.0A Diode Forward Voltage V SD - 0.9 1.5 V I D=1.0A Bootstrap Diode Leak Current I LBD - - 10 µA V BX=250V Forward Voltage V FBD 1.5 1.8 2.1 V I BD=-5mA, including series-R Series Resistance R BD - 200 - Ω Under Voltage Lock Out HS Release Voltage V BUVH 9.5 10.0 10.5 V V BX - VX HS Lockout Voltage V BUVL 8.5 9.0 9.5 V V BX - VX

DatasheetDatasheetBM6214FS TSZ02201-0828AB400370-1-2© 2016 ROHM Co., Ltd. All rights reserved. 27.Jun.2016 Rev.001 http://www.rohm.com TSZ22111 · 15 · 001 Electrical Characteristics (Controller part, unless otherwise specified, Ta=25°C and VCC=15V) Parameter Symbol Min Typ Max Unit Conditions Power Supply Supply Current I CC 0.8 1.7 3.0 mA VSP=0V VREG Voltage V REG 4.5 5.0 5.5 V I O=-30mA Hall Comparators Input Bias Current I HALL -2.0 -0.1 2.0 µA V IN=0V Common Mode Input V HALLCM 0 - V REG-1.5 V Minimum Input Level V HALLMIN 50 - - mV p-p Hysteresis Voltage P V HALLHY+ 5 13 23 mV Hysteresis Voltage N V HALLHY- -23 -13 -5 mV Duty Control Input Bias Current I SP 15 25 35 µA V IN=5V Duty Minimum Voltage V SPMIN 1.8 2.1 2.4 V Duty Maximum Voltage V SPMAX 5.1 5.4 5.7 V Test Mode Range V SPTST 8.2 - 18 V Minimum Output Duty D MIN - 2 - % F OSC=20kHz Maximum Output Duty D MAX - 95 - % F OSC=20kHz Mode Switch - FGS and CCW Input Bias Current I IN -70 -50 -30 µA V IN=0V Input High Voltage V INH 3 - V REG V Input Low Voltage V INL 0 - 1 V Fault Input/Output - FOB Input High Voltage V FOBIH 3 - V REG V Input Low Voltage V FOBIL 0 - 1 V Output Low Voltage V FOBOL 0 0.07 0.60 V I O=5mA Monitor Output - FG Output High Voltage V MONH V REG-0.40 V REG-0.08 V REG V I O=-2mA Output Low Voltage V MONL 0 0.02 0.40 V I O=2mA Current Detection Input Bias Current I SNS -30 -20 -10 µA V IN=0V Current Limiter Voltage V SNS 0.48 0.50 0.52 V Overcurrent Voltage V OVER 0.84 0.90 0.96 V Noise Masking Time T MASK 0.8 1.0 1.2 µs Phase Control Minimum Lead Angle P MIN - 0 1 deg V PC=0V Maximum Lead Angle P MAX 29 30 - deg V PC=1/2·VREG Carrier Frequency Oscillator Carrier Frequency F OSC 18 20 22 kHz R T=20kΩ Under Voltage Lock Out LS Release Voltage V CCUVH 11.5 12.0 12.5 V LS Lockout Voltage V CCUVL 10.5 11.0 11.5 V

DatasheetDatasheetBM6214FS TSZ02201-0828AB400370-1-2© 2016 ROHM Co., Ltd. All rights reserved. 27.Jun.2016 Rev.001 http://www.rohm.com TSZ22111 · 15 · 001 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lin es of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage be low that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining care fully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the applic ation board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground trac es of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be excee ded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that t he internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capa citor directly to a low-impedance output pin may subject the IC to stress. Always discharge capaci tors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it fr om the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when m ounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

DatasheetDatasheetBM6214FS TSZ02201-0828AB400370-1-2© 2016 ROHM Co., Ltd. All rights reserved. 27.Jun.2016 Rev.001 http://www.rohm.com TSZ22111 · 15 · 001 11. Unused Input Pins Input pins of an IC are often connect ed to the gate of a MOS transistor. T he gate has extremely high impedance and extremely low capacitance. If left unconnec ted, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the IC. When using this IC, the high voltage pins VDC, BU/U, BV/ V and BW/W need a resin coating between these pins. It is judged that the inter-pins distance is not enough. If any spec ial mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or ASO. In the event a large capacitor is connected between t he output and ground, and if VCC and VDC are short-circuited with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC. This IC contains the controller chip, P+ isolation and P substrate layers between ad jacent elements in order to keep them isolated. P-N junctions are formed at the intersection of t he P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC . The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). Figure A-1. Example of IC structure Resistor Pin A Parasitic Elements P+ P + N N N N P P Substrate GND Parasitic Elements Pin A Transistor(NPN) Parasitic Elements P Substrate GND Pin B C B GND P+NN NP P+NN E Pin B E C B N Region close-by Parasitic Elements

DatasheetDatasheetBM6214FS TSZ02201-0828AB400370-1-2© 2016 ROHM Co., Ltd. All rights reserved. 27.Jun.2016 Rev.001 http://www.rohm.com TSZ22111 · 15 · 001 Physical Dimension, Tape and Reel Information Package Name SSOP-A54_36 Direction of feed1pin Reel <Tape and Reel Information> The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1000pcs Embossed carrier tape Direction of feed Quantity Tape *Order quantity needs to be multiple of the minimum quantity. 0.8 0.1 0.4 Min. 36 28 271 (MAX 22.35 include BURR) 22.0 0.2 0.38 0.1 4 +6 0.27 0.1 14.1 0.3 2.1 0.1 1.05 0.1 0.1 0.1 11.4 0.2 (UNIT : mm) PKG : SSOP-A54_36

Ordering Information

BM6213 : 250V/2.0A, 120° BM6214 : 250V/2.0A, 150° BM6215 : 250V/2.0A, 180°sinusoidal Package FS : SSOP-A54_36 Packaging specification E2 : Embossed carrier tape BM6214FS 1PIN MARK LOT Number Part Number Marking SSOP-A54_36 (TOP VIEW)

Revision History

27.Jun.2016 001 New release

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cleanin g residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under devian t condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e .g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information an d data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatso ever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Package SSOP-A54_36 Unit Quantity 1000 Minimum Package Quantity 1000 Packing Type Taping Constitution Materials List inquiry RoHS Yes BM6214FS - Web Page

Selected Specification

Rohm BM6213FS-E2 overview.

Overview

BM6213FS-E2 is listed in the Driver IC category. Available datasheets include documents from Rohm. DigiCamel provides a local PDF and searchable HTML technical text for online reference.

Summary

3-Phase Brushless Fan Motor Driver

Description

3-Phase Brushless Fan Motor Driver

Source title BM6213FS-E2 Datasheet(PDF) - Rohm

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