BD9397EFV Datasheet PDF & Specifications

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BD9397EFV ROHM

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1.1 Electrical Characteristics 1(Unless otherwise specified, Ta=25°C，VCC=24V) Parameter Symbol Limit Unit Condition Min. Typ. Max. 【Whole device】 Operating circuit current ICC - 9 16 mA STB=3V,LED1-6=ON, RT=30kΩ Stand-by circuit current ISTB - 12 20 μA STB=0V 【REG9V block】 REG9V output voltage REG9V 8.9 9.0 9.1 V IO=0mA Maximum REG9V output current IREG9V 20 - - mA 【Switching block】 N terminal source resistance RONH - 2.5 3.5 Ω ION=-10mA N terminal sink resistance RONL - 3.0 4.2 Ω ION=10mA 【Over current protection (OCP) block】 Over current protection voltage VOCP 0.40 0.45 0.50 V VCS=SWEEP UP 【Soft-start block】 SS terminal source current ISS -1.4 -1.0 -0.6 μA SS terminal release voltage VSS 2.9 3.0 3.1 V SS=SWEEP UP 【Error amplifier block】 LED control voltage VLED 0.66 0.7 0.74 V LED_LV=0.7V FB sink current IFBSINK 55 100 155 μA LED=2.0V, VFB=1.0V FB source current IFBSOURCE -155 -100 -55 μA LED=0V, VFB=1.0V LED_LV terminal input current ILED_LV -2 0 2 uA VLED_LV=3V 【CT oscillator block】 Oscillation frequency FCT 440 500 560 kHz RT=30k Ω MAX DUTY DMAX 78 84 91 % 【Over voltage protection (OVP) block】 OVP detection voltage VOVP 2.34 2.43 2.52 V VOVP=SWEEP UP OVP hysteresis voltage VOVPHYS 10 50 100 mV VOVP=SWEEP DOWN OVP feedback voltage FBOVP 0.93 1.05 1.17 V PMW1-6=0V,SS=2.8V, VLED_LV=0.7V 【Short current protection (SCP) block】 Short circuit protection voltage VSCP 0.12 0.20 0.28 V VOVP=SWEEP DOWN 【M_LED block】 Diode forward voltage VFLED 1120 1340 1560 mV VLED=0V Forward voltage offset each ch VFOFFSET - - 20 mV VLED=0V REG9V pull up resistance RM_DET 60 100 140 k Ω

1.2 Electrical Characteristics 2(Unless otherwise specified, Ta=25°C，VCC=24V) Parameter Symbol Limit Unit Condition Min. Typ. Max. 【UVLO block】 Operation power source voltage (VCC) VUVLO_VCC 7.0 7.5 8.0 V VCC=SWEEP UP Hysteresis voltage (VCC) VUHYS_VCC 150 300 600 mV VCC=SWEEP DOWN UVLO Release voltage VUVLO_U 2. 375 2.5 2.625 V VUVLO=SWEEP UP Hysteresis voltage (UVLO) VUHYS_U 50 100 150 mV VUVLO=SWEEP DOWN UVLO terminal input resistance RUVLO 370 610 850 k Ω VUVLO=3V 【Filter block】 CP detection voltage VCP 1.9 2.0 2.1 V CP=SWEEP UP CP source current ICP -1.2 -1.0 -0.8 μA VCP=0V 【LED driver block】 S terminal voltage VSLED 196 200 204 mV VREF=1.0V 294.6 300 305.4 mV VREF=1.5V 392.8 400 407.2 mV VREF=2.0V 491 500 509 mV VREF=2.5V LED current rise time ILEDtr - 400 760 ns VREF=0.3V,RS=2Ω LED current fall time ILEDtf - 100 280 ns VREF=0.3V,RS=2Ω OPEN detection voltage VOPEN 0.12 0.20 0.28 V VLED=SWEEP DOWN SHORT detection voltage VSHORT 5.7 6.0 6.3 V VLED=SWEEPUP, VLSP=1.2V SHORT MASK voltage VSHTMASK 2.85 3.0 3.15 V VREF terminal input current IVREF -2 0 2 μA VVREF=3V LSP terminal input current ILSP -2 0 2 μA VLSP=3V 【STB block】 STB terminal HIGH voltage STBH 2.0 - VCC V STB terminal LOW voltage STBL -0.3 - 0.8 V STB terminal Pull Down resistance RSTB 0.5 1.0 1.5 M Ω STB=3V 【PWM IN block】 PWM terminal HIGH voltage PWMH 2.0 - 20 V PWM terminal LOW voltage PWML -0.3 - 0.8 V PWM terminal Pull Down resistance RPWM 200 300 400 k Ω PWM=3V 【FAIL_MODE,FAIL_RST,SUMPWM block】 Input terminal High voltage VINH 2.0 - 20 V Input terminal Low voltage VINL -0.3 - 0.8 V Input terminal Pull Down resistance RVIN 60 100 140 k Ω VIN=3V 【FAIL block（OPEN DRAIN）】 FAIL LOW output voltage VOL 0.25 0.5 1.0 V IOL=1mA

