Power Management

BDJ2GA3WNUX-TR

Rohm

300mA Variable / Fixed Output LDO Regulators 17.May.2013 Rev.004

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BDXXGA3WEFJ ROHM

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Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
PDF pages: 23

Technical content

○Product structure：Silicon monolithic integrated circuit ○ This product is not designed to have protection against radioactive rays. 1/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･14･001 17.May.2013 Rev.004 Datasheet 300mA Variable / Fixed Output LDO Regulators BDxxGA3WEFJ / BDxxGA3WNUX

General Description BDxxGA3WEFJ / BDxxGA3WNUX series devices are LDO regu lators with an output current of 300mA. The output accuracy is ±1% of the output voltage. Both fixed and variable output voltage devices are avai lable. The output voltage of the variable output voltage device can be varied from 1.5V to 13V using external resistors. Various fixed output voltage devices that do not use external resistors are also available. It can be used for a wide range of digital appliance applications. These devices have built-in over cu rrent protection to protect the device when output is shorted, 0μ A shutdown mode, and thermal shutdown circuit to protect the device during thermal over-load conditions. These LDO regulators are usable with ceramic capacitors that enable a smaller layout and longer life.
Package ( T y p . ) ( T y p . ) ( M a x . ) ●Features +/-1% output voltage accuracy Built-in Over Current Protection (OCP) Built-in Thermal Shut Down circuit (TSD) Zero µA shutdown mode
Key Specifications Input power supply voltage range: 4.5V to 14.0V Output voltage range(Variable type): 1.5V to 13.0V Output current: 0.3A (Max.) Shutdown current: 0μA(Typ.) Operating temperature range: -25 ℃ to +85 ℃
Typical Application Circuit HTSOP-J8 (EFJ) 4.90mm x 6.00mm x 1.00mm VSON008X2030 (NUX) 2.00mm x 3.00mm x 0.60mm HTSOP-J8 (EFJ) VSON008X2030 (NUX) VCC EN GND FIN VO VO VCC EN GND FIN R VO_S COUT CIN CIN, COUT : Ceramic Capacitor FB COUT CIN CIN, COUT : Ceramic Capacitor Output voltage variable type Output voltage fixed type

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet

Ordering Information B D x x G A 3 W y y y - z z Part Number Output voltage 00:Variable 15:1.5V 18:1.8V 25:2.5V 30:3.0V 33:3.3V 50:5.0V 60:6.0V 70:7.0V 80:8.0V 90:9.0V J0:10.0V J2:12.0V Input voltage range G:15V Output current A3:0.3A Shutdown mode “W”:Included Package EFJ :HTSOP-J8 NUX:VSON008X2030 Packaging and forming specification E2:Emboss tape reel (HTSOP-J8) TR:Emboss tape reel (VSON008X2030)
Line up xx Output Voltage(V) Product Name 00 variable BD00GA3WEFJ-E2 BD00GA3WNUX-TR 15 1.5 BD15GA3WEFJ-E2 BD15GA3WNUX-TR 18 1.8 BD18GA3WEFJ-E2 BD18GA3WNUX-TR 25 2.5 BD25GA3WEFJ-E2 BD25GA3WNUX-TR 30 3.0 BD30GA3WEFJ-E2 BD30GA3WNUX-TR 33 3.3 BD33GA3WEFJ-E2 BD33GA3WNUX-TR 50 5.0 BD50GA3WEFJ-E2 BD50GA3WNUX-TR 60 6.0 BD60GA3WEFJ-E2 BD60GA3WNUX-TR 70 7.0 BD70GA3WEFJ-E2 BD70GA3WNUX-TR 80 8.0 BD80GA3WEFJ-E2 BD80GA3WNUX-TR 90 9.0 BD90GA3WEFJ-E2 BD90GA3WNUX-TR J0 10.0 BDJ0GA3WEFJ-E2 BDJ0GA3WNUX-TR J2 12.0 BDJ2GA3WEFJ-E2 BDJ2GA3WNUX-TR 2/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

Block Diagram BD00GA3WEFJ / BD00GA3WNUX (Variable output voltage type)
Pin Configuration (TOP VIEW)
Pin Description Pin No. Pin name Pin Function

1 V O Output pin

2 FB Feedback pin

3 GND GND pin

5 EN Enable pin

8 V CC Input pin

Figure 1. Block Diagram

Block Diagram BDxxGA3WEFJ / BDxxGA3WNUX (Fixed output voltage type)
Pin Configuration (TOP VIEW)
Pin Description Pin No. Pin name Pin Function

