BD7411G

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Omnipolar Detection Hall ICs

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Description The bipolar Hall ICs are magnetic switches that can operate both S-and N-pole , upon which the output goes from Hi to Low. In addition to regular single-output Hall ICs, We offers a line up of dual-output units with a reverse output terminal (active High).
Features 1) Omnipolar detection 2) Micropower operation (small current using in termittent operation method)(BD7411G is excluded.) 3) Ultra-compact CSP package (BU52001GUL,BU52015GUL) 4) Ultra-Small outline package HVSOF5 (BU52011HFV,BU52021HFV) 5) Ultra-Small outline package SSON004X1216 (BU52051NVXV) 6) Small outline package (BU52025G,BD7411G) 7) Line up of supply voltage For 1.8V Power supply voltage(BU52011HFV,BU52015GUL,BU52051NVX) For 3.0V Power supply voltage (BU52001GUL) For 3.3V Power supply voltage (BU52021HFV,BU52025G) For 5.0V Power supply voltage (BD7411G) 8) Dual output type (BU52015GUL) 9) High ESD resistance 8kV(HBM)
Applications Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc.
Product Lineup Product name Supply voltage (V) Operate point (mT) Hysteresis (mT) Period (ms) Supply current (AVG) (A) Output type Package ※Plus is expressed on the S-pole; minus on the N-pole No.10045ECT02

Absolute Maximum Ratings BU52001GUL (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1～+4.5 ※1 V Output Current IOUT ±1 mA Power Dissipation Pd 420※2 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -40 ～+125 ℃ ※1. Not to exceed Pd ※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 50mm ×58mm Glass-epoxy PCB) BU52015GUL (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ～+4.5※3 V Output Current IOUT ±0.5 mA Power Dissipation Pd 420※4 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -40 ～+125 ℃ ※3. Not to exceed Pd ※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 50mm ×58mm Glass-epoxy PCB) BU52051NVX (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ～+4.5※5 V Output Current IOUT ±0.5 mA Power Dissipation Pd 2049※6 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -40 ～+125 ℃ ※5. Not to exceed Pd ※6. Reduced by 20.49mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 70mm ×70 mm×1.6mm Glass-epoxy PCB) BU52011HFV (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ～+4.5※7 V Output Current IOUT ±0.5 mA Power Dissipation Pd 536※8 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -40 ～+125 ℃ ※7. Not to exceed Pd ※8. Reduced by 5.36mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 70mm ×70 mm×1.6mm Glass-epoxy PCB)

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. BU52021NVX (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ～+4.5※9 V Output Current IOUT ±1 mA Power Dissipation Pd 536※10 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -40 ～+125 ℃ ※9. Not to exceed Pd ※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 70mm ×70 mm×1.6mm Glass-epoxy PCB) BU52025G (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.1 ～+4.5※11 V Output Current IOUT ±1 mA Power Dissipation Pd 540※12 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -40 ～+125 ℃ ※11. Not to exceed Pd ※12. Reduced by 5.40mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 70mm ×70 mm×1.6mm Glass-epoxy PCB) BD7411G (Ta=25℃) PARAMETERS SYMBOL LIMIT UNIT Power Supply Voltage VDD -0.3 ～+7.0※13 V Output Current IOUT ±1 mA Power Dissipation Pd 540※14 mW Operating Temperature Range Topr -40 ～+85 ℃ Storage Temperature Range Tstg -55 ～+150 ℃ ※13. Not to exceed Pd ※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25 ℃ (mounted on 70mm ×70 mm×1.6mm Glass-epoxy PCB)