1.3 Pin Descriptions No Pin name In/Out Function rating [V] 1 VCC IN Power source terminal -0.3 to 36 2 FAIL OUT Abnormality detection output terminal (OPEN DRAIN) -0.3 to 36 3 REG9V OUT 9V regulator output terminal -0.3 to 13 4 N.C. - Non connection terminal - 5 N OUT DC/DC switching output terminal -0.3 to 13

6 PGND IN Power GND terminal -

7 CS IN DC/DC FET output current detection terminal -0.3 to 7 8 OVP IN Overvoltage protection detection terminal -0.3 to 7 9 M_DET OUT LED Diode OR output terminal -0.3 to 13

10 AGND IN GND terminal for analog part -

11 LED1 OUT LED output 1 -0.3 to 60 12 LED2 OUT LED output 2 -0.3 to 60 13 LED3 OUT LED output 3 -0.3 to 60 14 LED4 OUT LED output 4 -0.3 to 60 15 LED5 OUT LED output 5 -0.3 to 60 16 LED6 OUT LED output 6 -0.3 to 60 17 STB IN Standby control terminal -0.3 to 36 18 PWM1 IN PWM dimming input signal terminal for LED 1 -0.3 to 22 19 PWM2 IN PWM dimming input signal terminal for LED 2 -0.3 to 22 20 PWM3 IN PWM dimming input signal terminal for LED 3 -0.3 to 22 21 PWM4 IN PWM dimming input signal terminal for LED 4 -0.3 to 22 22 PWM5 IN PWM dimming input signal terminal for LED 5 -0.3 to 22 23 PWM6 IN PWM dimming input signal terminal for LED 6 -0.3 to 22 24 FAIL_RST IN FAIL output reset terminal -0.3 to 22 25 S6 IN Connecting terminal for LED 6 constant current setting resistor -0.3 to 7 26 S5 IN Connecting terminal for LED 5 constant current setting resistor -0.3 to 7 27 S4 IN Connecting terminal for LED 4 constant current setting resistor -0.3 to 7 28 S3 IN Connecting terminal for LED 3 constant current setting resistor -0.3 to 7 29 S2 IN Connecting terminal for LED 2 constant current setting resistor -0.3 to 7 30 S1 IN Connecting terminal for LED 1 constant current setting resistor -0.3 to 7 31 CP OUT Connecting terminal for non-r eaction time setting capacitor -0.3 to 7 32 SS OUT Connecting terminal for soft-sta rt time setting capacitor -0.3 to 7 33 FB OUT Error amplifier output terminal -0.3 to 7 34 RT OUT Connecting terminal for DC/DC frequency setting resistor -0.3 to 7 35 VREF IN Analog dimming DC voltage input terminal -0.3 to 7 36 LED_LV IN LED control voltage set terminal -0.3 to 7 37 LSP IN LED SHORT detection voltage setting terminal -0.3 to 7 38 FAIL_MODE IN FAIL functi on change terminal -0.3 to 7 39 UVLO IN Low voltage malfunction prev ention detection terminal -0.3 to 10.5