2 V O_S Output voltage monitor pin

Figure 2. Block Diagram

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet

Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit Power supply voltage VCC 15.0 *1 V EN voltage VEN 15.0 V HTSOP-J8 Pd *2 2110 *2 Power dissipation VSON008X2030 Pd *3 1700 *3 mW Operating Temperature Range Topr -25 to +85 ℃ Storage Temperature Range Tstg -55 to +150 ℃ Junction Temperature Tjmax +150 ℃ *1 Not to exceed Pd *2 Reduced by 16.9mW/℃ for temperature above 25 ℃. (When mounted on a two-layer glass epoxy board with 70mm×70mm×1.6mm dimension)
Recommended Operating Range (Ta=25℃) Ratings Parameter Symbol Min. Max. Unit Input power supply voltage VCC 4.5 14.0 V EN voltage VEN 0.0 14.0 V Output voltage setting range VO 1.5 13.0 V Output current IO 0.0 0.3 A
Electrical Characteristics (Unless otherwise specified, Ta=25℃, EN=3V, VCC=6V, R1=43kΩ, R2=8.2kΩ) Limits Parameter Symbol Min. Typ. Max. Unit Conditions Circuit current at shutdown mode ISD - 0 5 μA V EN=0V, OFF mode Bias current ICC - 600 900 μA Line regulation Reg.I -1 - 1 % VCC=( VO+0.9V )→14.0V Load regulation Reg IO -1.5 - 1.5 % IO=0→0.3A Minimum dropout voltage1 VCO1 - 0.15 0.30 V VCC=5V, IO=100mA Minimum dropout voltage2 VCO2 - 0.30 0.60 V VCC=5V, IO=200mA Minimum dropout voltage3 VCO3 - 0.45 0.90 V VCC=5V, IO=300mA Output reference voltage(Variable type) VFB 0.792 0.800 0.808 V IO=0A Output voltage(Fixed type) VO V O×0.99 VO V O×1.01 V I O=0A EN Low voltage VEN (Low) 0 - 0.8 V EN High voltage VEN (High) 2.4 - 14.0 V EN bias current IEN 1 3 9 µA 5/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

Power Dissipation ◎HTSOP-J8 ◎VSON008X2030 周囲温度:Ta [℃] Measurement condition: mounted on a ROHM board, Substrate size: 70mm × 70mm × 1.6mm ( S u b s t r a t e w i t h t h e r m a l v i a ) ・Solder the thermal pad to Ground ① IC only θj-a=249.5 ℃/W ② 1-layer （copper foil are : 0mm×0mm） θj-a=153.2 ℃/W ③ 2-layer （copper foil are : 15mm×15mm） θj-a=113.6 ℃/W ④ 2-layer （copper foil are : 70mm×70mm） θj-a=59.2℃ /W ⑤ 4-layer （copper foil are : 70mm×70mm） θj-a=33.3℃ /W Power Dissipation :Pd [W] 0 25 50 75 100 125 150 2.0 3.0 4.0 1.0 ①0.50W ②0.82W ③1.10W ④2.11W ⑤3.76W Ambient Temperature : Ta [℃] Power Dissipation :Pd [W] 0 25 50 75 100 125 150 2.0 3.0 4.0 周囲温度:Ta [℃] 1.0 ①0.26W ②0.56W ③1.70W ④1.80W Ambient Temperature : Ta [℃] Measurement condition: mounted on a ROHM board, Substrate size: 114.3mm × 76.2mm × 1.6 mm ・Solder the thermal pad to Ground ① IC only θj-a=480.8 ℃/W ② 1-layer （copper foil are : 0mm θj-a=223.2 ℃/W ③ 4-layer （2nd, 3rd layer copper foil are : 5655mm2, 4th layer copper foil are : thermal land） θj-a=73.5℃ /W ④ 4-layer （2nd, 3rd, 4th layer copper foil are : 5655mm2） θj-a=69.4℃ /W

