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Online Datasheet

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BD4XXM5-C ROHM

Document overview

Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
PDF pages: 39

Technical content

Ordering Information B D 4 x x M 5 W F P J － C Z E 2 Part Number Output Voltage 33: 3.3 V 50: 5.0 V Output Current 5: 500 mA Enable Input W: Includes Enable Input Package FPJ: TO252-J5(F) FP : TO252-3 FP2: TO263-5(F) TO263-3(F) Packaging and Forming Specification Z: Manufacturing Code E2: Embossed Tape and Reel
Lineup Output Current Ability Output Voltage (Typ.) Enable Input (1) Package Type Orderable Part Number 500 mA 3.3 V TO252-J5(F) BD433M5WFPJ-CZE2 TO263-5(F) BD433M5WFP2-CZE2 TO252-3 BD433M5FP-CE2 TO263-3(F) BD433M5FP2-CZE2 5.0 V TO252-J5(F) BD450M5WFPJ-CZE2 TO263-5(F) BD450M5WFP2-CZE2 TO252-3 BD450M5FP-CE2 TO263-3(F) BD450M5FP2-CZE2 (1) ○: Includes Enable Input – : Not includes Enable Input

Pin Configurations

Figure 3. Pin Configuration

Pin Descriptions ■ BD433 / 450M5WFPJ-C ■BD433 / 450M5WFP2-C Pin No. Pin Name Function Pin No. Pin Name Function

1 VCC Supply Voltage Input Pin 1 VCC Supply Voltage Input Pin

2 CTL Output Control Pin 2 CTL Output Control Pin

3 GND Ground Pin 3 GND Ground Pin

5 VOUT Output Pin 5 VOUT Output Pin

3 VOUT Output Pin 3 VOUT Output Pin

N.C. Pin is recommended to short with GND.
N.C. Pin can be open because it isn’t connected it inside of IC.

Block Diagrams ■ BD433 / 450M5WFPJ-C ■ BD433 / 450M5WFP2-C

Description of Blocks Block Name Function Description of Blocks CTL (1) Control Output Voltage ON/OFF A logical “HIGH” ( ≥ 2.8 V ) at the CTL enables the device and “LOW” ( ≤ 0.8 V ) at the CTL disable the device. PREREG Internal Power Supply Power Supply for Internal Circuit TSD Thermal Shutdown Protection To protect the device from overheating. If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ. ), the output is turned off. VREF Reference Voltage Generate the Reference Voltage DRIVER Output MOS FET Driver Drive the Output MOS FET OCP Over Current Protection To protect the device from damage caused by over current. If the output current reaches ca. 900 mA (Typ.), the output is turned off. (1) Applicable for product with Enable Input.

Absolute Maximum Ratings Parameter Symbol Ratings Unit Supply Voltage (1) VCC -0.3 to +45.0 V Output Control Voltage (2) CTL -0.3 to +45.0 V Output Voltage VOUT -0.3 to +8.0 V Junction Temperature Range Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C ESD withstand Voltage (HBM) (3) V ESD, HBM ±2000 V (1) Do not exceed Pd. (2) Applicable for product with Enable Input. The start-up orders of power supply (VCC) and the CTL do not influence if the voltage is within the operation power supply voltage range. (3) ESD susceptibility Human Body Model “HBM”.
Operating Conditions (-40 °C ≤ Tj ≤ +150 °C) Parameter Symbol Min. Max. Unit Supply Voltage ( IOUT ≤ 500 mA ) (1) VCC 5.9 42.0 V Supply Voltage ( IOUT ≤ 250 mA ) (1) VCC 5.5 42.0 V Supply Voltage ( IOUT ≤ 500 mA ) (2) VCC 4.6 42.0 V Supply Voltage ( IOUT ≤ 250 mA ) (2) VCC 4.0 42.0 V Output Control Voltage (3) CTL 0 42.0 V Start-Up Voltage (4) VCC 3.0 – V Output Current IOUT 0 500 mA Junction Temperature Range Tj -40 +150 °C (1) BD450M5WFPJ-C / BD450M5WFP 2-C / BD450M5FP-C / BD450M5FP2-C (2) BD433M5WFPJ-C / BD433M5WFP 2-C / BD433M5FP-C / BD433M5FP2-C (3) Applicable for Product with Enable Input. (4) When IOUT = 0 mA Notice: Please consider that the output voltage would be dropped (Dropout voltage) according to the output current.

