BM1422AGMV

Rohm

3-Axis Digital Magnetometer IC

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BM1422AGMV ROHM

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 29

Technical content

Features

 3-axis Magnetic Sensor using MI Elements  I2C Interface  12bit / 14bit Digital Output

Applications

 Wristwatch  Mobile phone, Smartphone Key Specifications  Input Voltage Range (AVDD): 1.7V to 3.6V  Input Voltage Range (DVDD): 1.7V to 3.6V  Operating Current (100SPS): 0.15mA(Typ)  Magnetic Measurable Range: ±1200μT(Typ)  Magnetic Sensitivity: 0.042μT/LSB(Typ)  Maximum Exposed Field: 1000mT  Operating Temperature Range: -40°C to +85°C Package W(Typ) x D(Typ) x H(Max) MLGA010V020A 2.00mm x 2.00mm x 1.00mm Typical Application Circuit MI Sensor X axis MI Sensor Y axis MI Sensor Z axis AVDD VREG GND DVDD ADDR SCL DRDY SDA TEST1 OPEN Host Logic Serial I/F Regulator (Internal) AD Converter BM1422AGMV TEST2 OPEN Datasheet

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Pin Configuration Above arrows indicate North-pole as “+”. Pin Description Pin No. Pin Name Function

1 AVDD Analog circuit power supply(Note 1)

2 GND Ground

3 VREG Internal regulator output(Note 2)

4 TEST1 Test pin(Note 3)

5 SDA I2C signal data I/O

6 TEST2 Test pin(Note 3)

7 SCL I2C signal clock input

8 DRDY Data ready output pin

9 ADDR I2C programmable address bit(Note 4)

10 DVDD Digital circuit power supply(Note 5)

(Note 1) Please place a bypass capacitor between AVDD and GND in the proximity of the terminals. (Note 2) Please place a bypass capacitor between VREG and GND in the proximity of the terminals. Please set a bypass capacitor of 1.0uF between VREG and GND (Note 3) Use as Non-Connection (NC). (Note 4) Please connect to DVDD or GND. (Note 5) Please place a bypass capacitor between DVDD and GND in the proximity of the terminals. 321 678 1PIN Mark Bottom View X-axis Y-axis Z-axis Top View

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Block Diagram MI Sensor X axis MI Sensor Y axis MI Sensor Z axis AVDD VREG GND DVDD ADDR SCL DRDY SDA TEST1 Logic Serial I/F Regulator (Internal) BM1422AGMV TEST2 PGA Circuit for MI Sensors Voltage Adjustment ADC Thermal Sensor

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Supply Voltage (AVDD) Vdd_a 4.5 V Supply Voltage (DVDD) Vdd_d 4.5 V Input Voltage Vin -0.3 to +(Vdd_d+0.3) V Operating Temperature Range Topr -40 to +85 °C Storage Temperature Range Tstg -40 to +125 °C Maximum Exposed Field Mef -1000 to +1000 mT Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider ci rcuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) MLGA010V020A Junction to Ambient θJA 317.3 191.5 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 60 41 °C/W (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4)Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Symbol Rating Unit Supply Voltage (AVDD) Vdd_a +1.7 to +3.6 V Supply Voltage (DVDD) Vdd_d +1.7 to +3.6 V I2C Clock Frequency fSCL MAX 400 kHz