Magnetic, Electrical Characteristics BU52001GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) PARAMETERS SYMBOL LIMIT UNIT CONDITIONS MIN TYP MAX Power Supply Voltage VDD 2.4 3.0 3.3 V Operate Point BopS - 3.7 5.5 mT BopN -5.5 -3.7 - Release Point BrpS 0.8 2.9 - mT BrpN - -2.9 -0.8 Hysteresis BhysS - 0.8 - mT BhysN - 0.8 - Period T p - 50 100 ms Output High Voltage VOH VDD -0.4 - - V BrpN<B<BrpS ※15 IOUT =-1.0mA Output Low Voltage VOL - - 0.4 V B<BopN,BopS< B ※15 IOUT =+1.0mA Supply Current IDD(AVG) - 8 12 μA Average Supply Current During Startup Time I DD (EN) - 4.7 - mA During Startup Time Value Supply CurrentDuring Standby Time I DD (DIS) - 3.8 - μA During Standby Time Value ※15 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed. BU52015GUL (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) PARAMETERS SYMBOL LIMIT UNIT CONDITIONS MIN TYP MAX Power Supply Voltage VDD 1.65 1.80 3.30 V Operate Point BopS - 3.0 5.0 mT BopN -5.0 -3.0 - Release Point BrpS 0.6 2.1 - mT BrpN - -2.1 -0.6 Hysteresis BhysS - 0.9 - mT BhysN - 0.9 - Period T p - 50 100 ms Output High Voltage VOH VDD -0.2 - - V OUT1: BrpN<B<BrpS ※16 OUT2: B<BopN, BopS<B IOUT = -0.5mA Output Low Voltage VOL - - 0.2 V OUT1: B<BopN, BopS< B ※16 OUT2: BrpN<B<BrpS IOUT = +0.5mA Supply Current 1 IDD1(AVG) - 5 8 μA VDD=1.8V, Average Supply Current During Startup Time 1 I DD1(EN) - 2.8 - mA VDD=1.8V, During Startup Time Value Supply CurrentDuring Standby Time 1 I DD1(DIS) - 1.8 - μA VDD=1.8V, During Standby Time Value Supply Current 2 IDD2(AVG) - 8 12 μA VDD=2.7V, Average Supply Current During Startup Time 2 I DD2(EN) - 4.5 - mA VDD=2.7V, During Startup Time Value Supply CurrentDuring Standby Time 2 I DD2(DIS) - 4.0 - μA VDD=2.7V, During Standby Time Value ※16 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. BU52051NVX , BU52011HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃) BU52021HFV,BU52025G (Unless otherwise specified, VDD＝3.0V, Ta＝25℃) PARAMETERS SYMBOL LIMIT UNIT CONDITIONS MIN TYP MAX Power Supply Voltage VDD 2.4 3.0 3.6 V Operate Point BopS - 3.7 5.5 mT BopN -5.5 -3.7 - Release Point BrpS 0.8 2.9 - mT BrpN - -2.9 -0.8 Hysteresis BhysS - 0.8 - mT BhysN - 0.8 - Period T p - 50 100 ms Output High Voltage VOH VDD -0.4 - - V BrpN<B<BrpS ※17 IOUT =-1.0mA Output Low Voltage VOL - - 0.4 V B<BopN, BopS< B ※17 IOUT =+1.0mA Supply Current IDD(AVG) - 8 12 μA Average Supply Current During Startup Time I DD (EN) - 4.7 - mA During Startup Time Value Supply CurrentDuring Standby Time I DD (DIS) - 3.8 - μA During Standby Time Value ※17 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (T P) to become definite output. Radiation hardiness is not designed. BD7411G (Unless otherwise specified, VDD＝5.0V, Ta＝25℃) PARAMETERS SYMBOL LIMIT UNIT CONDITIONS MIN TYP MAX Power Supply Voltage VDD 4.5 5.0 5.5 V Operate Point BopS - 3.4 5.6 mT BopN -5.6 -3.4 - Release Point BrpS 1.5 3.0 - mT BrpN - -3.0 -1.5 Hysteresis BhysS - 0.4 - mT BhysN - 0.4 - Output High Voltage VOH 4.6 - - V BrpN<B<BrpS ※18 IOUT =-1.0mA Output Low Voltage VOL - - 0.4 V B<BopN, BopS< B ※18 IOUT =+1.0mA Supply Current IDD - 2 4 mA ※18 B = Magnetic flux density 1mT=10Gauss Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. Radiation hardiness is not designed.