Thermal Impedance (1) Parameter Symbol Typ. Unit Conditions TO252-J5(F) / TO252-3 Junction to Ambient θJA 136 °C / W 1s (2) 23 °C / W 2s2p (3) Junction to Top Center of Case (4) ΨJT 17 °C / W 1s (2) 3 °C / W 2s2p (3) TO263-5(F) / TO263-3(F) Junction to Ambient θJA 81 °C / W 1s (2) 21 °C / W 2s2p (3) Junction to Top Center of Case (4) ΨJT 8 °C / W 1s (2) 2 °C / W 2s2p (3) (1) The thermal impedance is based on JESD51 - 2A (Still-Air) standard. (2) JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s) (Top copper foil: ROHM recommended footpr int + wiring to measure, 2 oz. copper.) (3) JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer （2s2p） (Top copper foil: ROHM recommended footprint + wiring to measur e / 2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, copper (top & reverse side / inner layers) 2oz. / 1oz.) (4) T T : Top center of case’s (mold) temperature

Electrical Characteristics Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA The typical value is defined at Tj = 25 °C. Parameter Symbol Limit Unit Conditions Min. Typ. Max. Shut Down Current Ishut (1) – 2.0 5.0 μA CTL = 0 V Tj ≤ 125 °C Circuit Current Icc – 38 95 μA IOUT = 0 mA Tj ≤ 125 °C – 38 175 μA IOUT ≤ 500 mA Tj ≤ 150 °C Output Voltage VOUT (2) 4.90 5.00 5.10 V 6 V ≤ VCC ≤ 42 V, 0 mA ≤ IOUT ≤ 400 mA 4.80 5.00 5.10 V 6 V ≤ VCC ≤ 42V 0 mA ≤ IOUT ≤ 500 mA VOUT (3) 3.23 3.30 3.37 V 6 V ≤ VCC ≤ 42 V 0 mA ≤ IOUT ≤ 400 mA 3.20 3.30 3.37 V 6 V ≤ VCC ≤ 42 V 0 mA ≤ IOUT ≤ 500 mA Dropout Voltage IOUT = 300 mA IOUT = 300 mA Ripple Rejection R.R. 55 60 – dB f = 120 Hz, ein = 1 Vrms IOUT = 100 mA Line Regulation Reg.I – 10 30 mV 8 V ≤ VCC ≤ 16 V Load Regulation Reg.L – 10 30 mV 10 mA ≤ IOUT ≤ 400 mA Thermal Shut Down TSD – 175 – °C Tj at TSD ON (1) Applicable for Product with Enable Input. (2) For BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C (3) For BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C
Electrical Characteristics ( Enable function * Applicable for product with Enable Input. ) Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA. The typical value is defined at Tj = 25 °C. Parameter Symbol Limit Unit Conditions Min. Typ. Max. CTL ON Mode Voltage VthH 2.8 – – V Active Mode CTL OFF Mode Voltage VthL – – 0.8 V Off Mode CTL Bias Current ICTL – 15 30 µA CTL = 5 V

Thermal Design This product exposes a frame on the back side of the package for thermal efficiency improvement. Within this IC, the power consumption is decided by the dropo ut voltage condition, the load cu rrent and the circuit current. Refer to power dissipation curves illustrated in Figure 44, 45 when using the IC in an environment of Ta ≥ 25 °C. Even if the ambient temperature Ta is at 25 °C, depending on the input vo ltage and the load current, chip junction temperature can be very high. Consider the design to be Tj ≤ Tjmax = 150 ℃ in all possible operating temperature range. Should by any condition the maximum junction temperature Tjmax = 150 ℃ rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design by the following method is used to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods. 1. The following method is used to calculate the junction temperature Tj. Tj = Ta + P C × θJA Tj : Junction Temperature Ta : Ambient Temperature PC : Power Consumption θJA : Thermal Impedance (Junction to Ambient) 2. The following method is also used to calculate the junction temperature Tj. Tj = TT + PC × ΨJT Tj : Junction Temperature TT : Top Center of Case’s (mold) Temperature PC : Power consumption ΨJT : Thermal Impedance (Junction to Top Center of Case) The following method is used to calculate the power consumption Pc (W). Pc = (VCC - VOUT) × IOUT + VCC × Icc PC : Power Consumption VCC : Input Voltage VOUT : Output Voltage IOUT : Load Current Icc : Circuit Current

