BM1383AGLV ROHM
Document overview
- Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 28
Technical content
Features
Piezo-resistive pressure sensor. Pressure range is from 300hPa to 1100hPa. Built-in temperature compensation function. I2C interface. Small package.
Applications
Smartphone, Healthcare, mobile device (e.g. game). Key Specifications Pressure Range: 300hPa to 1100hPa Relative Pressure Accuracy: ±0.12hPa(Typ) Absolute Pressure Accuracy: ±1hPa(Typ) Average Current Consumption: 3μA (Typ) Operating Temperature Range: -40°C to +85°C Package W(Typ) x D(Typ) x H(Max) CLGA12V025M 2.50mm x 2.50mm x 1.00mm Typical Application Circuit ADC Temperature Sensor MUX Signal Processing I2C SCL SDA NC1 NC0 DRDY Pressure Sensor Memory Clock TOUT TEST1 TEST0 TIN VDD VSS DREG HOST BM1383AGLV Regulator (internal) Datasheet
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV
Contents
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Pin Configuration Pin Description Pin No. Pin Name In/Out Function
1 DREG - Logic voltage pin(Note 1)
2 VDD - power voltage pin(Note 2)
3 VSS - GND pin
4 TIN In Test pin (connect to TOUT)
5 TOUT Out Test pin (connect to TIN)
6 TEST1 In Test pin (connect to GND)
7 NC0 - Non connect pin
8 NC1 - Non connect pin
9 SCL In I2C serial bus clock pin
10 SDA In/Out I2C serial bus data pin
11 DRDY Out Data ready output pin
12 TEST0 In Test pin (connect to GND)
(Note 1) Please place a bypass capacitor between DREG and VSS in the proximity of the terminals. Please set a bypass capacitor of 0.22µF between DREG and VSS. Please do not use this pin for external power source. (Note 2) Please place a bypass capacitor between VDD and VSS in the proximity of the terminals. Top View Bottom View (pads not visible) (pads visible) NC0 NC1 SCL SDA DRDY TEST0 DREG VDD VSS TIN TOUT TEST1 HOLE NC0 NC1 TEST1 TEST0 DREG VDD SCL SDA DRDY VSS TIN TOUT 1PIN MARK
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Block Diagram ADC Temperature Sensor MUX Signal Processing I2C SCL SDA NC1 NC0 DRDY Pressure Sensor Memory Clock TOUT TEST1 TEST0 TIN VDD VSS DREG BM1383AGLV Regulator (internal)
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Power Supply VDD_MR 4.5 V Input Voltage VIN -0.3 to VDD+0.3 V Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -40 to +125 °C Maximum Junction Temperature Tjmax 125 ℃ Pressure Povr 20000 hPa Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consi der circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) CLGA12V025M Junction to Ambient θJA 360.5 230.5 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 153 144 °C/W (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4)Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Symbol Rating Unit Power Supply VDD 1.7 to 3.6 V I2C clock Input Frequency fSCL MAX 400 kHz
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Electrical Characteristics (Unless otherwise specified VDD=1.8V Ta=25°C) Parameter Symbol Min Typ Max Unit Conditions Current Consumption Operating Mode Current Consumption Iddp - 650 1000 µA Power Down Mode Current Iss - 1 5 µA PWR_DOWN=0, RSTB=0 Logic L Input Voltage VIL GND - 0.3 * VDD V SDA, SCL H Input Voltage VIH 0.7 * VDD - VDD V SDA, SCL L Input Current IIL -10 - 0 μA VIL= GND (SDA, SCL) H Input Current IIH 0 - 10 μA VIH= VDD (SDA, SCL) L Output Voltage 1 VOL1 GND - 0.2 * VDD V IL= -0.3mA (DRDY) L Output Voltage 2 VOL2 GND - 0.2 * VDD V IL= -3mA (SDA) Pressure characteristics Pressure Detection Range PR 300 - 1100 hPa Relative Pressure Accuracy(Note 1) Prel - ±0.12 - hPa 950hPa to 1050hPa Absolute Pressure Accuracy Pabs - ±1 - hPa 1000hPa Temperature Accuracy Tabs - ±2 - °C 25°C to 85°C Measurement Time※ Tm - - 6 ms AVE_NUM=000 (Note 1) Target values ※Measurement time is changed by average number of measurement data. It is written in Measurement time.