Figure of measurement circuit Product Name I OUT BU52001GUL, BU52021HFV, BU52025G, BD7411G 1.0mA BU52015GUL, BU52051NVX, BU52011HFV 0.5mA Product Name IOUT BU52001GUL, BU52021HFV, BU52025G, BD7411G 1.0mA BU52015GUL, BU52051NVX, BU52011HFV 0.5mA Product Name C BU52001GUL,BU52015GUL,BU52051NVX, BU52011HFV, BU52021HFV, BU52025G 2200μF BD7411G 100 μF Bop/Brp VDD VDD GND OUT 100μF V Tp 200Ω VDD VDD GND OUT IDD VDD VDD GND OUT C A VOH VDD GND OUT 100μF V IOUT VOL VDD VDD GND OUT 100μF V IOUT Oscilloscope The period is monitored by Oscilloscope. Bop and Brp are measured with applying the magnetic field from the outside. Fig.1 B op,Brp measurement circuit Fig.2 T p measurement circuit Fig.3 V OH measurement circuit Fig.4 V OL measurement circuit Fig.5 I DD measurement circuit VDD

Technical (Reference) Data BU52001GUL (VDD=2.4V～3.3V type) BU52015GUL, BU52051NVX, BU52011HFV (VDD=1.65V～3.3V type) Fig.6 Bop,Brp– Ambient temperature Fig.10 I DD– Ambient temperature Fig.7 Bop,Brp- Supply voltage Fig.11 I DD – Supply voltage Fig.8 T P– Ambient temperature Fig.9 T P– Supply voltage Fig.12 Bop,Brp– Ambient temperature Fig.15 T P– Supply voltage Fig.14 T P – Ambient temperature Fig.16 I DD– Ambient temperature Fig.13 Bop,Brp– Supply voltage Fig.17 I DD – Supply voltage 100 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] PERIOD [ms] VDD=1.8V 100 SUPPLY VOLTAGE [V] PERIOD [ms] Ta = 100 SUPPLY VOLTAGE [V] PERIOD [ms] Ta = 25°C -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] MAGNETIC FLUX DENSITY [mT] Bop S Brp S Brp N Bop N VDD=3.0V -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 SUPPLY VOLTAGE ［V］ MAGNETIC FLUX DENSITY [mT] Ta = 25°C Bop S Brp S Brp N Bop N 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] AVERAGE SUPPLY CURRENT [µA] VDD=3.0V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 SUPPLY VOLTAGE [V] AVERAGE SUPPLY CURRENT [µA] Ta = 25°C -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] MAGNETIC FLUX DENSITY [mT] Bop S Brp N Bop N Brp S VDD=1.8V -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 SUPPLY VOLTAGE ［V］ MAGNETIC FLUX DENSITY [mT] Ta = 25°C Bop S Brp S Brp N Bop N 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 SUPPLY VOLTAGE [V] AVERAGE SUPPLY CURRENT [µA] Ta = 25°C 100 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] PERIOD [ms] VDD=3.0V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] AVERAGE SUPPLY CURRENT [µA] VDD=1.8V

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. BU52021HFV, BU52025G (VDD=2.4V～3.6V type) BD7411G (V DD=4.5V～5.5V type) Fig.24 Bop,Brp– Ambient temperature Fig.25 Bop,Brp– Supply voltage Fig.26 I DD – Ambient temperature Fig.27 I DD – Supply voltage Fig.18 Bop,Brp– Ambient temperature Fig.19 Bop,Brp– Supply voltage Fig.22 I DD – Ambient temperature Fig.23 I DD – Supply voltage Fig.20 T P – Ambient temperature Fig.21 T P – Supply voltage -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] MAGNETIC FLUX DENSITY [mT] Bop S Brp N Bop N VDD=3.0V Brp S 100 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] AVERAGE SUPPLY CURRENT [µA] VDD=3.0V 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 SUPPLY VOLATAGE [V] AVERAGE SUPPLY CURRENT [µA] Ta = 25°C -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] MAGNETIC FLUX DENSITY [mT] Bop S Brp S Brp N Bop N VDD=5.0V -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 SUPPLY VOLTAGE ［V］ MAGNETIC FLUX DENSITY [mT] Bop S Brp S Brp N Bop N Ta = 25°C 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -60 -40 -20 0 20 40 60 80 100 AM BIENT TEM PERATURE [℃] AVERAGE SUPPLY CURRENT [mA] VDD=5.0V 0.0 1.0 2.0 3.0 4.0 5.0 6.0 SUPPLY VOLTAGE [V] AVERAGE SUPPLY CURRENT [mA] Ta = 25°C -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 SUPPLY VOLTAGE ［V］ MAGNETIC FLUX DENSITY [mT] Bop S Brp N Bop N Brp S Ta = 25°C 100 SUPPLY VOLTAGE [V] PERIOD [ms] Ta = 25°C 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE [℃] AVERAGE SUPPLY CURRENT [µA] VDD=3.0V