27/36 TSZ02201-0G1G0AN00066-1-2© 2015 ROHM Co., Ltd. All rights reserved. 22.Feb.2017 Rev.006 www.rohm.com TSZ22111･15･001 BD4xxM5-C Series ・Calculation Example(TO252-J5(F) / TO252-3) If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows: PC = (VCC - VOUT) × IOUT + VCC × Icc = (13.5 V – 5.0 V) × 200 mA + 13.5 V × 38 μA = 1.7 W At the ambient temperature Tamax = 85°C, the thermal Impedance ( Junction to Ambient )θJA = 23 °C / W( 4-layer PCB ), Tj = Tamax + PC × θJA = 124.1 °C When operating the IC, the top center of case’s (mold) temperature TT = 100℃、ΨJT = 17 °C / W( 1-layer PCB ), Tj = TT + PC × ΨJT = 100 °C + 1.7 W × 17 °C / W = 128.9 °C For optimum thermal performance, it is recommended to expa nd the copper foil area of the board, increasing the layer and thermal via between thermal land pad. ・Calculation Example (TO263-5(F) / TO263-3(F)) If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows: P C = (VCC - VOUT) × IOUT + VCC × Icc = (13.5 V – 5.0 V) × 200 mA + 13.5 V × 38 μA = 1.7 W At the ambient temperature Tamax = 85°C, the thermal impedance ( Junction to Ambient )θJA = 21 °C / W( 4-layer PCB ), Tj = Tamax + PC × θJA = 120.7 °C When operating the IC, the top cent er of case’s (mold) temperature TT = 100℃、ΨJT = 8 °C / W( 1-layer PCB ), Tj = TT + PC × ΨJT = 113.6 °C For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad.

Operational Notes 1) Absolute Maximum Ratings Exceeding the absolute maximum rating for supply voltage, oper ating temperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossi ble to determine the cause of the damage (e.g. short circuit, open circuit, etc.). T herefore, if any special mode is being c onsidered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. Transient characteristics should be sufficiently verified. 3) GND Electric Potential Keep the GND potential at t he lowest (minimum) level under any operati ng condition. Furthermore, ensure that, including the transient, none of the pin’s voltage is less than the GND voltage. 4) GND Wiring Pattern When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is recommended. This in order to separate the small-signal an d high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. 5) CTL Do not make voltage level of chip enab le keep floating level, or in between VthH and VthL. Otherwise, the output voltage would be unstable or indefinite. 6) Inter-pin Shorting and Mounting Errors Ensure that when mounting the IC on the PCB the direction an d position are correct. Incorre ct mounting may result in damaging the IC. Also, shorts caused by dust entering between the output, i nput and the GND may result in damaging the IC. 7) Inspection Using the Set Board The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. Also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8) Thermal Design The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. On the revers e side of the package this product has an exposed heat pad for improving the heat dissipation. Use both the front and reverse side of t he PCB to increase the heat dissipation pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually usi ng the chip, ensure that the generated heat does not exceed the Pd rating. Should by any condition the maximum junction temperature Tjmax = 150 ℃ rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JE DEC standard. Verify the application and allow sufficient margins in the thermal design. 9) Overcurrent Protection Circuit This IC incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 10) Thermal Shut Down (TSD) This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (Tj) will rise and the TSD circuit will be activated and turn a ll output pins OFF. After the Tj falls below the TSD threshold the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute ma ximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage.

Physical Dimension, Tape and Reel Information (F)

Marking Diagrams (Top View) Part Number Marking Output Voltage [V] Enable Input (1) Part Number Marking Output Voltage [V] Enable Input (1) 433M5W 3.3 ◯ 433M5W 3.3 ◯ 450M5W 5.0 ◯ 450M5W 5.0 ◯ Part Number Marking Output Voltage [V] Enable Input (1) Part Number Marking Output Voltage [V] Enable Input (1) 433M5 3.3 – 433M5 3.3 – 450M5 5.0 – 450M5 5.0 – TO252-J5(F) (Top View) Part Number Marking LOT Number 1Pin TO252-3 (Top View) Part Number Marking LOT Number TO263-5(F) (Top View) Part Number Marking LOT Number 1Pin (1) ○: Includes Enable Input – : Not includes Enable Input TO263-3(F) (Top View) Part Number Marking LOT Number 1Pin (1) ○: Includes Enable Input – : Not includes Enable Input (1) ○: Includes Enable Input – : Not includes Enable Input (1) ○: Includes Enable Input – : Not includes Enable Input

Notice-PAA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications ”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a cert ain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cle aning residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under de viant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive pr oduct, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condi tion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

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500-mA 3.3-V or 5.0-V Output LDO Regulators 22.Feb.2017 Rev.006

Description

500-mA 3.3-V or 5.0-V Output LDO Regulators 22.Feb.2017 Rev.006

Source title BD433 Datasheet(PDF) - Rohm

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