40 AGND IN GND terminal for analog part -

1.4.1 I/O equivalence circuit REG9V / N / PGND / CS SS FB FB LED1 to LED6, S1 to S6 CP UVLO LED1-6 S1-6 CP PWM1 to PWM6 VREF LSP,LED_LV PWM1-6 300k VREF LSP OVP FAIL RT FAIL 500 RT STB FAIL_MODE / FAIL_RST M_DET STB

Figure 5. I/O equivalence circuit

2 Block Diagram ----- + OPEN/SHORT Detect ERR AMP Control Logic DRIVER Current Sense SS OSC + + PWM COMP VREG PROTECTION Logic PWM１ VREF LSP FB AGND SS RT STB VCC REG9V UVLO FAIL OVP CP N PGND LED1 CS Vin Cin VCC CVCC RFB CFB Cout REG9V LED6 LED_LV REG9V UVLO (VCC) UVLO TSD OVP SCP Filter FAIL_MODE PWM6 AGND N.C. REG9V M_DET FAIL_RST

Figure 11. Block Diagram

3.1 Pin Configuration 1 pin. VCC Power supply terminal of IC. The input range is 9 to 35V. 2 pin. FAIL FAIL signal output terminal (NMOS open-drain). NMOS is O PEN at the normal operation so FAIL pin is Hi-Z. NMOS becomes ON state (500 ohm typ.) at the abnormal detection. It is possible to select the FAIL type from latch type (FAIL_MODE=L) or one shot pulse (FAIL_MODE=H).Please refer to the detail explanation＜38pin. FAIL_MODE terminal＞ 3 pin. REG9V REG9V is a 9 V output pin used delivering 20mA at maximum for switching power supply of N terminal. Use at a current higher than 20mA may affect the reference voltage within IC, which may result in malfunction. It will also cause heating of IC itself. Therefore it is recommended to set the load as small as possible. The characteristic of VCC line regulation at REG9V is shown as figure. VCC must be used in more than 10.5V for stable 9V output. Install an oscillation prevention ceramic capacitor (2.2 to 10μF) nearest to VREG between VREG-AGND terminals. 4 pin. N.C Non connect pin. Please set it the open state or deal with connecting the GND. 5 pin. N Gate driving output pin of external NMOS of DC/DC converter with 0 to 9V (REG9V) swing. Output resistance of High side For details, see the explanation of <34pin. RT terminal>. 6pin. PGND Power GND terminal of output terminal, N driver: 7pin. CS Inductor current detection resistor connecting terminal of DC/DC current mode: it transforms the current flowing through the inductor into voltage by sense resistor R CS connected to CS terminal, and this voltage is compared with that set in the error amplifier by current detection comparat or to control DC/DC output voltage. RCS al so performs over current protection (OCP) and stops switching action when the voltage of CS terminal is 0.45 V (typ.) or higher (Pulse by Pulse). 8 pin. OVP OVP terminal is the detection terminal of overvoltage protec tion (OVP) and short circuit protection (SCP) for DC/DC output voltage. Depending on the setting of the FAIL_MODE termi nal, FAIL and CP terminal behave differently when an abnormality is detected. For details, see the table for each protection operation is described in ●3.2 and ●3.3. During the soft start (SS), there is a function which returns the OVP voltage to error amplifier to boost DC/DC output voltage at all Low PWM (OVPFB function). After completion of SS, this function is disabled. 9 pin. M_DET The Di OR output terminal of LED 1 to 6. The output is the vo ltage which is added a diode forward voltage(two diode stack) to the lowest voltage among 6 LED terminals. 10pin. AGND Analog GND for IC 11 to 16pin. LED1 to LED6 LED constant current driver output terminal. Setting of LED current value is adjustable by setting the VREF voltage and connecting a resistor to S terminal. For details, see the explanation of <25 to 30pin. S1 to S6, 35pin. VREF >. The PWM dimming frequency of LED current driver and upper/lower limit of t he duty need to be set in a manner that necessary linearity of PWM dimming characteristics can be secured referring to the following figures: Start/Stop time of constant current driver (PWM pulse response) Start-up time depends on the VREF value; the response becomes quick, so that voltage is high. In the way of reference, the current response upon application of current rise rate and pulse PWM1us (current pulse) to describe the dependence of VREF. It needs to be adequately verified with an actual device because the response rate may vary with application conditions. Figure 12. 0 5 10 15 20 25 30 35 REG9V [V] VCC [V] REG9V ‐VCC (Line Regulation)