Block Diagram BU52001GUL BU52015GUL Fig.29 PIN No. PIN NAME FUNCTION COMMENT A1 VDD POWER SUPPLY A2 GND GROUND B1 OUT OUTPUT B2 N.C. OPEN or Short to GND. PIN No. PIN NAME FUNCTION COMMENT A1 OUT1 Output pin (Active Low) A2 OUT2 Output pin (Active High) B1 GND GROUND B2 VDD Power Supply Voltage OUT GND ＶDD LATCH TIMING LOGIC DYNAMIC OFFSET CANCELLATION SAMPLE & HOLD HALL ELEMENT Fig.28 0.1μF The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. B2 B1 Reverse B2 B1 Surface GND OUT1 OUT2 LATCH VDD GND VDD TIMING LOGIC SAMPLE & HOLD HALL ELEMENT DYNAMIC OFFSET CANCELLATION 0.1μF B2 B1 Reverse B2 B1 Surface The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. BU52051NVX BU52011HFV,BU52021HFV PIN No. PIN NAME FUNCTION COMMENT

1 OUT OUTPUT

2 GND GROUND

3 N.C. OPEN or Short to GND.

4 VDD POWER SUPPLY

PIN No. PIN NAME FUNCTION COMMENT 1 N.C. OPEN or Short to GND. 3 N.C. OPEN or Short to GND.

5 OUT OUTPUT

ＶDD LATCH TIMING LOGIC DYNAMIC OFFSET CANCELLATION SAMPLE & HOLD HALL ELEMENT Fig.30 0.1μF 1 2 4 3 3 4 2 1 ReverseSurface OUT GND ＶDD LATCH TIMING LOGIC DYNAMIC OFFSET CANCELLATION SAMPLE & HOLD HALL ELEMENT Fig.31 0.1μF Reverse 1 2 Surface 4 5 The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. BU52025G BD7411G Fig.33 PIN No. PIN NAME FUNCTION COMMENT 1 N.C. OPEN or Short to GND. 3 N.C. OPEN or Short to GND. PIN No. PIN NAME FUNCTION COMMENT 1 N.C. OPEN or Short to GND. 3 N.C. OPEN or Short to GND.

4 OUT OUTPUT

5 VDD POWER SUPPLY

ＶDD LATCH TIMING LOGIC DYNAMIC OFFSET CANCELLATION SAMPLE & HOLD HALL ELEMENT Fig.32 0.1μF ReverseSurface 1 2 33 1 4 5 ReverseSurface 1 2 33 1 4 5 0.1μF OUT GND ＶDD LATCH TIMING LOGIC DYNAMIC OFFSET CANCELLATION HALL ELEMENT SAMPLE & HOLD REG The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.

Description of Operations (Micropower Operation) (Offset Cancelation) The Omnipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. Reference period: 50ms (MAX100ms) Reference startup time: 48μs ※BD7411G don’t adopts an intermittent operation method. IDD Standby Startup time Period t Fig.34 The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 35 and a magnetic field is applied perpend icular to the Hall elements, voltage is generated at the mid- point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 ˚ angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released. GND VDD I B × Hall Voltage Fig.35

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. (Magnetic Field Detection Mechanism) The Omnipolar detection Hall IC detects magnetic fields runn ing perpendicular to the top surf ace of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops bel ow the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output sw itches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is know n as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation. Flux B Low Bop N Brp N Brp S Bop S 0 High N-Pole Magnetic flux density [mT] S-Pole Fig.37 Flux High High Low OUT [V] N N S S S N The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer. Fig.36 S S N S N S N Flux Flux