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Electrical Characteristics (Unless otherwise specified AVDD=1.8V, DVDD=1.8V, GND=0.0V, Ta=25°C) Parameter Symbol Min Typ Max Unit Conditions Current Consumption Average Current during Measurement Idd - 150 300 µA Output Data Rate = 100SPS Stand-by-mode Current Iss - 1.5 5 µA ALL Power Down Logic Low-level Input Voltage VIL GND - 0.3 * DVDD V High-level Input Voltage VIH 0.7 * DVDD - DVDD V Low-level Input Current IIL -10 - 0 µA VIL = GND High-level Input Current IIH 0 - 10 µA VIH = DVDD Low-level Output Voltage VOL GND - 0.2 * DVDD V IL = -0.3mA High-level Output Voltage VOH 0.8 * DVDD - DVDD V IL = 0.3mA Serial Communication Low-level Input Current IIL2 -10 - 0 µA VIL = GND High-level Input Current IIH2 0 - 10 µA At HiZ, VIH = DVDD Low-level Output Voltage VOL2 GND - 0.2 * DVDD V IL = -3mA Magnetic Sensor Moving Range Rm - ±300 - µT Measurable Range(Note 1) Ra - ±1200 - µT X,Y-axis Linearity(Note 2) Lin1 - 0.5 2 %FS Rm = ±200µT Z-axis Linearity(Note 2) Lin2 - 1.0 2.8 %FS Rm = ±200µT Output Offset Vofs - 0 - LSB Magnetic Field = 0µT Magnetic Sensitivity DeltaV - 0.042 - µT/ LSB Measurement Time Tms - 0.5 - msec Average 4times (Note1) Measurable Range: Overall measurable range within which preset operat ing range can be fit by adjusting appropriate offsets. (Note2) Linearity [%FS] = Output Error / Rm = (output – ideal output) / Rm

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV I2C bus Timing Characteristics (Unless otherwise specified DVDD =1.8V, Ta = 25°C) Parameter Symbol Min. Typ. Max. Units Conditions I2C SCL Clock frequency fSCL 0 - 400 kHz I2C ‘L’ Period of the SCL Clock tLOW 1.3 - - µs I2C ‘H’ Period of the SCL Clock tHIGH 0.6 - - µs I2C Setup Time for Repeated START Condition tSU;STA 0.6 - - µs I2C Hold Time (Repeated) START Condition tHD;STA 0.6 - - µs I2C Data Setup Time tSU;DAT 100 - - ns I2C Data Hold Time tHD;DAT 0 - - µs I2C Setup Time for STOP Condition tSU;STO 0.6 - - µs I2C Bus Free Time between a STOP and START Condition tBUF 1.3 - - µs I2C bus Communication 1. Main write format (1) Indicate register address S Slave Address W

0 ACK Indicate register address ACK P

(2) Write to data register after indicating register address S Slave Address W

0 ACK Indicate register address ACK

Data specified at register address field ACK ・・・ ACK Data specified at register address field + N ACK P 2. Main read format (1) Read data after indicate register address (Master issues restart condition) S Slave Address W

1 ACK Data specified at register

Data specified at register address field + 1 ACK ・・・ ACK Data specified at register address field + N NACK P (2) Case of read data S Slave Address R Data specified at register address field + 1 ACK ・・・ ACK Data specified at register address field + N NACK P from master to slave from slave to master SDA SCL tHD;STA tLOW tHD;DAT tSU;DAT tHIGH tSU;STA tHD;STA tSU;STO tBUF VIL VIL VIL VIH VIH VIL VIH VIH VIH VIH VIH VIH VIH VIL VIL VIL VIH S : Start S : Start P : Stop S : Restart