TSZ02201-0F1F0C100330-1-2© 2013 ROHM Co., Ltd. All rights reserved. CP terminal voltage reaches 2.0V (typ.), the IC is latched and FAIL terminal operates (at FAIL_MODE = L). capacitor connected with SS terminal, which enables soft-start of DC/DC converter. etc. before the voltage of 3.0 V is detected. by adjusting the FB voltage. described in ●3.7 How to set phase compensation. A resistor and a capacitor need to be connected in series nearest to the terminal between FB and AGND. time of charge to the specified voltage, which results in speed-up in DC/DC conversion. RT sets charge/discharge current determining frequency inside IC. V at Tj = 85°C, so LED_LV voltage must be at least a minimum 0.47V. taken to thermal design in use. Note: LED_LV voltage is not allowed setting below 0.3V. Note: LED current by raising LED_LV voltage can flow to MAX 400mA, use with care in the dissipation of the package. Figure 16. Figure 17.

TSZ02201-0F1F0C100330-1-2© 2013 ROHM Co., Ltd. All rights reserved. 9.Jan.2014 Rev.001 www.rohm.com TSZ22111・15・001 BD9397EFV LED_LV LED1 LED2 LED3 LED4 LED5 LED6 REG9V AMP 37pin. LSP Terminal which sets LED SHORT detection voltage: The input impedance of LSP pin is High Impedance, because it is assumed that the input of LSP terminal is set by dividing the resistance with a high degree of accuracy. The LSP terminal is assumed that it is set by dividing the resistance with a high degree of accuracy, LSP terminal inside the IC is in open state (High Impedance). It is necessary to input voltage to divide the resistance from the output of REG9V or use external power source. Using the terminal in open state needs to be avoided. Set LSP voltage in the range of 0.8V to 3.0V. LED SHORT：LSP detection Voltage, VLSP：LSP terminal voltage The conditions there are restrict ions on short LED detection. For details, see the explanation of section ●3.5.2 Setting the LED short detect voltage (LSP pin). 38pin. FAIL_MODE Output mode of FAIL can be change by FAIL_MODE terminal. When FAIL_MODE is in Low state, the output of FAIL terminal is the latch mode. FAIL terminal is latched after the CP charge time from detection of abnormal stat e. When FAIL_MODE is in High state, the output of FAIL terminal is one-sh ot-pulse mode. At detected abnormality, firstly FAIL is in Low state (Drain state). FAIL returns to High state (Open state) if abnormality is cleared after CP charge time, In this mode, there is no latch stop for protection operation in IC. Monitoring the FAIL with the Microcomputer, decide to stop working IC. For FAIL_MODE = H when the detection sequence, see the explanation of section ●3.8.3 Protective operation sequence at FAIL_MODE=H. On application to change modes is prohibited. 39pin. UVLO UVLO terminal of the power of step-up DC/DC converter: at 2.5 V (typ.) or higher, IC starts step-up operation and stops at The power of step-up DC/DC converter needs to be set detection level by dividing the resistance. If any problem on the application causes noise on UVLO terminal which results in unstable operation of DC/DC c onverter, a capacitance of approximately 1000 pF needs to be connected between UVLO and AGND terminals. 40pin. AGND Analog GND for IC ] [ 5V VLSPLED SHORT   Figure 18.