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV I2C bus Timing Chart (Unless Otherwise VDD=1.8V Ta=25°C) Parameter Symbol Min Typ Max Unit Conditions I2C SCL Frequency fSCL 0 - 400 kHz I2C ‘L’ Period of SCL tLOW 1.3 - - µs I2C ‘H’ Period of SCL tHIGH 0.6 - - µs I2C Setup Time for START Condition tSU;STA 0.6 - - µs I2C Hold Time for (Repeated) START Condition tHD;STA 0.6 - - µs I2C Data Setup Time tSU;DAT 100 - - ns I2C Data Hold Time tHD;DAT 0 - - µs I2C Setup Time For STOP Condition tSU;STO 0.6 - - µs I2C Bus Free Time Between STOP and START Condition tBUF 1.3 - - µs SDA SCL tHD;STA tLOW tHD;DAT tSU;DAT tHIGH tSU;STA tHD;STA tSU;STO tBUF
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Register Map(Note 1) Address Register name RW D7 D6 D5 D4 D3 D2 D1 D0 0Fh ID1 R 1 1 1 0 0 0 0 0 10h ID2 R 0 0 1 1 0 0 1 0 12h POWER_DOWN RW 0 0 0 0 0 0 0 PWR_ DOWN 13h RESET RW 0 0 0 0 0 0 0 RSTB 14h MODE_CONTROL RW AVE_NUM DREN 1 0 MODE 19h STATUS R 0 0 0 0 0 0 0 RD_ DRDY 1Ah PRESSURE_MSB (Upper 8bit) R PRESS_OUT[15:8] 1Bh PRESSURE_LSB (Lower 8bit) R PRESS_OUT[7:0] 1Ch PRESSURE_LSB (Least 6bit) R PRESS_OUT_XL[5:0] 0 0 1Dh TEMPERATURE_MSB (Upper 8bit) R TEMP_OUT[15:8] 1Eh TEMPERATURE_LSB (Lower 8bit) R TEMP_OUT[7:0] (Note 1)Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table. Address from 0x14 to 0x1E registers can be accessed only when PWR_DOWN=1 and RSTB=1. (In other case Write: Ignored, Read: 0xXX)
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV ○ID1(0Fh) Field Bit TYPE Description ID1 7 : 0 R 11100000 default value E0h ○ID2(10h) Field Bit TYPE Description ID2 7 : 0 R 00110010 default value 32h ○POWER_DOWN(12h) Field Bit TYPE Description Reserved 7 : 1 RW Reserved Write “0” PWR_DOWN 0 RW 0: power down 1: active default value 00h ○RESET(13h) Field Bit TYPE Description Reserved 7 : 1 RW Reserved Write “0” RSTB 0 RW 0: Measurement control block is reset 1: Measurement control block is active default value 00h
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV ○MODE_CONTROL(14h) Field Bit TYPE Description AVE_NUM 7 : 5 RW Set the average number of measurement data 000: single 001: average of 2 times 010: average of 4 times 011: average of 8 times 100: average of 16 times 101: average of 32 times 110: average of 64 times 111: inhibit DREN 4 RW DRDY pin Enable 0 : DRDY pin Disable 1 : DRDY pin Enable Reserved 3 RW Refer to Operation mode transition Reserved 2 RW Reserved Write “0” MODE 1 : 0 RW Set measurement mode default value 08h Measurement time and RMS noise against number of average AVE_NUM Measurement time Tm max[ms] Measurement cycle Ti max[ms] RMS noise [hPa] 000 6 60 0.090 001 9 60 0.063 010 16 60 0.045 011 30 60 0.032 100 60 60 0.023 101 120 120 0.016 110 240 240 0.011 RMS noise is calculated as standard deviation of 32 data points (1σ). RMS noise is a reference value and it’s not the value with guarantee. Condition VDD=1.8V Ta=25°C Measurement mode MODE Measurement mode
00 Stand by
01 One shot
10 Continuous
11 Prohibition
Pressure and Temperature are measured at one rate Measurement time One shot mode perform one measurement. Measurement data is updated when measurement is completed, so it should be read more than Tm after start of measurement. Continuous mode repeat measurement in every measurement cycle Ti. The latest measurement data which is completed is read. Measurement time Tm and measurement cycle Ti is determined by number of measurement. <One shot mode> <Continuous mode> First Measurement Measurement time Tm Measurement cycle Ti Second measurement Start of measurement Measurement time Tm Start of measurement Start of measurement Measurement Measurement Pressure data of first time Measurement is read.