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV I2C bus Slave address Selectable I2C Slave Address ( ADDR=L: 0001110, ADDR=H: 0001111 ) Register Map(Note 1) Address Register Name R/W D7 D6 D5 D4 D3 D2 D1 D0 0x0D INFO R INFO [7:0] 0x0E R INFO [15:8] 0x0F WIA R WIA [7:0] 0x10 DATAX R DATAX [7:0] 0x11 R DATAX [15:8] 0x12 DATAY R DATAY [7:0] 0x13 R DATAY [15:8] 0x14 DATAZ R DATAZ [7:0] 0x15 R DATAZ [15:8] 0x18 STA1 R 0 RD_ DRDY 0 0 0 0 0 0 0x1B CNTL1 RW PC1 OUT_ BIT RST_ LV ODR [1:0] 0 FS1 0 0x1C CNTL2 RW 0 0 0 0 DREN DRP 0 0 0x1D CNTL3 RW 0 FORC E 0 0 0 0 0 0 0x40 AVE_A RW 0 0 0 AVE_A [2:0] 0 0 0x5C CNTL4 W RSTB_LV [7:0] 0x5D W RSTB_LV [15:8] 0x60 TEMP R TEMP [7:0] 0x61 R TEMP [15:8] 0x6C OFF_X RW OFF_X [7:0] 0x6D RW OFF_X [15:8] 0x72 OFF_Y RW OFF_Y [7:0] 0x73 RW OFF_Y [15:8] 0x78 OFF_Z RW OFF_Z [7:0] 0x79 RW OFF_Z [15:8] 0x90 FINEOUTPUTX R FINEOUTPUTX [7:0] 0x91 R FINEOUTPUTX [15:8] 0x92 FINEOUTPUTY R FINEOUTPUTY [7:0] 0x93 R FINEOUTPUTY [15:8] 0x94 FINEOUTPUTZ R FINEOUTPUTZ [7:0] 0x95 R FINEOUTPUTZ [15:8] 0x9C GAIN_PARA_X R GAIN_PARA_X [7:0] 0x9D R GAIN_PARA_X [15:8] 0x9E GAIN_PARA_Y R GAIN_PARA_Y [7:0] 0x9F R GAIN_PARA_Y [15:8]

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV 0xA0 GAIN_PARA_Z R GAIN_PARA_Z [7:0] 0xA1 R GAIN_PARA_Z [15:8] (Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table. It is the following conditions to be able to access each register. Condition Accessible Register Supply Power CNTL1 CNTL4 INFO WIA OFF_X,Y ,Z Supply Power (CNTL1) PC1=1 (CNTL1) RST_LV=0 (CNTL4) RSTB_LV=1 STA1 CNTL2 CNTL3 AVE_A OFF_X,Y ,Z Supply Power (CNTL1) PC1=1 (CNTL1) RST_LV=0 (CNTL4) RSTB_LV=1 (CNTL3) FORCE=1 after first access DATAX,Y ,Z TEMP FINEOUTPUTX,Y ,Z Supply Power (CNTL1) PC1=1, FS1=1 (CNTL1) RST_LV=0 (CNTL4) RSTB_LV=1 (CNTL3) FORCE=1 after first access DATAX,Y ,Z TEMP FINEOUTPUTX,Y ,Z GAIN_PARA_X,Y ,Z

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV ( 0x0D/0x0E ) Information Register Fields Function INFO [7:0] Information LSB : 0x01 INFO [15:0] Information MSB : 0x01 ( 0x0F) WIA Register Fields Function WIA [7:0] Who I am : 0x41 ( 0x10/0x11, 0x12/0x13, 0x14/0x15 ) Output Data Register Fields Function DATAX [7:0] Xch Output value LSB DATAX [15:0] Xch Output value MSB DATAY [7:0] Ych Output value LSB DATAY [15:0] Ych Output value MSB DATAZ [7:0] Zch Output value LSB DATAZ [15:0] Zch Output value MSB default value 0xXXXX signed 16bit -2048d(0xF800) to +2047d(0x07FF) [Register OUT_BIT=0] -8192d(0xE000) to +8191d(0x1FFF) [Register OUT_BIT=1] ( 0x18 ) Status Register Fields Function RD_DRDY This bit is output to the DRDY to inform the preparation status of the measured data 0 : Not ready NG 1 : Ready OK default value 0x00 ( 0x1B ) Control setting1 Register Fields Function PC1 Power Control 0 : PowerDown 1 : Active OUT_BIT Output Data bit setting 0 : 12bit Output , 1 : 14bit Output RST_LV Logic reset control 0 : Reset release 1 : Reset Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1 ODR [1:0] Measurement output data rates 00 : 10Hz , 10 : 20Hz , 01 : 100Hz , 11 : 1kHz FS1 Measurement mode setting 0 : Continuous mode , 1 : Single mode default value 0x22 ( 0x1C ) Control setting2 Register Fields Function DREN DRDY terminal enable setting 0 : Disable , 1 : Enable DRP DRDY terminal active setting 0 : Low active , 1 : High active default value 0x04