3.2 Protection Operation at FAIL Latch output (FAILMODE=L)
3.2.1 List of the Threshold Function terminal（typ. condition） Please decide the resistance divider of the various protection detection using the following table. Protection name Detection Pin name Detection condition Release condition Protection type PWM PWM LED Open LEDx LEDx < 0.2V SS>3V High LEDx > 0.2V High/Low Stop the CH latch after the CP charge is completed. LED short LEDx LEDx > 5×VLSP SS>3V High LEDx < 5×VLSP High/Low Stop the CH latch after the CP charge is completed. UVLO UVLO UVLO < 2.3V ― UVLO > 2.5V ― Stop the system OVP OVP OVP > 2.43V ― OVP < 2.4V ― Stop the N output SCP OVP OVP < 0.2V ― OVP > 0.2V ― Stop the N output. Stop the system after the CP charge is completed. OCP CS CS > 0.45V ― CS < 0.45V ― Stop the N output under the detection.（Pulse by Pulse） It is possible to reset with the FAIL_RST terminal to release the latch stop.
3.2.2 List of Protection function （*1）Short protection doesn't hang when becoming remainder 1ch. DCDC output falls as LED short. Protection function Action when protection function is detected DC/DC converter LED driver Soft-start FAIL terminal STB Stop Stop Discharge OPEN LED Open Normal operation (Stop when all LED CH stop) Stop after CP charge (Latch operation) Normal operation DRAIN after the CP charge is completed. (Latch operation) LED short Normal operation Stop after CP charge (Latch operation) Normal operation DRAIN after the CP charge is completed. (Latch operation) UVLO Stop Stop Discharge GND OVP Stop N output Normal operat ion Normal operation OPEN SCP Stop N output Stop after CP charge (Latch operation) Discharge after latch DRAIN after the CP charge is completed. (Latch operation) OCP Stop the N output (Pulse by Pulse) Normal operation Normal operation OPEN

3.3 Protection operation when the FAIL one shot outputs(FAILMODE=H)
3.3.1 List of the threshold function terminal （typ. condition） Please decide the resistance divider of the various protection detection using the following table. Protection name Detection Pin name Detection condition Release condition Protection type PWM PWM LED Open LEDx LEDx < 0.2V SS>3V High LEDx > 0.2V High/Low FAIL drain state under the detection. LED short LEDx LEDx > 5×VLSP SS>3V High LEDx < 5×VLSP High/Low FAIL drain state under the detection. UVLO UVLO UVLO < 2.3V ― UVLO > 2.5V ― Stop the system. OVP OVP OVP > 2.43V ― OVP < 2.4V ― Stop the system FAIL drain state under the detection.. SCP OVP OVP < 0.2V ― OVP > 0.2V ― Stop the system. FAIL drain state under the detection.. OCP CS CS > 0.45V ― CS < 0.45V ― Stop the N output under the detection. （Pulse by Pulse）
3.3.2 List of the protection function Protection function Action when protection function is detected DC/DC converter LED driver DC/DC converter FAIL terminal STB STB Stop Stop Discharge LED Open LED Open Normal operation (Stop when the all CH stop) Normal operation Normal operation LED short LED short Normal operation Normal operation Normal operation UVLO UVLO Stop Stop Discharge OVP OVP Stop the N output Normal o peration Normal operation SCP SCP Stop the N output Normal operation Normal operation OCP OCP Stop the N output (Pulse by Pulse) Normal operation Normal operation

TSZ02201-0F1F0C100330-1-2© 2013 ROHM Co., Ltd. All rights reserved. 9.Jan.2014 Rev.001 www.rohm.com TSZ22111・15・001 BD9397EFV 5 ] [ ] [] [  A I V Vohm R LED VREF S ] V [ 0 . 3 ] A [ 10 0 . 1 ] S [ T] F [ C SS SS   ] V [ 0 . 2 ] A [ 10 0 . 1 ] S [ T] F [ C CP CP   LSP CLSP REG9V=9V LEDx 3200kΩ 800kΩ LSP COMP