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet Thermal design should ensure operation within the following co nditions. Note that the temper atures listed are the allowed temperature limits and thermal design should allow sufficient margin beyond these limits. 1. Ambient temperature Ta can be not higher than 85℃. 2. Chip junction temperature (Tj) can be not higher than 150℃. Chip junction temperature can be determined as follows: Calculation based on ambient temperature (Ta) Tj=Ta+θj-a×W ＜Reference values＞ θj-a: HTSOP-J8 153.2℃/W 1-layer substrate (copper foil density 0mm ×0mm) 113.6℃/W 2-layer substrate (copper foil density 15mm ×15mm) 59.2℃/W 2-layer substrate (copper foil density 70mm ×70mm) 33.3℃/W 4-layer substrate (copper foil density 70mm ×70mm) Substrate size: 70mm×70mm×1.6mm (Substrate with thermal via) θj-a: VSON008X2030 223.2℃/W 1-layer substrate (copper foil density 0mm 73.5℃/W 4-layer substrate (2 nd, 3rd layer copper foil density 5655mm2, 4th layer copper foil : thermal land) 69.4℃/W 4-layer substrate (2 nd, 3rd, 4th layer copper foil density 5655mm2) Substrate size: 114.3mm ×76.2mm×1.6mm Most of the heat loss that occurs in the BDxxGA3WEFJ / BD xxGA3WNUX series is generated from the output Pch FET. Power loss is determined by the voltage drop across V CC-VO and the output current. Be sure to confirm the system’s input and output voltages, as well as the output cu rrent conditions in relation to the powe r dissipation characteristics of the V CC and VO in the design. Bearing in mind that the power dissipation may vary substantially depending on the PCB employed, it is important to consider PCB size based on thermal design and power dissipation characteristics of the chip with the PCB. Power consumption [W] = Input voltage (V CC) - Output voltage (VO) × IO(Ave) Example: Where VCC=5.0V, VO=3.3V, IO (Ave) = 0.1A, Power consumption [W] = 5.0V - 3.3V ×0.1A = 0 . 1 7 W 13/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet

Input and Output Capacitor It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also, as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation will be and the capacitor will make improvements of characteristics depending on the load. However, please check the actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application. DC Bias Voltage [V] Ceramic capacitor capacity – DC bias characteristics (Characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 Rated Voltage：10V B1 characteristics Rated Voltage：4V X6S characteristics Capacitance Change [%] Rated Voltage:10V F characteristics Rated Voltage：6.3V B characteristics B characteristics Rated Voltage：10V
Equivalent Series Resistance ESR (Output Capacitor) To prevent oscillations, please attach a capacitor between VO and GND. Capacitors usually have ESR (Equivalent Series Resistance). Operation will be stable in the ESR-I O range shown to the right. Ceramic, tantalum and electrolytic Capacitors have different ESR values, so please ensure that you are using a capacitor that operates in the stable operating region shown on the right. Finally, please evaluate in the actual application. CO=1μF ESR – IO characteristics 14/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

Evaluation Board Circuit
Evaluation Board Parts List
Board Layout PCB layout considerations: ・Input capacitor C IN connected to VCC (VIN) should be placed as close to VCC(VIN) pin as possible. Output capacitor COUT also should be placed as close to IC pin as possi ble. In case the part is connected to inner layer GND plane, please use several through holes. ・FB pin has comparatively high impedance and can be affect ed by noise, so stray capacitance should be as small as possible. Please take care of this during layout. ・Please make GND pattern wide enough to handle thermal dissipation. ・For output voltage setting (BD00GA3WEFJ / BD00GA3WNUX) Output voltage can be set by FB pin voltage（0.800V typ.）and external resistance R1, R2. （The use of resistors with R1+R2=1k to 90kΩ is recommended ） Designation Value Part No. Company Designation Value Part No. Company R1 43k Ω MCR01PZPZF4302 ROHM C4 ‐ ‐ ‐ R2 8.2k Ω MCR01PZPZF8201 ROHM C5 1µF CM105B105K16A KYOCERA C1 1µF CM105B105K16A KYOCERA C10 ‐ ‐ ‐ C2 ‐ ‐ ‐ U1 ‐ BDxxGA3WEFJ / BDxxGA3WNUX ROHM VO = VFB× R1+R2 N.C.GND FB N.C. N.C. VO VO

1 VCC

( VCC VIN ) CIN R1 R2 COUT

I/O Equivalent Circuits (Variable type : BD00GA3WEFJ / BD00GA3WNUX)
I/O Equivalent Circuits (Fixed type : BDxxGA3WEFJ /BDxxGA3WNUX) 8pin (VCC) / 1pin (VO) 2pin (FB) 5pin (EN) 2pin (FB) 8pin (VCC) 1pin (VO) 5pin (EN) 1MΩ 2MΩ 8pin (VCC) / 1pin (VO) 2pin (VO_S) 5pin (EN) 2pin (VO_S) 8pin (VCC) 1pin (VO) 5pin (EN) 1MΩ 2MΩ