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV ( 0x1D ) Control setting3 Register Fields Function FORCE AD start measurement trigger at continuous mode (FS1=0) and single mode (FS1=1) 1: Start measurement ※Register is automatic clear “0” after write data “1” ※Write data “0” is invalid ※If write data “1” on measurement way, restart measurement default value 0x00 ( 0x40 ) Average time Register Fields Function AVE_A Average Time 000:4times, 001:1times, 010:2times, 011:8times, 100:16times default value 0x00 ( 0x5C/0x5D ) Control setting4 Register Fields Function RSTB_LV [7:0] Reserved (ignore write data) RSTB_LV [15:8] RSTB_LV=1 by write access (ignore write data) Reset release at RST_LV(CNTL1)=0 & RSTB_LV(CNTL4)=1 RSTB_LV=0 by write PC1(CNTL1)=0 default value 0x04 ( 0x60/0x61 ) Temperature value Register Fields Function TEMP [7:0] Temperature value LSB TEMP [15:8] Temperature value MSB default value 0xXXXX unsigned 16bit 0d(0x0000) to +4095d(0x0FFF) [Register OUT_BIT=0] 0d(0x0000) to +16383d(0x3FFF) [ Register OUT_BIT=1] ( 0x6C/0x6D, 0x72/0x73, 0x78/0x79 ) Output Data Register Fields Function OFF_X [7:0] Xch Offset value OFF_X [15:8] Reserved Write ”00000000” OFF_Y [7:0] Ych Offset value OFF_Y [15:8] Reserved Write ”00000000” OFF_Z [7:0] Zch Offset value OFF_Z [15:8] Reserved Write ”00000000” default value 0x30 unsigned 8bit 1d(0x01) to +95d(0x5F) ( 0x90/0x91, 0x92/0x93, 0x94/0x95 ) Fine output Register Fields Function FINEOUTPUTX [7:0] DATAX value per OFF_X LSB FINEOUTPUTX [15:0] DATAX value per OFF_X MSB FINEOUTPUTY [7:0] DATAY value per OFF_Y LSB FINEOUTPUTY [15:0] DATAY value per OFF_Y MSB FINEOUTPUTZ [7:0] DATAZ value per OFF_Z LSB FINEOUTPUTZ [15:0] DATAZ value per OFF_Z MSB default value 0xXXXX unsigned 16bit 0d(0x0 000) to +16383d(0x3FFF)

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV ( 0x9C/0x9D, 0x9E/0x9F, 0xA0/0xA1 ) Axis interference Register Fields Function GAIN_PARA_X [7:0] Axis interference Xch to Zch GAIN_PARA_X [15:0] Axis interference Xch to Ych GAIN_PARA_Y [7:0] Axis interference Ych to Zch GAIN_PARA_Y [15:0] Axis interference Ych to Xch GAIN_PARA_Z [7:0] Axis interference Zch to Ych GAIN_PARA_Z [15:0] Axis interference Zch to Xch default value 0xXX unsigned 8bit 0d(0x00) to +255d(0xFF)

1.1 Power supply start-up sequence

The order of starting up the power supplies of AVDD and DVDD is arbitrary, when they are supplied from different sources. Please do the command control by I2C after all powers are supplied.

1.2 Power supply end sequence

Address：1Bh Data[7] = 0 Data[5] = 1 > 0ms AVDD, DVDD I2C 1.7V 0.4V > 1ms > 1ms AVDD, DVDD I2C command Address：1Bh Data[7] = 1 > 0.1ms command Address：5Ch, 5Dh Data：00h command 1.7V

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV 2. Measurement sequence There are the following two kinds of measurement modes Continuous Mode BM1422AGMV is measured at specified cycle (ODR=10,20,100,1kHz) at the cycle. Single Mode BM1422AGMV is measured by the measurement request from the host.