3.4 Setting of the external components.（typ. condition）
3.4.1 Setting the LED current (VREF and Sx pin) First, VREF pin voltage is determined. When performing Analog dimming, be careful of VREF pin input range (0.2 to 2.5V) and decide typical voltage. In BD9397EFV, LED constant current is controlled by Sx terminal voltage as a reference point. Sx terminal is controlled to become one fifth of the voltage of VREF terminal voltage. In the case of VREF=1V, it is set to Sx=0.2V. Therefore, when the resistance to Sx terminal versus GND is set to "RS", the relationship between RS, VREF and ILED is as follows
3.4.2 Setting the LED short detect voltage (LSP pin) The voltage of LED short detection can be arbitrarily set up with LSP pin voltage. LSP pin cannot be used by OPEN because of High Impedance. Please be sure to applied voltage from the exterior. About LED short detection voltage, if "VLEDshort" and LSP pin voltage are set to "VLSP", it is as follows. Since the setting range of a LSP pin is set to 0.8V to 3.0V, VLEDshort can be set up in 4Vto15V. ○Equation of setting LSP detect Voltage When the detection voltage VLSP of LSP is set up by resistance division of R1 and R2 using REG9V, it becomes like the following formula. *Also including the variation in IC, please also take the part variation in a set into consid eration for an actual constant setup, and inquire enough to it.
3.4.3 Timer latch time(CP pin) When various abnormalities are detected, the source current of 1.0uA is first flowed from CP pin. BD9397EFV don’t stop by latch, unless abnormal state is continues and CP pin voltage reaches continues 2V. With the capacity linked to CP pin, the unresponded time from detection to a latch stop. The relationship between the unresponded time “Tcp” and CP pin connection capacitor “Ccp” is as follows.
3.4.4 Setting the soft-start time (SS pin) The starting time of a DCDC output is dependent on SS pin connection capacity. Moreover, although SS pin is charged by source current of 1uA, IC does not perform LED protection as under DCDC starting state until SS pin voltage arrive to 3.0V. (The soft starting time set up here should be the mask time of a under [ starting ], and please keep in mind that it differs from time until a DCDC output is stabilized.) Time until a DCDC output is stabilized is greatly dependent on a ratio of step-up or load. The relationship between soft starting time "TSS" and SS pin connection capacity "CSS" is as follows.
3.4.5 DCDC operation frequency (RT pin) The oscillation frequency of the DCDC output is decided by RT resistance. BD9397EFV is designed to become a 500-kHz setup at the time of 30kohm. RT resistance and frequency have a relation of an inverse proportion, and become settled as the following formula. =DCDC convertor oscillation frequency [Hz] Please connect RT resistance close as much as possible from RT pin and an AGND pin. ] [10 5 . 110  SW RT fR swf ] [] [ V VLEDV V short LSP  ] [ 52 1

29 VR R

RV REGVLEDshort     Figure 19.

One with over current protection setting or higher is recommended.
Selection of one with small ON resistance results in high efficiency.

OUT, and low forward voltage VF especially needs to be selected. which gate-source withstand voltage and drain-source withstand voltage are both higher than VIN needs to be selected. To provide soft-start for the load switch, a capacitor must be inserted among gates and sources.

3.6 How to set phase compensation DC/DC converter application controlling current mode has each one pole (phase lag) f p due to CR filter composed of output capacitor and output resistance (= LED current) and ZERO (phase lead) fZ by output capacitor and ESR of the capacitor. Moreover, step-up DC/DC converter has RHP ZERO f ZRHP as another ZERO. Since RHP ZERO has a characteristic of phase lag (-90°) as pole does, cross-over frequency fc needs to be set at RHP ZERO or lower. i. Determine Pole f p and RHPZERO fZRHP of DC/DC converter: H e r e , 、＝=sum of LED current, ii. Determine Phase compen sation to be inserted into error amplifier (with fc set at 1/5 of fZRHP) Here, iii. Determine ZERO to compensate ESR (R ESR) of COUT (electrolytic capacitor) * When a ceramic capacitor (with R ESR of the order of millimeters) is used to COUT, too, operation is stabilized by insertion of RESR and CFB2. Though increase in R FB1 and decrease in C FB1 are necessary to improve transient response, it needs to be adequately verified with an actual device in consideration of variation between external parts since phase margin is decreased. VOUT VIN COUTRCS L RESR

Figure 25. Output part Figure 26. Error Amplifier

1 Ff RC

3.7 Timing chart
3.7.1 Normal operation sequence DisableEnableDisable VCC , , LED open detection LED short detection 7.5V STB 2.0V REG9V 5.8V FAIL UVLO SS VOUT PWM* ILED* 5.4V 0.8V ・ILED* current is independent controlled by each PWM* pin. ・FAIL pin is pulled up. 3.0V 2.5V Figure 27.