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Operation mode transition Please refer to the below figure of operation mode transition. Power down mode is the smallest current consumption mode due to circuit is OFF. Please set this mode when reducing current consumption. Measurement is not available in this mode, so the measurement is performed after switching to standby mode. In reset mode, regulator for internal blocks is active and measurement control block is reset. Register is initialized in Reset mode. Measurement command is acceptable when “1” is written in “RSTB” There are 2 measurement modes. One shot mode and Continuo us mode. They are transferred from stand by mode. Then, please set “AVE_NUM” register at the same time. Please write “0x1400” when transferring to standby mode again. In one shot mode, a single measurement is performed when “01” is written in “MODE”. Afte r the measurement completes, it is transferred to standby mode automatically. When “0x1400” is written before end of measurement, mode is switched to standby immediately but pressure value is not updated. Transition to the other measurement mode during measurement in one shot mode is forbidden. In Continuous mode, when “10” is written in “MODE”, measurement starts and it continues until “0x1400” is written.Transition to the other measurement mode from Continuous mode is forbidden. 0x14X9 Measurement time Tm later or 0x1400 0x14XA 0x1400 One Shot Continuous Stand by Reset 0x1301 0x1300 Power Down 0x1201 0x1200 0x1400 0x14XA → Prohibition Prohibition Regulator：OFF Processing：OFF Regulator：ON Processing：OFF Regulator：ON Processing：ON 0x14X9 → Prohibition 0xYYZZ （send command） YY：Address ZZ：Data
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV ○STATUS(19h) Field Bit TYPE Description Reserved 7 : 1 R 0000000 RD_DRDY 0 R Pressure and temperature measurement data ready bit 0: measurement data output is not yet available (measuring) 1: measurement data output is available default value 00h ○PRESSURE_MSB(1Ah) Field Bit TYPE Description PRESS_OUT[15:8] 7 : 0 R The upper part of pressure data default value 00h ○PRESSURE_LSB(1Bh) Field Bit TYPE Description PRESS_OUT[7:0] 7 : 0 R The lower part of pressure data default value 00h ○PRESSURE_LSB(Least 6bit) ( 1Ch ) Field Bit TYPE Description PRESS_OUT_XL [5:0] 7 : 2 R Pressure data output (decimal extension 6bit) Reserved 1 : 0 R 00 default value 00h Conversion to pressure value is like below. Pressure counts = PRESS_OUT[15:8] x 214 + PRESS_OUT[7:0] x 26 + PRESS_OUT_XL[5:0] [counts] (dec) Pressure value [hPa] = Pressure counts [counts] / 2048 [counts/hPa] Data register (0x1A~0x1C) should be read by continuous read. Data is updated at the timing of measurement completion. If they are not read by continuous read, data might be mixed up with the data of different measurement. ○TEMPERATURE_MSB(1Dh) Field Bit TYPE Description TEMP_OUT[15:8] 7 : 0 R The upper part of temperature data. default value 00h ○TEMPERATURE_LSB(1Eh) Field Bit TYPE Description TEMP_OUT[7:0] 7 : 0 R The lower part of temperature data default value 00h Conversion to temperature value is like below. But please note that TEMP_OUT is data with sign (two’s complement). Temp counts = TEMP_OUT[15:8] x 28 +TEMP_OUT[7:0] [counts] (dec) Temperature value [℃] = Temp counts [counts] / 32 [counts/℃] (in case of positive number) Data register (0x1D,0x1E) should be read by continuous read. Data is updated at the timing of measurement completion. If they are not read by continuous read, data might be mixed up with the data of different measurement.