2.1 Continuous Mode

(Send command example) Case of 12bit Output Data (Send command example) Case of 14bit Output Data Register Name Address Data Step1 CNTL1 0x1B 0x80 CNTL4 0x5C 0x00 0x5D 0x00 Step2 CNTL2 0x1C 0x0C Step3 OFF_X 0x6C offx_dat OFF_Y 0x72 offy_dat OFF_Z 0x78 offz_dat Step4 CNTL3 0x1D 0x40 Step5 DATAX 0x10 Read 0x11 DATAY 0x12 Read 0x13 DATAZ 0x14 Read 0x15 Register Name Address Data Step1 CNTL1 0x1B 0xC0 CNTL4 0x5C 0x00 0x5D 0x00 Step2 CNTL2 0x1C 0x0C Step3 OFF_X 0x6C offx_dat OFF_Y 0x72 offy_dat OFF_Z 0x78 offz_dat Step4 CNTL3 0x1D 0x40 Step5 DATAX 0x10 Read 0x11 DATAY 0x12 Read 0x13 DATAZ 0x14 Read 0x15 (Power Off) Power Down ・Supply AVDD and DVDD voltage ・Send “Logic ON” command Measurment ・Send Setting Command ・Send “Measurement Start” Command ・Finish Measurement @ Single mode ・Send “Select Single mode” command @ continuous mode ・Send “Logic OFF” command Ready Start Host BM1422AGMV Start Supply Power POR Power Down Write CNTL1 : PC1=1, RST_LV=0 Write CNTL1 : ODR=00 Write CNTL1 : FS1=0 Write CNTL4 : RSTB_LV=1 Active Step1 Write CNTL2 : DREN=1 DREN=1 Step2 Write OFF_X : offx_dat (*1) Write OFF_Y : offy_dat (*1) Write OFF_Z : offz_dat (*1)Step3 Timer=10SPS Continuous Mode Timer (wait) Measurement(x,y,z) DRDY High Does DRDY output the rising edge?No Yes Read DATAX, Y, Z DRDY Low Step5 Write CNTL3 : FORCE=1Step4 (*1) The value is obtained at offset adjustment. If not obtained yet, then skip.

2.2 Single Mode

(Send command example) Case of 12bit Output Data (Send command example) Case of 14bit Output Data Register Name Address Data Step1 CNTL1 0x1B 0x82 CNTL4 0x5C 0x00 0x5D 0x00 Step2 CNTL2 0x1C 0x0C Step3 OFF_X 0x6C offx_dat OFF_Y 0x72 offy_dat OFF_Z 0x78 offz_dat Step4 CNTL3 0x1D 0x40 Step5 DATAX 0x10 Read 0x11 DATAY 0x12 Read 0x13 DATAZ 0x14 Read 0x15 Register Name Address Data Step1 CNTL1 0x1B 0xC2 CNTL4 0x5C 0x00 0x5D 0x00 Step2 CNTL2 0x1C 0x0C Step3 OFF_X 0x6C offx_dat OFF_Y 0x72 offy_dat OFF_Z 0x78 offz_dat Step4 CNTL3 0x1D 0x40 Step5 DATAX 0x10 Read 0x11 DATAY 0x12 Read 0x13 DATAZ 0x14 Read 0x15 Start Host BM1422AGMV Start Supply Power POR Power Down Write CNTL1 : PC1=1, RST_LV=0 Write CNTL4 : RSTB_LV=1 Active Step1 Write CNTL2 : DREN=1 DREN=1 Step2 Write OFF_X : offx_dat (*1) Write OFF_Y : offy_dat (*1) Write OFF_Z : offz_dat (*1)Step3 Measurement(x,y,z) DRDY High Does DRDY output the rising edge?No Yes Read DATAX, Y, Z DRDY Low Step5 Write CNTL3 : FORCE=1Step4 (*1) The value is obtained at offset adjustment. If not obtained yet, then skip.