3.8.2 Protective operation state transition table at FAIL_MODE=L (Open detection) PWM Error state PWM Error state PWM Error state L(no pulse) or pulse less than 4cnt. don't care discharge -- - - normal state Not detect discharge -- - - normal state Not detect discharge - - normal state Not detect normal state detect CH latch FAIL latch Not detect normal state detect CH latch FAIL latch Not detect discharge - - normal state Not detect normal state detect CH latch FAIL latch Not detect normal state detect CH latch FAIL latch L(no pulse) H(input pulse) detect charge L(no pulse) H(input pulse) detect charge L(no pulse) H(input pulse) before CP charge → CP charge → CP=2V arrival end of state pulse over 4cnt. detect start charge (Short detection) PWM Error state PWM Error state PWM Error state L(no pulse) or puse less than 4cnt. don't care discharge -- - - normal state Not detect discharge -- - - normal state L(no pulse) don't care CH latch FAIL latch Not deetect normal state detect CH latch FAIL latch Not detect discharge -- normal state L(no pulse) don't care CH latch FAIL latch Not deetect normal state detect CH latch FAIL latch end of statebefore CP charge CP charge CP=2V arrival→→ H(input pulse) charge H(input pulse) chargedetect don't care H(input pulse) pulse over 4cnt. detect start charge L(no pulse) With "the pulse of less than 4 cnt", it is defined as the pulse width from (100n)sec to (Hi time of less than 4 cnt of DCDC fre quency). In the pulse below (100n)sec, since delay from a PWM pin input to internal logic exists, it becomes unfixed.

3.7.4 About LED SHORT detection LED SHORT detection don’t work by individual ch. The followings are needed for detection. ・Detection channel is PWM=H and LED terminal voltage is over LED SHORT detection threshold voltage. ・Except for detection ch, any 1ch is PWM=H and LED terminal voltage is under 3V. ・The above-mentioned 2 states continue over 4clk of DCDC oscillation frequency. Detection sequence is the followings.(omit 4clk mask) Figure 30.

TSZ02201-0F1F0C100330-1-2© 2013 ROHM Co., Ltd. All rights reserved. 9.Jan.2014 Rev.001 www.rohm.com TSZ22111・15・001 BD9397EFV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. Furthermore, connect a capacitor to ground at all po wer supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground trac es of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always dischar ge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assemb ly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PC B. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 31. Example of monolithic IC structure temperature and the decrease in nominal capacitance due to DC bias and others.

Area of Safe Operation (ASO)
Thermal Shutdown Circuit(TSD)

the TSD threshold, the circuits are automatically restored to normal operation.

Over Current Protection Circuit (OCP)

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

Ordering Information B D 9 3 9 7 E F V - E2 Part Number Package EFV:HTSSOP-B Packaging and forming specification E2: Embossed tape and reel
Marking Diagram HTSSOP-B40 (TOP VIEW) BD9397EFV Part Number Marking LOT Number 1PIN MARK

TSZ02201-0F1F0C100330-1-2© 2013 ROHM Co., Ltd. All rights reserved. 9.Jan.2014 Rev.001 www.rohm.com TSZ22111・15・001 BD9397EFV Physical Dimension, Tape and Reel Information Package Name HTSSOP-B40 ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tape (with dry pack)Tape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs Direction of feed Reel 1pin

Revision History

9.Jan.2014 001 Draft Version

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufac tured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring ex tremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sale s representative in advance. Unless otherwise agreed in writing by ROHM in advance, RO HM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASS Ⅲ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. Accordin gly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subjec t to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperat ure is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2. You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contain ed in this document is for reference only. ROHM does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any wa y whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Overview

BD9397EFV is listed in the Driver IC category. Available datasheets include documents from Rohm. DigiCamel provides a local PDF and searchable HTML technical text for online reference.

Summary

White LED Driver for large LCD panel

Description

White LED Driver for large LCD panel

Source title BD9397EFV Datasheet(PDF) - Rohm

BD9397EFV

Compare BD9397EFV variants.

Read the Rohm document online.