Intermittent Operation at Power ON The Omnipolar detection Hall IC adopts an intermittent operat ion method in detecting the magnetic field during startup, as shown in Fig. 38. It outputs to the appr opriate terminal based on the detection re sult and maintains the output condition during the standby period. The time from power ON until the en d of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 1 00ms. To accommodate the system desig n, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage. ※BD7411G don’t adopts an intermittent operation method.
Magnet Selection Of the two representative varieties of permanent magnet, neodym ium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniat urization, Thus, neodymium is best suited for small equipment applications. Fig. 39 shows the relation between the size (volum e) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 40 shows Hall IC detection distance – a good guide for determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area. M a g n e t m a t e r i a l : N E O M A X - 4 4 H ( m a t e r i a l ) Maker: NEOMAX CO.,LTD. 02468 1 0 1 2 1 4 1 6 1 8 2 0 Distance between magnet and Hall IC [mm] Magnetic flux density[mT] Fig.39 7.6mm t=3mm t=1mm t=2mm 9.2mm 10.4mm X=Y=4mm t=1mm,2mm,3mm X t Y …Flux density measuring point L: Variable t Fig.40 Magnet Dimensions and Flux Density Measuring Point Magnet size Magnet VDD Startup time Standby time Standby time Startup time (Intermittent action) Indefinite OUT (No magnetic field present) Indefinite OUT (Magnetic field present) Low High Supply current Fig.38 Power ON

Position of the Hall Effect IC(Reference)
Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) (UNIT：mm) 0.55 0.55 0.35 0.6 0.8 0.2 0.6 0.8 0.2 SSON004X1216 VCSP50L1 HVSOF5 SSOP5 0.8 0.6 1.45 (UNIT：mm) Please avoid having potential overstress from PCB material, strength, mounting positions. If you had any further questions or concerns, please contact your Rohm sales and affiliate. VCSP50L1 SSON004X1216 HVSOF5 SSOP5

Terminal Equivalent Circuit Diagram OUT , OUT1, OUT2
Operation Notes 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be ident ified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any oper ating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, plac ing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6) Slide-by position sensing Fig.42 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.43, the magnetic field runs in opposit e directions at Point A and Point B. Sinc e the Omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching out put ON as the magnet slides by in the process of position detection. Fig. 44 plot s magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, t he magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the ma gnet and Hall IC reduces the reverse magnetic field and prevents malfunctions. GND VDD Fig.41 Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation. L d Magnet Hall IC Slide Fig.42 -10 0123456789 1 0 Horizontal distance from the magnet [mm] Magnetic fux density[mT] Reverse Fig.44 Fig.43 B S A N Flux Flux

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. 7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the ligh t. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 11) Power source design Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under examine adequate evaluations when designing the power source.

Ordering part number B D 7 4 1 1 G - T R Part No. Part No. 52001,52015 52025,7411 52051 52011,52021 Package GUL: VSCP50L1 G: SSOP5 NVX: SSON004X1216 HFV: HVSOF5 Packaging and forming specification E2: Embossed tape and reel (VSCP50L1 ) TR: Embossed tape and reel (SSOP5, HVSOF5, SSON004X1216) (Unit : mm) SSOP5 2.9±0.2 0.13 4° +6° −4° 1.6 2.8±0.2 1.1±0.05 0.05±0.05 +0.2 −0.1 +0.05 −0.03 0.42 +0.05 −0.04 0.95 5 4 12 3 1.25Max. 0.2Min. 0.1 Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs TR 1pin ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs Direction of feed Reel 1pin (Unit:mm) VCSP50L1 (BU52001GUL,BU52015GUL)

BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G www.rohm.com 2010.01 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. (Unit : mm) SSON004X1216 S 0.08 S 2 1 1PIN MARK 1.2±0.1 0.65±0.1 0.75±0.1 1.6±0.1 0.2±0.1 0.8±0.1 0.6MAX (0.12) 0.02+0.03 -0.02 0.2 +0.05 -0.04 ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 5000pcs TR Direction of feed Reel 1pin (Unit : mm) HVSOF5 S 0.08 M 0.1 S 3 2 1 (0.05) 1.6±0.05 1.0±0.05 1.6±0.05 1.2±0.05 (MAX 1.28 include BURR) 32 1 (0.8) (0.91) (0.3) (0.41) 0.2MAX 0.13±0.05 0.22±0.05 0.6MAX 0.5 0.02 +0.03 –0.02 Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs TR 1pin

R1010Awww.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Notice ROHM Customer Support System http://www.rohm.com/contact/ Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redunda ncy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospac e machinery, nuclear-reactor controller, fuel- controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Selected Specification

Rohm BD7411G overview.

Summary

Omnipolar Detection Hall ICs

Description

Omnipolar Detection Hall ICs

Source title BD7411G Datasheet(PDF) - Rohm

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