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV 3. Offset Adjustment Offset adjustment sequence make the output value around zero under the normal magnetic environment. After measuring the following parameter, HOST should save it in memory, and it needs to be set after applying power supply to BM1422AGMV. (Send command example) Case of 12bit Output Data (Send command example) Case of 14bit Output Data When OFF_X, OFF_Y , OFF_Z are changed in the same magnetic field environment, the change directions of the output are as follows Parameter Description offx_dat Adjusted value of Xch offset offy_dat Adjusted value of Ych offset offz_dat Adjusted value of Zch offset Register Name Address Data Step1 CNTL1 0x1B 0x82 CNTL4 0x5C 0x00 0x5D 0x00 Step2 CNTL2 0x1C 0x0C Step3 OFF_X 0x6C wk_dat Step4 CNTL3 0x1D 0x40 Step5 DATAX 0x10 Read 0x11 Step6 OFF_X 0x6C offx_dat Register Name Address Data Step1 CNTL1 0x1B 0xC2 CNTL4 0x5C 0x00 0x5D 0x00 Step2 CNTL2 0x1C 0x0C Step3 OFF_X 0x6C wk_dat Step4 CNTL3 0x1D 0x40 Step5 DATAX 0x10 Read 0x11 Step6 OFF_X 0x6C offx_dat OFF_X,Y,Z + OFF_X,Y,Z - X axis - + Y axis - + Z axis - + Start Host BM1422AGMV Start Active Write CNTL2 : DREN=1 DREN=1 Step2 Write OFF_X : wk_datStep3 Measurement(x,y,z) wk_dat < 96 No Yes Read DATAX Write CNTL3 : FORCE=1Step4 diff_x = 9999 wk_dat = 1 DRDY rising edge If(diff_x > abs(DATAX)) then offx_dat = wk_dat; diff_x = abs(DATAX); End if wk_dat = wk_dat + 1 Write OFF_X : offx_dat EndEnd Step5 Step6 Supply Power POR Power Down Write CNTL1 : PC1=1, RST_LV=0 Write CNTL4 : RSTB_LV=1Step1 Write only Xch offset adjustment Ych and Zch should also be performed

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Application Example (Note) Sensor property may change due to around magnetic parts. We recommend calibrating the sensitivity and origin point of magnetic sensors after mounting. MI Sensor X axis MI Sensor Y axis MI Sensor Z axis AVDD VREG GND DVDD ADDR SCL DRDY SDA TEST1 OPEN Host Logic Serial I/F Regulator (Internal) AD Converter BM1422AGMV TEST2 OPEN 1.0uF 1.0uF 0.01uF

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV I/O equivalent circuit Pin name Equivalent Circuit Diagram Pin name Equivalent Circuit Diagram SCL SDA DRDY ADDR TEST1 TEST2 VREG DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD AVDD AVDD

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins . Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application boar d to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge cap acitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

TSZ02201-0M2M0F916070-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 17.Oct.2016 Rev.001 www.rohm.com TSZ22111 • 15 • 001 BM1422AGMV Operational Notes – continued 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins shou ld be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P -N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, con ditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Ev en if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considerin g the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Absolute Maximum Ratings Operate the IC such that the output voltage, output current, and power dissipation are all within the Absolute Maximum Ratings.

Ordering Information

B M 1 4 2 2 A G M V - Z E 2 Part Number Package GMV:MLGA010V020A Packaging and forming specification E2: Embossed tape and reel Marking Diagrams MLGA010V020A (TOP VIEW) AD Part Number Marking LOT Number 1PIN MARK

Revision History

17.Oct.2016 001 New Release

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cleanin g residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under devian t condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e .g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information an d data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatso ever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Minimum Package Quantity 2500 Packing Type Taping Constitution Materials List inquiry RoHS Yes BM1422AGMV - Web Page Distribution Inventory

Selected Specification

Rohm BM1422AGMV overview.

Summary

3-Axis Digital Magnetometer IC

Description

3-Axis Digital Magnetometer IC

Source title BM1422AGMV Datasheet(PDF) - Rohm

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