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet

Operational Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit. If there is any possibility of exposure over the rated values, please consider addi ng circuit protection devices such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity c an damage the IC. Take precautio ns when connecting the power supply lines. An external direction diode can be added. (3) Power supply lines Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the grou nd section and supply lines of t he digital and analog blocks. Furt hermore, for all power supply terminals to ICs, connect a capacitor between the power suppl y and GND terminal. When using electrolytic capacitors in a circuit, note that capacitance values are reduced at low temperatures and over time. (4) GND voltage The potential of the GND pin must be minimum potential under all operating conditions. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (6) Inter-pin shorts and mounting errors Use caution when positioning the IC fo r mounting on printed circuit boards. T he IC may be damaged if there is any connection error or if pins are shorted together. (7) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electr omagnetic field as doing so may cause the IC to malfunction. (8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (9) Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD ON Temperature[℃] (typ.) Hysteresis Temperature [℃] (typ.) BDxxGA3WEFJ / BDxxGA3WNUX 175 15 (10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 17/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet (11) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersecti on of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interf erence among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND(P substrate) voltage to an input pin, should not be used. Resistor Transistor (NPN) N N N P+ P + P P substrate GND Parasitic element Pin A N N P+ P+ P P substrate GND Parasitic element Pin B C B E N GND Pin A Pin B Other adjacent elements E B C GND Parasitic element Parasitic element (12) Ground Wiring Pattern. When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluc tuations in the small-signal ground caused by large currents. Also ens ure that the ground traces of external components do not cause variations on the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 18/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

Physical Dimension Tape and Reel Information
Marking Diagram xx Product Name

00 BD00GA3WEFJ BD00GA3WNUX

15 BD15GA3WEFJ BD15GA3WNUX

18 BD18GA3WEFJ BD18GA3WNUX

25 BD25GA3WEFJ BD25GA3WNUX

30 BD30GA3WEFJ BD30GA3WNUX

33 BD33GA3WEFJ BD33GA3WNUX

50 BD50GA3WEFJ BD50GA3WNUX

60 BD60GA3WEFJ BD60GA3WNUX

70 BD70GA3WEFJ BD70GA3WNUX

80 BD80GA3WEFJ BD80GA3WNUX

90 BD90GA3WEFJ BD90GA3WNUX

J0 BDJ0GA3WEFJ BDJ0GA3WNUX J2 BDJ2GA3WEFJ BDJ2GA3WNUX (Unit : mm) HTSOP-J8 0.08 S 0.08 M S 1.0MAX 0.85±0.05 1.27 0.08±0.08 0.42 +0.05 -0.04 1.05±0.2 0.65±0.15 4°+6° −4° 0.17 +0.05 -0.03 234 5 6 8 (MAX 5.25 include BURR) 0.545 (3.2) 4.9±0.1 6.0±0.2 (2.4) 3.9±0.1 1PIN MARK ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs Direction of feed Reel 1pin HTSOP-J8 (TOP VIEW) xxGA3W Part Number Marking LOT Number 1PIN MARK VSON008X2030 (TOP VIEW) GA3 x x Part Number Marking LOT Number 1PIN MARK ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 4000pcs TR Direction of feed Reel 1pin (Unit : mm) VSON008X2030 1.4±0.1 0.25 1.5±0.1 0.5 0.3±0.1 0.25 +0.05 −0.04 C0.25 0.6MAX (0.12) 0.02 +0.03 −0.02 3.0±0.1 2.0±0.1 1PIN MARK 0.08 S S

BDxxGA3WEFJ / BDxxGA3WNUX Datasheet

Revision History Date Revision Changes 20.July.2012 001 New Release 03.Dec.2012 002 Improvement English translation and added Package Lineup 17.Jan.2013 003 The description was modified. 17.May.2013 004 Added BDxxGA3WNUX series 20/20 TSZ02201-0R6R0A600180-1-2© 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 17.May.2013.Rev.004

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufac tured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring ex tremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sale s representative in advance. Unless otherwise agreed in writing by ROHM in advance, RO HM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASS Ⅲ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. Accordin gly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subjec t to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperat ure is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2. You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contain ed in this document is for reference only. ROHM does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any wa y whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Selected Specification

Rohm BDJ2GA3WNUX-TR overview.

Summary

300mA Variable / Fixed Output LDO Regulators 17.May.2013 Rev.004

Description

300mA Variable / Fixed Output LDO Regulators 17.May.2013 Rev.004

Source title BDJ2GA3WNUX-TR Datasheet(PDF) - Rohm

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