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV I2C bus communication 1. Slave address : “1011101” 2. Write format (1) Case of indicating only register address ST Slave Address W
0 ACK Indicate register address ACK SP
(2) Case of writing data register afte r indicating register address ST Slave Address W
0 ACK Indicate register address ACK
Data specified at register address field ACK ・・・・・・ ACK Data specified at register address field + N ACK SP 3. Read format (1) Case of continuous reading data after indicating register address (Master issues restart condition) ST Slave Address W
1 ACK Data specified at register
Data specified at register address field + 1 ACK ・・・・・・ ACK Data specified at register address field + N NACK SP (2) Case of continuous reading data ST Slave Address R Data specified at register address field + 1 ACK ・・・・・・ ACK Data specified at register address field + N NACK SP from master to slave from slave to master
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Interrupt function In case that Interrupt function is enable ( DREN=1), interrupt occur ( RD_DRDY register become “1” and DRDY terminal become L active) just after measurement is finished. Once interrupt occur, RD_DRDY register and DRDY terminal keep active until interrupt is cleared. Interrupt can be cleared by reading RD_DRDY register or setting reset mode. DRDY terminal is Nch open drain so this terminal should be pull-up to voltage source by an external resister. DRDY terminal is high impedance just after VDD is supplied. DRDY terminal becomes inactive (High impedance) by reading RD_DRDY register or setting reset mode. VDD current (approximately 6µA at VDD=1.8V) is consumed during DRDY is active. If you disable interrupt function, please set DREN=0 after clearing interrupt. ＜DRDY pin action example：1shot mode＞ Stand by One shot High Low DRDY pin Write 0x14X9 Stand by data ready OK Read 0x19 One shot Stand by One shot Stand by Read 0x19 Write 0x14X9 Write 0x14X9 Operation mode data ready OK data ready OK
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Control sequence 1. Power supply start-up sequence Please do the command control by I2C after power is supplied. 2. Power supply end sequence > 2ms VDD I2C command Write ： 0x1201 > 0.1ms command Write ： 0x1301 command 1.7V command Write ： 0x1200 command Write ： 0x1300 > 0ms > 0ms VDD I2C 1.7V 0.4V > 1ms
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV 3. Starting sequence power supply POWER_DOWN setting Write ： 0x1201 RESET setting Write ： 0x1301 Completion of starting sequence release Power down release Reset mode wait for more than 2ms wait for more than 0.1ms 4. Measurement sequence: One Shot Mode Starting sequence MODE_CONTROL setting Write ： 0x14X9 (DREN=1) DRDY terminal L H read PRESSURE Read ： 0x1A～0x1C Measurement complestion measurement mode setting： wait interrupt(DRDY='L') or measurement end： read Pressure data： Enable DRDY？ noyes MODE_CONTROL setting Write ： 0x14X9 (DREN=0) wait for the end of measurement no yes read STATUS Read ： 0x19 check interrupt status DRDY terminal is set to 'H' by reading.：
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV 5. Measurement sequence: Continuous Mode Starting sequence MODE_CONTROL setting Write：0x14XA (DREN=1) DRDY terminal L H read PRESSURE Read ： 0x1A～0x1C Measurement complestion measurement mode setting： wait interrupt(DRDY='L') or measurement end： read Pressure data： Enable DRDY？ noyes MODE_CONTROL setting Write：0x14XA (DREN=0) wait for the end of measurement no yes read STATUS Read ： 0x19 ： MODE_CONTROL setting Write ： 0x1400 shift to Stand-by mode.： yes no measurement stop？ Enable INT？ noyes End judgement of Continuous mode： check interrupt status DRDY terminal is set to 'H' by reading.
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV 6. Ending sequence Measurement complestion RESET setting Write ： 0x1300 POWER_DOWN setting Write ： 0x1200 VDD OFF Reset： power down：
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Application Example ADC Temperature Sensor MUX Signal Processing I2C SCL SDA NC1 NC0 DRDY Pressure Sensor Memory Clock TOUT TEST1 TEST0 TIN VDD VSS DREG BM1383AGLV Regulator (internal) 0.22µF 0.1µF
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV I/O equivalent circuit Pin name Equivalent Circuit Diagram Pin name Equivalent Circuit Diagram SCL SDA DRDY DREG TOUT TIN TEST0 TEST1 VDD VDD VDD VDD VDD
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avo id fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering se quence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field fr om the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Operational Notes – continued 12. Regarding the Input Pin of the IC In the construction of this IC, P -N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasiti c elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be a voided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP , IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light.
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV
Ordering Information
B M 1 3 8 3 A G L V - Z E 2 Part Number Package GLV: CLGA12V025M Packaging and forming specification E2: Embossed tape and reel Marking Diagrams M 1 3
1 PIN MARK
(TOP VIEW）
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV Physical Dimension, Tape and Reel Information
TSZ02201-0M1M0FZ15130-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24.Mar.2016 Rev.003 www.rohm.com TSZ22111 • 15 • 001 BM1383AGLV
Revision History
17.Nov.2015 001 New Release 30.Mar.2016 002 P1 modify Typical Application Circuit P3 modify Pin Description P4 modify Block Diagram P5 modify Absolute Maximum Ratings P6 modify Electrical Characteristics P9 modify POWER_DOWN and RESET P10 modify MODE_CONTROL P11 modify Operation mode transition P12 modify STATUS, Pressure value and Temperature value P13 modify I2C bus communication P19 modify Application Example 21.Apr.2016 003 P5 modify Absolute Maximum Ratings and Thermal Resistance P8,10,12 modify note of Register Map P11 modify Operation mode transition P21,22 modify Operational Notes
Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cleanin g residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under devian t condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e .g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information an d data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatso ever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.
Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.